A novel five layer tape is provided for {HEAD ~ applications} such as bonding, interconnection and {TAIL ~ insulation} of different parts of a semiconductor package at the same time 
such as
A novel five layer tape is provided for { HEAD ~ applications } such as bonding , interconnection and { TAIL ~ insulation } of different parts of a semiconductor package at the same time
OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD REL REL OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH