A wired circuit board has a metal supporting board, a metal foil formed on {HEAD ~ the metal supporting board} to have {TAIL ~ a thickness} of less than 2.0 μm, a first insulating layer formed on the metal supporting board to cover the metal foil, and a conductive pattern formed on the first insulating layer 
A wired circuit board has a metal supporting board , a metal foil formed on { HEAD ~ the metal supporting board } to have { TAIL ~ a thickness } of less than 2.0 μm , a first insulating layer formed on the metal supporting board to cover the metal foil , and a conductive pattern formed on the first insulating layer
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH