In the 1970s, semiconductors were fabricated on 3 inch (75 mm) diameter silicon wafers. Each wafer could produce 100 to 200 integrated circuit chips or dies. The technical literature would state the length and width of each chip in "mils" (0.001 inch). The current industry practice is to state the chip area. Processing wafers required multiple steps and flaws would appear at various locations on the wafer during each step. The larger the chip the more likely it would encounter a defect. The percentage of working chips, or yield, declined steeply for chips larger than 160 mils (4 mm) on a side.