The process comprises {HEAD ~ the steps} of applying the solution to the wafer surface and spinning {TAIL ~ the wafer} about the central axis at a spindle speed until the solution has dried 
of spinning
The process comprises { HEAD ~ the steps } of applying the solution to the wafer surface and spinning { TAIL ~ the wafer } about the central axis at a spindle speed until the solution has dried
OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL OTH OTH OTH OTH OTH OTH OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH