Explanation: Silicon is abundantly available in the form of sand. It is possible to form superior stable SiO2(Which has superb insulating property). Whereas GaAs is more difficult to grow in crystal form and Ge crystal will be destroyed at high temperature. 9. What will be the next step after slicing (process) silicon wafers?
A. All of the mentioned
B. Lapping
C. Polishing
D. Chemical
Answer:A
Explanation: Silicon is abundantly available in the form of sand. It is possible to form superior stable SiO2(Which has superb insulating property). Whereas GaAs is more difficult to grow in crystal form and Ge crystal will be destroyed at high temperature. 9. What will be the next step after slicing (process) silicon wafers?
A. All of the mentioned B. Lapping C. Polishing D. Chemical
Explanation: When the silicon ingots are sliced for the given industrial dimension. It gives a rough surface and thus undergo lapping, polishing and chemical processing steps to get a smooth surface. 10. During ion implantation process (before the ion strike the wafer) the accelerated ions are passed through