{HEAD ~ An interconnect device} for connecting an electronic package, whether it be a single chip or a multi component device, to a primary substrate requiring the mating of dissimilar solder patterns includes {TAIL ~ a secondary substrate} having a first face and a second face 
{ HEAD ~ An interconnect device } for connecting an electronic package , whether it be a single chip or a multi component device , to a primary substrate requiring the mating of dissimilar solder patterns includes { TAIL ~ a secondary substrate } having a first face and a second face
HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH