{HEAD ~ The thermal diffusion process} may also be performed by heating the entire chip or {TAIL ~ multi chip module}, for example, in an oven that has been heated to, for example, about 250° C. The oven heating technique is particularly useful when large areas of the composite film are to be heated or if multiple disconnections are to be made simultaneously 
performed by heating
{ HEAD ~ The thermal diffusion process } may also be performed by heating the entire chip or { TAIL ~ multi chip module } , for example , in an oven that has been heated to , for example , about 250 ° C. The oven heating technique is particularly useful when large areas of the composite film are to be heated or if multiple disconnections are to be made simultaneously
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