A semiconductor device comprising a semiconductor element; a substrate; and a hot melt adhesive sheet bonding the semiconductor element to the substrate, wherein the hot melt adhesive sheet comprises a spacer having the form of a sheet and {HEAD ~ a hot melt adhesive} on both sides of {TAIL ~ the spacer} 
A semiconductor device comprising a semiconductor element ; a substrate ; and a hot melt adhesive sheet bonding the semiconductor element to the substrate , wherein the hot melt adhesive sheet comprises a spacer having the form of a sheet and { HEAD ~ a hot melt adhesive } on both sides of { TAIL ~ the spacer }
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