A semiconductor device that includes a metal substrate including a top surface, a bottom surface and four side surfaces, a conductive pattern insulated from the metal substrate, and {HEAD ~ a semiconductor element} mounted on and electrically connected to {TAIL ~ the conductive pattern} 
mounted on
A semiconductor device that includes a metal substrate including a top surface , a bottom surface and four side surfaces , a conductive pattern insulated from the metal substrate , and { HEAD ~ a semiconductor element } mounted on and electrically connected to { TAIL ~ the conductive pattern }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL