As described above, according to the invention, the feed of {TAIL ~ the single crystal ingot} to the blade of the ID saw slicing machine is increased and decreased alternately in accordance with a predetermined control pattern, so that it is possible to intentionally give slight irregularity to the faces of the wafer sliced from {HEAD ~ the single crystal ingot}; as a result, the wafer will have less bow even after removing the irregularity through conventional lapping and etching processes 
As described above , according to the invention , the feed of { TAIL ~ the single crystal ingot } to the blade of the ID saw slicing machine is increased and decreased alternately in accordance with a predetermined control pattern , so that it is possible to intentionally give slight irregularity to the faces of the wafer sliced from { HEAD ~ the single crystal ingot } ; as a result , the wafer will have less bow even after removing the irregularity through conventional lapping and etching processes
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