First, {HEAD ~ AGA} 50 is prepared by attaching {TAIL ~ solder joints} 55 at the desired points along its surface preferably using the stenciling method described by the present inventor in issued U.S. Pat No 6,000,126, the contents of which are hereby incorporated by reference 
First , { HEAD ~ AGA } 50 is prepared by attaching { TAIL ~ solder joints } 55 at the desired points along its surface preferably using the stenciling method described by the present inventor in issued U.S. Pat No 6,000,126 , the contents of which are hereby incorporated by reference
OTH OTH HEAD HEAD HEAD HEAD HEAD OTH REL REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH