A method of forming solder bumps includes the steps of applying {HEAD ~ a thick layer} of {TAIL ~ solder resist} to a substrate 
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A method of forming solder bumps includes the steps of applying { HEAD ~ a thick layer } of { TAIL ~ solder resist } to a substrate
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH