CMOS circuits used with {TAIL ~ the polysilicon or polysilicon germanium MEMS structures} use interconnect materials that can withstand the high temperatures used during {HEAD ~ MEMS fabrication} 
CMOS circuits used with { TAIL ~ the polysilicon or polysilicon germanium MEMS structures } use interconnect materials that can withstand the high temperatures used during { HEAD ~ MEMS fabrication }
OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD