Explanation: Aluminium forms low resistance (it is a good conductor of electricity). Therefore, it forms ohmic contact (Semiconductor-metal contact) with p-type silicon and heavily doped n-type silicon. 4. How the aluminium film coating is carried out in metallization process?
A. Heating and pouring aluminium in required place.
B. Aluminium is vacuum evaporated and then condensed
C. Placing the aluminium in required place and then heating it using tungsten
D. None of the mentioned
Answer:A
Explanation: Aluminium forms low resistance (it is a good conductor of electricity). Therefore, it forms ohmic contact (Semiconductor-metal contact) with p-type silicon and heavily doped n-type silicon. 4. How the aluminium film coating is carried out in metallization process?
A. Heating and pouring aluminium in required place. B. Aluminium is vacuum evaporated and then condensed C. Placing the aluminium in required place and then heating it using tungsten D. None of the mentioned
Explanation: Metallization process takes place in Vacuum evaporation chamber, where the material is evaporated by focussing a high power density electron beam. Vapours then hit the substrate and get condensed to form thin film coating. 5. What type of packing is suitable for Integrated Circuits?