In particular, this invention relates to a process control apparatus and method for improving coating thickness control of photoresist coatings on semiconductor wafers which improves {TAIL ~ line width control} of {HEAD ~ device features} 
In particular , this invention relates to a process control apparatus and method for improving coating thickness control of photoresist coatings on semiconductor wafers which improves { TAIL ~ line width control } of { HEAD ~ device features }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD