{HEAD ~ A wafer processing cluster tool}, having one or more load locks, is provided with one or more batch preheating modules that receive wafers only from {TAIL ~ the cluster tool transport module} at the internal vacuum pressure of the machine 
{ HEAD ~ A wafer processing cluster tool } , having one or more load locks , is provided with one or more batch preheating modules that receive wafers only from { TAIL ~ the cluster tool transport module } at the internal vacuum pressure of the machine
HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH