The heat sink is mounted on the solid state switching device such that a first portion of the heat sink is thermal communication with the solid state switching device and {HEAD ~ a second portion} of the heat sink is in thermal communication with an exposed portion of {TAIL ~ a trace} on the circuit board 
The heat sink is mounted on the solid state switching device such that a first portion of the heat sink is thermal communication with the solid state switching device and { HEAD ~ a second portion } of the heat sink is in thermal communication with an exposed portion of { TAIL ~ a trace } on the circuit board
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH