The main surface of a first semiconductor substrate is bonded to the main surface of {TAIL ~ a second semiconductor substrate} with {HEAD ~ an insulation film} interposed therebetween to form a composite substrate 
The main surface of a first semiconductor substrate is bonded to the main surface of { TAIL ~ a second semiconductor substrate } with { HEAD ~ an insulation film } interposed therebetween to form a composite substrate
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH