{HEAD ~ The first laminate} is provided over the semiconductor substrate and includes {TAIL ~ a first interlayer dielectric film} having a first mechanical strength 
includes
{ HEAD ~ The first laminate } is provided over the semiconductor substrate and includes { TAIL ~ a first interlayer dielectric film } having a first mechanical strength
HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH