{HEAD ~ The method} may include mounting a memory package including a second optical window formed at a surface and a built in memory die on a PCB including a first optical window formed at a surface and {TAIL ~ a built in optical waveguide} 
{ HEAD ~ The method } may include mounting a memory package including a second optical window formed at a surface and a built in memory die on a PCB including a first optical window formed at a surface and { TAIL ~ a built in optical waveguide }
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL