This invention relates generally to electronic packaging leads, and more particularly to a multi path feed thru {HEAD ~ lead} providing {TAIL ~ a plurality} of discrete conductive pathways on a single substrate member 
providing
This invention relates generally to electronic packaging leads , and more particularly to a multi path feed thru { HEAD ~ lead } providing { TAIL ~ a plurality } of discrete conductive pathways on a single substrate member
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH