In the semiconductor device depicted in FIG 3, {TAIL ~ a semiconductor element} 1 is bonded to a circuit substrate 7 by the hot melt adhesive sheet 2, and in this case the semiconductor element 1 and {HEAD ~ the interconnects} 4 on the circuit substrate 7 are electrically connected by the bumps 8  
In the semiconductor device depicted in FIG 3 , { TAIL ~ a semiconductor element } 1 is bonded to a circuit substrate 7 by the hot melt adhesive sheet 2 , and in this case the semiconductor element 1 and { HEAD ~ the interconnects } 4 on the circuit substrate 7 are electrically connected by the bumps 8
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