{HEAD ~ The dicing tape integrated wafer back surface protective film} 1, wherein said colored wafer back surface protective film has {TAIL ~ a laser} marking ability 
{ HEAD ~ The dicing tape integrated wafer back surface protective film } 1 , wherein said colored wafer back surface protective film has { TAIL ~ a laser } marking ability
HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH