Explanation: Ceramic DIP can be used for high temperature and high performance equipment. 2. A Dual-In-Line Package is usually referred to as
A. DIPn
B. nDIP
C. DIPn
D. All of the mentioned
Answer:A
Explanation: Ceramic DIP can be used for high temperature and high performance equipment. 2. A Dual-In-Line Package is usually referred to as
A. DIPn B. nDIP C. DIPn D. All of the mentioned
Explanation: A Dual-In-Line Package is usually referred to as DIPn. Where, n represent the number of pin terminals in the IC. 3. Which type of DIP IC dissipates more heat?