{HEAD ~ The apparatus} of the present invention preferably includes {TAIL ~ first and second vacuum processing chambers} , wherein the first chamber performs the plasma cleaning of the workpiece according to the method of the invention, and the second chamber performs an additional process step, e.g., depositing a metal 
preferably includes
{ HEAD ~ The apparatus } of the present invention preferably includes { TAIL ~ first and second vacuum processing chambers } , wherein the first chamber performs the plasma cleaning of the workpiece according to the method of the invention , and the second chamber performs an additional process step , e.g. , depositing a metal
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH