An integrated circuit chip packaging construction for mounting and interconnecting IC chips and {TAIL ~ IC chip packages} with a multilayer printed circuit board, without soldering, special tooling or special labor, and for interconnecting IC chips with minimized interconnection lead {HEAD ~ lengths} between the IC chips, without cable harnesses or back panel wiring 
An integrated circuit chip packaging construction for mounting and interconnecting IC chips and { TAIL ~ IC chip packages } with a multilayer printed circuit board , without soldering , special tooling or special labor , and for interconnecting IC chips with minimized interconnection lead { HEAD ~ lengths } between the IC chips , without cable harnesses or back panel wiring
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