Explanation: The flat pack is more reliable and lighter than a comparable DIP package and therefore is suited for airborne application. 5. How a choice is made, if all three package types are available?
A. Based on cost
B. Based on fabrication
C. Based on Experimentation usage
D. All of the mentioned
Answer:A
Explanation: The flat pack is more reliable and lighter than a comparable DIP package and therefore is suited for airborne application. 5. How a choice is made, if all three package types are available?
A. Based on cost B. Based on fabrication C. Based on Experimentation usage D. All of the mentioned
Explanation: When all three packages are available for a specific application, the choice can be made based on the relative cost, ease of fabrication and breadbording the IC. 6. How many temperature grades are available for IC?