{TAIL ~ The Si forming solution} may be coated on a substrate and {HEAD ~ a solvent} in the Si forming solution may be coated on the substrate 
{ TAIL ~ The Si forming solution } may be coated on a substrate and { HEAD ~ a solvent } in the Si forming solution may be coated on the substrate
TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH