In a three dimensional construction employing the principles of the invention, the IC chips are arranged in modules, and interconnections may be made between IC chips within each module, transversely between modules, and in a third direction between {HEAD ~ layers} of {TAIL ~ modules} 
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In a three dimensional construction employing the principles of the invention , the IC chips are arranged in modules , and interconnections may be made between IC chips within each module , transversely between modules , and in a third direction between { HEAD ~ layers } of { TAIL ~ modules }
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