The method 18, wherein said step of removing portions of the cap wafer between the plurality of cavities and the back surface of the cap wafer further includes the step of grinding the cap wafer from the back surface of the cap wafer until the back surface of the cap wafer reaches {HEAD ~ the plurality} of {TAIL ~ cavities} 
The method 18 , wherein said step of removing portions of the cap wafer between the plurality of cavities and the back surface of the cap wafer further includes the step of grinding the cap wafer from the back surface of the cap wafer until the back surface of the cap wafer reaches { HEAD ~ the plurality } of { TAIL ~ cavities }
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