A method for manufacturing a silicon chip package for a circuit board assembly is provided with a package substrate having {HEAD ~ a silicon chip} and {TAIL ~ an array} of contact pads provided by conductive material 
A method for manufacturing a silicon chip package for a circuit board assembly is provided with a package substrate having { HEAD ~ a silicon chip } and { TAIL ~ an array } of contact pads provided by conductive material
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH