Furthermore, the present invention is related to {TAIL ~ a printed circuit board} for implementing a flip chip and {HEAD ~ the manufacturing method} thereof 
Furthermore , the present invention is related to { TAIL ~ a printed circuit board } for implementing a flip chip and { HEAD ~ the manufacturing method } thereof
OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH