Gases, e.g., hydrogen or nitrogen can be in the deposited films by creating a background plasma of {HEAD ~ the desired gas} using {TAIL ~ either RF energy}, thermionic emission, or consequential ionization of the gas passing through the arc or around the substrate 
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Gases , e.g. , hydrogen or nitrogen can be in the deposited films by creating a background plasma of { HEAD ~ the desired gas } using { TAIL ~ either RF energy } , thermionic emission , or consequential ionization of the gas passing through the arc or around the substrate
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH