Simultaneously, {HEAD ~ the resist solution} is dropped from a resist solution supply nozzle onto {TAIL ~ the semiconductor wafer} and spread following the solvent 
is dropped onto
Simultaneously , { HEAD ~ the resist solution } is dropped from a resist solution supply nozzle onto { TAIL ~ the semiconductor wafer } and spread following the solvent
OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL OTH OTH OTH OTH OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH