The aqueous dispersion for CMP according to the invention has an excellent balance between chemical etching and mechanical polishing ability, and when used for polishing of polishing surfaces with metal layers it can give highly precise polished surfaces with {TAIL ~ no corrosion}, dishing or {HEAD ~ keyholes} on the polished surfaces 
The aqueous dispersion for CMP according to the invention has an excellent balance between chemical etching and mechanical polishing ability , and when used for polishing of polishing surfaces with metal layers it can give highly precise polished surfaces with { TAIL ~ no corrosion } , dishing or { HEAD ~ keyholes } on the polished surfaces
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