{HEAD ~ an epitaxial layer} formed on said {TAIL ~ second semiconductor substrate} to fill said etched portion, said epitaxial layer being electrically connected to said first and second semiconductor substrates; and 
formed on
{ HEAD ~ an epitaxial layer } formed on said { TAIL ~ second semiconductor substrate } to fill said etched portion , said epitaxial layer being electrically connected to said first and second semiconductor substrates ; and
HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH