Referring to FIG 4J, {HEAD ~ conductive material} is provided to the window 240 and formed therein, then an etching process is performed to form {TAIL ~ a self aligned contact pad} 300 a 
Referring to FIG 4J , { HEAD ~ conductive material } is provided to the window 240 and formed therein , then an etching process is performed to form { TAIL ~ a self aligned contact pad } 300 a
OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH