{HEAD ~ The present invention} provides {TAIL ~ a ceramic laminated circuit substrate} which is less in fluctuation of degree of shrinkage at firing and is less in voids and is suitable for formation of functional modules 
provides
{ HEAD ~ The present invention } provides { TAIL ~ a ceramic laminated circuit substrate } which is less in fluctuation of degree of shrinkage at firing and is less in voids and is suitable for formation of functional modules
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