An object of the present invention is to provide a method for bonding {HEAD ~ a semiconductor structure} with {TAIL ~ a substrate} and a high efficiency photonic device manufactured by using the same method, which are advantageous in increasing the yield, stability, and reliability of products by lowering the bonding temperature and by reducing the chance of oxidation of bonding interface layer by using a composite bonding layer 
An object of the present invention is to provide a method for bonding { HEAD ~ a semiconductor structure } with { TAIL ~ a substrate } and a high efficiency photonic device manufactured by using the same method , which are advantageous in increasing the yield , stability , and reliability of products by lowering the bonding temperature and by reducing the chance of oxidation of bonding interface layer by using a composite bonding layer
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH