{HEAD ~ These manufacturing methods} facilitate {TAIL ~ control} of the oxygen concentration in the SRO, the relative thicknesses of the silicon oxide and silicon layers, and provides improved step coverage, thus allowing the manufacturing of high quality semiconductor devices 
{ HEAD ~ These manufacturing methods } facilitate { TAIL ~ control } of the oxygen concentration in the SRO , the relative thicknesses of the silicon oxide and silicon layers , and provides improved step coverage , thus allowing the manufacturing of high quality semiconductor devices
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