In {TAIL ~ the method} for forming a resist pattern of the present invention, after a resist pattern is formed and the resist pattern thickening material is applied over the surface of the resist pattern, the resist pattern thickening material residing near {HEAD ~ the interface} with the resist pattern infiltrates into the resist pattern to interact with or be mixed with the material of the resist pattern, and the compound represented by the following General Formula reacts to the resin residing near the compound 
In { TAIL ~ the method } for forming a resist pattern of the present invention , after a resist pattern is formed and the resist pattern thickening material is applied over the surface of the resist pattern , the resist pattern thickening material residing near { HEAD ~ the interface } with the resist pattern infiltrates into the resist pattern to interact with or be mixed with the material of the resist pattern , and the compound represented by the following General Formula reacts to the resin residing near the compound
OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH