{HEAD ~ A solder} resist layer having an opening portion is then formed on the wiring portion, and the support board is removed to expose a surface of the electrode or {TAIL ~ a surface} of the electrode and insulating layer 
{ HEAD ~ A solder } resist layer having an opening portion is then formed on the wiring portion , and the support board is removed to expose a surface of the electrode or { TAIL ~ a surface } of the electrode and insulating layer
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH