The method 18, wherein said step of removing portions of the cap wafer between the plurality of cavities and the back surface of the cap wafer further includes {TAIL ~ the step} of grinding the cap wafer from the back surface of the cap wafer until the back surface of the cap wafer reaches {HEAD ~ the plurality} of cavities 
The method 18 , wherein said step of removing portions of the cap wafer between the plurality of cavities and the back surface of the cap wafer further includes { TAIL ~ the step } of grinding the cap wafer from the back surface of the cap wafer until the back surface of the cap wafer reaches { HEAD ~ the plurality } of cavities
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