{HEAD ~ A low dielectric insulation layer} for {TAIL ~ an integrated circuit structure material}, and a method of making same, are disclosed 
for
{ HEAD ~ A low dielectric insulation layer } for { TAIL ~ an integrated circuit structure material } , and a method of making same , are disclosed
HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH