Explanation: Photolithographic involves both processes in sequence. First photographic mask is used for artwork and reduction. Then Photo etching for removal of SiO2 from designed region. 2. How will be the initial artwork done for a normal IC?
A. Smaller than the final dimension of chip
B. Same as that of final dimension of chip
C. Larger than the final dimension of chip
D. None of the mentioned
Answer:A
Explanation: Photolithographic involves both processes in sequence. First photographic mask is used for artwork and reduction. Then Photo etching for removal of SiO2 from designed region. 2. How will be the initial artwork done for a normal IC?
A. Smaller than the final dimension of chip B. Same as that of final dimension of chip C. Larger than the final dimension of chip D. None of the mentioned
Explanation: The initial artwork of an IC is done at a scale several hundred times longer than the final dimensions. This is because for a tiny chip, larger the artwork, more accurate is the final mask. 3. Find the area of artwork done for a monolithic chip of area 30mil × 30mil.