{TAIL ~ A semiconductor device} that includes a metal substrate including a top surface, {HEAD ~ a bottom surface} and four side surfaces, a conductive pattern insulated from the metal substrate, and a semiconductor element mounted on and electrically connected to the conductive pattern 
{ TAIL ~ A semiconductor device } that includes a metal substrate including a top surface , { HEAD ~ a bottom surface } and four side surfaces , a conductive pattern insulated from the metal substrate , and a semiconductor element mounted on and electrically connected to the conductive pattern
TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH