A substrate processing method is provided to process a substrate having a structure in which a lower photoresist layer, {HEAD ~ a hard mask layer} containing {TAIL ~ silicon}, and an upper photoresist layer are sequentially formed on a target layer to be processed 
containing
A substrate processing method is provided to process a substrate having a structure in which a lower photoresist layer , { HEAD ~ a hard mask layer } containing { TAIL ~ silicon } , and an upper photoresist layer are sequentially formed on a target layer to be processed
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH