It also relates to highly reliable semiconductor devices in which the semiconductor element therein is bonded to {TAIL ~ its element attachment site} using {HEAD ~ this hot melt adhesive sheet} 
It also relates to highly reliable semiconductor devices in which the semiconductor element therein is bonded to { TAIL ~ its element attachment site } using { HEAD ~ this hot melt adhesive sheet }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD