The aqueous dispersion for {HEAD ~ CMP} according to {TAIL ~ the invention} is therefore useful for CMP of polished surfaces with metal layers in manufacturing processes for semiconductor devices 
according to
The aqueous dispersion for { HEAD ~ CMP } according to { TAIL ~ the invention } is therefore useful for CMP of polished surfaces with metal layers in manufacturing processes for semiconductor devices
OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH