A resin sealing mold 1, wherein said semiconductor chip is mounted on a die pad of a lead flame and a mirror face region is formed in said external lead placing regions and {TAIL ~ a region} for placing {HEAD ~ the die pad} 
A resin sealing mold 1 , wherein said semiconductor chip is mounted on a die pad of a lead flame and a mirror face region is formed in said external lead placing regions and { TAIL ~ a region } for placing { HEAD ~ the die pad }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD