The first face of the secondary substrate may include {HEAD ~ a first pattern} of {TAIL ~ conductive lands} formed on the first face corresponding to a plurality of conductive leads of an electronic package 
of
The first face of the secondary substrate may include { HEAD ~ a first pattern } of { TAIL ~ conductive lands } formed on the first face corresponding to a plurality of conductive leads of an electronic package
OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH