As a consequence, {HEAD ~ accidental scratching} and breakage of {TAIL ~ workpieces} such as semiconductor wafers and display substrates may be reduced or eliminated 
of
As a consequence , { HEAD ~ accidental scratching } and breakage of { TAIL ~ workpieces } such as semiconductor wafers and display substrates may be reduced or eliminated
OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH REL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH