{TAIL ~ A ceramic laminated circuit substrate} 1, wherein the conductor layer comprises Cu, Au, Ag, Ag Pd, W, or an alloy of at least two of them and ceramic material of {HEAD ~ the ceramic insulating layers} softens at a temperature lower than the melting point of the conductor layer 
{ TAIL ~ A ceramic laminated circuit substrate } 1 , wherein the conductor layer comprises Cu , Au , Ag , Ag Pd , W , or an alloy of at least two of them and ceramic material of { HEAD ~ the ceramic insulating layers } softens at a temperature lower than the melting point of the conductor layer
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