{HEAD ~ The backside} of {TAIL ~ the wafer} 22 is then ground down to the saw kerfs 24 to separate the devices 32 
{ HEAD ~ The backside } of { TAIL ~ the wafer } 22 is then ground down to the saw kerfs 24 to separate the devices 32
HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH