Explanation: Metallization process takes place in Vacuum evaporation chamber, where the material is evaporated by focussing a high power density electron beam. Vapours then hit the substrate and get condensed to form thin film coating. 5. What type of packing is suitable for Integrated Circuits?
A. Metal can package
B. Dual-in-line package
C. Ceramic flat package
D. All of the mentioned
Answer:A
Explanation: Metallization process takes place in Vacuum evaporation chamber, where the material is evaporated by focussing a high power density electron beam. Vapours then hit the substrate and get condensed to form thin film coating. 5. What type of packing is suitable for Integrated Circuits?
A. Metal can package B. Dual-in-line package C. Ceramic flat package D. All of the mentioned
Explanation: These packages are the three different possible packages available in Integrated Circuits. Its usage depends upon the number of leads required for application. 6. Metal can IC packages are available in