After that, the substrate 2 and the composite bonding layer 3 are pressurized at the temperature between {TAIL ~ 60° C.} to {HEAD ~ 500° C.} to form a composite alloyed bonding layer 4 
After that , the substrate 2 and the composite bonding layer 3 are pressurized at the temperature between { TAIL ~ 60 ° C. } to { HEAD ~ 500 ° C. } to form a composite alloyed bonding layer 4
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH