In {TAIL ~ yet another aspect} of the invention {HEAD ~ the solder paste} is applied directly to the substrate with a squeegee 
In
In { TAIL ~ yet another aspect } of the invention { HEAD ~ the solder paste } is applied directly to the substrate with a squeegee
REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH