{HEAD ~ A semiconductor device} comprising {TAIL ~ a semiconductor element}; a substrate; and a hot melt adhesive sheet bonding the semiconductor element to the substrate, wherein the hot melt adhesive sheet comprises a mixture of a hot melt adhesive and a spacer, wherein the adhesive is selected from a silicone modified epoxy resin adhesive, a silicone adhesive, and a silicone modified polyimide adhesive, and the spacer has the form of particles 
{ HEAD ~ A semiconductor device } comprising { TAIL ~ a semiconductor element } ; a substrate ; and a hot melt adhesive sheet bonding the semiconductor element to the substrate , wherein the hot melt adhesive sheet comprises a mixture of a hot melt adhesive and a spacer , wherein the adhesive is selected from a silicone modified epoxy resin adhesive , a silicone adhesive , and a silicone modified polyimide adhesive , and the spacer has the form of particles
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