applying an electrically nonconductive polymeric material to the second side of the circuit board so that the material flows through the second through hole, contacts the component, and bonds the component to {HEAD ~ the first side} of {TAIL ~ the circuit board} 
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applying an electrically nonconductive polymeric material to the second side of the circuit board so that the material flows through the second through hole , contacts the component , and bonds the component to { HEAD ~ the first side } of { TAIL ~ the circuit board }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL