The present invention relates to a method for bonding a semiconductor structure with a substrate and a high efficiency photonic device manufactured by using the same method and, more particularly, to a method for bonding {TAIL ~ a semiconductor structure} with a substrate and a manufactured structure by using the same method where the temperature at which a semiconductor is bonded with a substrate can be reduced effectively by means of providing a composite bonding layer on {HEAD ~ the semiconductor structure}, the substrate, or both on the semiconductor structure and the substrate 
The present invention relates to a method for bonding a semiconductor structure with a substrate and a high efficiency photonic device manufactured by using the same method and , more particularly , to a method for bonding { TAIL ~ a semiconductor structure } with a substrate and a manufactured structure by using the same method where the temperature at which a semiconductor is bonded with a substrate can be reduced effectively by means of providing a composite bonding layer on { HEAD ~ the semiconductor structure } , the substrate , or both on the semiconductor structure and the substrate
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