A further object is to provide an improved method and apparatus for applying solder paste to thin, brittle substrates in {HEAD ~ a way} that avoids subjecting {TAIL ~ the substrates} to excessive bending and shear stresses that will cause the substrates .to break 
avoids subjecting
A further object is to provide an improved method and apparatus for applying solder paste to thin , brittle substrates in { HEAD ~ a way } that avoids subjecting { TAIL ~ the substrates } to excessive bending and shear stresses that will cause the substrates .to break
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH