Also in accordance with this invention there is provided {HEAD ~ an integrated circuit package} including a leadless chip carrier having a plurality of elctrically conductive pads near {TAIL ~ the periphery} of one of its surfaces 
Also in accordance with this invention there is provided { HEAD ~ an integrated circuit package } including a leadless chip carrier having a plurality of elctrically conductive pads near { TAIL ~ the periphery } of one of its surfaces
OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH