Semiconductor package having {HEAD ~ grooves} formed at {TAIL ~ side flash}, groove forming method, and deflashing method using semiconductor package formed with grooves 
formed at
Semiconductor package having { HEAD ~ grooves } formed at { TAIL ~ side flash } , groove forming method , and deflashing method using semiconductor package formed with grooves
OTH OTH OTH HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH