Realization of mixed-signal functionality requires from manufacturing technologies additionally to traditional active (various transistors) also options and modelling understanding to realize well performing passive elements like coils, capacitors and resistors on the same chip with digital functionality. High voltage transistors might be needed in the power management functions on the same chip with digital functionality possibly with a low power CMOS processor system. Some advanced mixed signal technologies may enable even analog sensor elements like pressure sensors or imaging diodes on the same chip with analog digital converter. Typically mixed-signal ICs are not necessarily needing fastest digital performance but need more mature models of active and passive elements for more accurate simulations and verification like for testability planning and reliability estimations. Therefore mixed-signal circuits are typically realized with larger line widths than highest speed and most dense digital logic, and the implementation technologies can be 2-4 nodes behind the latest digital implementation technologies. Additionally mixed signal processing may need passive elements like resistors, capacitors and coils, which may require specific metal or dielectric layers or similar. Because of these specific requirements the manufacturers of mixed signal devices foundries can be different from the digital IC manufacturers or foundries.