Flat panel dicing using short laser pulses is an important application due to the fact that as the glass substrates become thinner it becomes more difficult to improve the process yield using conventional diamond blade dicing techniques. Using short pulses dicing speeds of over 400 mm/s has been successfully demonstrated on non-alkali glass and borosilicate glass, using a 50 kHz, 5W high-power femtosecond laser. The working principal developed by Kamata et al. is the following. The short pulse laser beam having a wavelength to which the work is transparent is directed to the front surface of the work toward the back surface and focused. A filament in the light beam traveling direction from the beam waist is formed by the auto-focusing action due to the laser beam propagation in the work is formed. The substance in the filament is decomposed by the laser beam and can be discharged from the back surface, and a cavity is formed in the channel. While forming the cavity, the laser beam is scanned, a machined surface is formed, and thereafter the work can be cut with a weak bending stress.