The bore diameter of the conductive layer portion 114 b of the through hole 114 is smaller than {HEAD ~ the bore diameter} of {TAIL ~ the insulating resin layer portion} and the adhesive layer portion 114 a to establish electrical connection between the conductive resin composition 115 and the conductive layer 112 by the rare surface 112 a of the conductive layer 112 
The bore diameter of the conductive layer portion 114 b of the through hole 114 is smaller than { HEAD ~ the bore diameter } of { TAIL ~ the insulating resin layer portion } and the adhesive layer portion 114 a to establish electrical connection between the conductive resin composition 115 and the conductive layer 112 by the rare surface 112 a of the conductive layer 112
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH