A process 5 which includes the further steps of removing the component from the package and installing the component into {HEAD ~ a furnace} used for {TAIL ~ processing semiconductor wafers} 
used for
A process 5 which includes the further steps of removing the component from the package and installing the component into { HEAD ~ a furnace } used for { TAIL ~ processing semiconductor wafers }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL