{HEAD ~ The position} and orientation of the semiconductor chip to be mounted next are determined by means of a first camera and made available in the form of positional data relating to {TAIL ~ a first system} of coordinates 
{ HEAD ~ The position } and orientation of the semiconductor chip to be mounted next are determined by means of a first camera and made available in the form of positional data relating to { TAIL ~ a first system } of coordinates
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH