According to the object of the invention, a bonding pad structure comprises {HEAD ~ a substrate} having a bonding region and {TAIL ~ a sensing region} 
having
According to the object of the invention , a bonding pad structure comprises { HEAD ~ a substrate } having a bonding region and { TAIL ~ a sensing region }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL