Referring to FIGS 1 3, a memory module assembly in accordance with a preferred embodiment of the present invention comprises a heat sink 10, a clip 20 mounting {HEAD ~ the heat sink} 10 onto {TAIL ~ a printed circuit board} 30 with a heat generating electronic component 32 mounted on a top surface thereof 
Referring to FIGS 1 3 , a memory module assembly in accordance with a preferred embodiment of the present invention comprises a heat sink 10 , a clip 20 mounting { HEAD ~ the heat sink } 10 onto { TAIL ~ a printed circuit board } 30 with a heat generating electronic component 32 mounted on a top surface thereof
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