Explanation: Cathode sputtering and vacuum evaporation uses identical system. However, the process of film deposition in cathode sputtering is slower than evaporation method. Since depositing a micron-thick film takes minutes to hours, compared to seconds to minutes for evaporation. 5. How a uniform film with good crystal structure is attained in cathode sputtering process?
A. By hitting high energy particle directly on the substrate
B. Allowing Less time for the particles to deposit on the substrate
C. High energy particle diffuse through low pressure gas and deposits on the substrate
D. Heavy inert gas is used for film deposition on the substrate
Answer:A
Explanation: Cathode sputtering and vacuum evaporation uses identical system. However, the process of film deposition in cathode sputtering is slower than evaporation method. Since depositing a micron-thick film takes minutes to hours, compared to seconds to minutes for evaporation. 5. How a uniform film with good crystal structure is attained in cathode sputtering process?
A. By hitting high energy particle directly on the substrate B. Allowing Less time for the particles to deposit on the substrate C. High energy particle diffuse through low pressure gas and deposits on the substrate D. Heavy inert gas is used for film deposition on the substrate
Explanation: The process of cathode sputtering is performed at a low pressure (about 10-12 torr). So, when the high energy particle landing on the substrate actually results in a very uniform film and adhesion. 6. Which process is used to deposit metals on glass, ceramic and plastic?