The IC chips and IC chip packages are mounted and interconnected using {HEAD ~ an insulating board} having {TAIL ~ openings} through it, and a number of connector elements in the form of compressible wads of conductive wire 
having
The IC chips and IC chip packages are mounted and interconnected using { HEAD ~ an insulating board } having { TAIL ~ openings } through it , and a number of connector elements in the form of compressible wads of conductive wire
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH