A semiconductor device wherein destruction of a sealing ring caused by cracking of an interlayer dielectric film is difficult to occur, as well as {HEAD ~ a method} for manufacturing {TAIL ~ the semiconductor device}, are provided 
for manufacturing
A semiconductor device wherein destruction of a sealing ring caused by cracking of an interlayer dielectric film is difficult to occur , as well as { HEAD ~ a method } for manufacturing { TAIL ~ the semiconductor device } , are provided
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH