Daily Papers

We introduce a simple and intuitive self-supervision task, Natural Synthetic Anomalies (NSA), for training an end-to-end model for anomaly detection and localization using only normal training data. NSA integrates Poisson image editing to seamlessly blend scaled patches of various sizes from separate images. This creates a wide range of synthetic anomalies which are more similar to natural sub-image irregularities than previous data-augmentation strategies for self-supervised anomaly detection. We evaluate the proposed method using natural and medical images. Our experiments with the MVTec AD dataset show that a model trained to localize NSA anomalies generalizes well to detecting real-world a priori unknown types of manufacturing defects. Our method achieves an overall detection AUROC of 97.2 outperforming all previous methods that learn without the use of additional datasets. Code available at https://github.com/hmsch/natural-synthetic-anomalies.

Manufacturing wafers is an intricate task involving thousands of steps. Defect Pattern Recognition (DPR) of wafer maps is crucial for determining the root cause of production defects, which may further provide insight for yield improvement in wafer foundry. During manufacturing, various defects may appear standalone in the wafer or may appear as different combinations. Identifying multiple defects in a wafer is generally harder compared to identifying a single defect. Recently, deep learning methods have gained significant traction in mixed-type DPR. However, the complexity of defects requires complex and large models making them very difficult to operate on low-memory embedded devices typically used in fabrication labs. Another common issue is the unavailability of labeled data to train complex networks. In this work, we propose an unsupervised training routine to distill the knowledge of complex pre-trained models to lightweight deployment-ready models. We empirically show that this type of training compresses the model without sacrificing accuracy despite being up to 10 times smaller than the teacher model. The compressed model also manages to outperform contemporary state-of-the-art models.

The chips contained in any electronic device are manufactured over circular silicon wafers, which are monitored by inspection machines at different production stages. Inspection machines detect and locate any defect within the wafer and return a Wafer Defect Map (WDM), i.e., a list of the coordinates where defects lie, which can be considered a huge, sparse, and binary image. In normal conditions, wafers exhibit a small number of randomly distributed defects, while defects grouped in specific patterns might indicate known or novel categories of failures in the production line. Needless to say, a primary concern of semiconductor industries is to identify these patterns and intervene as soon as possible to restore normal production conditions. Here we address WDM monitoring as an open-set recognition problem to accurately classify WDM in known categories and promptly detect novel patterns. In particular, we propose a comprehensive pipeline for wafer monitoring based on a Submanifold Sparse Convolutional Network, a deep architecture designed to process sparse data at an arbitrary resolution, which is trained on the known classes. To detect novelties, we define an outlier detector based on a Gaussian Mixture Model fitted on the latent representation of the classifier. Our experiments on a real dataset of WDMs show that directly processing full-resolution WDMs by Submanifold Sparse Convolutions yields superior classification performance on known classes than traditional Convolutional Neural Networks, which require a preliminary binning to reduce the size of the binary images representing WDMs. Moreover, our solution outperforms state-of-the-art open-set recognition solutions in detecting novelties.

Anomaly detection is a crucial process in industrial manufacturing and has made significant advancements recently. However, there is a large variance between the data used in the development and the data collected by the production environment. Therefore, we present the Texture-AD benchmark based on representative texture-based anomaly detection to evaluate the effectiveness of unsupervised anomaly detection algorithms in real-world applications. This dataset includes images of 15 different cloth, 14 semiconductor wafers and 10 metal plates acquired under different optical schemes. In addition, it includes more than 10 different types of defects produced during real manufacturing processes, such as scratches, wrinkles, color variations and point defects, which are often more difficult to detect than existing datasets. All anomalous areas are provided with pixel-level annotations to facilitate comprehensive evaluation using anomaly detection models. Specifically, to adapt to diverse products in automated pipelines, we present a new evaluation method and results of baseline algorithms. The experimental results show that Texture-AD is a difficult challenge for state-of-the-art algorithms. To our knowledge, Texture-AD is the first dataset to be devoted to evaluating industrial defect detection algorithms in the real world. The dataset is available at https://XXX.

Identifying defect patterns in a wafer map during manufacturing is crucial to find the root cause of the underlying issue and provides valuable insights on improving yield in the foundry. Currently used methods use deep neural networks to identify the defects. These methods are generally very huge and have significant inference time. They also require GPU support to efficiently operate. All these issues make these models not fit for on-line prediction in the manufacturing foundry. In this paper, we propose an extremely simple yet effective technique to extract features from wafer images. The proposed method is extremely fast, intuitive, and non-parametric while being explainable. The experiment results show that the proposed pipeline outperforms conventional deep learning models. Our feature extraction requires no training or fine-tuning while preserving the relative shape and location of data points as revealed by our interpretability analysis.

3D anomaly detection plays a crucial role in monitoring parts for localized inherent defects in precision manufacturing. Embedding-based and reconstruction-based approaches are among the most popular and successful methods. However, there are two major challenges to the practical application of the current approaches: 1) the embedded models suffer the prohibitive computational and storage due to the memory bank structure; 2) the reconstructive models based on the MAE mechanism fail to detect anomalies in the unmasked regions. In this paper, we propose R3D-AD, reconstructing anomalous point clouds by diffusion model for precise 3D anomaly detection. Our approach capitalizes on the data distribution conversion of the diffusion process to entirely obscure the input's anomalous geometry. It step-wisely learns a strict point-level displacement behavior, which methodically corrects the aberrant points. To increase the generalization of the model, we further present a novel 3D anomaly simulation strategy named Patch-Gen to generate realistic and diverse defect shapes, which narrows the domain gap between training and testing. Our R3D-AD ensures a uniform spatial transformation, which allows straightforwardly generating anomaly results by distance comparison. Extensive experiments show that our R3D-AD outperforms previous state-of-the-art methods, achieving 73.4% Image-level AUROC on the Real3D-AD dataset and 74.9% Image-level AUROC on the Anomaly-ShapeNet dataset with an exceptional efficiency.

Industrial anomaly detection achieves progress thanks to datasets such as MVTec-AD and VisA. However, they suf- fer from limitations in terms of the number of defect sam- ples, types of defects, and availability of real-world scenes. These constraints inhibit researchers from further exploring the performance of industrial detection with higher accuracy. To this end, we propose a new large-scale anomaly detection dataset called 3CAD, which is derived from real 3C produc- tion lines. Specifically, the proposed 3CAD includes eight different types of manufactured parts, totaling 27,039 high- resolution images labeled with pixel-level anomalies. The key features of 3CAD are that it covers anomalous regions of different sizes, multiple anomaly types, and the possibility of multiple anomalous regions and multiple anomaly types per anomaly image. This is the largest and first anomaly de- tection dataset dedicated to 3C product quality control for community exploration and development. Meanwhile, we in- troduce a simple yet effective framework for unsupervised anomaly detection: a Coarse-to-Fine detection paradigm with Recovery Guidance (CFRG). To detect small defect anoma- lies, the proposed CFRG utilizes a coarse-to-fine detection paradigm. Specifically, we utilize a heterogeneous distilla- tion model for coarse localization and then fine localiza- tion through a segmentation model. In addition, to better capture normal patterns, we introduce recovery features as guidance. Finally, we report the results of our CFRG frame- work and popular anomaly detection methods on the 3CAD dataset, demonstrating strong competitiveness and providing a highly challenging benchmark to promote the development of the anomaly detection field. Data and code are available: https://github.com/EnquanYang2022/3CAD.

This survey paper offers a comprehensive review of methodologies utilizing machine learning (ML) classification techniques for identifying wafer defects in semiconductor manufacturing. Despite the growing body of research demonstrating the effectiveness of ML in wafer defect identification, there is a noticeable absence of comprehensive reviews on this subject. This survey attempts to fill this void by amalgamating available literature and providing an in-depth analysis of the advantages, limitations, and potential applications of various ML classification algorithms in the realm of wafer defect detection. An innovative taxonomy of methodologies that we present provides a detailed classification of algorithms into more refined categories and techniques. This taxonomy follows a three-tier structure, starting from broad methodology categories and ending with specific techniques. It aids researchers in comprehending the complex relationships between different algorithms and their techniques. We employ a rigorous empirical and experimental evaluation to rank these varying techniques. For the empirical evaluation, we assess techniques based on a set of five criteria. The experimental evaluation ranks the algorithms employing the same techniques, sub-categories, and categories. Also the paper illuminates the future prospects of ML classification techniques for wafer defect identification, underscoring potential advancements and opportunities for further research in this field

Industry 4.0 has revolutionized manufacturing by driving digitalization and shifting the paradigm toward additive manufacturing (AM). Fused Deposition Modeling (FDM), a key AM technology, enables the creation of highly customized, cost-effective products with minimal material waste through layer-by-layer extrusion, posing a significant challenge to traditional subtractive methods. However, the susceptibility of material extrusion techniques to errors often requires expert intervention to detect and mitigate defects that can severely compromise product quality. While automated error detection and machine learning models exist, their generalizability across diverse 3D printer setups, firmware, and sensors is limited, and deep learning methods require extensive labeled datasets, hindering scalability and adaptability. To address these challenges, we present a process monitoring and control framework that leverages pre-trained Large Language Models (LLMs) alongside 3D printers to detect and address printing defects. The LLM evaluates print quality by analyzing images captured after each layer or print segment, identifying failure modes and querying the printer for relevant parameters. It then generates and executes a corrective action plan. We validated the effectiveness of the proposed framework in identifying defects by comparing it against a control group of engineers with diverse AM expertise. Our evaluation demonstrated that LLM-based agents not only accurately identify common 3D printing errors, such as inconsistent extrusion, stringing, warping, and layer adhesion, but also effectively determine the parameters causing these failures and autonomously correct them without any need for human intervention.

Defect inspection is paramount within the closed-loop manufacturing system. However, existing datasets for defect inspection often lack precision and semantic granularity required for practical applications. In this paper, we introduce the Defect Spectrum, a comprehensive benchmark that offers precise, semantic-abundant, and large-scale annotations for a wide range of industrial defects. Building on four key industrial benchmarks, our dataset refines existing annotations and introduces rich semantic details, distinguishing multiple defect types within a single image. Furthermore, we introduce Defect-Gen, a two-stage diffusion-based generator designed to create high-quality and diverse defective images, even when working with limited datasets. The synthetic images generated by Defect-Gen significantly enhance the efficacy of defect inspection models. Overall, The Defect Spectrum dataset demonstrates its potential in defect inspection research, offering a solid platform for testing and refining advanced models.

One persistent obstacle in industrial quality inspection is the detection of anomalies. In real-world use cases, two problems must be addressed: anomalous data is sparse and the same types of anomalies need to be detected on previously unseen objects. Current anomaly detection approaches can be trained with sparse nominal data, whereas domain generalization approaches enable detecting objects in previously unseen domains. Utilizing those two observations, we introduce the hybrid task of domain generalization on sparse classes. To introduce an accompanying dataset for this task, we present a modification of the well-established MVTec AD dataset by generating three new datasets. In addition to applying existing methods for benchmark, we design two embedding-based approaches, Spatial Embedding MLP (SEMLP) and Labeled PatchCore. Overall, SEMLP achieves the best performance with an average image-level AUROC of 87.2 % vs. 80.4 % by MIRO. The new and openly available datasets allow for further research to improve industrial anomaly detection.

Being able to spot defective parts is a critical component in large-scale industrial manufacturing. A particular challenge that we address in this work is the cold-start problem: fit a model using nominal (non-defective) example images only. While handcrafted solutions per class are possible, the goal is to build systems that work well simultaneously on many different tasks automatically. The best performing approaches combine embeddings from ImageNet models with an outlier detection model. In this paper, we extend on this line of work and propose PatchCore, which uses a maximally representative memory bank of nominal patch-features. PatchCore offers competitive inference times while achieving state-of-the-art performance for both detection and localization. On the challenging, widely used MVTec AD benchmark PatchCore achieves an image-level anomaly detection AUROC score of up to 99.6%, more than halving the error compared to the next best competitor. We further report competitive results on two additional datasets and also find competitive results in the few samples regime.^* Work done during a research internship at Amazon AWS. Code: github.com/amazon-research/patchcore-inspection.

Detecting surface anomalies of industrial materials poses a significant challenge within a myriad of industrial manufacturing processes. In recent times, various methodologies have emerged, capitalizing on the advantages of employing a network pre-trained on natural images for the extraction of representative features. Subsequently, these features are subjected to processing through a diverse range of techniques including memory banks, normalizing flow, and knowledge distillation, which have exhibited exceptional accuracy. This paper revisits approaches based on pre-trained features by introducing a novel method centered on target-specific embedding. To capture the most representative features of the texture under consideration, we employ a variant of a contrastive training procedure that incorporates both artificially generated defective samples and anomaly-free samples during training. Exploiting the intrinsic properties of surfaces, we derived a meaningful representation from the defect-free samples during training, facilitating a straightforward yet effective calculation of anomaly scores. The experiments conducted on the MVTEC AD and TILDA datasets demonstrate the competitiveness of our approach compared to state-of-the-art methods.

As the globalization of semiconductor design and manufacturing processes continues, the demand for defect detection during integrated circuit fabrication stages is becoming increasingly critical, playing a significant role in enhancing the yield of semiconductor products. Traditional wafer map defect pattern detection methods involve manual inspection using electron microscopes to collect sample images, which are then assessed by experts for defects. This approach is labor-intensive and inefficient. Consequently, there is a pressing need to develop a model capable of automatically detecting defects as an alternative to manual operations. In this paper, we propose a method that initially employs a pre-trained VAE model to obtain the fault distribution information of the wafer map. This information serves as guidance, combined with the original image set for semi-supervised model training. During the semi-supervised training, we utilize a teacher-student network for iterative learning. The model presented in this paper is validated on the benchmark dataset WM-811K wafer dataset. The experimental results demonstrate superior classification accuracy and detection performance compared to state-of-the-art models, fulfilling the requirements for industrial applications. Compared to the original architecture, we have achieved significant performance improvement.

Shrinking pattern dimensions leads to an increased variety of defect types in semiconductor devices. This has spurred innovation in patterning approaches such as Directed self-assembly (DSA) for which no traditional, automatic defect inspection software exists. Machine Learning-based SEM image analysis has become an increasingly popular research topic for defect inspection with supervised ML models often showing the best performance. However, little research has been done on obtaining a dataset with high-quality labels for these supervised models. In this work, we propose a method for obtaining coherent and complete labels for a dataset of hexagonal contact hole DSA patterns while requiring minimal quality control effort from a DSA expert. We show that YOLOv8, a state-of-the-art neural network, achieves defect detection precisions of more than 0.9 mAP on our final dataset which best reflects DSA expert defect labeling expectations. We discuss the strengths and limitations of our proposed labeling approach and suggest directions for future work in data-centric ML-based defect inspection.

Manufacturing wafers is an intricate task involving thousands of steps. Defect Pattern Recognition (DPR) of wafer maps is crucial to find the root cause of the issue and further improving the yield in the wafer foundry. Mixed-type DPR is much more complicated compared to single-type DPR due to varied spatial features, the uncertainty of defects, and the number of defects present. To accurately predict the number of defects as well as the types of defects, we propose a novel compact deformable convolutional transformer (DC Transformer). Specifically, DC Transformer focuses on the global features present in the wafer map by virtue of learnable deformable kernels and multi-head attention to the global features. The proposed method succinctly models the internal relationship between the wafer maps and the defects. DC Transformer is evaluated on a real dataset containing 38 defect patterns. Experimental results show that DC Transformer performs exceptionally well in recognizing both single and mixed-type defects. The proposed method outperforms the current state of the models by a considerable margin

In this paper, we introduce an approach for detecting modifications in assembled printed circuit boards based on photographs taken without tight control over perspective and illumination conditions. One instance of this problem is the visual inspection of gas pumps PCBs, which can be modified by fraudsters wishing to deceive costumers or evade taxes. Given the uncontrolled environment and the huge number of possible modifications, we address the problem as a case of anomaly detection, proposing an approach that is directed towards the characteristics of that scenario, while being well-suited for other similar applications. The proposed approach employs a deep convolutional autoencoder trained to reconstruct images of an unmodified board, but which remains unable to do the same for images showing modifications. By comparing the input image with its reconstruction, it is possible to segment anomalies and modifications in a pixel-wise manner. Experiments performed on a dataset built to represent real-world situations (and which we will make publicly available) show that our approach outperforms other state-of-the-art approaches for anomaly segmentation in the considered scenario, while producing comparable results on the popular MVTec-AD dataset for a more general object anomaly detection task.

Quality control is of vital importance during electronics production. As the methods of producing electronic circuits improve, there is an increasing chance of solder defects during assembling the printed circuit board (PCB). Many technologies have been incorporated for inspecting failed soldering, such as X-ray imaging, optical imaging, and thermal imaging. With some advanced algorithms, the new technologies are expected to control the production quality based on the digital images. However, current algorithms sometimes are not accurate enough to meet the quality control. Specialists are needed to do a follow-up checking. For automated X-ray inspection, joint of interest on the X-ray image is located by region of interest (ROI) and inspected by some algorithms. Some incorrect ROIs deteriorate the inspection algorithm. The high dimension of X-ray images and the varying sizes of image dimensions also challenge the inspection algorithms. On the other hand, recent advances on deep learning shed light on image-based tasks and are competitive to human levels. In this paper, deep learning is incorporated in X-ray imaging based quality control during PCB quality inspection. Two artificial intelligence (AI) based models are proposed and compared for joint defect detection. The noised ROI problem and the varying sizes of imaging dimension problem are addressed. The efficacy of the proposed methods are verified through experimenting on a real-world 3D X-ray dataset. By incorporating the proposed methods, specialist inspection workload is largely saved.

The usage of electronic devices increases, and becomes predominant in most aspects of life. Surface Mount Technology (SMT) is the most common industrial method for manufacturing electric devices in which electrical components are mounted directly onto the surface of a Printed Circuit Board (PCB). Although the expansion of electronic devices affects our lives in a productive way, failures or defects in the manufacturing procedure of those devices might also be counterproductive and even harmful in some cases. It is therefore desired and sometimes crucial to ensure zero-defect quality in electronic devices and their production. While traditional Image Processing (IP) techniques are not sufficient to produce a complete solution, other promising methods like Deep Learning (DL) might also be challenging for PCB inspection, mainly because such methods require big adequate datasets which are missing, not available or not updated in the rapidly growing field of PCBs. Thus, PCB inspection is conventionally performed manually by human experts. Unsupervised Learning (UL) methods may potentially be suitable for PCB inspection, having learning capabilities on the one hand, while not relying on large datasets on the other. In this paper, we introduce ChangeChip, an automated and integrated change detection system for defect detection in PCBs, from soldering defects to missing or misaligned electronic elements, based on Computer Vision (CV) and UL. We achieve good quality defect detection by applying an unsupervised change detection between images of a golden PCB (reference) and the inspected PCB under various setting. In this work, we also present CD-PCB, a synthesized labeled dataset of 20 pairs of PCB images for evaluation of defect detection algorithms.

In this work we explore the application of AI to robotic welding. Robotic welding is a widely used technology in many industries, but robots currently do not have the capability to detect welding defects which get introduced due to various reasons in the welding process. We describe how deep-learning methods can be applied to detect weld defects in real-time by recording the welding process with microphones and a camera. Our findings are based on a large database with more than 4000 welding samples we collected which covers different weld types, materials and various defect categories. All deep learning models are trained in an unsupervised fashion because the space of possible defects is large and the defects in our data may contain biases. We demonstrate that a reliable real-time detection of most categories of weld defects is feasible both from audio and video, with improvements achieved by combining both modalities. Specifically, the multi-modal approach achieves an average Area-under-ROC-Curve (AUC) of 0.92 over all eleven defect types in our data. We conclude the paper with an analysis of the results by defect type and a discussion of future work.

Industrial anomaly detection is generally addressed as an unsupervised task that aims at locating defects with only normal training samples. Recently, numerous 2D anomaly detection methods have been proposed and have achieved promising results, however, using only the 2D RGB data as input is not sufficient to identify imperceptible geometric surface anomalies. Hence, in this work, we focus on multi-modal anomaly detection. Specifically, we investigate early multi-modal approaches that attempted to utilize models pre-trained on large-scale visual datasets, i.e., ImageNet, to construct feature databases. And we empirically find that directly using these pre-trained models is not optimal, it can either fail to detect subtle defects or mistake abnormal features as normal ones. This may be attributed to the domain gap between target industrial data and source data.Towards this problem, we propose a Local-to-global Self-supervised Feature Adaptation (LSFA) method to finetune the adaptors and learn task-oriented representation toward anomaly detection.Both intra-modal adaptation and cross-modal alignment are optimized from a local-to-global perspective in LSFA to ensure the representation quality and consistency in the inference stage.Extensive experiments demonstrate that our method not only brings a significant performance boost to feature embedding based approaches, but also outperforms previous State-of-The-Art (SoTA) methods prominently on both MVTec-3D AD and Eyecandies datasets, e.g., LSFA achieves 97.1% I-AUROC on MVTec-3D, surpass previous SoTA by +3.4%.

In recent years, the deterioration of artificial materials used in structures has become a serious social issue, increasing the importance of inspections. Non-destructive testing is gaining increased demand due to its capability to inspect for defects and deterioration in structures while preserving their functionality. Among these, Laser Ultrasonic Visualization Testing (LUVT) stands out because it allows the visualization of ultrasonic propagation. This makes it visually straightforward to detect defects, thereby enhancing inspection efficiency. With the increasing number of the deterioration structures, challenges such as a shortage of inspectors and increased workload in non-destructive testing have become more apparent. Efforts to address these challenges include exploring automated inspection using machine learning. However, the lack of anomalous data with defects poses a barrier to improving the accuracy of automated inspection through machine learning. Therefore, in this study, we propose a method for automated LUVT inspection using an anomaly detection approach with a diffusion model that can be trained solely on negative examples (defect-free data). We experimentally confirmed that our proposed method improves defect detection and localization compared to general object detection algorithms used previously.

Unsupervised texture anomaly detection has been a concerning topic in a vast amount of industrial processes. Patterned textures inspection, particularly in the context of fabric defect detection, is indeed a widely encountered use case. This task involves handling a diverse spectrum of colors and textile types, encompassing a wide range of fabrics. Given the extensive variability in colors, textures, and defect types, fabric defect detection poses a complex and challenging problem in the field of patterned textures inspection. In this article, we propose a knowledge distillation-based approach tailored specifically for addressing the challenge of unsupervised anomaly detection in textures resembling fabrics. Our method aims to redefine the recently introduced reverse distillation approach, which advocates for an encoder-decoder design to mitigate classifier bias and to prevent the student from reconstructing anomalies. In this study, we present a new reverse distillation technique for the specific task of fabric defect detection. Our approach involves a meticulous design selection that strategically highlights high-level features. To demonstrate the capabilities of our approach both in terms of performance and inference speed, we conducted a series of experiments on multiple texture datasets, including MVTEC AD, AITEX, and TILDA, alongside conducting experiments on a dataset acquired from a textile manufacturing facility. The main contributions of this paper are the following: a robust texture anomaly detector utilizing a reverse knowledge-distillation technique suitable for both anomaly detection and domain generalization and a novel dataset encompassing a diverse range of fabrics and defects.

Addressing the uncertainty and variability in the quality of 3D printed metals can further the wide spread use of this technology. Process mapping for new alloys is crucial for determining optimal process parameters that consistently produce acceptable printing quality. Process mapping is typically performed by conventional methods and is used for the design of experiments and ex situ characterization of printed parts. On the other hand, in situ approaches are limited because their observable features are limited and they require complex high-cost setups to obtain temperature measurements to boost accuracy. Our method relaxes these limitations by incorporating the temporal features of molten metal dynamics during laser-metal interactions using video vision transformers and high-speed imaging. Our approach can be used in existing commercial machines and can provide in situ process maps for efficient defect and variability quantification. The generalizability of the approach is demonstrated by performing cross-dataset evaluations on alloys with different compositions and intrinsic thermofluid properties.

In recent years, the wood product industry has been facing a skilled labor shortage. The result is more frequent sudden failures, resulting in additional costs for these companies already operating in a very competitive market. Moreover, sawmills are challenging environments for machinery and sensors. Given that experienced machine operators may be able to diagnose defects or malfunctions, one possible way of assisting novice operators is through acoustic monitoring. As a step towards the automation of wood-processing equipment and decision support systems for machine operators, in this paper, we explore using a deep convolutional autoencoder for acoustic anomaly detection of wood planers on a new real-life dataset. Specifically, our convolutional autoencoder with skip connections (Skip-CAE) and our Skip-CAE transformer outperform the DCASE autoencoder baseline, one-class SVM, isolation forest and a published convolutional autoencoder architecture, respectively obtaining an area under the ROC curve of 0.846 and 0.875 on a dataset of real-factory planer sounds. Moreover, we show that adding skip connections and attention mechanism under the form of a transformer encoder-decoder helps to further improve the anomaly detection capabilities.

To enable automatic disassembly of different product types with uncertain conditions and degrees of wear in remanufacturing, agile production systems that can adapt dynamically to changing requirements are needed. Machine learning algorithms can be employed due to their generalization capabilities of learning from various types and variants of products. However, in reality, datasets with a diversity of samples that can be used to train models are difficult to obtain in the initial period. This may cause bad performances when the system tries to adapt to new unseen input data in the future. In order to generate large datasets for different learning purposes, in our project, we present a Blender add-on named MotorFactory to generate customized mesh models of various motor instances. MotorFactory allows to create mesh models which, complemented with additional add-ons, can be further used to create synthetic RGB images, depth images, normal images, segmentation ground truth masks, and 3D point cloud datasets with point-wise semantic labels. The created synthetic datasets may be used for various tasks including motor type classification, object detection for decentralized material transfer tasks, part segmentation for disassembly and handling tasks, or even reinforcement learning-based robotics control or view-planning.

Printed Circuit Boards are the foundation for the functioning of any electronic device, and therefore are an essential component for various industries such as automobile, communication, computation, etc. However, one of the challenges faced by the PCB manufacturers in the process of manufacturing of the PCBs is the faulty placement of its components including missing components. In the present scenario the infrastructure required to ensure adequate quality of the PCB requires a lot of time and effort. The authors present a novel solution for detecting missing components and classifying them in a resourceful manner. The presented algorithm focuses on pixel theory and object detection, which has been used in combination to optimize the results from the given dataset.

In recent years, Printed Circuit Boards (PCB) have become the backbone of a large number of consumer electronic devices leading to a surge in their production. This has made it imperative to employ automatic inspection systems to identify manufacturing defects in PCB before they are installed in the respective systems. An important task in this regard is the classification of defects as either true or pseudo defects, which decides if the PCB is to be re-manufactured or not. This work proposes a novel approach to detect most common defects in the PCBs. The problem has been approached by employing highly discriminative features based on multi-scale wavelet transform, which are further boosted by using a kernalized version of the support vector machines (SVM). A real world printed circuit board dataset has been used for quantitative analysis. Experimental results demonstrated the efficacy of the proposed method.

This paper studies zero-shot anomaly classification (AC) and segmentation (AS) in industrial vision. We reveal that the abundant normal and abnormal cues implicit in unlabeled test images can be exploited for anomaly determination, which is ignored by prior methods. Our key observation is that for the industrial product images, the normal image patches could find a relatively large number of similar patches in other unlabeled images, while the abnormal ones only have a few similar patches. We leverage such a discriminative characteristic to design a novel zero-shot AC/AS method by Mutual Scoring (MuSc) of the unlabeled images, which does not need any training or prompts. Specifically, we perform Local Neighborhood Aggregation with Multiple Degrees (LNAMD) to obtain the patch features that are capable of representing anomalies in varying sizes. Then we propose the Mutual Scoring Mechanism (MSM) to leverage the unlabeled test images to assign the anomaly score to each other. Furthermore, we present an optimization approach named Re-scoring with Constrained Image-level Neighborhood (RsCIN) for image-level anomaly classification to suppress the false positives caused by noises in normal images. The superior performance on the challenging MVTec AD and VisA datasets demonstrates the effectiveness of our approach. Compared with the state-of-the-art zero-shot approaches, MuSc achieves a 21.1% PRO absolute gain (from 72.7% to 93.8%) on MVTec AD, a 19.4% pixel-AP gain and a 14.7% pixel-AUROC gain on VisA. In addition, our zero-shot approach outperforms most of the few-shot approaches and is comparable to some one-class methods. Code is available at https://github.com/xrli-U/MuSc.

Automated detection of defects in Printed Circuit Board (PCB) manufacturing using Solder Paste Inspection (SPI) and Automated Optical Inspection (AOI) machines can help improve operational efficiency and significantly reduce the need for manual intervention. In this paper, using SPI-extracted features of 6 million pins, we demonstrate a data-centric approach to train Machine Learning (ML) models to detect PCB defects at three stages of PCB manufacturing. The 6 million PCB pins correspond to 2 million components that belong to 15,387 PCBs. Using a base extreme gradient boosting (XGBoost) ML model, we iterate on the data pre-processing step to improve detection performance. Combining pin-level SPI features using component and PCB IDs, we developed training instances also at the component and PCB level. This allows the ML model to capture any inter-pin, inter-component, or spatial effects that may not be apparent at the pin level. Models are trained at the pin, component, and PCB levels, and the detection results from the different models are combined to identify defective components.

In MRI, motion artefacts are among the most common types of artefacts. They can degrade images and render them unusable for accurate diagnosis. Traditional methods, such as prospective or retrospective motion correction, have been proposed to avoid or alleviate motion artefacts. Recently, several other methods based on deep learning approaches have been proposed to solve this problem. This work proposes to enhance the performance of existing deep learning models by the inclusion of additional information present as image priors. The proposed approach has shown promising results and will be further investigated for clinical validity.

Large Vision-Language Models (LVLMs) such as MiniGPT-4 and LLaVA have demonstrated the capability of understanding images and achieved remarkable performance in various visual tasks. Despite their strong abilities in recognizing common objects due to extensive training datasets, they lack specific domain knowledge and have a weaker understanding of localized details within objects, which hinders their effectiveness in the Industrial Anomaly Detection (IAD) task. On the other hand, most existing IAD methods only provide anomaly scores and necessitate the manual setting of thresholds to distinguish between normal and abnormal samples, which restricts their practical implementation. In this paper, we explore the utilization of LVLM to address the IAD problem and propose AnomalyGPT, a novel IAD approach based on LVLM. We generate training data by simulating anomalous images and producing corresponding textual descriptions for each image. We also employ an image decoder to provide fine-grained semantic and design a prompt learner to fine-tune the LVLM using prompt embeddings. Our AnomalyGPT eliminates the need for manual threshold adjustments, thus directly assesses the presence and locations of anomalies. Additionally, AnomalyGPT supports multi-turn dialogues and exhibits impressive few-shot in-context learning capabilities. With only one normal shot, AnomalyGPT achieves the state-of-the-art performance with an accuracy of 86.1%, an image-level AUC of 94.1%, and a pixel-level AUC of 95.3% on the MVTec-AD dataset. Code is available at https://github.com/CASIA-IVA-Lab/AnomalyGPT.

Anomaly detection is the task of identifying examples that do not behave as expected. Because anomalies are rare and unexpected events, collecting real anomalous examples is often challenging in several applications. In addition, learning an anomaly detector with limited (or no) anomalies often yields poor prediction performance. One option is to employ auxiliary synthetic anomalies to improve the model training. However, synthetic anomalies may be of poor quality: anomalies that are unrealistic or indistinguishable from normal samples may deteriorate the detector's performance. Unfortunately, no existing methods quantify the quality of auxiliary anomalies. We fill in this gap and propose the expected anomaly posterior (EAP), an uncertainty-based score function that measures the quality of auxiliary anomalies by quantifying the total uncertainty of an anomaly detector. Experimentally on 40 benchmark datasets of images and tabular data, we show that EAP outperforms 12 adapted data quality estimators in the majority of cases.

Unsupervised anomaly in industry has been a concerning topic and a stepping stone for high performance industrial automation process. The vast majority of industry-oriented methods focus on learning from good samples to detect anomaly notwithstanding some specific industrial scenario requiring even less specific training and therefore a generalization for anomaly detection. The obvious use case is the fabric anomaly detection, where we have to deal with a really wide range of colors and types of textile and a stoppage of the production line for training could not be considered. In this paper, we propose an automation process for industrial fabric texture defect detection with a specificity-learning process during the domain-generalized anomaly detection. Combining the ability to generalize and the learning process offer a fast and precise anomaly detection and segmentation. The main contributions of this paper are the following: A domain-generalization texture anomaly detection method achieving the state-of-the-art performances, a fast specific training on good samples extracted by the proposed method, a self-evaluation method based on custom defect creation and an automatic detection of already seen fabric to prevent re-training.

Autoencoders have been proposed as a powerful tool for model-independent anomaly detection in high-energy physics. The operating principle is that events which do not belong to the space of training data will be reconstructed poorly, thus flagging them as anomalies. We point out that in a variety of examples of interest, the connection between large reconstruction error and anomalies is not so clear. In particular, for data sets with nontrivial topology, there will always be points that erroneously seem anomalous due to global issues. Conversely, neural networks typically have an inductive bias or prior to locally interpolate such that undersampled or rare events may be reconstructed with small error, despite actually being the desired anomalies. Taken together, these facts are in tension with the simple picture of the autoencoder as an anomaly detector. Using a series of illustrative low-dimensional examples, we show explicitly how the intrinsic and extrinsic topology of the dataset affects the behavior of an autoencoder and how this topology is manifested in the latent space representation during training. We ground this analysis in the discussion of a mock "bump hunt" in which the autoencoder fails to identify an anomalous "signal" for reasons tied to the intrinsic topology of n-particle phase space.

Multivariate time series data for real-world applications typically contain a significant amount of missing values. The dominant approach for classification with such missing values is to impute them heuristically with specific values (zero, mean, values of adjacent time-steps) or learnable parameters. However, these simple strategies do not take the data generative process into account, and more importantly, do not effectively capture the uncertainty in prediction due to the multiple possibilities for the missing values. In this paper, we propose a novel probabilistic framework for classification with multivariate time series data with missing values. Our model consists of two parts; a deep generative model for missing value imputation and a classifier. Extending the existing deep generative models to better capture structures of time-series data, our deep generative model part is trained to impute the missing values in multiple plausible ways, effectively modeling the uncertainty of the imputation. The classifier part takes the time series data along with the imputed missing values and classifies signals, and is trained to capture the predictive uncertainty due to the multiple possibilities of imputations. Importantly, we show that na\"ively combining the generative model and the classifier could result in trivial solutions where the generative model does not produce meaningful imputations. To resolve this, we present a novel regularization technique that can promote the model to produce useful imputation values that help classification. Through extensive experiments on real-world time series data with missing values, we demonstrate the effectiveness of our method.

3D perception, especially point cloud classification, has achieved substantial progress. However, in real-world deployment, point cloud corruptions are inevitable due to the scene complexity, sensor inaccuracy, and processing imprecision. In this work, we aim to rigorously benchmark and analyze point cloud classification under corruptions. To conduct a systematic investigation, we first provide a taxonomy of common 3D corruptions and identify the atomic corruptions. Then, we perform a comprehensive evaluation on a wide range of representative point cloud models to understand their robustness and generalizability. Our benchmark results show that although point cloud classification performance improves over time, the state-of-the-art methods are on the verge of being less robust. Based on the obtained observations, we propose several effective techniques to enhance point cloud classifier robustness. We hope our comprehensive benchmark, in-depth analysis, and proposed techniques could spark future research in robust 3D perception.

Machine learning (ML) has become a ubiquitous tool across various domains of data mining and big data analysis. The efficacy of ML models depends heavily on high-quality datasets, which are often complicated by the presence of missing values. Consequently, the performance and generalization of ML models are at risk in the face of such datasets. This paper aims to examine the nuanced impact of missing values on ML workflows, including their types, causes, and consequences. Our analysis focuses on the challenges posed by missing values, including biased inferences, reduced predictive power, and increased computational burdens. The paper further explores strategies for handling missing values, including imputation techniques and removal strategies, and investigates how missing values affect model evaluation metrics and introduces complexities in cross-validation and model selection. The study employs case studies and real-world examples to illustrate the practical implications of addressing missing values. Finally, the discussion extends to future research directions, emphasizing the need for handling missing values ethically and transparently. The primary goal of this paper is to provide insights into the pervasive impact of missing values on ML models and guide practitioners toward effective strategies for achieving robust and reliable model outcomes.

Visual anomaly classification and segmentation are vital for automating industrial quality inspection. The focus of prior research in the field has been on training custom models for each quality inspection task, which requires task-specific images and annotation. In this paper we move away from this regime, addressing zero-shot and few-normal-shot anomaly classification and segmentation. Recently CLIP, a vision-language model, has shown revolutionary generality with competitive zero-/few-shot performance in comparison to full-supervision. But CLIP falls short on anomaly classification and segmentation tasks. Hence, we propose window-based CLIP (WinCLIP) with (1) a compositional ensemble on state words and prompt templates and (2) efficient extraction and aggregation of window/patch/image-level features aligned with text. We also propose its few-normal-shot extension WinCLIP+, which uses complementary information from normal images. In MVTec-AD (and VisA), without further tuning, WinCLIP achieves 91.8%/85.1% (78.1%/79.6%) AUROC in zero-shot anomaly classification and segmentation while WinCLIP+ does 93.1%/95.2% (83.8%/96.4%) in 1-normal-shot, surpassing state-of-the-art by large margins.

Autoencoders were widely used in many machine learning tasks thanks to their strong learning ability which has drawn great interest among researchers in the field of outlier detection. However, conventional autoencoder-based methods lacked considerations in two aspects. This limited their performance in outlier detection. First, the mean squared error used in conventional autoencoders ignored the judgment uncertainty of the autoencoder, which limited their representation ability. Second, autoencoders suffered from the abnormal reconstruction problem: some outliers can be unexpectedly reconstructed well, making them difficult to identify from the inliers. To mitigate the aforementioned issues, two novel methods were proposed in this paper. First, a novel loss function named Probabilistic Reconstruction Error (PRE) was constructed to factor in both reconstruction bias and judgment uncertainty. To further control the trade-off of these two factors, two weights were introduced in PRE producing Adjustable Probabilistic Reconstruction Error (APRE), which benefited the outlier detection in different applications. Second, a conceptually new outlier scoring method based on mean-shift (MSS) was proposed to reduce the false inliers caused by the autoencoder. Experiments on 32 real-world outlier detection datasets proved the effectiveness of the proposed methods. The combination of the proposed methods achieved 41% of the relative performance improvement compared to the best baseline. The MSS improved the performance of multiple autoencoder-based outlier detectors by an average of 20%. The proposed two methods have the potential to advance autoencoder's development in outlier detection. The code is available on www.OutlierNet.com for reproducibility.

This paper addresses a regression problem in which output label values are the results of sensing the magnitude of a phenomenon. A low value of such labels can mean either that the actual magnitude of the phenomenon was low or that the sensor made an incomplete observation. This leads to a bias toward lower values in labels and the resultant learning because labels may have lower values due to incomplete observations, even if the actual magnitude of the phenomenon was high. Moreover, because an incomplete observation does not provide any tags indicating incompleteness, we cannot eliminate or impute them. To address this issue, we propose a learning algorithm that explicitly models incomplete observations corrupted with an asymmetric noise that always has a negative value. We show that our algorithm is unbiased as if it were learned from uncorrupted data that does not involve incomplete observations. We demonstrate the advantages of our algorithm through numerical experiments.

While data are the primary fuel for machine learning models, they often suffer from missing values, especially when collected in real-world scenarios. However, many off-the-shelf machine learning models, including artificial neural network models, are unable to handle these missing values directly. Therefore, extra data preprocessing and curation steps, such as data imputation, are inevitable before learning and prediction processes. In this study, we propose a simple and intuitive yet effective method for pruning missing values (PROMISSING) during learning and inference steps in neural networks. In this method, there is no need to remove or impute the missing values; instead, the missing values are treated as a new source of information (representing what we do not know). Our experiments on simulated data, several classification and regression benchmarks, and a multi-modal clinical dataset show that PROMISSING results in similar prediction performance compared to various imputation techniques. In addition, our experiments show models trained using PROMISSING techniques are becoming less decisive in their predictions when facing incomplete samples with many unknowns. This finding hopefully advances machine learning models from being pure predicting machines to more realistic thinkers that can also say "I do not know" when facing incomplete sources of information.

Semiconductor lasers have been rapidly evolving to meet the demands of next-generation optical networks. This imposes much more stringent requirements on the laser reliability, which are dominated by degradation mechanisms (e.g., sudden degradation) limiting the semiconductor laser lifetime. Physics-based approaches are often used to characterize the degradation behavior analytically, yet explicit domain knowledge and accurate mathematical models are required. Building such models can be very challenging due to a lack of a full understanding of the complex physical processes inducing the degradation under various operating conditions. To overcome the aforementioned limitations, we propose a new data-driven approach, extracting useful insights from the operational monitored data to predict the degradation trend without requiring any specific knowledge or using any physical model. The proposed approach is based on an unsupervised technique, a conditional variational autoencoder, and validated using vertical-cavity surface-emitting laser (VCSEL) and tunable edge emitting laser reliability data. The experimental results confirm that our model (i) achieves a good degradation prediction and generalization performance by yielding an F1 score of 95.3%, (ii) outperforms several baseline ML based anomaly detection techniques, and (iii) helps to shorten the aging tests by early predicting the failed devices before the end of the test and thereby saving costs

In recent years, the neural implicit surface has emerged as a powerful representation for multi-view surface reconstruction due to its simplicity and state-of-the-art performance. However, reconstructing smooth and detailed surfaces in indoor scenes from multi-view images presents unique challenges. Indoor scenes typically contain large texture-less regions, making the photometric loss unreliable for optimizing the implicit surface. Previous work utilizes monocular geometry priors to improve the reconstruction in indoor scenes. However, monocular priors often contain substantial errors in thin structure regions due to domain gaps and the inherent inconsistencies when derived independently from different views. This paper presents DebSDF to address these challenges, focusing on the utilization of uncertainty in monocular priors and the bias in SDF-based volume rendering. We propose an uncertainty modeling technique that associates larger uncertainties with larger errors in the monocular priors. High-uncertainty priors are then excluded from optimization to prevent bias. This uncertainty measure also informs an importance-guided ray sampling and adaptive smoothness regularization, enhancing the learning of fine structures. We further introduce a bias-aware signed distance function to density transformation that takes into account the curvature and the angle between the view direction and the SDF normals to reconstruct fine details better. Our approach has been validated through extensive experiments on several challenging datasets, demonstrating improved qualitative and quantitative results in reconstructing thin structures in indoor scenes, thereby outperforming previous work.

This paper presents LLM4SecHW, a novel framework for hardware debugging that leverages domain specific Large Language Model (LLM). Despite the success of LLMs in automating various software development tasks, their application in the hardware security domain has been limited due to the constraints of commercial LLMs and the scarcity of domain specific data. To address these challenges, we propose a unique approach to compile a dataset of open source hardware design defects and their remediation steps, utilizing version control data. This dataset provides a substantial foundation for training machine learning models for hardware. LLM4SecHW employs fine tuning of medium sized LLMs based on this dataset, enabling the identification and rectification of bugs in hardware designs. This pioneering approach offers a reference workflow for the application of fine tuning domain specific LLMs in other research areas. We evaluate the performance of our proposed system on various open source hardware designs, demonstrating its efficacy in accurately identifying and correcting defects. Our work brings a new perspective on automating the quality control process in hardware design.

Unsupervised anomaly detection (UAD) aims to find anomalous images by optimising a detector using a training set that contains only normal images. UAD approaches can be based on reconstruction methods, self-supervised approaches, and Imagenet pre-trained models. Reconstruction methods, which detect anomalies from image reconstruction errors, are advantageous because they do not rely on the design of problem-specific pretext tasks needed by self-supervised approaches, and on the unreliable translation of models pre-trained from non-medical datasets. However, reconstruction methods may fail because they can have low reconstruction errors even for anomalous images. In this paper, we introduce a new reconstruction-based UAD approach that addresses this low-reconstruction error issue for anomalous images. Our UAD approach, the memory-augmented multi-level cross-attentional masked autoencoder (MemMC-MAE), is a transformer-based approach, consisting of a novel memory-augmented self-attention operator for the encoder and a new multi-level cross-attention operator for the decoder. MemMCMAE masks large parts of the input image during its reconstruction, reducing the risk that it will produce low reconstruction errors because anomalies are likely to be masked and cannot be reconstructed. However, when the anomaly is not masked, then the normal patterns stored in the encoder's memory combined with the decoder's multi-level cross attention will constrain the accurate reconstruction of the anomaly. We show that our method achieves SOTA anomaly detection and localisation on colonoscopy, pneumonia, and covid-19 chest x-ray datasets.