In order to have a contact with a terminal on {TAIL ~ the semiconductor die} or other bonding pad site, windows are formed in {HEAD ~ the insulative layer} 
In order to have a contact with a terminal on { TAIL ~ the semiconductor die } or other bonding pad site , windows are formed in { HEAD ~ the insulative layer }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD