As in the prior embodiment the wafer and {HEAD ~ fixture} can now be washed to remove {TAIL ~ any dicing debris} created by the sawing operation 
washed to remove
As in the prior embodiment the wafer and { HEAD ~ fixture } can now be washed to remove { TAIL ~ any dicing debris } created by the sawing operation
OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD OTH OTH OTH REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH