{HEAD ~ The thermal diffusion process} may also be performed by heating {TAIL ~ the entire chip} or multi chip module, for example, in an oven that has been heated to, for example, about 250° C. The oven heating technique is particularly useful when large areas of the composite film are to be heated or if multiple disconnections are to be made simultaneously 
{ HEAD ~ The thermal diffusion process } may also be performed by heating { TAIL ~ the entire chip } or multi chip module , for example , in an oven that has been heated to , for example , about 250 ° C. The oven heating technique is particularly useful when large areas of the composite film are to be heated or if multiple disconnections are to be made simultaneously
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