{HEAD ~ A process} 4, wherein {TAIL ~ the amount} of the metal element selected in the Periodic Table used in the contact treatment is in the range of from 0.001 to 0.5 part by weight per part of platinum or palladium 
wherein
{ HEAD ~ A process } 4 , wherein { TAIL ~ the amount } of the metal element selected in the Periodic Table used in the contact treatment is in the range of from 0.001 to 0.5 part by weight per part of platinum or palladium
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH