A ceramic laminated circuit substrate 1, wherein the conductor layer comprises Cu, Au, Ag, Ag Pd, W, or an alloy of at least two of them and ceramic material of the ceramic insulating layers softens at {HEAD ~ a temperature} lower than {TAIL ~ the melting point} of the conductor layer 
lower than
A ceramic laminated circuit substrate 1 , wherein the conductor layer comprises Cu , Au , Ag , Ag Pd , W , or an alloy of at least two of them and ceramic material of the ceramic insulating layers softens at { HEAD ~ a temperature } lower than { TAIL ~ the melting point } of the conductor layer
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