In a presently preferred embodiment of the invention, an IC chip is mounted and interconnected with a multilayer printed circuit board, to effect {HEAD ~ a Level 2 interconnect}, without a ceramic chip package, soldered wires, special tooling or {TAIL ~ special labor} 
without
In a presently preferred embodiment of the invention , an IC chip is mounted and interconnected with a multilayer printed circuit board , to effect { HEAD ~ a Level 2 interconnect } , without a ceramic chip package , soldered wires , special tooling or { TAIL ~ special labor }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH REL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL