A solder resist layer having {TAIL ~ an opening portion} is then formed on the wiring portion, and the support board is removed to expose a surface of {HEAD ~ the electrode} or a surface of the electrode and insulating layer 
A solder resist layer having { TAIL ~ an opening portion } is then formed on the wiring portion , and the support board is removed to expose a surface of { HEAD ~ the electrode } or a surface of the electrode and insulating layer
OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH