{HEAD ~ The method} of the present invention further includes electrically connecting a contact portion of the lead terminal to the transparent plate through {TAIL ~ a substantially flexible and movable conductive joint portion} of the lead terminal to substantially minimize residual stresses formed from the electrical coupling between the transparent plate and the circuit portion 
{ HEAD ~ The method } of the present invention further includes electrically connecting a contact portion of the lead terminal to the transparent plate through { TAIL ~ a substantially flexible and movable conductive joint portion } of the lead terminal to substantially minimize residual stresses formed from the electrical coupling between the transparent plate and the circuit portion
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