According to the present invention, a polishing pad that is useful for polishing a material to be polished such as a semiconductor wafer at {HEAD ~ good precision} and high polishing efficiency, and {TAIL ~ a cushion} for a polishing pad used for producing the polishing pad 
According to the present invention , a polishing pad that is useful for polishing a material to be polished such as a semiconductor wafer at { HEAD ~ good precision } and high polishing efficiency , and { TAIL ~ a cushion } for a polishing pad used for producing the polishing pad
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