For this reason, the resist pattern thickening material of the present invention can also be preferably used in forming resist patterns such as a lines & spaces pattern on {HEAD ~ an interconnection layer} of {TAIL ~ a LOGIC LSI} where not only a contact hole pattern but also various sizes of thickened resist patterns are utilized 
For this reason , the resist pattern thickening material of the present invention can also be preferably used in forming resist patterns such as a lines & spaces pattern on { HEAD ~ an interconnection layer } of { TAIL ~ a LOGIC LSI } where not only a contact hole pattern but also various sizes of thickened resist patterns are utilized
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