The material is preferably {HEAD ~ a curable composition} that is cured to form a strong bond between {TAIL ~ the component and circuit board} 
The material is preferably { HEAD ~ a curable composition } that is cured to form a strong bond between { TAIL ~ the component and circuit board }
OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL