In the case of {HEAD ~ large electronic computer}, it can exhibit sufficient performances by application of the semiconductor module made by bonding {TAIL ~ a semiconductor} to the ceramic laminated circuit substrate of the present invention with high accuracy 
In the case of { HEAD ~ large electronic computer } , it can exhibit sufficient performances by application of the semiconductor module made by bonding { TAIL ~ a semiconductor } to the ceramic laminated circuit substrate of the present invention with high accuracy
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