Furthermore, {HEAD ~ the present invention} is related to {TAIL ~ a printed circuit board} for implementing a flip chip and the manufacturing method thereof 
is related to
Furthermore , { HEAD ~ the present invention } is related to { TAIL ~ a printed circuit board } for implementing a flip chip and the manufacturing method thereof
OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH