The ROM of the present invention is manufactured by laser annealing at {TAIL ~ the final step} in the flow of wafer fabrication so half finished goods having nonactivated resistances can be stocked when the specifications of {HEAD ~ users} are not yet determined 
The ROM of the present invention is manufactured by laser annealing at { TAIL ~ the final step } in the flow of wafer fabrication so half finished goods having nonactivated resistances can be stocked when the specifications of { HEAD ~ users } are not yet determined
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH