2049
CWE-1248: Semiconductor Defects in Hardware Logic with Security-Sensitive
Implications
Weakness ID : 1248
Structure : Simple
Abstraction : Base
Description
The security-sensitive hardware module contains semiconductor defects.
Extended Description
A semiconductor device can fail for various reasons. While some are manufacturing and packaging
defects, the rest are due to prolonged use or usage under extreme conditions. Some mechanisms
that lead to semiconductor defects include encapsulation failure, die-attach failure, wire-bond
failure, bulk-silicon defects, oxide-layer faults, aluminum-metal faults (including electromigration,
corrosion of aluminum, etc.), and thermal/electrical stress. These defects manifest as faults on
chip-internal signals or registers, have the effect of inputs, outputs, or intermediate signals being
always 0 or always 1, and do not switch as expected. If such faults occur in security-sensitive
hardware modules, the security objectives of the hardware module may be compromised.
Relationships
The table(s) below shows the weaknesses and high level categories that are related to this
weakness. These relationships are defined as ChildOf, ParentOf, MemberOr and give insight to
similar items that may exist at higher and lower levels of abstraction. In addition, relationships such
as PeerOf and CanAlsoBe are defined to show similar weaknesses that may want to be explored.
Relevant to the view "Research Concepts" (CWE-1000)
Nature Type ID Name Page
ChildOf 693 Protection Mechanism Failure 1520
Applicable Platforms
Language : Not Language-Specific (Prevalence = Undetermined)
Operating_System : Not OS-Specific (Prevalence = Undetermined)
Architecture : Not Architecture-Specific (Prevalence = Undetermined)
Technology : Not Technology-Specific (Prevalence = Undetermined)
Common Consequences
Scope Impact Likelihood
Availability
Access Control
DoS: Instability
Potential Mitigations
Phase: Testing
While semiconductor-manufacturing companies implement several mechanisms to continuously
improve the semiconductor manufacturing process to ensure reduction of defects, some defects
can only be fixed after manufacturing. Post-manufacturing testing of silicon die is critical. Fault
models such as stuck-at-0 or stuck-at-1 must be used to develop post-manufacturing test cases
and achieve good coverage. Once the silicon packaging is done, extensive post-silicon testing
must be performed to ensure that hardware logic implementing security functionalities is defectfree.
Phase: Operation
Operating the hardware outside device specification, such as at extremely high temperatures,
voltage, etc., accelerates semiconductor degradation and results in defects. When these defects
CWE Version 4.14
CWE-1249: Application-Level Admin Tool with Inconsistent View of Underlying Operating System
CWE-1249: Application-Level Admin Tool with
Inconsistent View of Underlying Operating System 2050
manifest as faults in security-critical, hardware modules, it results in compromise of security
guarantees. Thus, operating the device within the specification is important.
Demonstrative Examples
Example 1:
The network-on-chip implements a firewall for access control to peripherals from all IP cores
capable of mastering transactions.
Example Language: Other (Bad)
A manufacturing defect in this logic manifests itself as a logical fault, which always sets the output of the filter to "allow"
access.
Post-manufacture testing must be performed to ensure that hardware logic implementing security
functionalities is defect-free.
MemberOf Relationships
This MemberOf relationships table shows additional CWE Catgeories and Views that reference this
weakness as a member. This information is often useful in understanding where a weakness fits
within the context of external information sources.
Nature Type ID Name Page
MemberOf 1195 Manufacturing and Life Cycle Management Concerns 1194 2469
MemberOf 1206 Power, Clock, Thermal, and Reset Concerns 1194 2473
MemberOf 1388 Physical Access Issues and Concerns 1194 2518
MemberOf 1413 Comprehensive Categorization: Protection Mechanism
Failure
1400 2542
Related Attack Patterns
CAPEC-ID Attack Pattern Name
624 Hardware Fault Injection
625 Mobile Device Fault Injection
References
[REF-1067]Brian Bailey. "Why Chips Die". < https://semiengineering.com/why-chips-die/ >.
[REF-1068]V. Lakshminarayan. "What causes semiconductor devices to fail". < Original
>.2023-04-07.
CWE-1249: Application-Level Admin Tool with Inconsistent View of Underlying
Operating System
Weakness ID : 1249
Structure : Simple
Abstraction : Base
Description
The product provides an application for administrators to manage parts of the underlying operating
system, but the application does not accurately identify all of the relevant entities or resources that
exist in the OS; that is, the application's model of the OS's state is inconsistent with the OS's actual
state.
Extended Description
Many products provide web-based applications or other interfaces for managing the underlying
operating system. This is common with cloud, network access devices, home networking, and other
CWE Version 4.14
CWE-1249: Application-Level Admin Tool with Inconsistent View of Underlying Operating System
CWE-1249: Application-Level Admin Tool with
Inconsistent View of Underlying Operating System