Alternatively, {HEAD ~ the semiconductor chip} or the thin film interconnection module may be heated in {TAIL ~ an oven} to cause the conductors to be disconnected 
heated in
Alternatively , { HEAD ~ the semiconductor chip } or the thin film interconnection module may be heated in { TAIL ~ an oven } to cause the conductors to be disconnected
OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH