A condition without using {HEAD ~ Ar} as {TAIL ~ plasma gas} is applied to processing of an organic anti reflection coating, which suppresses a spatter effect and decreases the cleavage of C—H and OC—O bonds in a resist 
A condition without using { HEAD ~ Ar } as { TAIL ~ plasma gas } is applied to processing of an organic anti reflection coating , which suppresses a spatter effect and decreases the cleavage of C — H and OC — O bonds in a resist
OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH