In a three dimensional construction employing the principles of the invention, the IC chips are arranged in modules, and {HEAD ~ interconnections} may be made between IC chips within each module, transversely between {TAIL ~ modules}, and in a third direction between layers of modules 
made transversely between
In a three dimensional construction employing the principles of the invention , the IC chips are arranged in modules , and { HEAD ~ interconnections } may be made between IC chips within each module , transversely between { TAIL ~ modules } , and in a third direction between layers of modules
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD OTH OTH REL OTH OTH OTH OTH OTH OTH OTH REL REL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH