In the above process, the component can be attached to the circuit board by {HEAD ~ wave soldering} prior to application of {TAIL ~ the material} 
In the above process , the component can be attached to the circuit board by { HEAD ~ wave soldering } prior to application of { TAIL ~ the material }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL