Referring to FIGS 1 3, a memory module assembly in {HEAD ~ accordance} with {TAIL ~ a preferred embodiment} of the present invention comprises a heat sink 10, a clip 20 mounting the heat sink 10 onto a printed circuit board 30 with a heat generating electronic component 32 mounted on a top surface thereof 
Referring to FIGS 1 3 , a memory module assembly in { HEAD ~ accordance } with { TAIL ~ a preferred embodiment } of the present invention comprises a heat sink 10 , a clip 20 mounting the heat sink 10 onto a printed circuit board 30 with a heat generating electronic component 32 mounted on a top surface thereof
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