{HEAD ~ Another aspect} provides a method of forming an integrated circuit device including {TAIL ~ the steps} of providing a semiconductor die; forming a first housing about the semiconductor die; thermally coupling a heat sink with the first housing; and forming a second housing about at least a portion of the heat sink following the thermally coupling 
{ HEAD ~ Another aspect } provides a method of forming an integrated circuit device including { TAIL ~ the steps } of providing a semiconductor die ; forming a first housing about the semiconductor die ; thermally coupling a heat sink with the first housing ; and forming a second housing about at least a portion of the heat sink following the thermally coupling
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