BAE Systems Controls Endicott United States
Meschter,Stephan J.
Snugovsky,Polina
Driven by legislation resulting from two European Union directives, Reduction of Hazardous Substances RoHS and Waste Electrical and Electronic Equipment Regulation WEEE, most commercial electronics manufacturers began delivering lead-free electronic components, assemblies, and equipment beginning in 2006. The DoD must now include lead-free materials considerations in the evaluation of commercial-off-the-shelf parts and assemblies intended for use in DoD systems. In particular, lead-free tin rich finishes and solder alloys are susceptible to tin whisker growth that can cause electrical short circuits and reduced reliability. This report describes the multi-year testing and modeling program to analyze tin whisker growth on lead-free manufactured assemblies and utilizes whisker short circuit statistical modeling to enable improved reliability assessments.
reliability (electronics)