{TAIL ~ A method} of forming solder bumps includes the steps of applying a thick layer of solder resist to {HEAD ~ a substrate} 
{ TAIL ~ A method } of forming solder bumps includes the steps of applying a thick layer of solder resist to { HEAD ~ a substrate }
TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD