The lead frame 104 where the semiconductor chip is loaded is positioned above the lower die 104, and {HEAD ~ the external leads} 18 of {TAIL ~ the lead frame} 12 are placed on the mirror finished region 22 formed on the surface of the lower die 104 
The lead frame 104 where the semiconductor chip is loaded is positioned above the lower die 104 , and { HEAD ~ the external leads } 18 of { TAIL ~ the lead frame } 12 are placed on the mirror finished region 22 formed on the surface of the lower die 104
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