At least one embodiment provides {HEAD ~ a silicon chip package} for {TAIL ~ a circuit board assembly} having a package substrate with a silicon chip 
for
At least one embodiment provides { HEAD ~ a silicon chip package } for { TAIL ~ a circuit board assembly } having a package substrate with a silicon chip
OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH