{TAIL ~ The metal oxide} on the metal seed layer is reduced by contacting the metal seed layer disposed on a substrate with an aqueous solution having a pH maintained in the range of about 6.5 to about 13 and subjecting {HEAD ~ the aqueous solution} to a voltage of from about 0.1 to 5 volts 
{ TAIL ~ The metal oxide } on the metal seed layer is reduced by contacting the metal seed layer disposed on a substrate with an aqueous solution having a pH maintained in the range of about 6.5 to about 13 and subjecting { HEAD ~ the aqueous solution } to a voltage of from about 0.1 to 5 volts
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