The droplet ejection head 1 further comprising a third bonding film between the other surface of the sealing plate and the piezoelectric means, wherein the third bonding film is constituted in {TAIL ~ the same manner} as {HEAD ~ the first bonding film}, and the piezoelectric means is bonded to the sealing plate through the third bonding film 
The droplet ejection head 1 further comprising a third bonding film between the other surface of the sealing plate and the piezoelectric means , wherein the third bonding film is constituted in { TAIL ~ the same manner } as { HEAD ~ the first bonding film } , and the piezoelectric means is bonded to the sealing plate through the third bonding film
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