That is, the object of the present invention is to provide an aqueous dispersion for CMP with a high removal rate that allows efficient polishing, while also producing minimal excessive etching, thinning, dishing, keyholes and scratches, to give {HEAD ~ finished surfaces} with {TAIL ~ satisfactory high precision} 
with
That is , the object of the present invention is to provide an aqueous dispersion for CMP with a high removal rate that allows efficient polishing , while also producing minimal excessive etching , thinning , dishing , keyholes and scratches , to give { HEAD ~ finished surfaces } with { TAIL ~ satisfactory high precision }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL