{HEAD ~ The method} for manufacturing a thermistor 1, wherein {TAIL ~ a thickness} of the metal base material after firing is 10 to 80 μm, and a thickness of the thermistor film layer after firing is 1 to 10 μm 
{ HEAD ~ The method } for manufacturing a thermistor 1 , wherein { TAIL ~ a thickness } of the metal base material after firing is 10 to 80 μm , and a thickness of the thermistor film layer after firing is 1 to 10 μm
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH