A method 4 and further including the substeps of squeezing a solder paste through a plurality of template holes which are aligned with said I/O pads, and partially curing {HEAD ~ said paste} on {TAIL ~ said I/O pads} prior to forming joints with said leads 
A method 4 and further including the substeps of squeezing a solder paste through a plurality of template holes which are aligned with said I / O pads , and partially curing { HEAD ~ said paste } on { TAIL ~ said I / O pads } prior to forming joints with said leads
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