An improved method of using an ID saw slicing machine for slicing a single crystal ingot in a direction normal to the axis of {HEAD ~ the ingot} to obtain {TAIL ~ wafers} 
An improved method of using an ID saw slicing machine for slicing a single crystal ingot in a direction normal to the axis of { HEAD ~ the ingot } to obtain { TAIL ~ wafers }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH TAIL TAIL TAIL TAIL TAIL