A novel five layer tape is provided for applications such as bonding, {HEAD ~ interconnection} and {TAIL ~ insulation} of different parts of a semiconductor package at the same time 
A novel five layer tape is provided for applications such as bonding , { HEAD ~ interconnection } and { TAIL ~ insulation } of different parts of a semiconductor package at the same time
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD OTH TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH