{HEAD ~ Transmission lines} 24 connecting to the via holes are etched onto {TAIL ~ the top conductive layer}, and an outline around each via hole is etched out of the bottom conductive layer to form conductive pads 38 that are separated from the ground layer 28 
are etched onto
{ HEAD ~ Transmission lines } 24 connecting to the via holes are etched onto { TAIL ~ the top conductive layer } , and an outline around each via hole is etched out of the bottom conductive layer to form conductive pads 38 that are separated from the ground layer 28
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH