The present invention also provides {HEAD ~ a process} for forming {TAIL ~ a resist pattern} and a process for manufacturing a semiconductor device, wherein the resist pattern thickening material of the present invention is suitably utilized 
The present invention also provides { HEAD ~ a process } for forming { TAIL ~ a resist pattern } and a process for manufacturing a semiconductor device , wherein the resist pattern thickening material of the present invention is suitably utilized
OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH