The invention is an apparatus and method for cleaving a semiconductor bar and coating {HEAD ~ the cleaved facets} within {TAIL ~ a vacuum environment} 
within
The invention is an apparatus and method for cleaving a semiconductor bar and coating { HEAD ~ the cleaved facets } within { TAIL ~ a vacuum environment }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL