The method of the present invention further includes electrically connecting {TAIL ~ a contact portion} of the lead terminal to {HEAD ~ the transparent plate} through a substantially flexible and movable conductive joint portion of the lead terminal to substantially minimize residual stresses formed from the electrical coupling between the transparent plate and the circuit portion 
The method of the present invention further includes electrically connecting { TAIL ~ a contact portion } of the lead terminal to { HEAD ~ the transparent plate } through a substantially flexible and movable conductive joint portion of the lead terminal to substantially minimize residual stresses formed from the electrical coupling between the transparent plate and the circuit portion
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH