In particular, the present invention relates to {HEAD ~ an underfilling material} which is used when a semiconductor package holding semiconductor elements on a carrier substrate is mounted onto a circuit board, a mounted board produced by such mounting, and a repairing method of {TAIL ~ a mounted board} 
In particular , the present invention relates to { HEAD ~ an underfilling material } which is used when a semiconductor package holding semiconductor elements on a carrier substrate is mounted onto a circuit board , a mounted board produced by such mounting , and a repairing method of { TAIL ~ a mounted board }
OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL