{HEAD ~ The technical field} of this disclosure is {TAIL ~ semiconductor manufacturing methods}, particularly, a method for molding light emitting diode lamps 
is
{ HEAD ~ The technical field } of this disclosure is { TAIL ~ semiconductor manufacturing methods } , particularly , a method for molding light emitting diode lamps
HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH