Referring to FIGS 1 3, {HEAD ~ a memory module assembly} in accordance with a preferred embodiment of the present invention comprises a heat sink 10, {TAIL ~ a clip} 20 mounting the heat sink 10 onto a printed circuit board 30 with a heat generating electronic component 32 mounted on a top surface thereof 
Referring to FIGS 1 3 , { HEAD ~ a memory module assembly } in accordance with a preferred embodiment of the present invention comprises a heat sink 10 , { TAIL ~ a clip } 20 mounting the heat sink 10 onto a printed circuit board 30 with a heat generating electronic component 32 mounted on a top surface thereof
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