A ceramic slurry is applied onto a carrier film to form the thermistor film layer, a metal powder containing paste is applied onto the thermistor film layer to form the metal base material, and further an electrode paste is applied onto {HEAD ~ the metal base material} to form {TAIL ~ the split electrodes} 
A ceramic slurry is applied onto a carrier film to form the thermistor film layer , a metal powder containing paste is applied onto the thermistor film layer to form the metal base material , and further an electrode paste is applied onto { HEAD ~ the metal base material } to form { TAIL ~ the split electrodes }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL