A dicing tape integrated wafer back surface protective film is used for protecting a back surface of {HEAD ~ a chip} shaped {TAIL ~ workpiece} and enhancing strength 
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A dicing tape integrated wafer back surface protective film is used for protecting a back surface of { HEAD ~ a chip } shaped { TAIL ~ workpiece } and enhancing strength
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH