The invention further relates to {TAIL ~ a method} for mounting {HEAD ~ the removed semiconductor chips} on a substrate 
The invention further relates to { TAIL ~ a method } for mounting { HEAD ~ the removed semiconductor chips } on a substrate
OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH