{HEAD ~ The complementary microstructures} may be superimposed in a controlled manner by operation of micro alignment means also formed in the foldable substrate by {TAIL ~ an etching} or similar process 
formed by
{ HEAD ~ The complementary microstructures } may be superimposed in a controlled manner by operation of micro alignment means also formed in the foldable substrate by { TAIL ~ an etching } or similar process
HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH REL OTH OTH OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH