Further, in accordance with a preferred embodiment of the present invention, the wafer transfer device has a first unit receives {HEAD ~ a first group} of {TAIL ~ semiconductor wafers} and a second unit which receives a second group of semiconductor wafers 
Further , in accordance with a preferred embodiment of the present invention , the wafer transfer device has a first unit receives { HEAD ~ a first group } of { TAIL ~ semiconductor wafers } and a second unit which receives a second group of semiconductor wafers
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH