Furthermore, application of the method and apparatus, in which resist modification and etching are carried out by turns, provides an improvement in apparatus cost and throughput as well as a contribution to the enhancement of productivity compared to the case where {HEAD ~ the resist modification} is performed in {TAIL ~ a standalone apparatus} 
is performed in
Furthermore , application of the method and apparatus , in which resist modification and etching are carried out by turns , provides an improvement in apparatus cost and throughput as well as a contribution to the enhancement of productivity compared to the case where { HEAD ~ the resist modification } is performed in { TAIL ~ a standalone apparatus }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL