Also, the present invention generally relates to cutting {HEAD ~ very thin materials}, including {TAIL ~ very thin materials} alone and very thin materials present with other components ; thick materials also may be cut 
Also , the present invention generally relates to cutting { HEAD ~ very thin materials } , including { TAIL ~ very thin materials } alone and very thin materials present with other components ; thick materials also may be cut
OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH