{HEAD ~ A dicing tape integrated wafer back surface protective film} is used for protecting {TAIL ~ a back surface} of a chip shaped workpiece and enhancing strength 
{ HEAD ~ A dicing tape integrated wafer back surface protective film } is used for protecting { TAIL ~ a back surface } of a chip shaped workpiece and enhancing strength
HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH