at least one additional IC chip package of {HEAD ~ similar construction} to {TAIL ~ the first IC chip package} arrayed in a parallel relationship with the first IC chip package; and 
to
at least one additional IC chip package of { HEAD ~ similar construction } to { TAIL ~ the first IC chip package } arrayed in a parallel relationship with the first IC chip package ; and
OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH