Explanation: Usually the silicon wafer obtained has a very rough surface due to slicing operation. So, these wafers undergo a number of polishing steps to produce flat and smooth polished surface. Therefore, the thickness of wafers will be reduced from its raw cut slice. 12. Which process is used to produce small circuits of micron range on silicon wafer?
A. Photo etching
B. Coordinatograph
C. Photolithography
D. Ion implantation
Answer:A
Explanation: Usually the silicon wafer obtained has a very rough surface due to slicing operation. So, these wafers undergo a number of polishing steps to produce flat and smooth polished surface. Therefore, the thickness of wafers will be reduced from its raw cut slice. 12. Which process is used to produce small circuits of micron range on silicon wafer?
A. Photo etching B. Coordinatograph C. Photolithography D. Ion implantation
Explanation: It is possible to fabricate as many as 10,000 transistors on a 1cmX1cm chip, using photolithography process. 13. Mention the technique used in photolithography process