As of 2020, Samsung and TSMC are the only companies who have used EUV in production, mainly targeting 5nm. At IEDM 2019, TSMC reported use of EUV for 5nm in contact, via, metal line, and cut layers, where the cuts can be applied to fins, gates or metal lines. At IEDM 2020, TSMC reported their 5nm minimum metal pitch to be reduced 30% from that of 7nm, which was 40 nm. Samsung's 5nm is lithographically the same design rule as 7nm, with a minimum metal pitch of 36 nm.