The method 1 further comprising forming the feet to accommodate {TAIL ~ respective set volumes} of {HEAD ~ adhesive therebeneath} for attaching the semiconductor heat spreader to a substrate 
The method 1 further comprising forming the feet to accommodate { TAIL ~ respective set volumes } of { HEAD ~ adhesive therebeneath } for attaching the semiconductor heat spreader to a substrate
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH