In particular, {HEAD ~ this invention} relates to a process control apparatus and {TAIL ~ method} for improving coating thickness control of photoresist coatings on semiconductor wafers which improves line width control of device features 
relates to
In particular , { HEAD ~ this invention } relates to a process control apparatus and { TAIL ~ method } for improving coating thickness control of photoresist coatings on semiconductor wafers which improves line width control of device features
OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL REL OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH