What might the rapid diffusion of coating metal into tin solder leave in the surface coating?
Other platings used are OSP (organic surface protectant), immersion silver (IAg), immersion tin, electroless nickel with immersion gold coating (ENIG), electroless nickel electroless palladium immersion gold (ENEPIG) and direct gold plating (over nickel). Edge connectors, placed along one edge of some boards, are often nickel plated then gold plated. Another coating consideration is rapid diffusion of coating metal into Tin solder. Tin forms intermetallics such as Cu5Sn6 and Ag3Cu that dissolve into the Tin liquidus or solidus(@50C), stripping surface coating or leaving voids.