The method may include mounting a memory package including {TAIL ~ a second optical window} formed at a surface and a built in memory die on a PCB including a first optical window formed at {HEAD ~ a surface} and a built in optical waveguide 
The method may include mounting a memory package including { TAIL ~ a second optical window } formed at a surface and a built in memory die on a PCB including a first optical window formed at { HEAD ~ a surface } and a built in optical waveguide
OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH