A semiconductor device comprising a semiconductor element; a substrate; and a hot melt adhesive sheet bonding the semiconductor element to the substrate, wherein the hot melt adhesive sheet comprises {TAIL ~ a spacer} having the form of a sheet and a hot melt adhesive on both sides of {HEAD ~ the spacer} 
A semiconductor device comprising a semiconductor element ; a substrate ; and a hot melt adhesive sheet bonding the semiconductor element to the substrate , wherein the hot melt adhesive sheet comprises { TAIL ~ a spacer } having the form of a sheet and a hot melt adhesive on both sides of { HEAD ~ the spacer }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD