{HEAD ~ The method} comprises steps of: providing {TAIL ~ a semiconductor structure} and a substrate; forming a composite bonding layer on the semiconductor structure; and bonding the substrate with the composite bonding layer on the semiconductor structure to form a composite alloyed bonding layer 
{ HEAD ~ The method } comprises steps of : providing { TAIL ~ a semiconductor structure } and a substrate ; forming a composite bonding layer on the semiconductor structure ; and bonding the substrate with the composite bonding layer on the semiconductor structure to form a composite alloyed bonding layer
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH