FIG 3 is a bottom view of {TAIL ~ one embodiment} of {HEAD ~ secondary substrate} having a solder pattern arranged to match the pre existing pattern on primary substrate 1 
FIG 3 is a bottom view of { TAIL ~ one embodiment } of { HEAD ~ secondary substrate } having a solder pattern arranged to match the pre existing pattern on primary substrate 1
OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH