{TAIL ~ A solvent} of a resist solution is dropped from a solvent supply nozzle onto the surface of {HEAD ~ a semiconductor wafer} held by a spin chuck 
{ TAIL ~ A solvent } of a resist solution is dropped from a solvent supply nozzle onto the surface of { HEAD ~ a semiconductor wafer } held by a spin chuck
TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH