This invention relates to novel crosslinkable and crosslinked polymer compositions and to processes for preparing these compositions, It also encompasses silica filled transfer molding compounds used for {HEAD ~ packaging electronic components} comprising {TAIL ~ the crosslinked compositions} 
comprising
This invention relates to novel crosslinkable and crosslinked polymer compositions and to processes for preparing these compositions , It also encompasses silica filled transfer molding compounds used for { HEAD ~ packaging electronic components } comprising { TAIL ~ the crosslinked compositions }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL