A method for bonding {HEAD ~ a semiconductor structure} with a substrate and a high efficiency photonic device manufactured by using {TAIL ~ the same method} are disclosed 
A method for bonding { HEAD ~ a semiconductor structure } with a substrate and a high efficiency photonic device manufactured by using { TAIL ~ the same method } are disclosed
OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH