{HEAD ~ The method} in accordance with the present invention is compatible with {TAIL ~ conventional CMOS fabrication processes} to form a zener diode and a lateral silicon controlled rectifier constituting an on chip ESD protection circuit in a semiconductor substrate 
{ HEAD ~ The method } in accordance with the present invention is compatible with { TAIL ~ conventional CMOS fabrication processes } to form a zener diode and a lateral silicon controlled rectifier constituting an on chip ESD protection circuit in a semiconductor substrate
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