A resin sealing mold 1, wherein said semiconductor chip is mounted on a die pad of a lead flame and {HEAD ~ a mirror face region} is formed in said external lead placing regions and {TAIL ~ a region} for placing the die pad 
is formed in
A resin sealing mold 1 , wherein said semiconductor chip is mounted on a die pad of a lead flame and { HEAD ~ a mirror face region } is formed in said external lead placing regions and { TAIL ~ a region } for placing the die pad
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL REL OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH