Problems involved are solved by a curing composition characterized by including an organic polymer having one or more silicon containing groups capable of {TAIL ~ cross} linking by forming siloxane bonds, a metal carboxylate and carboxylic acid, and a silicon compound having a hetero atom on the carbon atom in the α or {HEAD ~ β} position with respect to the silicon atom 
Problems involved are solved by a curing composition characterized by including an organic polymer having one or more silicon containing groups capable of { TAIL ~ cross } linking by forming siloxane bonds , a metal carboxylate and carboxylic acid , and a silicon compound having a hetero atom on the carbon atom in the α or { HEAD ~ β } position with respect to the silicon atom
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH