The present invention utilizes a nanoindenter type device obtaining mechanical properties as a function of displacement depth and applied load into {HEAD ~ the bond pad surface} to accurately predict {TAIL ~ electrical property stability} of the entire substrate or sample under test 
The present invention utilizes a nanoindenter type device obtaining mechanical properties as a function of displacement depth and applied load into { HEAD ~ the bond pad surface } to accurately predict { TAIL ~ electrical property stability } of the entire substrate or sample under test
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH