The method in accordance with the present invention is compatible with {HEAD ~ conventional CMOS fabrication processes} to form a zener diode and {TAIL ~ a lateral silicon controlled rectifier} constituting an on chip ESD protection circuit in a semiconductor substrate 
to form
The method in accordance with the present invention is compatible with { HEAD ~ conventional CMOS fabrication processes } to form a zener diode and { TAIL ~ a lateral silicon controlled rectifier } constituting an on chip ESD protection circuit in a semiconductor substrate
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH