A wired circuit board has a metal supporting board, a metal foil formed on the metal supporting board to have a thickness of less than 2.0 μm, a first insulating layer formed on {HEAD ~ the metal supporting board} to cover {TAIL ~ the metal foil}, and a conductive pattern formed on the first insulating layer 
A wired circuit board has a metal supporting board , a metal foil formed on the metal supporting board to have a thickness of less than 2.0 μm , a first insulating layer formed on { HEAD ~ the metal supporting board } to cover { TAIL ~ the metal foil } , and a conductive pattern formed on the first insulating layer
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