A multi path feed thru lead is disclosed that provides increased conductive pathway density and that has {TAIL ~ particular utility} in combination with {HEAD ~ microcircuit packages housing hybrid and semiconductor discrete} and integrated circuit chips 
A multi path feed thru lead is disclosed that provides increased conductive pathway density and that has { TAIL ~ particular utility } in combination with { HEAD ~ microcircuit packages housing hybrid and semiconductor discrete } and integrated circuit chips
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH