{HEAD ~ A further object} is to provide an improved method and {TAIL ~ apparatus} for applying solder paste to thin, brittle substrates in a way that avoids subjecting the substrates to excessive bending and shear stresses that will cause the substrates .to break 
{ HEAD ~ A further object } is to provide an improved method and { TAIL ~ apparatus } for applying solder paste to thin , brittle substrates in a way that avoids subjecting the substrates to excessive bending and shear stresses that will cause the substrates .to break
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