The method 18, wherein said step of removing {HEAD ~ portions} of {TAIL ~ the cap wafer} between the plurality of cavities and the back surface of the cap wafer further includes the step of grinding the cap wafer from the back surface of the cap wafer until the back surface of the cap wafer reaches the plurality of cavities 
of
The method 18 , wherein said step of removing { HEAD ~ portions } of { TAIL ~ the cap wafer } between the plurality of cavities and the back surface of the cap wafer further includes the step of grinding the cap wafer from the back surface of the cap wafer until the back surface of the cap wafer reaches the plurality of cavities
OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH