{HEAD ~ The conductive pad} 32, which is formed of a conductive metallic material such as aluminum or aluminum alloys, is embedded in {TAIL ~ the top surface} of the silicon substrate 12 to provide electrical connection to the inductor coil 20 
is embedded in
{ HEAD ~ The conductive pad } 32 , which is formed of a conductive metallic material such as aluminum or aluminum alloys , is embedded in { TAIL ~ the top surface } of the silicon substrate 12 to provide electrical connection to the inductor coil 20
HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH