Moreover, {HEAD ~ the curing composition} of the present invention can adhere, by itself or with the aid of a primer, to a wide variety of {TAIL ~ substrates} including glass, porcelain, woods, metals and molded resin substances, and accordingly, can be used as various types of hermetically sealing compositions and adhesive compositions 
Moreover , { HEAD ~ the curing composition } of the present invention can adhere , by itself or with the aid of a primer , to a wide variety of { TAIL ~ substrates } including glass , porcelain , woods , metals and molded resin substances , and accordingly , can be used as various types of hermetically sealing compositions and adhesive compositions
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