{HEAD ~ The dielectric compositions} of this invention significantly reduce or eliminate {TAIL ~ warpage} of the substrate caused by the firing process 
significantly eliminate
{ HEAD ~ The dielectric compositions } of this invention significantly reduce or eliminate { TAIL ~ warpage } of the substrate caused by the firing process
HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH REL OTH OTH REL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH