{HEAD ~ A ceramic slurry} is applied onto {TAIL ~ a carrier film} to form the thermistor film layer, a metal powder containing paste is applied onto the thermistor film layer to form the metal base material, and further an electrode paste is applied onto the metal base material to form the split electrodes 
is applied onto
{ HEAD ~ A ceramic slurry } is applied onto { TAIL ~ a carrier film } to form the thermistor film layer , a metal powder containing paste is applied onto the thermistor film layer to form the metal base material , and further an electrode paste is applied onto the metal base material to form the split electrodes
HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH