The invention further relates to {HEAD ~ a method} for mounting {TAIL ~ the removed semiconductor chips} on a substrate 
for mounting
The invention further relates to { HEAD ~ a method } for mounting { TAIL ~ the removed semiconductor chips } on a substrate
OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH