The apparatus also includes {TAIL ~ a second vacuum processing chamber} adapted to perform {HEAD ~ a process} selected from the group consisting of CVD, PVD, sputtering, and etching of a workpiece 
The apparatus also includes { TAIL ~ a second vacuum processing chamber } adapted to perform { HEAD ~ a process } selected from the group consisting of CVD , PVD , sputtering , and etching of a workpiece
OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH