Explanation: Electrical isolation between the components in monolithic ICs can be achieved by any one of the three isolation techniques dielectric, beam-lead or PN-junction. 9. Monolithic Integrated Circuits exhibits
A. Increase in power consumption
B. Non-matched devices
C. Thermal stability
D. All of the mentioned
Answer:A
Explanation: Electrical isolation between the components in monolithic ICs can be achieved by any one of the three isolation techniques dielectric, beam-lead or PN-junction. 9. Monolithic Integrated Circuits exhibits
A. Increase in power consumption B. Non-matched devices C. Thermal stability D. All of the mentioned
Explanation: Monolithic ICs exhibits good thermal stability because all the components are integrated on the same chip very close to each other. 10. How are thin film hybrid ICs obtained?