Next, a reactive ion etching process is applied to remove the insulation layer 110 in {HEAD ~ order} for {TAIL ~ the inlets} 212 of the trenches 210 of the second substrate 200 to communicate with the channels 140 of the first substrate 100, so a micro syringe array is finally formed as shown 
for
Next , a reactive ion etching process is applied to remove the insulation layer 110 in { HEAD ~ order } for { TAIL ~ the inlets } 212 of the trenches 210 of the second substrate 200 to communicate with the channels 140 of the first substrate 100 , so a micro syringe array is finally formed as shown
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH