The present invention resides in {TAIL ~ an integrated circuit packaging construction} for mounting and interconnecting IC chips and IC chip packages with a multilayer printed circuit board and for interconnecting IC chips with minimized interconnection lead lengths between {HEAD ~ the IC chips} 
The present invention resides in { TAIL ~ an integrated circuit packaging construction } for mounting and interconnecting IC chips and IC chip packages with a multilayer printed circuit board and for interconnecting IC chips with minimized interconnection lead lengths between { HEAD ~ the IC chips }
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