In a semiconductor device such as {HEAD ~ a high frequency power amplifier module}, a plurality of amplifying means are formed on a semiconductor chip which is mounted on a main surface of a wiring substrate, and {TAIL ~ electrodes} of the semiconductor chip are electrically connected by wires to electrodes of the wiring substrate 
In a semiconductor device such as { HEAD ~ a high frequency power amplifier module } , a plurality of amplifying means are formed on a semiconductor chip which is mounted on a main surface of a wiring substrate , and { TAIL ~ electrodes } of the semiconductor chip are electrically connected by wires to electrodes of the wiring substrate
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