In order to have {HEAD ~ a contact} with a terminal on the semiconductor die or other bonding pad site, windows are formed in {TAIL ~ the insulative layer} 
In order to have { HEAD ~ a contact } with a terminal on the semiconductor die or other bonding pad site , windows are formed in { TAIL ~ the insulative layer }
OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL