Furthermore, there is {HEAD ~ no interconnection} fanout between the IC chip contact areas and the ultimate connection to {TAIL ~ the multilayer circuit board}, thus dramatically increasing, by three or four times, the number of IC chips that can be mounted on a single multilayer circuit board or packaged in a one dimensional or three dimensional packaging construction 
Furthermore , there is { HEAD ~ no interconnection } fanout between the IC chip contact areas and the ultimate connection to { TAIL ~ the multilayer circuit board } , thus dramatically increasing , by three or four times , the number of IC chips that can be mounted on a single multilayer circuit board or packaged in a one dimensional or three dimensional packaging construction
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