{HEAD ~ A laser unit} includes a semiconductor laser tip mounted on a substrate of a material such as Si, {TAIL ~ a monitoring photodiode}, and a laser driving integrated circuit, all of which are fixed to a base member of a material, such as metal, by soldering or the like 
includes
{ HEAD ~ A laser unit } includes a semiconductor laser tip mounted on a substrate of a material such as Si , { TAIL ~ a monitoring photodiode } , and a laser driving integrated circuit , all of which are fixed to a base member of a material , such as metal , by soldering or the like
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