A process is described for fabricating various optical devices including {TAIL ~ photodiodes} in which a protective dielectric layer is put down on the surface of the device prior to heating to temperatures over {HEAD ~ about 250 300 degrees C} 
A process is described for fabricating various optical devices including { TAIL ~ photodiodes } in which a protective dielectric layer is put down on the surface of the device prior to heating to temperatures over { HEAD ~ about 250 300 degrees C }
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