In view of such aspects, it is an object of the present invention to provide methods of manufacturing a lead frame and an integrated circuit package which prevent a solder resist film from being peeled off and can make {HEAD ~ sizes} of {TAIL ~ projecting electrodes} uniform 
In view of such aspects , it is an object of the present invention to provide methods of manufacturing a lead frame and an integrated circuit package which prevent a solder resist film from being peeled off and can make { HEAD ~ sizes } of { TAIL ~ projecting electrodes } uniform
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