The present invention relates to {HEAD ~ a method} for bonding a semiconductor structure with a substrate and a high efficiency photonic device manufactured by using the same method and, more particularly, to a method for bonding a semiconductor structure with a substrate and {TAIL ~ a manufactured structure} by using the same method where the temperature at which a semiconductor is bonded with a substrate can be reduced effectively by means of providing a composite bonding layer on the semiconductor structure, the substrate, or both on the semiconductor structure and the substrate 
The present invention relates to { HEAD ~ a method } for bonding a semiconductor structure with a substrate and a high efficiency photonic device manufactured by using the same method and , more particularly , to a method for bonding a semiconductor structure with a substrate and { TAIL ~ a manufactured structure } by using the same method where the temperature at which a semiconductor is bonded with a substrate can be reduced effectively by means of providing a composite bonding layer on the semiconductor structure , the substrate , or both on the semiconductor structure and the substrate
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