An object of the present invention is to provide a polishing pad that is excellent in flatness of a surface to be polished and evenness of a film thickness after polishing and also excellent in a polishing rate, and can achieve excellent polishing to {HEAD ~ a material} to be polished such as an insulating film, a metallic film, etc, and a cushion using for {TAIL ~ the polishing pad} 
An object of the present invention is to provide a polishing pad that is excellent in flatness of a surface to be polished and evenness of a film thickness after polishing and also excellent in a polishing rate , and can achieve excellent polishing to { HEAD ~ a material } to be polished such as an insulating film , a metallic film , etc , and a cushion using for { TAIL ~ the polishing pad }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL