The present invention is directed to {HEAD ~ a semiconductor device} comprising a semiconductor element; a substrate; and {TAIL ~ a hot melt adhesive sheet} bonding the semiconductor element to the substrate, wherein the hot melt adhesive sheet comprises a spacer having the form of a sheet and a hot melt adhesive on both sides of the spacer 
The present invention is directed to { HEAD ~ a semiconductor device } comprising a semiconductor element ; a substrate ; and { TAIL ~ a hot melt adhesive sheet } bonding the semiconductor element to the substrate , wherein the hot melt adhesive sheet comprises a spacer having the form of a sheet and a hot melt adhesive on both sides of the spacer
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