The force from the load plate ensures that the processor is completely level, giving the CPU's upper surface optimal contact with the heat sink or cold-water block fixed onto the top of the CPU to carry away the heat generated by the CPU. This socket also introduces a new method of connecting the heat dissipation interface to the chip surface and motherboard. With LGA 775, the heat dissipation interface is connected directly to the motherboard on four points, compared with the two connections of the Socket 370 and the "clamshell" four-point connection of the Socket 478.