second means for connecting said conductive pads and ground layer to a circuit board, wherein said second means includes a ball grid array, wherein said ball grid array includes a plurality of solder balls, {TAIL ~ at least one solder ball} attached to each conductive pad and at least one solder ball attached to {HEAD ~ said ground}; and 
second means for connecting said conductive pads and ground layer to a circuit board , wherein said second means includes a ball grid array , wherein said ball grid array includes a plurality of solder balls , { TAIL ~ at least one solder ball } attached to each conductive pad and at least one solder ball attached to { HEAD ~ said ground } ; and
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH