A method of forming solder bumps includes the steps of applying {HEAD ~ a thick layer} of solder resist to {TAIL ~ a substrate} 
to
A method of forming solder bumps includes the steps of applying { HEAD ~ a thick layer } of solder resist to { TAIL ~ a substrate }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL