{HEAD ~ The edge metallization} of the present invention may be fabricated by drilling {TAIL ~ holes} into a wafer of ferrite substrate 26, at the edge metallization locations 36 
fabricated by drilling
{ HEAD ~ The edge metallization } of the present invention may be fabricated by drilling { TAIL ~ holes } into a wafer of ferrite substrate 26 , at the edge metallization locations 36
HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH REL REL REL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH