A substrate wafer processing method and apparatus is disclosed utilizing a bowl having a central axis, a baffle surface positioned above the inside bottom surface of the bowl and a chuck member having a top surface for supporting and spinning substrate and positionable coaxially within {HEAD ~ the bowl} closely spaced from {TAIL ~ the baffle surface} 
closely spaced from
A substrate wafer processing method and apparatus is disclosed utilizing a bowl having a central axis , a baffle surface positioned above the inside bottom surface of the bowl and a chuck member having a top surface for supporting and spinning substrate and positionable coaxially within { HEAD ~ the bowl } closely spaced from { TAIL ~ the baffle surface }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL