The first face of the secondary substrate may include a first pattern of conductive lands formed on the first face corresponding to a plurality of {HEAD ~ conductive leads} of {TAIL ~ an electronic package} 
of
The first face of the secondary substrate may include a first pattern of conductive lands formed on the first face corresponding to a plurality of { HEAD ~ conductive leads } of { TAIL ~ an electronic package }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL