In the above metal compound powder, preferably, {TAIL ~ compound} is not dissociated under the irradiation with {HEAD ~ a carbon dioxide gas laser}, and therefore, no adverse influence is caused on a semiconductor chip and the intimate contact capability of a hole wall 
In the above metal compound powder , preferably , { TAIL ~ compound } is not dissociated under the irradiation with { HEAD ~ a carbon dioxide gas laser } , and therefore , no adverse influence is caused on a semiconductor chip and the intimate contact capability of a hole wall
OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH