{HEAD ~ A condition} without using Ar as plasma gas is applied to processing of an organic anti reflection coating, which suppresses {TAIL ~ a spatter effect} and decreases the cleavage of C—H and OC—O bonds in a resist 
{ HEAD ~ A condition } without using Ar as plasma gas is applied to processing of an organic anti reflection coating , which suppresses { TAIL ~ a spatter effect } and decreases the cleavage of C — H and OC — O bonds in a resist
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH