Problems involved are solved by a curing composition characterized by including an organic polymer having one or more silicon containing groups capable of cross linking by forming siloxane bonds, a metal carboxylate and carboxylic acid, and a silicon compound having {HEAD ~ a hetero atom} on {TAIL ~ the carbon atom} in the α or β position with respect to the silicon atom 
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Problems involved are solved by a curing composition characterized by including an organic polymer having one or more silicon containing groups capable of cross linking by forming siloxane bonds , a metal carboxylate and carboxylic acid , and a silicon compound having { HEAD ~ a hetero atom } on { TAIL ~ the carbon atom } in the α or β position with respect to the silicon atom
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