Moreover, {HEAD ~ the curing composition} of the present invention can adhere, by itself or with the aid of a primer, to a wide variety of substrates including glass, porcelain, woods, metals and molded resin substances, and accordingly, can be used as {TAIL ~ various types} of hermetically sealing compositions and adhesive compositions 
used as
Moreover , { HEAD ~ the curing composition } of the present invention can adhere , by itself or with the aid of a primer , to a wide variety of substrates including glass , porcelain , woods , metals and molded resin substances , and accordingly , can be used as { TAIL ~ various types } of hermetically sealing compositions and adhesive compositions
OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH