{HEAD ~ The main surface} of a first semiconductor substrate is bonded to the main surface of a second semiconductor substrate with {TAIL ~ an insulation film} interposed therebetween to form a composite substrate 
{ HEAD ~ The main surface } of a first semiconductor substrate is bonded to the main surface of a second semiconductor substrate with { TAIL ~ an insulation film } interposed therebetween to form a composite substrate
HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH