More particularly, through holes 20 are provided in the circuit board 10 adjacent the plated through holes, and the material 14 is applied such that it flows through the through holes 20 and contacts the surface of {HEAD ~ the component} 12 nearest {TAIL ~ the circuit board} 10 
nearest
More particularly , through holes 20 are provided in the circuit board 10 adjacent the plated through holes , and the material 14 is applied such that it flows through the through holes 20 and contacts the surface of { HEAD ~ the component } 12 nearest { TAIL ~ the circuit board } 10
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH