Method for bonding {HEAD ~ semiconductor structure} with {TAIL ~ substrate and high efficiency photonic device} manufactured by using the same method 
with
Method for bonding { HEAD ~ semiconductor structure } with { TAIL ~ substrate and high efficiency photonic device } manufactured by using the same method
OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH