{HEAD ~ The first laminate} is provided over {TAIL ~ the semiconductor substrate} and includes a first interlayer dielectric film having a first mechanical strength 
{ HEAD ~ The first laminate } is provided over { TAIL ~ the semiconductor substrate } and includes a first interlayer dielectric film having a first mechanical strength
HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH