With a semiconductor apparatus package of example embodiments of the technology disclosed herein and {HEAD ~ a method} of producing {TAIL ~ the semiconductor apparatus package}, the semiconductor apparatus package includes a circuit board and a semiconductor device sealed with sealing resin 
of producing
With a semiconductor apparatus package of example embodiments of the technology disclosed herein and { HEAD ~ a method } of producing { TAIL ~ the semiconductor apparatus package } , the semiconductor apparatus package includes a circuit board and a semiconductor device sealed with sealing resin
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