The present invention relates to conductive particles for use in conductive adhesives, anisotropic conductive adhesive films, {HEAD ~ conductive connection structures} and the like for {TAIL ~ mounting circuit boards}, and polymer particles used in the conductive particles 
The present invention relates to conductive particles for use in conductive adhesives , anisotropic conductive adhesive films , { HEAD ~ conductive connection structures } and the like for { TAIL ~ mounting circuit boards } , and polymer particles used in the conductive particles
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH