The method may include mounting a memory package including a second optical window formed at a surface and a built in memory die on a PCB including {HEAD ~ a first optical window} formed at a surface and {TAIL ~ a built in optical waveguide} 
formed at
The method may include mounting a memory package including a second optical window formed at a surface and a built in memory die on a PCB including { HEAD ~ a first optical window } formed at a surface and { TAIL ~ a built in optical waveguide }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL