The main surface of a first semiconductor substrate is bonded to the main surface of {HEAD ~ a second semiconductor substrate} with {TAIL ~ an insulation film} interposed therebetween to form a composite substrate 
with
The main surface of a first semiconductor substrate is bonded to the main surface of { HEAD ~ a second semiconductor substrate } with { TAIL ~ an insulation film } interposed therebetween to form a composite substrate
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH