As in the prior embodiment the wafer and fixture can now be washed to remove {HEAD ~ any dicing debris} created by {TAIL ~ the sawing operation} 
As in the prior embodiment the wafer and fixture can now be washed to remove { HEAD ~ any dicing debris } created by { TAIL ~ the sawing operation }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL