The method 1, wherein {HEAD ~ the physical vapor deposition} comprises {TAIL ~ radio frequency sputtering} or magnetron sputtering 
comprises
The method 1 , wherein { HEAD ~ the physical vapor deposition } comprises { TAIL ~ radio frequency sputtering } or magnetron sputtering
OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH