For this purpose, the material preferably contacts {HEAD ~ the entire surface} of {TAIL ~ the component} facing a near surface region of the circuit board and bonds the component surface to the surface region 
of
For this purpose , the material preferably contacts { HEAD ~ the entire surface } of { TAIL ~ the component } facing a near surface region of the circuit board and bonds the component surface to the surface region
OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH