The connector elements are disposed in selected openings in the insulating board and compressed into {HEAD ~ contact} with {TAIL ~ the contact areas} on the IC chips and IC chip packages 
with
The connector elements are disposed in selected openings in the insulating board and compressed into { HEAD ~ contact } with { TAIL ~ the contact areas } on the IC chips and IC chip packages
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH