Particularly, the present invention relates to {HEAD ~ a semiconductor apparatus package}, and a method of producing {TAIL ~ the semiconductor apparatus package}, including a land on a circuit board that is partially exposed outwardly from a resin sealing section of a semiconductor device 
Particularly , the present invention relates to { HEAD ~ a semiconductor apparatus package } , and a method of producing { TAIL ~ the semiconductor apparatus package } , including a land on a circuit board that is partially exposed outwardly from a resin sealing section of a semiconductor device
OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH