In particular, this invention relates to a process control apparatus and method for improving coating thickness control of {HEAD ~ photoresist coatings} on {TAIL ~ semiconductor wafers} which improves line width control of device features 
on
In particular , this invention relates to a process control apparatus and method for improving coating thickness control of { HEAD ~ photoresist coatings } on { TAIL ~ semiconductor wafers } which improves line width control of device features
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