In the manufacturing method, since {TAIL ~ the thermistor thin film layer} is formed by a solid phase method, the thermistor thin film layer can be manufactured at a lower cost than that of a case where the thermistor thin film layer is manufactured by a gas phase method and also since the metal base material, the thermistor thin film layer, and the split electrodes are integrally fired, {HEAD ~ the occurrence} of cracking in the metal base material or the thermistor thin film layer can be suppressed as much as possible 
In the manufacturing method , since { TAIL ~ the thermistor thin film layer } is formed by a solid phase method , the thermistor thin film layer can be manufactured at a lower cost than that of a case where the thermistor thin film layer is manufactured by a gas phase method and also since the metal base material , the thermistor thin film layer , and the split electrodes are integrally fired , { HEAD ~ the occurrence } of cracking in the metal base material or the thermistor thin film layer can be suppressed as much as possible
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