According to {TAIL ~ one aspect} of the present invention, an integrated circuit device includes a semiconductor die and a first housing encapsulating {HEAD ~ the semiconductor die} 
According to { TAIL ~ one aspect } of the present invention , an integrated circuit device includes a semiconductor die and a first housing encapsulating { HEAD ~ the semiconductor die }
OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD