The present invention surmounts the inherent disadvantages of prior art flat packs by providing {HEAD ~ a multi path feed} thru lead that efficiently and economically permits {TAIL ~ an increase} in the conductive pathway density without a significant increase in the overall size of the lead member 
The present invention surmounts the inherent disadvantages of prior art flat packs by providing { HEAD ~ a multi path feed } thru lead that efficiently and economically permits { TAIL ~ an increase } in the conductive pathway density without a significant increase in the overall size of the lead member
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