Also, the components being attached to the substrate can be {HEAD ~ flip chip semiconductor dies} or chip capacitors, which typically require {TAIL ~ an underfilling operation} after reflow 
Also , the components being attached to the substrate can be { HEAD ~ flip chip semiconductor dies } or chip capacitors , which typically require { TAIL ~ an underfilling operation } after reflow
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH