A novel five layer tape is provided for applications such as bonding, interconnection and insulation of {HEAD ~ different parts} of {TAIL ~ a semiconductor package} at the same time 
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A novel five layer tape is provided for applications such as bonding , interconnection and insulation of { HEAD ~ different parts } of { TAIL ~ a semiconductor package } at the same time
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH