The present invention provides {HEAD ~ a ceramic laminated circuit substrate} which is less in fluctuation of degree of shrinkage at firing and is less in voids and is suitable for {TAIL ~ formation} of functional modules 
is suitable for
The present invention provides { HEAD ~ a ceramic laminated circuit substrate } which is less in fluctuation of degree of shrinkage at firing and is less in voids and is suitable for { TAIL ~ formation } of functional modules
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