The present invention achieves {HEAD ~ technical advantages} by providing for the accurate prediction of whether or not contact resistance stability of a bond pad, rendered due to a change in process control or {TAIL ~ a current process control}, leads to bond pads that are well suited for subsequent multi probe testing 
The present invention achieves { HEAD ~ technical advantages } by providing for the accurate prediction of whether or not contact resistance stability of a bond pad , rendered due to a change in process control or { TAIL ~ a current process control } , leads to bond pads that are well suited for subsequent multi probe testing
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