The resist layer is then removed as is {HEAD ~ the exposed portion} of {TAIL ~ the bulk metal layer}, leaving under bump metallization 160 under conductive bump 165 as shown in FIG 7 
The resist layer is then removed as is { HEAD ~ the exposed portion } of { TAIL ~ the bulk metal layer } , leaving under bump metallization 160 under conductive bump 165 as shown in FIG 7
OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH