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RE: 65nm 360 please
By deeznuts on 5/16/2007 1:00:27 PM , Rating: 2
What difference does the 65nm do to gameplay. Oh yeah I remember now: NOTHING!

Hmm, how about, allowing you to play! One purported cause of red rings is heat around the cpu/gpu right? Well less heat around the cpu MIGHT reduce the risk of RROD. So go learn something before mouthing off.

RE: 65nm 360 please
By GoatMonkey on 5/16/2007 1:13:33 PM , Rating: 2
What they need to do is actually fix the problem. If it takes a 65nm chip to do that then that's fine. There are other solutions to heat problems though.

Microsoft needs to step up and fix the existing 360s when they finally do come up with a solution, or at minimum increase the warranty coverage by a couple of years so that the ones that do fail get replaced.

RE: 65nm 360 please
By IMPoor on 5/16/07, Rating: -1
RE: 65nm 360 please
By vitul on 5/16/2007 3:42:07 PM , Rating: 2
the heat difference between the 65nm and the 90nm isint going to stop any of the problems. people are saying its actually warping the main board due to heat.

look at the dual core pentiums with 90nm and the 65nm the heat difference is VERY minimal.

the damage being done to the 360s with rrod needs a serious cooling change.

RE: 65nm 360 please
By theapparition on 5/17/2007 8:55:41 AM , Rating: 2
Just to clarify, heating a PCB will not cause it to warp. PC boards are composites, made of basically fiberglass and copper. Both of these materials have different coefficients of thermal expansion. My speculation, is that the board is unbalanced with too much copper on some layers, and not enough on others. When this happens, that can cause the board to warp and break solderballs. The chips themselves also have different coefficients, and just plain warping may not be necessary as the solderballs can break from a shearing action.
I'd like to see some long term data on the PCB layout in the elite system.

RE: 65nm 360 please
By dflynchimp on 5/17/2007 1:08:39 AM , Rating: 3
Yet overheating is actually one of the foremost reasons for failure. You can't penalize people for wanting to bid on the extra reliability. At least in computer chips and motherboards overheating and motherboard warping due to heat are both widely documented and frequent cases of error and failure. The 360 is essentially a compact computer packed into a very small space, so cooling becomes a major issue. If 65nm does significantly decrease both heat output as well as power consumption then I don't see why you have to flame it. Seriously, for those of us paying the power bill every penny counts.


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