The present invention provides a method and an apparatus for increasing a deposition rate of {HEAD ~ dielectric films} deposited on a substrate at {TAIL ~ a given temperature} while providing good step coverage and gap fill properties 
The present invention provides a method and an apparatus for increasing a deposition rate of { HEAD ~ dielectric films } deposited on a substrate at { TAIL ~ a given temperature } while providing good step coverage and gap fill properties
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL OTH OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH