Gases, e.g., hydrogen or nitrogen can be in the deposited films by creating a background plasma of the desired gas using either RF energy, {HEAD ~ thermionic emission}, or {TAIL ~ consequential ionization} of the gas passing through the arc or around the substrate 
Gases , e.g. , hydrogen or nitrogen can be in the deposited films by creating a background plasma of the desired gas using either RF energy , { HEAD ~ thermionic emission } , or { TAIL ~ consequential ionization } of the gas passing through the arc or around the substrate
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH