{HEAD ~ The ROM} of the present invention is manufactured by laser annealing at {TAIL ~ the final step} in the flow of wafer fabrication so half finished goods having nonactivated resistances can be stocked when the specifications of users are not yet determined 
{ HEAD ~ The ROM } of the present invention is manufactured by laser annealing at { TAIL ~ the final step } in the flow of wafer fabrication so half finished goods having nonactivated resistances can be stocked when the specifications of users are not yet determined
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH REL REL OTH OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH