Raytek has established the capabilities of electrical characterizations to work closely with our customers for RDL RLC extraction to optimize the design work. Our team has abundant experience in serving customers. Raytek is developing the capabilities of signal integrity (SI) and power integrity (PI), thermal, mechanical, which covers thermal resistance (still air & forced air environments), package-level mechanical stress analysis, board-level solder fatigue, and drop test analysis for FOWLP development.