The invention relates to a method for picking up {HEAD ~ semiconductor chips} from {TAIL ~ a wafer table} and, optionally, their mounting on a substrate by means of a pick and place system 
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The invention relates to a method for picking up { HEAD ~ semiconductor chips } from { TAIL ~ a wafer table } and , optionally , their mounting on a substrate by means of a pick and place system
OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH