The IC chips and IC chip packages are mounted and interconnected using an insulating board having openings through it, and {HEAD ~ a number} of {TAIL ~ connector elements} in the form of compressible wads of conductive wire 
The IC chips and IC chip packages are mounted and interconnected using an insulating board having openings through it , and { HEAD ~ a number } of { TAIL ~ connector elements } in the form of compressible wads of conductive wire
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH