The material is preferably a curable composition that is cured to form {HEAD ~ a strong bond} between {TAIL ~ the component and circuit board} 
between
The material is preferably a curable composition that is cured to form { HEAD ~ a strong bond } between { TAIL ~ the component and circuit board }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL