A method of manufacturing a semiconductor device 6, wherein {HEAD ~ the semiconductor die} is {TAIL ~ a flip chip} 
is
A method of manufacturing a semiconductor device 6 , wherein { HEAD ~ the semiconductor die } is { TAIL ~ a flip chip }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL