An integrated circuit chip packaging construction for mounting and interconnecting {HEAD ~ IC chips} and IC chip packages with a multilayer printed circuit board, without soldering, special tooling or {TAIL ~ special labor}, and for interconnecting IC chips with minimized interconnection lead lengths between the IC chips, without cable harnesses or back panel wiring 
without
An integrated circuit chip packaging construction for mounting and interconnecting { HEAD ~ IC chips } and IC chip packages with a multilayer printed circuit board , without soldering , special tooling or { TAIL ~ special labor } , and for interconnecting IC chips with minimized interconnection lead lengths between the IC chips , without cable harnesses or back panel wiring
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