This being so, damage on {TAIL ~ the surface} of {HEAD ~ the semiconductor wafer} 200 is thereby eliminated 
This being so , damage on { TAIL ~ the surface } of { HEAD ~ the semiconductor wafer } 200 is thereby eliminated
OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH