In {TAIL ~ the manufacturing process} {HEAD ~ the different distances} between the plates and the wafers are adjusted and maintained via the spacer means comprising the adhesive layers 
In { TAIL ~ the manufacturing process } { HEAD ~ the different distances } between the plates and the wafers are adjusted and maintained via the spacer means comprising the adhesive layers
REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH