The conductive pad 32, which is formed of {HEAD ~ a conductive metallic material} such as {TAIL ~ aluminum or aluminum alloys}, is embedded in the top surface of the silicon substrate 12 to provide electrical connection to the inductor coil 20 
such as
The conductive pad 32 , which is formed of { HEAD ~ a conductive metallic material } such as { TAIL ~ aluminum or aluminum alloys } , is embedded in the top surface of the silicon substrate 12 to provide electrical connection to the inductor coil 20
OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH