The method 3 further comprising the step of using a second probe to contact the bond pad proximate {TAIL ~ the first location} to measure {HEAD ~ an electrical property} 
The method 3 further comprising the step of using a second probe to contact the bond pad proximate { TAIL ~ the first location } to measure { HEAD ~ an electrical property }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD