In more detail, as shown in FIG 6a, {TAIL ~ a new RCC} 68 is stacked on the board manufactured by the process of FIGS 4a to 4 f, and then the structure is heated and pressed Next, as shown in FIG 6b, the YAG laser is irradiated to the board with {HEAD ~ RCC} stacked thereon to form the via hole 
In more detail , as shown in FIG 6a , { TAIL ~ a new RCC } 68 is stacked on the board manufactured by the process of FIGS 4a to 4 f , and then the structure is heated and pressed Next , as shown in FIG 6b , the YAG laser is irradiated to the board with { HEAD ~ RCC } stacked thereon to form the via hole
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH