The method 1, wherein {TAIL ~ the bonding finger} is a portion of {HEAD ~ the interconnection pattern} electrically connected to a bonding pad of the chip 
The method 1 , wherein { TAIL ~ the bonding finger } is a portion of { HEAD ~ the interconnection pattern } electrically connected to a bonding pad of the chip
OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH