Explanation: During crystal pulling process, the seed crystal and the crucible rotate in opposite direction, in order to produce ingots of circular cross section (diameter of 10/15cm normally obtained). 11. If the thickness of wafer after all polishing steps in silicon wafer preparation is 23-40 mils. Find its raw cut slice thickness?
A. 16-32 mils
B. 23-40 mils
C. 8-12 mils
D. None of the mentioned
Answer:A
Explanation: During crystal pulling process, the seed crystal and the crucible rotate in opposite direction, in order to produce ingots of circular cross section (diameter of 10/15cm normally obtained). 11. If the thickness of wafer after all polishing steps in silicon wafer preparation is 23-40 mils. Find its raw cut slice thickness?
A. 16-32 mils B. 23-40 mils C. 8-12 mils D. None of the mentioned