In an embodiment, the diode 104, the backsheet 102, the interconnects 106 and {TAIL ~ the heat spreader} 110 are mounted above {HEAD ~ a substrate} 116, such as a glass substrate, via an encapsulant 118, as depicted in FIG 1 
In an embodiment , the diode 104 , the backsheet 102 , the interconnects 106 and { TAIL ~ the heat spreader } 110 are mounted above { HEAD ~ a substrate } 116 , such as a glass substrate , via an encapsulant 118 , as depicted in FIG 1
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