After that, the semiconductor wafer is cut into {TAIL ~ semiconductor chips} by dicing along the grooves of {HEAD ~ the protective sheet} 
After that , the semiconductor wafer is cut into { TAIL ~ semiconductor chips } by dicing along the grooves of { HEAD ~ the protective sheet }
OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD