Here, the adhesive film includes a curable hot melt adhesive layer including a curable resin and moisture absorbent, the curable hot melt adhesive layer includes a first region coming in {HEAD ~ contact} with {TAIL ~ the OED} upon encapsulation of the OED, and a second region not coming in contact with the OED, and the moisture absorbent is present at contents of 0 to 20% and 80 to 100% in the first and second regions, respectively, based on the total weight of the moisture absorbent in the adhesive layer 
with
Here , the adhesive film includes a curable hot melt adhesive layer including a curable resin and moisture absorbent , the curable hot melt adhesive layer includes a first region coming in { HEAD ~ contact } with { TAIL ~ the OED } upon encapsulation of the OED , and a second region not coming in contact with the OED , and the moisture absorbent is present at contents of 0 to 20 % and 80 to 100 % in the first and second regions , respectively , based on the total weight of the moisture absorbent in the adhesive layer
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