Furthermore, there is {TAIL ~ no interconnection} fanout between the IC chip contact areas and the ultimate connection to the multilayer circuit board, thus dramatically increasing, by three or four times, the number of IC chips that can be mounted on a single multilayer circuit board or packaged in {HEAD ~ a one dimensional or three dimensional packaging construction} 
Furthermore , there is { TAIL ~ no interconnection } fanout between the IC chip contact areas and the ultimate connection to the multilayer circuit board , thus dramatically increasing , by three or four times , the number of IC chips that can be mounted on a single multilayer circuit board or packaged in { HEAD ~ a one dimensional or three dimensional packaging construction }
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