Then, a semiconductor wafer is bonded to the protective sheet at {HEAD ~ an opposite side} of {TAIL ~ the jig}, and the jig is detached from the protective sheet and the semiconductor wafer bonded together 
of
Then , a semiconductor wafer is bonded to the protective sheet at { HEAD ~ an opposite side } of { TAIL ~ the jig } , and the jig is detached from the protective sheet and the semiconductor wafer bonded together
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH