The target size for the 6800 was 180 mils (4.6 mm) on each side but the final size was 212 mils (5.4 mm) with an area of 29.0 mm2. At 180 mils, a wafer will hold about 190 chips, 212 mils reduces that to 140 chips. At this size the yield may be 20% or 28 chips per wafer. The Motorola 1975 annual report highlights the new MC6800 microprocessor but has several paragraphs on the "MOS yield problems." The yield problem was solved with a design revision started in 1975 to use depletion mode in the M6800 family devices. The 6800 die size was reduced to 160 mils (4 mm) per side with an area of 16.5 mm2. This also allowed faster clock speeds, the MC68A00 would operate at 1.5 MHz and the MC68B00 at 2.0 MHz. The new parts were available in July 1976.