Because the peripheral edge portion of the protective sheet is provided at {TAIL ~ the inside} of {HEAD ~ the peripheral edge portion} of the semiconductor chip, a dicing blade does not contact the protective member when cutting the semiconductor wafer 
Because the peripheral edge portion of the protective sheet is provided at { TAIL ~ the inside } of { HEAD ~ the peripheral edge portion } of the semiconductor chip , a dicing blade does not contact the protective member when cutting the semiconductor wafer
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH