Bonding is the third and final process required to complete an ACF assembly. In the first two processes the temperatures can range from ambient to 100 °C, with the heat applied for 1 second or less. For bonding, the amount of thermal energy required is higher due to the need to first flow the adhesive and allow the two sides to come together into electrical contact, and then to cure the adhesive and create a lasting reliable bond. The temperatures, times, and pressure required for these processes can vary as shown in the following table.