An object of the present invention is to provide a method for bonding a semiconductor structure with a substrate and a high efficiency photonic device manufactured by using the same method, which are advantageous in increasing the yield, stability, and reliability of products by lowering the bonding temperature and by reducing {HEAD ~ the chance} of {TAIL ~ oxidation} of bonding interface layer by using a composite bonding layer 
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An object of the present invention is to provide a method for bonding a semiconductor structure with a substrate and a high efficiency photonic device manufactured by using the same method , which are advantageous in increasing the yield , stability , and reliability of products by lowering the bonding temperature and by reducing { HEAD ~ the chance } of { TAIL ~ oxidation } of bonding interface layer by using a composite bonding layer
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