A socket for a solder bumped member is obtained by first providing a substrate having {HEAD ~ metalized pads} corresponding to {TAIL ~ the solder bumps} of the member 
A socket for a solder bumped member is obtained by first providing a substrate having { HEAD ~ metalized pads } corresponding to { TAIL ~ the solder bumps } of the member
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH