{HEAD ~ The present invention} generally relates to the field of semiconductor memory devices, and more particularly, to {TAIL ~ semiconductor memory devices} configured for stacked arrangements 
{ HEAD ~ The present invention } generally relates to the field of semiconductor memory devices , and more particularly , to { TAIL ~ semiconductor memory devices } configured for stacked arrangements
HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH REL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH