E. laminating {HEAD ~ the structure} at {TAIL ~ a pressure} of at least 1000 psi and a temperature of at least 20° C. and then firing the structure so as to provide a monolithic cofired electronic structure 
at
E. laminating { HEAD ~ the structure } at { TAIL ~ a pressure } of at least 1000 psi and a temperature of at least 20 ° C. and then firing the structure so as to provide a monolithic cofired electronic structure
OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH