{TAIL ~ The present invention} relates generally to {HEAD ~ a memory module assembly}, and more particularly to a memory module assembly including a clip and a heat sink, where the heat sink is mounted to an electronic component attached on a surface of a printed circuit board of the memory module assembly via the clip 
{ TAIL ~ The present invention } relates generally to { HEAD ~ a memory module assembly } , and more particularly to a memory module assembly including a clip and a heat sink , where the heat sink is mounted to an electronic component attached on a surface of a printed circuit board of the memory module assembly via the clip
TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH