In 1972, C.W. Horsting of the RCA Corporation published a paper which reported test results on the reliability of semiconductor devices in which the connections were made using aluminium wires bonded ultrasonically to gold plated posts. His paper demonstrated the importance of the Kirkendall effect in wire bonding technology, but also showed the significant contribution of any impurities present to the rate at which precipitation occurred at the wire bonds. Two of the important contaminants that have this effect, known as Horsting effect (Horsting voids) are fluorine and chlorine. Both Kirkendall voids and Horsting voids are known causes of wire bond fractures, though historically this cause is often confused with the purple colored appearance of one of the five different gold-aluminium intermetallics, commonly referred to as "purple plague" and less often "white plague".