A multilayer wiring board assembly component comprises: an insulating substrate component ; a conductive layer 112 formed on one surface of said insulating {HEAD ~ substrate component} 111 in {TAIL ~ the form} of an electrode pattern; an adhesive layer 113 formed on the other surface of said insulating substrate component 111; and a conductive resin composition 115 with which is filled a through hole passing through said insulating substrate component 111, 
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A multilayer wiring board assembly component comprises : an insulating substrate component ; a conductive layer 112 formed on one surface of said insulating { HEAD ~ substrate component } 111 in { TAIL ~ the form } of an electrode pattern ; an adhesive layer 113 formed on the other surface of said insulating substrate component 111 ; and a conductive resin composition 115 with which is filled a through hole passing through said insulating substrate component 111 ,
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