The cap wafer is aligned with the device wafer and bonded to {HEAD ~ the device wafer} using {TAIL ~ a glass frit} as a bonding agent 
The cap wafer is aligned with the device wafer and bonded to { HEAD ~ the device wafer } using { TAIL ~ a glass frit } as a bonding agent
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH