The present invention relates generally to a memory module assembly, and more particularly to a memory module assembly including a clip and a heat sink, where the heat sink is mounted to an electronic component attached on a surface of {HEAD ~ a printed circuit board} of {TAIL ~ the memory module assembly} via the clip 
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The present invention relates generally to a memory module assembly , and more particularly to a memory module assembly including a clip and a heat sink , where the heat sink is mounted to an electronic component attached on a surface of { HEAD ~ a printed circuit board } of { TAIL ~ the memory module assembly } via the clip
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