{HEAD ~ A method} 4 and further including the substeps of squeezing a solder paste through a plurality of template holes which are aligned with said I/O pads, and partially curing said paste on {TAIL ~ said I/O pads} prior to forming joints with said leads 
{ HEAD ~ A method } 4 and further including the substeps of squeezing a solder paste through a plurality of template holes which are aligned with said I / O pads , and partially curing said paste on { TAIL ~ said I / O pads } prior to forming joints with said leads
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH