{TAIL ~ The present invention} was made in view of these problems, and it is an object of the invention to provide {HEAD ~ a method} of using an ID saw slicing machine for slicing a single crystal ingot into wafers in which the amount of bow is reduced, and also to provide a slicing apparatus for effecting this method 
{ TAIL ~ The present invention } was made in view of these problems , and it is an object of the invention to provide { HEAD ~ a method } of using an ID saw slicing machine for slicing a single crystal ingot into wafers in which the amount of bow is reduced , and also to provide a slicing apparatus for effecting this method
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