{HEAD ~ A high frequency module} 1, wherein {TAIL ~ interference preventing grounding patterns} are provided on a surface of the laminate board and between the dielectric layers of the laminate board, and connected to each other through via hole conductors 
{ HEAD ~ A high frequency module } 1 , wherein { TAIL ~ interference preventing grounding patterns } are provided on a surface of the laminate board and between the dielectric layers of the laminate board , and connected to each other through via hole conductors
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