Explanation: The maximum lead available in a metal can IC package is 12. The remaining lead numbers are commonly available in dual-in-line packages. 7. What process is used in semiconductor industry to fabricate Integrated Circuits?
A. Silicon wafer preparation
B. Silicon planar process
C. Epitaxial growth of silicon
D. Photolithography process
Answer:A
Explanation: The maximum lead available in a metal can IC package is 12. The remaining lead numbers are commonly available in dual-in-line packages. 7. What process is used in semiconductor industry to fabricate Integrated Circuits?
A. Silicon wafer preparation B. Silicon planar process C. Epitaxial growth of silicon D. Photolithography process