According to one aspect of the invention, the affected layer formed on {TAIL ~ the surface} of the substrate provided with {HEAD ~ the mask} is removed by the wet etching 
According to one aspect of the invention , the affected layer formed on { TAIL ~ the surface } of the substrate provided with { HEAD ~ the mask } is removed by the wet etching
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH