It is {TAIL ~ a second object} of the present invention to provide a flexible printed board, although a semiconductor element is flip chip bonded on the flexible printed board, which can easily prevent a change in performance, an erroneous operation, or the like caused by the photo electric effect of {HEAD ~ an element} on a semiconductor 
It is { TAIL ~ a second object } of the present invention to provide a flexible printed board , although a semiconductor element is flip chip bonded on the flexible printed board , which can easily prevent a change in performance , an erroneous operation , or the like caused by the photo electric effect of { HEAD ~ an element } on a semiconductor
OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH