The method comprises steps of: providing a semiconductor structure and a substrate; forming {TAIL ~ a composite bonding layer} on {HEAD ~ the semiconductor structure}; and bonding the substrate with the composite bonding layer on the semiconductor structure to form a composite alloyed bonding layer 
The method comprises steps of : providing a semiconductor structure and a substrate ; forming { TAIL ~ a composite bonding layer } on { HEAD ~ the semiconductor structure } ; and bonding the substrate with the composite bonding layer on the semiconductor structure to form a composite alloyed bonding layer
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH