Preferably, the nozzle, {HEAD ~ channel} and recess are etched from {TAIL ~ the silicon substrate} by reactive ion etching and other standard semiconductor processing techniques 
Preferably , the nozzle , { HEAD ~ channel } and recess are etched from { TAIL ~ the silicon substrate } by reactive ion etching and other standard semiconductor processing techniques
OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD OTH OTH REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH