Explanation: For photographic purpose, artwork should not contain any line drawing but must be of alternate clear and opaque region. The red layer can be easily peeled off thus exposing clear areas with a knife edge from regions where impurities have to be diffused. 5. Find the coating material used for photo etching process along with its thickness range.
A. Kodak photoresist (5000-10000Å)
B. Kodak photoresist (1000-5000Å)
C. Kodak photo etchant (1000-5000 Å)
D. Kodak photo etchant (500-1000 Å)
Answer:A
Explanation: For photographic purpose, artwork should not contain any line drawing but must be of alternate clear and opaque region. The red layer can be easily peeled off thus exposing clear areas with a knife edge from regions where impurities have to be diffused. 5. Find the coating material used for photo etching process along with its thickness range.
A. Kodak photoresist (5000-10000Å) B. Kodak photoresist (1000-5000Å) C. Kodak photo etchant (1000-5000 Å) D. Kodak photo etchant (500-1000 Å)
Explanation: The coating material is Kodak photoresist. It is a photosensitive emulsion film coated on wafer to remove SiO2 from desired region. 6. Which type of etching process is preferred to make the photoresist immune to etchants?