A method for manufacturing a silicon chip package for a circuit board assembly is provided with a package substrate having a silicon chip and an array of {HEAD ~ contact pads} provided by {TAIL ~ conductive material} 
provided by
A method for manufacturing a silicon chip package for a circuit board assembly is provided with a package substrate having a silicon chip and an array of { HEAD ~ contact pads } provided by { TAIL ~ conductive material }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL