The method for manufacturing a nonreciprocal circuit device 2, wherein {HEAD ~ said device} comprises {TAIL ~ a high temperature solder} which melts at 230° C. or higher 
comprises
The method for manufacturing a nonreciprocal circuit device 2 , wherein { HEAD ~ said device } comprises { TAIL ~ a high temperature solder } which melts at 230 ° C. or higher
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH