In particular, the present invention relates to an underfilling material which is used when {HEAD ~ a semiconductor package holding semiconductor elements} on a carrier substrate is mounted onto a circuit board, a mounted board produced by {TAIL ~ such mounting}, and a repairing method of a mounted board 
In particular , the present invention relates to an underfilling material which is used when { HEAD ~ a semiconductor package holding semiconductor elements } on a carrier substrate is mounted onto a circuit board , a mounted board produced by { TAIL ~ such mounting } , and a repairing method of a mounted board
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH