Explanation: The coating material is Kodak photoresist. It is a photosensitive emulsion film coated on wafer to remove SiO2 from desired region. 6. Which type of etching process is preferred to make the photoresist immune to etchants?
A. None of the mentioned
B. Wet etching
C. Plasma etching
D. Chemical etching
Answer:A
Explanation: The coating material is Kodak photoresist. It is a photosensitive emulsion film coated on wafer to remove SiO2 from desired region. 6. Which type of etching process is preferred to make the photoresist immune to etchants?
A. None of the mentioned B. Wet etching C. Plasma etching D. Chemical etching
Explanation: Plasma etching is also called as dry etching. The major advantage of dry etching process is that, it is possible to achieve smaller line openings (<1µm) compared to other process. [/expand]