The present invention provides a ceramic laminated circuit substrate which is less in {HEAD ~ fluctuation} of degree of shrinkage at {TAIL ~ firing} and is less in voids and is suitable for formation of functional modules 
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The present invention provides a ceramic laminated circuit substrate which is less in { HEAD ~ fluctuation } of degree of shrinkage at { TAIL ~ firing } and is less in voids and is suitable for formation of functional modules
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