The present invention relates to a taping apparatus and process for electronic components, arid in particular, for storing chip type electronic components in storage compartments within a tape, which is wound to {TAIL ~ a tape reel}, and for sealing the upper opening of the storage compartment with {HEAD ~ a cover tape} 
The present invention relates to a taping apparatus and process for electronic components , arid in particular , for storing chip type electronic components in storage compartments within a tape , which is wound to { TAIL ~ a tape reel } , and for sealing the upper opening of the storage compartment with { HEAD ~ a cover tape }
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