The backside of the wafer 22 is then ground down to {HEAD ~ the saw kerfs} 24 to separate {TAIL ~ the devices} 32 
to separate
The backside of the wafer 22 is then ground down to { HEAD ~ the saw kerfs } 24 to separate { TAIL ~ the devices } 32
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH