Then, a semiconductor wafer is bonded to {TAIL ~ the protective sheet} at an opposite side of the jig, and {HEAD ~ the jig} is detached from the protective sheet and the semiconductor wafer bonded together 
Then , a semiconductor wafer is bonded to { TAIL ~ the protective sheet } at an opposite side of the jig , and { HEAD ~ the jig } is detached from the protective sheet and the semiconductor wafer bonded together
OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH