{HEAD ~ The method} 1 further comprising forming {TAIL ~ the feet} to accommodate respective set volumes of adhesive therebeneath for attaching the semiconductor heat spreader to a substrate 
{ HEAD ~ The method } 1 further comprising forming { TAIL ~ the feet } to accommodate respective set volumes of adhesive therebeneath for attaching the semiconductor heat spreader to a substrate
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH