{TAIL ~ The conductive pad} 32, which is formed of a conductive metallic material such as aluminum or aluminum alloys, is embedded in the top surface of {HEAD ~ the silicon substrate} 12 to provide electrical connection to the inductor coil 20 
{ TAIL ~ The conductive pad } 32 , which is formed of a conductive metallic material such as aluminum or aluminum alloys , is embedded in the top surface of { HEAD ~ the silicon substrate } 12 to provide electrical connection to the inductor coil 20
TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH