{HEAD ~ The present invention} relates to a semiconductor apparatus package and a method of producing the semiconductor apparatus package, which semiconductor apparatus package is to be used in semiconductor apparatuses that can be mounted at {TAIL ~ high density} 
{ HEAD ~ The present invention } relates to a semiconductor apparatus package and a method of producing the semiconductor apparatus package , which semiconductor apparatus package is to be used in semiconductor apparatuses that can be mounted at { TAIL ~ high density }
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