Semiconductor package having grooves formed at side flash, groove forming method, and deflashing method using {TAIL ~ semiconductor package} formed with {HEAD ~ grooves} 
Semiconductor package having grooves formed at side flash , groove forming method , and deflashing method using { TAIL ~ semiconductor package } formed with { HEAD ~ grooves }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH HEAD HEAD HEAD HEAD HEAD