The hooks are received in the recesses and resiliently press {TAIL ~ the base} of the heat sink toward the heat generating electronic component, whereby {HEAD ~ the clip} clamps the heat sink and the printed circuit board together 
The hooks are received in the recesses and resiliently press { TAIL ~ the base } of the heat sink toward the heat generating electronic component , whereby { HEAD ~ the clip } clamps the heat sink and the printed circuit board together
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