According to the invention, vibrational damping of {HEAD ~ the component} 12 is achieved by the application of a material 14 to the surface of {TAIL ~ the circuit board} 10 opposite the component 12 
According to the invention , vibrational damping of { HEAD ~ the component } 12 is achieved by the application of a material 14 to the surface of { TAIL ~ the circuit board } 10 opposite the component 12
OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH