An improved method of using an ID saw slicing machine for slicing a single crystal ingot in {HEAD ~ a direction} normal to {TAIL ~ the axis} of the ingot to obtain wafers 
An improved method of using an ID saw slicing machine for slicing a single crystal ingot in { HEAD ~ a direction } normal to { TAIL ~ the axis } of the ingot to obtain wafers
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH