{TAIL ~ A method} and apparatus for selectively disconnecting two electrical conductors either on the surface or below the surface of {HEAD ~ a semiconductor chip} or a thin film interconnection module connecting several semiconductor chips utilizes a thin metal film such as a silver film that is deposited over the ends of two conductors that it may become necessary to disconnect in the future 
{ TAIL ~ A method } and apparatus for selectively disconnecting two electrical conductors either on the surface or below the surface of { HEAD ~ a semiconductor chip } or a thin film interconnection module connecting several semiconductor chips utilizes a thin metal film such as a silver film that is deposited over the ends of two conductors that it may become necessary to disconnect in the future
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