When the wafer is diced to form individual circulators, the via holes are sliced in half, leaving a conductive trace 36 on the side of {TAIL ~ the circulator} substrate 26 that connects {HEAD ~ the transmission lines} 24 on the top to the conductive pads 38 on the bottom 
When the wafer is diced to form individual circulators , the via holes are sliced in half , leaving a conductive trace 36 on the side of { TAIL ~ the circulator } substrate 26 that connects { HEAD ~ the transmission lines } 24 on the top to the conductive pads 38 on the bottom
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH