A method for manufacturing {HEAD ~ a semiconductor device} 1, wherein {TAIL ~ said circuit board} is a multi layer printed circuit board 
A method for manufacturing { HEAD ~ a semiconductor device } 1 , wherein { TAIL ~ said circuit board } is a multi layer printed circuit board
OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH