{HEAD ~ An accelerometer} with internal electronics is mounted within {TAIL ~ a Faraday shield} and encapsulated within a non electrically conductive material applied by hot injection molding at a high pressure to form a hermetically sealed case with integral strain relief, cable bend protection, ground loop isolation and protection against EMI/RFI interference through both conduction and radiation 
{ HEAD ~ An accelerometer } with internal electronics is mounted within { TAIL ~ a Faraday shield } and encapsulated within a non electrically conductive material applied by hot injection molding at a high pressure to form a hermetically sealed case with integral strain relief , cable bend protection , ground loop isolation and protection against EMI / RFI interference through both conduction and radiation
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH