applying {HEAD ~ an electrically nonconductive polymeric material} to the second side of the circuit board so that the material flows through the second through hole, contacts the component, and bonds the component to {TAIL ~ the first side} of the circuit board 
applying { HEAD ~ an electrically nonconductive polymeric material } to the second side of the circuit board so that the material flows through the second through hole , contacts the component , and bonds the component to { TAIL ~ the first side } of the circuit board
OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH