{HEAD ~ The droplet ejection head} 1 further comprising {TAIL ~ a third bonding film} between the other surface of the sealing plate and the piezoelectric means, wherein the third bonding film is constituted in the same manner as the first bonding film, and the piezoelectric means is bonded to the sealing plate through the third bonding film 
comprising
{ HEAD ~ The droplet ejection head } 1 further comprising { TAIL ~ a third bonding film } between the other surface of the sealing plate and the piezoelectric means , wherein the third bonding film is constituted in the same manner as the first bonding film , and the piezoelectric means is bonded to the sealing plate through the third bonding film
HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH