During a first cycle {HEAD ~ any} of the aforementioned conventional chemical vapor deposition methods may be employed to deposit {TAIL ~ the interlayers} 2, 4  
During a first cycle { HEAD ~ any } of the aforementioned conventional chemical vapor deposition methods may be employed to deposit { TAIL ~ the interlayers } 2 , 4
OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH