According to {TAIL ~ the invention}, {HEAD ~ vibrational damping} of the component 12 is achieved by the application of a material 14 to the surface of the circuit board 10 opposite the component 12 
According to { TAIL ~ the invention } , { HEAD ~ vibrational damping } of the component 12 is achieved by the application of a material 14 to the surface of the circuit board 10 opposite the component 12
REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH