Furthermore, it is preferred to extend the conductive resin composition filling the through hole through the interlayer adhesive surface in the form of {TAIL ~ a projection} of {HEAD ~ the conductive resin composition} 
Furthermore , it is preferred to extend the conductive resin composition filling the through hole through the interlayer adhesive surface in the form of { TAIL ~ a projection } of { HEAD ~ the conductive resin composition }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD