{HEAD ~ The MEMS arrays} include {TAIL ~ polysilicon or polysilicon germanium components} that are mechanically superior to metals used in other MEMS applications, but that require process temperatures not compatible with conventional CMOS technologies 
{ HEAD ~ The MEMS arrays } include { TAIL ~ polysilicon or polysilicon germanium components } that are mechanically superior to metals used in other MEMS applications , but that require process temperatures not compatible with conventional CMOS technologies
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