{HEAD ~ A further technical advantage} of {TAIL ~ the invention} is its compatibility with a VLSI logic process in which other, lower power devices are made simultaneously in the same chip 
of
{ HEAD ~ A further technical advantage } of { TAIL ~ the invention } is its compatibility with a VLSI logic process in which other , lower power devices are made simultaneously in the same chip
HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH