In order to have a contact with a terminal on the semiconductor die or other bonding pad site, {HEAD ~ windows} are formed in {TAIL ~ the insulative layer} 
In order to have a contact with a terminal on the semiconductor die or other bonding pad site , { HEAD ~ windows } are formed in { TAIL ~ the insulative layer }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL