{HEAD ~ The present invention} relates generally to {TAIL ~ image correction} and inspection technologies, and more particularly to a method and apparatus for correcting ultrafine pattern images as formed on reticles for use in the manufacture of highly integrated semiconductor circuit devices, such as LSI chips 
{ HEAD ~ The present invention } relates generally to { TAIL ~ image correction } and inspection technologies , and more particularly to a method and apparatus for correcting ultrafine pattern images as formed on reticles for use in the manufacture of highly integrated semiconductor circuit devices , such as LSI chips
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