applying an electrically nonconductive polymeric material to the second side of {TAIL ~ the circuit board} so that the material flows through the second through hole, contacts the component, and bonds the component to the first side of {HEAD ~ the circuit board} 
applying an electrically nonconductive polymeric material to the second side of { TAIL ~ the circuit board } so that the material flows through the second through hole , contacts the component , and bonds the component to the first side of { HEAD ~ the circuit board }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD