Preferably, the nozzle, {TAIL ~ channel} and {HEAD ~ recess} are etched from the silicon substrate by reactive ion etching and other standard semiconductor processing techniques 
Preferably , the nozzle , { TAIL ~ channel } and { HEAD ~ recess } are etched from the silicon substrate by reactive ion etching and other standard semiconductor processing techniques
OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH