Alternatively, the semiconductor chip or the thin film interconnection module may be heated in {HEAD ~ an oven} to cause {TAIL ~ the conductors} to be disconnected 
to cause
Alternatively , the semiconductor chip or the thin film interconnection module may be heated in { HEAD ~ an oven } to cause { TAIL ~ the conductors } to be disconnected
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH