{TAIL ~ The conductive pad} 32, which is formed of a conductive metallic material such as aluminum or aluminum alloys, is embedded in the top surface of the silicon substrate 12 to provide electrical connection to {HEAD ~ the inductor coil} 20 
{ TAIL ~ The conductive pad } 32 , which is formed of a conductive metallic material such as aluminum or aluminum alloys , is embedded in the top surface of the silicon substrate 12 to provide electrical connection to { HEAD ~ the inductor coil } 20
TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH