A process for mounting {HEAD ~ a surface mount component}, such as {TAIL ~ a stick leaded device}, to a circuit board having a pair of plated through holes and at least one additional through hole , each of which extends through the circuit board  
A process for mounting { HEAD ~ a surface mount component } , such as { TAIL ~ a stick leaded device } , to a circuit board having a pair of plated through holes and at least one additional through hole , each of which extends through the circuit board
OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH