A method of making {HEAD ~ an IC device} includes providing a stack of leadframe sheets each including a plurality of leadframes and an interleaf member interposed between adjacent ones of {TAIL ~ the leadframe sheets} 
A method of making { HEAD ~ an IC device } includes providing a stack of leadframe sheets each including a plurality of leadframes and an interleaf member interposed between adjacent ones of { TAIL ~ the leadframe sheets }
OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL