{TAIL ~ CMOS circuits} used with {HEAD ~ the polysilicon or polysilicon germanium MEMS structures} use interconnect materials that can withstand the high temperatures used during MEMS fabrication 
{ TAIL ~ CMOS circuits } used with { HEAD ~ the polysilicon or polysilicon germanium MEMS structures } use interconnect materials that can withstand the high temperatures used during MEMS fabrication
TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH