Semiconductors {HEAD ~ 5 a} and {TAIL ~ 5 b} are bonded on the flexible printed board 2 by a so called flip chip bonding method 
Semiconductors { HEAD ~ 5 a } and { TAIL ~ 5 b } are bonded on the flexible printed board 2 by a so called flip chip bonding method
OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH