The present invention relates to {HEAD ~ conductive particles} for use in conductive adhesives, anisotropic conductive adhesive films, conductive connection structures and the like for mounting circuit boards, and polymer particles used in {TAIL ~ the conductive particles} 
The present invention relates to { HEAD ~ conductive particles } for use in conductive adhesives , anisotropic conductive adhesive films , conductive connection structures and the like for mounting circuit boards , and polymer particles used in { TAIL ~ the conductive particles }
OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL