E. laminating the structure at a pressure of {HEAD ~ at least 1000 psi} and {TAIL ~ a temperature} of at least 20° C. and then firing the structure so as to provide a monolithic cofired electronic structure 
E. laminating the structure at a pressure of { HEAD ~ at least 1000 psi } and { TAIL ~ a temperature } of at least 20 ° C. and then firing the structure so as to provide a monolithic cofired electronic structure
OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH