The Pentium Pro (up to 512 KB cache) is packaged in a ceramic multi-chip module (MCM). The MCM contains two underside cavities in which the microprocessor die and its companion cache die reside. The dies are bonded to a heat slug, whose exposed top helps the heat from the dies to be transferred more directly to cooling apparatus such as a heat sink. The dies are connected to the package using conventional wire bonding. The cavities are capped with a ceramic plate.