{HEAD ~ The loading}, unloading, handling and processing of {TAIL ~ wafers} in the machine can occur while other wafers are being preheated 
of
{ HEAD ~ The loading } , unloading , handling and processing of { TAIL ~ wafers } in the machine can occur while other wafers are being preheated
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH REL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH