and therefore, when a solder bump is used, the solder bump is melt bonded to the substrate electrode while conforming to {HEAD ~ the concave surface} thereof to alleviate the deformation of and the stress concentration to the locally deformed portion in the boundary surface between the solder bump and the substrate electrode so that the reliability of {TAIL ~ interlayer interconnection} is improved 
and therefore , when a solder bump is used , the solder bump is melt bonded to the substrate electrode while conforming to { HEAD ~ the concave surface } thereof to alleviate the deformation of and the stress concentration to the locally deformed portion in the boundary surface between the solder bump and the substrate electrode so that the reliability of { TAIL ~ interlayer interconnection } is improved
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH