The present invention relates to a method of forming polishing pads used for chemical mechanical planarization , and in particular relates to a method of forming {HEAD ~ a polishing pad} using {TAIL ~ laser sintering} 
using
The present invention relates to a method of forming polishing pads used for chemical mechanical planarization , and in particular relates to a method of forming { HEAD ~ a polishing pad } using { TAIL ~ laser sintering }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL