For this purpose, the material preferably contacts the entire surface of the component facing a near surface region of {HEAD ~ the circuit board} and bonds the component surface to {TAIL ~ the surface region} 
For this purpose , the material preferably contacts the entire surface of the component facing a near surface region of { HEAD ~ the circuit board } and bonds the component surface to { TAIL ~ the surface region }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL