Another way to remove these devices is to use Field's metal, an alloy which melts at around 140 °F (62 °C), lower than the boiling point of water. The metal is melted into the solder joints of the device, where it remains liquid even once cooled down to room temperature, and the chip can simply be lifted off the board. This has the advantage of not damaging the PCB or the IC, although the solder joints must be carefully cleaned of any remaining Field's metal to maintain solder joint strength after resoldering.