This invention relates to novel crosslinkable and crosslinked polymer compositions and to processes for preparing these compositions, It also encompasses {HEAD ~ silica filled transfer molding compounds} used for {TAIL ~ packaging electronic components} comprising the crosslinked compositions 
This invention relates to novel crosslinkable and crosslinked polymer compositions and to processes for preparing these compositions , It also encompasses { HEAD ~ silica filled transfer molding compounds } used for { TAIL ~ packaging electronic components } comprising the crosslinked compositions
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH