According to {TAIL ~ the object} of the invention, a bonding pad structure comprises {HEAD ~ a substrate} having a bonding region and a sensing region 
According to { TAIL ~ the object } of the invention , a bonding pad structure comprises { HEAD ~ a substrate } having a bonding region and a sensing region
OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH