Here, the adhesive film includes a curable hot melt adhesive layer including a curable resin and moisture absorbent, the curable hot melt adhesive layer includes {HEAD ~ a first region} coming in contact with the OED upon {TAIL ~ encapsulation} of the OED, and a second region not coming in contact with the OED, and the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive layer 
Here , the adhesive film includes a curable hot melt adhesive layer including a curable resin and moisture absorbent , the curable hot melt adhesive layer includes { HEAD ~ a first region } coming in contact with the OED upon { TAIL ~ encapsulation } of the OED , and a second region not coming in contact with the OED , and the moisture absorbent is present at contents of 0 to 20 % and 80 to 100 % in the first and second regions , respectively , based on the total weight of the moisture absorbent in the adhesive layer
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH