{TAIL ~ A rotating or vibrating disk} or pad is moved relative to the semiconductor wafer surface in the presence of {HEAD ~ a chemical mechanical polishing slurry} 
{ TAIL ~ A rotating or vibrating disk } or pad is moved relative to the semiconductor wafer surface in the presence of { HEAD ~ a chemical mechanical polishing slurry }
TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD