In a presently preferred embodiment of the invention, an IC chip is mounted and interconnected with a multilayer printed circuit board, to effect a Level 2 interconnect, without a ceramic chip package, {HEAD ~ soldered wires}, special tooling or {TAIL ~ special labor} 
In a presently preferred embodiment of the invention , an IC chip is mounted and interconnected with a multilayer printed circuit board , to effect a Level 2 interconnect , without a ceramic chip package , { HEAD ~ soldered wires } , special tooling or { TAIL ~ special labor }
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