When a semiconductor wafer fixed on a chuck table is surface ground using a cup shaped grinding {TAIL ~ wheel}, the semiconductor wafer is ground toward the center thereof such that the grinding wheel cuts into {HEAD ~ the semiconductor wafer} at the outer peripheral edge thereof and moves away from the semiconductor wafer at the central portion thereof and the ground semiconductor wafer is planarized according to a PACE method 
When a semiconductor wafer fixed on a chuck table is surface ground using a cup shaped grinding { TAIL ~ wheel } , the semiconductor wafer is ground toward the center thereof such that the grinding wheel cuts into { HEAD ~ the semiconductor wafer } at the outer peripheral edge thereof and moves away from the semiconductor wafer at the central portion thereof and the ground semiconductor wafer is planarized according to a PACE method
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