Further, when the second step includes a step of forming a recess portion by etching the support board and the electrode is formed to correspond to the recess portion, {HEAD ~ the electrode} can be constituted by {TAIL ~ a structure} of being projected from the first solder resist layer 
constituted by
Further , when the second step includes a step of forming a recess portion by etching the support board and the electrode is formed to correspond to the recess portion , { HEAD ~ the electrode } can be constituted by { TAIL ~ a structure } of being projected from the first solder resist layer
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH