{HEAD ~ An array} of {TAIL ~ contact pads} on the package substrate are provided by a conductive material 
of
{ HEAD ~ An array } of { TAIL ~ contact pads } on the package substrate are provided by a conductive material
HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH