Elimination of the ceramic chip package also removed the main source of resistance to heat transfer between {TAIL ~ the IC chip} and {HEAD ~ the heat sink} 
Elimination of the ceramic chip package also removed the main source of resistance to heat transfer between { TAIL ~ the IC chip } and { HEAD ~ the heat sink }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD