The present invention utilizes a nanoindenter type device obtaining mechanical properties as a function of displacement depth and applied load into the bond pad surface to accurately predict electrical property stability of the entire substrate or {TAIL ~ sample} under {HEAD ~ test} 
The present invention utilizes a nanoindenter type device obtaining mechanical properties as a function of displacement depth and applied load into the bond pad surface to accurately predict electrical property stability of the entire substrate or { TAIL ~ sample } under { HEAD ~ test }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD