FIGS 2 to 4 show one embodiment of {HEAD ~ the method} of manufacturing {TAIL ~ an imprinting template} using a semiconductor manufacturing process according to the present invention 
of manufacturing
FIGS 2 to 4 show one embodiment of { HEAD ~ the method } of manufacturing { TAIL ~ an imprinting template } using a semiconductor manufacturing process according to the present invention
OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH