A semiconductor package facilitates package connection due to {HEAD ~ different locations} of {TAIL ~ input/output pads} in each interlayer die depending on coding information in a multi chip package 
A semiconductor package facilitates package connection due to { HEAD ~ different locations } of { TAIL ~ input / output pads } in each interlayer die depending on coding information in a multi chip package
OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH