A first mold insert is placed in the mold frame and light converting material comprising {TAIL ~ a carrier} and {HEAD ~ light converting particles} is injected into the first mold insert to form a light converting molding around each LED chip 
A first mold insert is placed in the mold frame and light converting material comprising { TAIL ~ a carrier } and { HEAD ~ light converting particles } is injected into the first mold insert to form a light converting molding around each LED chip
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH