In {HEAD ~ order} to have {TAIL ~ a contact} with a terminal on the semiconductor die or other bonding pad site, windows are formed in the insulative layer 
to have
In { HEAD ~ order } to have { TAIL ~ a contact } with a terminal on the semiconductor die or other bonding pad site , windows are formed in the insulative layer
OTH HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH