An object of {HEAD ~ the subject invention} is to provide {TAIL ~ an improved method} for deposition on a semiconductor wafer 
An object of { HEAD ~ the subject invention } is to provide { TAIL ~ an improved method } for deposition on a semiconductor wafer
OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH