That is, {HEAD ~ the object} of the present invention is to provide {TAIL ~ an aqueous dispersion} for CMP with a high removal rate that allows efficient polishing, while also producing minimal excessive etching, thinning, dishing, keyholes and scratches, to give finished surfaces with satisfactory high precision 
is to provide
That is , { HEAD ~ the object } of the present invention is to provide { TAIL ~ an aqueous dispersion } for CMP with a high removal rate that allows efficient polishing , while also producing minimal excessive etching , thinning , dishing , keyholes and scratches , to give finished surfaces with satisfactory high precision
OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH