Another aspect provides a method of forming an integrated circuit device including {HEAD ~ the steps} of providing a semiconductor die; forming a first housing about the semiconductor die; thermally coupling a heat sink with the first housing; and forming {TAIL ~ a second housing} about at least a portion of the heat sink following the thermally coupling 
of forming
Another aspect provides a method of forming an integrated circuit device including { HEAD ~ the steps } of providing a semiconductor die ; forming a first housing about the semiconductor die ; thermally coupling a heat sink with the first housing ; and forming { TAIL ~ a second housing } about at least a portion of the heat sink following the thermally coupling
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