Problems involved are solved by a curing composition characterized by including an organic polymer having one or more silicon containing groups capable of cross linking by forming siloxane bonds, a metal carboxylate and {TAIL ~ carboxylic acid}, and a silicon compound having a hetero atom on the carbon atom in the α or {HEAD ~ β} position with respect to the silicon atom 
Problems involved are solved by a curing composition characterized by including an organic polymer having one or more silicon containing groups capable of cross linking by forming siloxane bonds , a metal carboxylate and { TAIL ~ carboxylic acid } , and a silicon compound having a hetero atom on the carbon atom in the α or { HEAD ~ β } position with respect to the silicon atom
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