In another preferred embodiment, the present invention relates to the curing composition according to {TAIL ~ the above description}, in which {HEAD ~ the curing composition} includes 0.01 to 20 parts by weight of the component in relation to 100 parts by weight of the component  
In another preferred embodiment , the present invention relates to the curing composition according to { TAIL ~ the above description } , in which { HEAD ~ the curing composition } includes 0.01 to 20 parts by weight of the component in relation to 100 parts by weight of the component
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH REL OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH