The mixture at the dip point of the diagram is called a eutectic alloy. Lead-tin mixtures formulated at that point (37/63 mixture) are useful when soldering electronic components, particularly if done manually, since the solid phase is quickly entered as the solder cools. In contrast, when lead-tin mixtures were used to solder seams in automobile bodies a pasty state enabled a shape to be formed with a wooden paddle or tool, so a 70-30 lead to tin ratio was used. (Lead is being removed from such applications owing to its toxicity and consequent difficulty in recycling devices and components that include lead.)