The method 1, wherein {HEAD ~ the physical vapor deposition} comprises radio frequency sputtering or {TAIL ~ magnetron sputtering} 
The method 1 , wherein { HEAD ~ the physical vapor deposition } comprises radio frequency sputtering or { TAIL ~ magnetron sputtering }
OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL