The IC chips and IC chip packages are mounted and interconnected using an insulating board having openings through it, and {TAIL ~ a number} of connector elements in the form of compressible wads of {HEAD ~ conductive wire} 
The IC chips and IC chip packages are mounted and interconnected using an insulating board having openings through it , and { TAIL ~ a number } of connector elements in the form of compressible wads of { HEAD ~ conductive wire }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD