A preferred embodiment of the present invention includes depositing {HEAD ~ a thin film} having a uniform film thickness distribution by taking {TAIL ~ advantage} of the relation between the plasma density and the DC bias voltage described above 
A preferred embodiment of the present invention includes depositing { HEAD ~ a thin film } having a uniform film thickness distribution by taking { TAIL ~ advantage } of the relation between the plasma density and the DC bias voltage described above
OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH