The aqueous dispersion for {HEAD ~ CMP} according to the invention is therefore useful for CMP of polished surfaces with metal layers in {TAIL ~ manufacturing processes} for semiconductor devices 
The aqueous dispersion for { HEAD ~ CMP } according to the invention is therefore useful for CMP of polished surfaces with metal layers in { TAIL ~ manufacturing processes } for semiconductor devices
OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH