At least one embodiment provides a silicon chip package for a circuit board assembly having {HEAD ~ a package substrate} with {TAIL ~ a silicon chip} 
with
At least one embodiment provides a silicon chip package for a circuit board assembly having { HEAD ~ a package substrate } with { TAIL ~ a silicon chip }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL