Explanation: The maximum lead available in a metal can IC package is 12. The remaining lead numbers are commonly available in dual-in-line packages. 7. What process is used in semiconductor industry to fabricate Integrated Circuits?
A. Silicon wafer preparation
B. Silicon planar process
C. Epitaxial growth of silicon
D. Photolithography process
Answer:A
Explanation: The maximum lead available in a metal can IC package is 12. The remaining lead numbers are commonly available in dual-in-line packages. 7. What process is used in semiconductor industry to fabricate Integrated Circuits?
A. Silicon wafer preparation B. Silicon planar process C. Epitaxial growth of silicon D. Photolithography process
Explanation: The planar process (Silicon planar technology) in semiconductor industry built individual components. It is the primary process by which Integrated Circuits are built. The other processes are the different steps involved within the planar process. 8. Which semiconductor is most widely used for fabrication of Integrated Circuit?