In {HEAD ~ the above process}, the component can be attached to the circuit board by {TAIL ~ wave soldering} prior to application of the material 
In { HEAD ~ the above process } , the component can be attached to the circuit board by { TAIL ~ wave soldering } prior to application of the material
OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH