This invention relates generally to {TAIL ~ electronic packaging leads}, and more particularly to a multi path feed thru lead providing a plurality of discrete conductive pathways on {HEAD ~ a single substrate member} 
This invention relates generally to { TAIL ~ electronic packaging leads } , and more particularly to a multi path feed thru lead providing a plurality of discrete conductive pathways on { HEAD ~ a single substrate member }
OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD