After that, the substrate 2 and the composite bonding layer 3 are pressurized at {HEAD ~ the temperature} between {TAIL ~ 60° C.} to 500° C. to form a composite alloyed bonding layer 4 
between
After that , the substrate 2 and the composite bonding layer 3 are pressurized at { HEAD ~ the temperature } between { TAIL ~ 60 ° C. } to 500 ° C. to form a composite alloyed bonding layer 4
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH