Referring now to FIG 8, a lift off {HEAD ~ resist layer} 30 is formed on {TAIL ~ the layered structure} T1, and side portions of the layered structure T1 not covered with the lift off resist layer 30 are removed by etching or the like 
is formed on
Referring now to FIG 8 , a lift off { HEAD ~ resist layer } 30 is formed on { TAIL ~ the layered structure } T1 , and side portions of the layered structure T1 not covered with the lift off resist layer 30 are removed by etching or the like
OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH