Moreover, the curing composition of the present invention can adhere, by itself or with the aid of a primer, to a wide variety of {HEAD ~ substrates} including {TAIL ~ glass}, porcelain, woods, metals and molded resin substances, and accordingly, can be used as various types of hermetically sealing compositions and adhesive compositions 
including
Moreover , the curing composition of the present invention can adhere , by itself or with the aid of a primer , to a wide variety of { HEAD ~ substrates } including { TAIL ~ glass } , porcelain , woods , metals and molded resin substances , and accordingly , can be used as various types of hermetically sealing compositions and adhesive compositions
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