forming a plurality of metalized conductive pathways on said intermediate portion and said first and second plurality of bonding pads of said first and second end portions, respectively, of said insulative substrate, {HEAD ~ adjacent ones} of {TAIL ~ said metalized conductive pathways} being defined and separated by respective exposed strips of said insulative substrate; and 
forming a plurality of metalized conductive pathways on said intermediate portion and said first and second plurality of bonding pads of said first and second end portions , respectively , of said insulative substrate , { HEAD ~ adjacent ones } of { TAIL ~ said metalized conductive pathways } being defined and separated by respective exposed strips of said insulative substrate ; and
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