{TAIL ~ At least one embodiment} provides a silicon chip package for a circuit board assembly having a package substrate with {HEAD ~ a silicon chip} 
{ TAIL ~ At least one embodiment } provides a silicon chip package for a circuit board assembly having a package substrate with { HEAD ~ a silicon chip }
TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD