A semiconductor device comprising a semiconductor element; a substrate; and a hot melt adhesive sheet bonding the semiconductor element to the substrate, wherein the hot melt adhesive sheet comprises a mixture of {HEAD ~ a hot melt adhesive} and a spacer, wherein the adhesive is selected from {TAIL ~ a silicone modified epoxy resin adhesive}, a silicone adhesive, and a silicone modified polyimide adhesive, and the spacer has the form of particles 
A semiconductor device comprising a semiconductor element ; a substrate ; and a hot melt adhesive sheet bonding the semiconductor element to the substrate , wherein the hot melt adhesive sheet comprises a mixture of { HEAD ~ a hot melt adhesive } and a spacer , wherein the adhesive is selected from { TAIL ~ a silicone modified epoxy resin adhesive } , a silicone adhesive , and a silicone modified polyimide adhesive , and the spacer has the form of particles
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