A method for fabricating {HEAD ~ a semiconductor heat spreader} from {TAIL ~ a unitary metallic plate} is provided 
from
A method for fabricating { HEAD ~ a semiconductor heat spreader } from { TAIL ~ a unitary metallic plate } is provided
OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH