The present invention relates to a method of forming {HEAD ~ polishing pads} used for chemical mechanical planarization , and in particular relates to {TAIL ~ a method} of forming a polishing pad using laser sintering 
The present invention relates to a method of forming { HEAD ~ polishing pads } used for chemical mechanical planarization , and in particular relates to { TAIL ~ a method } of forming a polishing pad using laser sintering
OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH