Herein, a mixture of the high thermal conductive resin and non high thermal conductive resin shown in the center of the table of FIG 4 is superior in {HEAD ~ the thermal conductivity} to {TAIL ~ the conventional non high thermal conductive resin}; nevertheless the thermal conductivity is insufficient to swiftly release heat generated in the first semiconductor chip 15 
Herein , a mixture of the high thermal conductive resin and non high thermal conductive resin shown in the center of the table of FIG 4 is superior in { HEAD ~ the thermal conductivity } to { TAIL ~ the conventional non high thermal conductive resin } ; nevertheless the thermal conductivity is insufficient to swiftly release heat generated in the first semiconductor chip 15
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