Then, {HEAD ~ a semiconductor wafer} is bonded to {TAIL ~ the protective sheet} at an opposite side of the jig, and the jig is detached from the protective sheet and the semiconductor wafer bonded together 
is bonded to
Then , { HEAD ~ a semiconductor wafer } is bonded to { TAIL ~ the protective sheet } at an opposite side of the jig , and the jig is detached from the protective sheet and the semiconductor wafer bonded together
OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH