In yet another aspect of the invention {HEAD ~ the solder paste} is applied directly to {TAIL ~ the substrate} with a squeegee 
In yet another aspect of the invention { HEAD ~ the solder paste } is applied directly to { TAIL ~ the substrate } with a squeegee
OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH