In one preferred method of forming the multi path feed thru lead of the present invention, {HEAD ~ the external surface} of the insulative substrate is first metalized and {TAIL ~ then selected portions} of metalization are removed to form the plurality of discrete conductive pathways 
In one preferred method of forming the multi path feed thru lead of the present invention , { HEAD ~ the external surface } of the insulative substrate is first metalized and { TAIL ~ then selected portions } of metalization are removed to form the plurality of discrete conductive pathways
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