In accordance with the invention, a novel five layer sandwich of adhesive, insulation, metal, insulation and adhesive layers provides a whole new variety of potential applications such as bonding, interconnection and mutual insulation of {HEAD ~ different parts} of {TAIL ~ the semiconductor package} at the same time 
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In accordance with the invention , a novel five layer sandwich of adhesive , insulation , metal , insulation and adhesive layers provides a whole new variety of potential applications such as bonding , interconnection and mutual insulation of { HEAD ~ different parts } of { TAIL ~ the semiconductor package } at the same time
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