{HEAD ~ The devices} on {TAIL ~ wafer} 34 are separated by a backside sawing operation 
on
{ HEAD ~ The devices } on { TAIL ~ wafer } 34 are separated by a backside sawing operation
HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH