The backside of {HEAD ~ the wafer} 22 is then ground down to {TAIL ~ the saw kerfs} 24 to separate the devices 32 
The backside of { HEAD ~ the wafer } 22 is then ground down to { TAIL ~ the saw kerfs } 24 to separate the devices 32
OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH