{HEAD ~ A resin sealing mold} 1, wherein {TAIL ~ said semiconductor chip} is mounted on a die pad of a lead flame and a mirror face region is formed in said external lead placing regions and a region for placing the die pad 
wherein
{ HEAD ~ A resin sealing mold } 1 , wherein { TAIL ~ said semiconductor chip } is mounted on a die pad of a lead flame and a mirror face region is formed in said external lead placing regions and a region for placing the die pad
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