The current specification HTX 3.1 remained competitive for 2014 high-speed (2666 and 3200 MT/s or about 10.4 GB/s and 12.8 GB/s) DDR4 RAM and slower (around 1 GB/s [http://www.extremetech.com/computing/175283-sandisk-announces-ulltra-dimms-terabytes-of-low-latency-flash-storage-directly-off-the-ram-channel] similar to high end PCIe SSDs ULLtraDIMM flash RAM) technology—a wider range of RAM speeds on a common CPU bus than any Intel front-side bus. Intel technologies require each speed range of RAM to have its own interface, resulting in a more complex motherboard layout but with fewer bottlenecks. HTX 3.1 at 26 GB/s can serve as a unified bus for as many as four DDR4 sticks running at the fastest proposed speeds. Beyond that DDR4 RAM may require two or more HTX 3.1 buses diminishing its value as unified transport.