In {HEAD ~ a three dimensional construction} employing {TAIL ~ the principles} of the invention, the IC chips are arranged in modules, and interconnections may be made between IC chips within each module, transversely between modules, and in a third direction between layers of modules 
In { HEAD ~ a three dimensional construction } employing { TAIL ~ the principles } of the invention , the IC chips are arranged in modules , and interconnections may be made between IC chips within each module , transversely between modules , and in a third direction between layers of modules
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