In particular, this invention relates to {TAIL ~ a process control apparatus} and method for improving {HEAD ~ coating thickness control} of photoresist coatings on semiconductor wafers which improves line width control of device features 
In particular , this invention relates to { TAIL ~ a process control apparatus } and method for improving { HEAD ~ coating thickness control } of photoresist coatings on semiconductor wafers which improves line width control of device features
OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH