According to another aspect of the present invention, {TAIL ~ a semiconductor device} has a semiconductor chip provided by cutting a semiconductor wafer by dicing, and a protective member disposed on {HEAD ~ the semiconductor chip} 
According to another aspect of the present invention , { TAIL ~ a semiconductor device } has a semiconductor chip provided by cutting a semiconductor wafer by dicing , and a protective member disposed on { HEAD ~ the semiconductor chip }
OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD