applying {HEAD ~ an electrically nonconductive polymeric material} to {TAIL ~ the second side} of the circuit board so that the material flows through the second through hole, contacts the component, and bonds the component to the first side of the circuit board 
to
applying { HEAD ~ an electrically nonconductive polymeric material } to { TAIL ~ the second side } of the circuit board so that the material flows through the second through hole , contacts the component , and bonds the component to the first side of the circuit board
OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH