A photosensitive resin composition that excels in sensitivity to actinic energy rays , is hardenable within a short period of time and can form pattern through development with a diluted aqueous alkali solution and that gives a cured film through thermal curing in the postcuring step, {HEAD ~ the cured film} having {TAIL ~ satisfactory flexibility} and being suitable to a solder mask ink of high insulation excelling in adherence and resistances of gold plating, electroless gold plating and tin plating; and a curing product thereof 
A photosensitive resin composition that excels in sensitivity to actinic energy rays , is hardenable within a short period of time and can form pattern through development with a diluted aqueous alkali solution and that gives a cured film through thermal curing in the postcuring step , { HEAD ~ the cured film } having { TAIL ~ satisfactory flexibility } and being suitable to a solder mask ink of high insulation excelling in adherence and resistances of gold plating , electroless gold plating and tin plating ; and a curing product thereof
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