As shown, {HEAD ~ resin} 42 encapsulates semiconductor die 15, lead frame pad 24, {TAIL ~ wire bonding connections} 32, and a portion of first leads 14 
As shown , { HEAD ~ resin } 42 encapsulates semiconductor die 15 , lead frame pad 24 , { TAIL ~ wire bonding connections } 32 , and a portion of first leads 14
OTH OTH OTH HEAD HEAD HEAD HEAD HEAD OTH REL OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH