According to one aspect of the present invention, {HEAD ~ an integrated circuit device} includes a semiconductor die and {TAIL ~ a first housing} encapsulating the semiconductor die 
includes
According to one aspect of the present invention , { HEAD ~ an integrated circuit device } includes a semiconductor die and { TAIL ~ a first housing } encapsulating the semiconductor die
OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH