The present invention relates to a substrate processing method; and, more particularly, to a substrate processing method for reducing {HEAD ~ a width} of {TAIL ~ an opening} formed on a layer used as a mask 
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The present invention relates to a substrate processing method ; and , more particularly , to a substrate processing method for reducing { HEAD ~ a width } of { TAIL ~ an opening } formed on a layer used as a mask
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH