In a three dimensional construction employing the principles of the invention, the IC chips are arranged in modules, and {TAIL ~ interconnections} may be made between IC chips within each module, transversely between modules, and in a third direction between {HEAD ~ layers} of modules 
In a three dimensional construction employing the principles of the invention , the IC chips are arranged in modules , and { TAIL ~ interconnections } may be made between IC chips within each module , transversely between modules , and in a third direction between { HEAD ~ layers } of modules
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