The present invention relates to a curing composition including an organic polymer which has silicon containing groups having one or more hydroxyl or hydrolyzable groups bonded to the silicon atom or {TAIL ~ atoms} and capable of {HEAD ~ cross} linking by forming siloxane bonds 
The present invention relates to a curing composition including an organic polymer which has silicon containing groups having one or more hydroxyl or hydrolyzable groups bonded to the silicon atom or { TAIL ~ atoms } and capable of { HEAD ~ cross } linking by forming siloxane bonds
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL OTH OTH OTH HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH