The present invention provides a ceramic laminated circuit substrate which is less in fluctuation of {HEAD ~ degree} of {TAIL ~ shrinkage} at firing and is less in voids and is suitable for formation of functional modules 
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The present invention provides a ceramic laminated circuit substrate which is less in fluctuation of { HEAD ~ degree } of { TAIL ~ shrinkage } at firing and is less in voids and is suitable for formation of functional modules
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