A process 5 which includes the further steps of removing the component from the package and installing {HEAD ~ the component} into {TAIL ~ a furnace} used for processing semiconductor wafers 
into
A process 5 which includes the further steps of removing the component from the package and installing { HEAD ~ the component } into { TAIL ~ a furnace } used for processing semiconductor wafers
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH