{HEAD ~ The method} 3 further comprising the step of using {TAIL ~ a second probe} to contact the bond pad proximate the first location to measure an electrical property 
{ HEAD ~ The method } 3 further comprising the step of using { TAIL ~ a second probe } to contact the bond pad proximate the first location to measure an electrical property
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH