A method for manufacturing a build up multi layer printed circuit board is disclosed in which a YAG laser is used upon the formation of a via {HEAD ~ hole} in the multi layer printed circuit board, such that it can have the following advantages: the manufacturing process would become simple; the component packaging density and freedom for the design of the board would be improved; and {TAIL ~ a high speed} of signal process would be ensured 
A method for manufacturing a build up multi layer printed circuit board is disclosed in which a YAG laser is used upon the formation of a via { HEAD ~ hole } in the multi layer printed circuit board , such that it can have the following advantages : the manufacturing process would become simple ; the component packaging density and freedom for the design of the board would be improved ; and { TAIL ~ a high speed } of signal process would be ensured
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