Explanation: Oxidation provides extreme hard protective coating, thus protecting against contamination and by selective etching, it can be made to fabricate components. 6. Mention the chemical reaction for oxidation process
A. Si + 2H2O –> SiO2 + 2H2
B. Si + O2 –> SiO2
C. 2Si + 2H2O –> 2SiO2 + 2H2
D. 2Si + 2H2O + 2O2 –> 2SiO2 + 2H2 + O2
Answer:A
Explanation: Oxidation provides extreme hard protective coating, thus protecting against contamination and by selective etching, it can be made to fabricate components. 6. Mention the chemical reaction for oxidation process
A. Si + 2H2O –> SiO2 + 2H2 B. Si + O2 –> SiO2 C. 2Si + 2H2O –> 2SiO2 + 2H2 D. 2Si + 2H2O + 2O2 –> 2SiO2 + 2H2 + O2
Explanation: For oxidation process, silicon wafers are heated to a high temperature and simultaneously they are exposed to a gas containing H2O or O2 or both. 7. At what temperature should the oxidation process be carried out to get an oxide film of thickness 0.02 to 2µm?