An array of contact pads on {HEAD ~ the package substrate} are provided by {TAIL ~ a conductive material} 
An array of contact pads on { HEAD ~ the package substrate } are provided by { TAIL ~ a conductive material }
OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL