{HEAD ~ The present invention} relates to a method for bonding a semiconductor structure with a substrate and a high efficiency photonic device manufactured by using the same method and, more particularly, to {TAIL ~ a method} for bonding a semiconductor structure with a substrate and a manufactured structure by using the same method where the temperature at which a semiconductor is bonded with a substrate can be reduced effectively by means of providing a composite bonding layer on the semiconductor structure, the substrate, or both on the semiconductor structure and the substrate 
relates to
{ HEAD ~ The present invention } relates to a method for bonding a semiconductor structure with a substrate and a high efficiency photonic device manufactured by using the same method and , more particularly , to { TAIL ~ a method } for bonding a semiconductor structure with a substrate and a manufactured structure by using the same method where the temperature at which a semiconductor is bonded with a substrate can be reduced effectively by means of providing a composite bonding layer on the semiconductor structure , the substrate , or both on the semiconductor structure and the substrate
HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH