A ceramic slurry is applied onto a carrier film to form the thermistor film layer, {HEAD ~ a metal powder} containing {TAIL ~ paste} is applied onto the thermistor film layer to form the metal base material, and further an electrode paste is applied onto the metal base material to form the split electrodes 
containing
A ceramic slurry is applied onto a carrier film to form the thermistor film layer , { HEAD ~ a metal powder } containing { TAIL ~ paste } is applied onto the thermistor film layer to form the metal base material , and further an electrode paste is applied onto the metal base material to form the split electrodes
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