The apparatus also includes {HEAD ~ a second vacuum processing chamber} adapted to perform {TAIL ~ a process} selected from the group consisting of CVD, PVD, sputtering, and etching of a workpiece 
The apparatus also includes { HEAD ~ a second vacuum processing chamber } adapted to perform { TAIL ~ a process } selected from the group consisting of CVD , PVD , sputtering , and etching of a workpiece
OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH