{TAIL ~ The conductive particles} of the present invention can be used in electrical connection structures of {HEAD ~ microelectrodes}, anisotropic conductive adhesive films, and the like, in circuit board mounting applications 
{ TAIL ~ The conductive particles } of the present invention can be used in electrical connection structures of { HEAD ~ microelectrodes } , anisotropic conductive adhesive films , and the like , in circuit board mounting applications
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