Embodiments of the invention relate to contact pads for silicon chip packages for {TAIL ~ attachment} to {HEAD ~ circuit boards} 
Embodiments of the invention relate to contact pads for silicon chip packages for { TAIL ~ attachment } to { HEAD ~ circuit boards }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD