A process 5 which includes {HEAD ~ the further steps} of removing the component from the package and installing {TAIL ~ the component} into a furnace used for processing semiconductor wafers 
of installing
A process 5 which includes { HEAD ~ the further steps } of removing the component from the package and installing { TAIL ~ the component } into a furnace used for processing semiconductor wafers
OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL OTH OTH OTH OTH OTH OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH