A solder resist layer having an opening portion is then formed on the wiring portion, and the support board is removed to expose {HEAD ~ a surface} of {TAIL ~ the electrode} or a surface of the electrode and insulating layer 
of
A solder resist layer having an opening portion is then formed on the wiring portion , and the support board is removed to expose { HEAD ~ a surface } of { TAIL ~ the electrode } or a surface of the electrode and insulating layer
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH