{HEAD ~ at least one additional IC chip package} of {TAIL ~ similar construction} to the first IC chip package arrayed in a parallel relationship with the first IC chip package; and 
of
{ HEAD ~ at least one additional IC chip package } of { TAIL ~ similar construction } to the first IC chip package arrayed in a parallel relationship with the first IC chip package ; and
HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH