e) forming one or more contact openings in said {HEAD ~ one or more lower solid insulation layers}, said low dielectric constant insulation layer, and said {TAIL ~ one or more upper solid insulation layers} 
e ) forming one or more contact openings in said { HEAD ~ one or more lower solid insulation layers } , said low dielectric constant insulation layer , and said { TAIL ~ one or more upper solid insulation layers }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL