In the manufacturing process the different distances between the plates and the wafers are adjusted and maintained via {HEAD ~ the spacer means} comprising {TAIL ~ the adhesive layers} 
comprising
In the manufacturing process the different distances between the plates and the wafers are adjusted and maintained via { HEAD ~ the spacer means } comprising { TAIL ~ the adhesive layers }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL