A process 4, wherein {HEAD ~ the amount} of the metal element selected in the Periodic Table used in the contact treatment is in {TAIL ~ the range} of from 0.001 to 0.5 part by weight per part of platinum or palladium 
A process 4 , wherein { HEAD ~ the amount } of the metal element selected in the Periodic Table used in the contact treatment is in { TAIL ~ the range } of from 0.001 to 0.5 part by weight per part of platinum or palladium
OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH