An object of the present invention is to provide a polishing pad that is excellent in flatness of a surface to be polished and evenness of a film thickness after polishing and also excellent in a polishing rate, and can achieve excellent polishing to {TAIL ~ a material} to be polished such as an insulating film, {HEAD ~ a metallic film}, etc, and a cushion using for the polishing pad 
An object of the present invention is to provide a polishing pad that is excellent in flatness of a surface to be polished and evenness of a film thickness after polishing and also excellent in a polishing rate , and can achieve excellent polishing to { TAIL ~ a material } to be polished such as an insulating film , { HEAD ~ a metallic film } , etc , and a cushion using for the polishing pad
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