This being so, damage on {HEAD ~ the surface} of {TAIL ~ the semiconductor wafer} 200 is thereby eliminated 
of
This being so , damage on { HEAD ~ the surface } of { TAIL ~ the semiconductor wafer } 200 is thereby eliminated
OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH