{HEAD ~ The region} around {TAIL ~ the bumps} 8 between the semiconductor element 1 and the circuit substrate 7 can be filled by a resin 9 
around
{ HEAD ~ The region } around { TAIL ~ the bumps } 8 between the semiconductor element 1 and the circuit substrate 7 can be filled by a resin 9
HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH