The multi path feed thru lead of the present invention has particular utility in combination with {HEAD ~ microcircuit packages} to increase {TAIL ~ the conductive pathway density} thereof without any significant decrease in the structural integrity thereof and increase in the size and weight thereof 
The multi path feed thru lead of the present invention has particular utility in combination with { HEAD ~ microcircuit packages } to increase { TAIL ~ the conductive pathway density } thereof without any significant decrease in the structural integrity thereof and increase in the size and weight thereof
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