It also relates to {HEAD ~ highly reliable semiconductor devices} in which {TAIL ~ the semiconductor element} therein is bonded to its element attachment site using this hot melt adhesive sheet 
It also relates to { HEAD ~ highly reliable semiconductor devices } in which { TAIL ~ the semiconductor element } therein is bonded to its element attachment site using this hot melt adhesive sheet
OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH