E. laminating {TAIL ~ the structure} at a pressure of at least 1000 psi and a temperature of {HEAD ~ at least 20° C.} and then firing the structure so as to provide a monolithic cofired electronic structure 
E. laminating { TAIL ~ the structure } at a pressure of at least 1000 psi and a temperature of { HEAD ~ at least 20 ° C. } and then firing the structure so as to provide a monolithic cofired electronic structure
OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH