A preferred embodiment of the present invention includes depositing a thin film having {HEAD ~ a uniform film thickness distribution} by taking {TAIL ~ advantage} of the relation between the plasma density and the DC bias voltage described above 
by taking
A preferred embodiment of the present invention includes depositing a thin film having { HEAD ~ a uniform film thickness distribution } by taking { TAIL ~ advantage } of the relation between the plasma density and the DC bias voltage described above
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH