Explanation: Usually the silicon wafer obtained has a very rough surface due to slicing operation. So, these wafers undergo a number of polishing steps to produce flat and smooth polished surface. Therefore, the thickness of wafers will be reduced from its raw cut slice. 12. Which process is used to produce small circuits of micron range on silicon wafer?
A. Photo etching
B. Coordinatograph
C. Photolithography
D. Ion implantation
Answer:A
Explanation: Usually the silicon wafer obtained has a very rough surface due to slicing operation. So, these wafers undergo a number of polishing steps to produce flat and smooth polished surface. Therefore, the thickness of wafers will be reduced from its raw cut slice. 12. Which process is used to produce small circuits of micron range on silicon wafer?
A. Photo etching B. Coordinatograph C. Photolithography D. Ion implantation