Simultaneously, {TAIL ~ the resist solution} is dropped from a resist solution supply nozzle onto {HEAD ~ the semiconductor wafer} and spread following the solvent 
Simultaneously , { TAIL ~ the resist solution } is dropped from a resist solution supply nozzle onto { HEAD ~ the semiconductor wafer } and spread following the solvent
OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH