In a presently preferred embodiment of the invention, an IC chip is mounted and interconnected with a multilayer printed circuit board, to effect a Level 2 interconnect, without {TAIL ~ a ceramic chip package}, soldered wires, {HEAD ~ special tooling} or special labor 
In a presently preferred embodiment of the invention , an IC chip is mounted and interconnected with a multilayer printed circuit board , to effect a Level 2 interconnect , without { TAIL ~ a ceramic chip package } , soldered wires , { HEAD ~ special tooling } or special labor
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