The present invention utilizes {HEAD ~ a nanoindenter type device} obtaining {TAIL ~ mechanical properties} as a function of displacement depth and applied load into the bond pad surface to accurately predict electrical property stability of the entire substrate or sample under test 
The present invention utilizes { HEAD ~ a nanoindenter type device } obtaining { TAIL ~ mechanical properties } as a function of displacement depth and applied load into the bond pad surface to accurately predict electrical property stability of the entire substrate or sample under test
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