Explanation: The process of cathode sputtering is performed at a low pressure (about 10-12 torr). So, when the high energy particle landing on the substrate actually results in a very uniform film and adhesion. 6. Which process is used to deposit metals on glass, ceramic and plastic?
A. Silk plating technique
B. Gas plating technique
C. Electroless plating technique
D. Electroplating technique
Answer:A
Explanation: The process of cathode sputtering is performed at a low pressure (about 10-12 torr). So, when the high energy particle landing on the substrate actually results in a very uniform film and adhesion. 6. Which process is used to deposit metals on glass, ceramic and plastic?
A. Silk plating technique B. Gas plating technique C. Electroless plating technique D. Electroplating technique