A method for manufacturing a semiconductor device 1, wherein {HEAD ~ said circuit board} is {TAIL ~ a multi layer printed circuit board} 
A method for manufacturing a semiconductor device 1 , wherein { HEAD ~ said circuit board } is { TAIL ~ a multi layer printed circuit board }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL