The present invention relates to a heat dissipator that includes a conductive substrate and a plurality of {HEAD ~ nanostructures} supported by {TAIL ~ the conductive substrate} 
supported by
The present invention relates to a heat dissipator that includes a conductive substrate and a plurality of { HEAD ~ nanostructures } supported by { TAIL ~ the conductive substrate }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL