As shown, resin 42 encapsulates semiconductor die 15, {HEAD ~ lead frame pad} 24, wire bonding connections 32, and a portion of {TAIL ~ first leads} 14 
As shown , resin 42 encapsulates semiconductor die 15 , { HEAD ~ lead frame pad } 24 , wire bonding connections 32 , and a portion of { TAIL ~ first leads } 14
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH