{TAIL ~ A first high frequency transmission line} connected to the semiconductor element is formed on the surface of said dielectric board in said cavity and {HEAD ~ a second high frequency transmission line} is formed on the bottom surface of said dielectric board, so that said first high frequency transmission line and said second high frequency transmission line are electromagnetically coupled together 
{ TAIL ~ A first high frequency transmission line } connected to the semiconductor element is formed on the surface of said dielectric board in said cavity and { HEAD ~ a second high frequency transmission line } is formed on the bottom surface of said dielectric board , so that said first high frequency transmission line and said second high frequency transmission line are electromagnetically coupled together
TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH