{TAIL ~ The first laminate} is provided over the semiconductor substrate and includes a first interlayer dielectric film having {HEAD ~ a first mechanical strength} 
{ TAIL ~ The first laminate } is provided over the semiconductor substrate and includes a first interlayer dielectric film having { HEAD ~ a first mechanical strength }
TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD