When the wafer is diced to form individual circulators, the via holes are sliced in half, leaving a conductive trace 36 on the side of the circulator substrate 26 that connects the transmission lines 24 on the top to {HEAD ~ the conductive pads} 38 on {TAIL ~ the bottom} 
When the wafer is diced to form individual circulators , the via holes are sliced in half , leaving a conductive trace 36 on the side of the circulator substrate 26 that connects the transmission lines 24 on the top to { HEAD ~ the conductive pads } 38 on { TAIL ~ the bottom }
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