applying an electrically nonconductive polymeric material to {HEAD ~ the second side} of {TAIL ~ the circuit board} so that the material flows through the second through hole, contacts the component, and bonds the component to the first side of the circuit board 
of
applying an electrically nonconductive polymeric material to { HEAD ~ the second side } of { TAIL ~ the circuit board } so that the material flows through the second through hole , contacts the component , and bonds the component to the first side of the circuit board
OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH