A process 5 which includes {HEAD ~ the further steps} of removing {TAIL ~ the component} from the package and installing the component into a furnace used for processing semiconductor wafers 
of removing
A process 5 which includes { HEAD ~ the further steps } of removing { TAIL ~ the component } from the package and installing the component into a furnace used for processing semiconductor wafers
OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH