This additional electrical measurement is correlated with the mechanical property measurements to accurately predict {HEAD ~ electrical property stability} of {TAIL ~ the entire conductive substrate}, preferably by predicting the presence of an unwanted material surface layer 
of
This additional electrical measurement is correlated with the mechanical property measurements to accurately predict { HEAD ~ electrical property stability } of { TAIL ~ the entire conductive substrate } , preferably by predicting the presence of an unwanted material surface layer
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH