In another preferred embodiment, the present invention relates to the curing composition according to the above description, in which the curing composition includes 0.01 to 20 parts by weight of {HEAD ~ the component} in {TAIL ~ relation} to 100 parts by weight of the component  
In another preferred embodiment , the present invention relates to the curing composition according to the above description , in which the curing composition includes 0.01 to 20 parts by weight of { HEAD ~ the component } in { TAIL ~ relation } to 100 parts by weight of the component
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH