The present invention relates to a cushion for a polishing pad and {HEAD ~ a polishing pad} using the cushion, and {TAIL ~ the polishing pad} is useful for polishing a material to be polished, for example, a semiconductor wafer and the like, at good precision and high polishing efficiency 
The present invention relates to a cushion for a polishing pad and { HEAD ~ a polishing pad } using the cushion , and { TAIL ~ the polishing pad } is useful for polishing a material to be polished , for example , a semiconductor wafer and the like , at good precision and high polishing efficiency
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