In a presently preferred embodiment of the invention, an IC chip is mounted and interconnected with a multilayer printed circuit board, to effect a Level 2 interconnect, without a ceramic chip package, soldered wires, {TAIL ~ special tooling} or {HEAD ~ special labor} 
In a presently preferred embodiment of the invention , an IC chip is mounted and interconnected with a multilayer printed circuit board , to effect a Level 2 interconnect , without a ceramic chip package , soldered wires , { TAIL ~ special tooling } or { HEAD ~ special labor }
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