An object of the present invention is to provide a polishing pad that is excellent in {TAIL ~ flatness} of a surface to be polished and evenness of a film thickness after polishing and also excellent in a polishing rate, and can achieve excellent polishing to a material to be polished such as an insulating film, a metallic film, etc, and {HEAD ~ a cushion} using for the polishing pad 
An object of the present invention is to provide a polishing pad that is excellent in { TAIL ~ flatness } of a surface to be polished and evenness of a film thickness after polishing and also excellent in a polishing rate , and can achieve excellent polishing to a material to be polished such as an insulating film , a metallic film , etc , and { HEAD ~ a cushion } using for the polishing pad
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