Components with more connections cannot be removed intact in the way described above unless the wire leads are long and flexible enough to be pulled out one by one. For a component such as a Dual-Inline Package (DIP), the pins are too short to pull out, and solder melted on one joint will solidify before another can be melted. A technique sometimes used is the use of a large soldering-iron tip designed to melt the solder on all pins at once; different tips are required for different packages. The component is removed while the solder is molten, most easily by a spring-loaded puller attached to it before heating.