The present invention relates to {HEAD ~ a heat dissipator} that includes a conductive substrate and {TAIL ~ a plurality} of nanostructures supported by the conductive substrate 
includes
The present invention relates to { HEAD ~ a heat dissipator } that includes a conductive substrate and { TAIL ~ a plurality } of nanostructures supported by the conductive substrate
OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH REL OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH