The multi path feed thru {HEAD ~ lead} according to {TAIL ~ the present invention} includes an insulative substrate having a predetermined geometric configuration and includes an extended intermediate portion and first and second end portions configured to define a plurality of bonding pads that facilitate wire bonding to the circuitry housed in the package and to external circuitry, respectively 
according to
The multi path feed thru { HEAD ~ lead } according to { TAIL ~ the present invention } includes an insulative substrate having a predetermined geometric configuration and includes an extended intermediate portion and first and second end portions configured to define a plurality of bonding pads that facilitate wire bonding to the circuitry housed in the package and to external circuitry , respectively
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