In order to have {HEAD ~ a contact} with {TAIL ~ a terminal} on the semiconductor die or other bonding pad site, windows are formed in the insulative layer 
In order to have { HEAD ~ a contact } with { TAIL ~ a terminal } on the semiconductor die or other bonding pad site , windows are formed in the insulative layer
OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH