The method comprises steps of: providing a semiconductor structure and a substrate; forming a composite bonding layer on the semiconductor structure; and bonding the substrate with the composite bonding layer on {HEAD ~ the semiconductor structure} to form {TAIL ~ a composite} alloyed bonding layer 
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The method comprises steps of : providing a semiconductor structure and a substrate ; forming a composite bonding layer on the semiconductor structure ; and bonding the substrate with the composite bonding layer on { HEAD ~ the semiconductor structure } to form { TAIL ~ a composite } alloyed bonding layer
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