A diameter of the plurality of contact pins is configured to be sufficiently small for the plurality of {HEAD ~ contact pins} to pierce the respective solder bumps so that an electrical connection is established by the upper end of each of {TAIL ~ the plurality} of solder bumps piercing an associated one of the solder bumps 
A diameter of the plurality of contact pins is configured to be sufficiently small for the plurality of { HEAD ~ contact pins } to pierce the respective solder bumps so that an electrical connection is established by the upper end of each of { TAIL ~ the plurality } of solder bumps piercing an associated one of the solder bumps
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH