{HEAD ~ A process} for mounting {TAIL ~ a surface mount component}, such as a stick leaded device, to a circuit board having a pair of plated through holes and at least one additional through hole , each of which extends through the circuit board  
for mounting
{ HEAD ~ A process } for mounting { TAIL ~ a surface mount component } , such as a stick leaded device , to a circuit board having a pair of plated through holes and at least one additional through hole , each of which extends through the circuit board
HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH