{HEAD ~ The complementary microstructures} may be superimposed in a controlled manner by operation of micro alignment means also formed in the foldable substrate by an etching or {TAIL ~ similar process} 
formed by
{ HEAD ~ The complementary microstructures } may be superimposed in a controlled manner by operation of micro alignment means also formed in the foldable substrate by an etching or { TAIL ~ similar process }
HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH REL OTH OTH OTH OTH REL OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL