{HEAD ~ The main surface} of a first semiconductor substrate is bonded to {TAIL ~ the main surface} of a second semiconductor substrate with an insulation film interposed therebetween to form a composite substrate 
is bonded to
{ HEAD ~ The main surface } of a first semiconductor substrate is bonded to { TAIL ~ the main surface } of a second semiconductor substrate with an insulation film interposed therebetween to form a composite substrate
HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH