That is, the object of the present invention is to provide {HEAD ~ an aqueous dispersion} for CMP with a high removal rate that allows efficient polishing, while also producing minimal excessive etching, thinning, dishing, keyholes and scratches, to give {TAIL ~ finished surfaces} with satisfactory high precision 
That is , the object of the present invention is to provide { HEAD ~ an aqueous dispersion } for CMP with a high removal rate that allows efficient polishing , while also producing minimal excessive etching , thinning , dishing , keyholes and scratches , to give { TAIL ~ finished surfaces } with satisfactory high precision
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH