The multilayer wiring board assembly 420 is obtained by adhesively aligning and joining {TAIL ~ a plurality} of {HEAD ~ multilayer wiring board assembly components}, each of which has been designed in the same manner as the multilayer wiring board assembly component 410, by the adhesive layer 413 
The multilayer wiring board assembly 420 is obtained by adhesively aligning and joining { TAIL ~ a plurality } of { HEAD ~ multilayer wiring board assembly components } , each of which has been designed in the same manner as the multilayer wiring board assembly component 410 , by the adhesive layer 413
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH