Elimination of the ceramic chip package also reduces {HEAD ~ the conventional multiple interconnections} between each chip contact area and {TAIL ~ the multilayer circuit board} to just one interconnection, resulting in a higher quality electrical connection 
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Elimination of the ceramic chip package also reduces { HEAD ~ the conventional multiple interconnections } between each chip contact area and { TAIL ~ the multilayer circuit board } to just one interconnection , resulting in a higher quality electrical connection
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