After that, {TAIL ~ the semiconductor wafer} is cut into semiconductor chips by dicing along {HEAD ~ the grooves} of the protective sheet 
After that , { TAIL ~ the semiconductor wafer } is cut into semiconductor chips by dicing along { HEAD ~ the grooves } of the protective sheet
OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH