The present invention utilizes a nanoindenter type device obtaining {HEAD ~ mechanical properties} as {TAIL ~ a function} of displacement depth and applied load into the bond pad surface to accurately predict electrical property stability of the entire substrate or sample under test 
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The present invention utilizes a nanoindenter type device obtaining { HEAD ~ mechanical properties } as { TAIL ~ a function } of displacement depth and applied load into the bond pad surface to accurately predict electrical property stability of the entire substrate or sample under test
OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH