{TAIL ~ The semiconductor device} 1, wherein {HEAD ~ the additional leads} further include a fourth lead between the second and third leads 
{ TAIL ~ The semiconductor device } 1 , wherein { HEAD ~ the additional leads } further include a fourth lead between the second and third leads
TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH