The present invention resides in an integrated circuit packaging construction for mounting and interconnecting IC chips and IC chip packages with a multilayer printed circuit board and for interconnecting IC chips with minimized interconnection lead {HEAD ~ lengths} between {TAIL ~ the IC chips} 
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The present invention resides in an integrated circuit packaging construction for mounting and interconnecting IC chips and IC chip packages with a multilayer printed circuit board and for interconnecting IC chips with minimized interconnection lead { HEAD ~ lengths } between { TAIL ~ the IC chips }
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