The edge metallization of the present invention may be fabricated by drilling holes into {HEAD ~ a wafer} of {TAIL ~ ferrite substrate} 26, at the edge metallization locations 36 
of
The edge metallization of the present invention may be fabricated by drilling holes into { HEAD ~ a wafer } of { TAIL ~ ferrite substrate } 26 , at the edge metallization locations 36
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH