In {TAIL ~ the embodiments}, {HEAD ~ a semiconductor wafer} means a wafer before and after a dicing cut step is carried out provided that the wafer has a contour of its initial state 
In
In { TAIL ~ the embodiments } , { HEAD ~ a semiconductor wafer } means a wafer before and after a dicing cut step is carried out provided that the wafer has a contour of its initial state
REL TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH