The backside of {TAIL ~ the wafer} 22 is then ground down to the saw kerfs 24 to separate {HEAD ~ the devices} 32 
The backside of { TAIL ~ the wafer } 22 is then ground down to the saw kerfs 24 to separate { HEAD ~ the devices } 32
OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH