die bonding {HEAD ~ a first semiconductor chip} with {TAIL ~ a large amount} of heat generation to the first die pad portion, wire bonding external electrode leading out bonding pads of the first semiconductor chip and the outer leads corresponding thereto 
with
die bonding { HEAD ~ a first semiconductor chip } with { TAIL ~ a large amount } of heat generation to the first die pad portion , wire bonding external electrode leading out bonding pads of the first semiconductor chip and the outer leads corresponding thereto
OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH