Aluminium is usually used for metallization of most IC as it offers
A. Relatively a good conductor
B. High resistance
C. Good mechanical bond with silicon
D. Deposition of aluminium film using vacuum deposition
Answer:A
Aluminium is usually used for metallization of most IC as it offers
A. Relatively a good conductor B. High resistance C. Good mechanical bond with silicon D. Deposition of aluminium film using vacuum deposition
Explanation: Aluminium forms low resistance (it is a good conductor of electricity). Therefore, it forms ohmic contact (Semiconductor-metal contact) with p-type silicon and heavily doped n-type silicon. 4. How the aluminium film coating is carried out in metallization process?