In particular, this invention relates to a process control apparatus and {HEAD ~ method} for improving {TAIL ~ coating thickness control} of photoresist coatings on semiconductor wafers which improves line width control of device features 
for improving
In particular , this invention relates to a process control apparatus and { HEAD ~ method } for improving { TAIL ~ coating thickness control } of photoresist coatings on semiconductor wafers which improves line width control of device features
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