The present invention relates to {HEAD ~ a heat dissipator} that includes {TAIL ~ a conductive substrate} and a plurality of nanostructures supported by the conductive substrate 
includes
The present invention relates to { HEAD ~ a heat dissipator } that includes { TAIL ~ a conductive substrate } and a plurality of nanostructures supported by the conductive substrate
OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH