die bonding a second semiconductor chip smaller in {HEAD ~ the amount} of {TAIL ~ heat generation} than the first semiconductor chip to the second die pad portion, wire bonding external electrode leading out bonding pads of the second semiconductor chip and the outer leads corresponding thereto; and 
die bonding a second semiconductor chip smaller in { HEAD ~ the amount } of { TAIL ~ heat generation } than the first semiconductor chip to the second die pad portion , wire bonding external electrode leading out bonding pads of the second semiconductor chip and the outer leads corresponding thereto ; and
OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH