Explanation: The process of cathode sputtering is performed at a low pressure (about 10-12 torr). So, when the high energy particle landing on the substrate actually results in a very uniform film and adhesion. 6. Which process is used to deposit metals on glass, ceramic and plastic?
A. Silk plating technique
B. Gas plating technique
C. Electroless plating technique
D. Electroplating technique
Answer:A
Explanation: The process of cathode sputtering is performed at a low pressure (about 10-12 torr). So, when the high energy particle landing on the substrate actually results in a very uniform film and adhesion. 6. Which process is used to deposit metals on glass, ceramic and plastic?
A. Silk plating technique B. Gas plating technique C. Electroless plating technique D. Electroplating technique
Explanation: In electroless plating, a metal ion in solution is reduced to the free metal and deposited as a metallic coating without the use of a coating without the use of an electric current. Thus, this process is used in plating on glass, ceramic and plastic. 7. Electroplating technique is suitable for