A high frequency module 1, wherein {TAIL ~ interference preventing grounding patterns} are provided on a surface of the laminate board and between the dielectric layers of {HEAD ~ the laminate board}, and connected to each other through via hole conductors 
A high frequency module 1 , wherein { TAIL ~ interference preventing grounding patterns } are provided on a surface of the laminate board and between the dielectric layers of { HEAD ~ the laminate board } , and connected to each other through via hole conductors
OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH