In the above process, the component can be attached to {HEAD ~ the circuit board} by {TAIL ~ wave soldering} prior to application of the material 
by
In the above process , the component can be attached to { HEAD ~ the circuit board } by { TAIL ~ wave soldering } prior to application of the material
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH