Furthermore, it is preferred to extend the conductive resin composition filling {HEAD ~ the through hole} through {TAIL ~ the interlayer adhesive surface} in the form of a projection of the conductive resin composition 
through
Furthermore , it is preferred to extend the conductive resin composition filling { HEAD ~ the through hole } through { TAIL ~ the interlayer adhesive surface } in the form of a projection of the conductive resin composition
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH