In {TAIL ~ an alternate embodiment} {HEAD ~ the devices} are separated by sawing completely through the wafer while in the fixture 
In
In { TAIL ~ an alternate embodiment } { HEAD ~ the devices } are separated by sawing completely through the wafer while in the fixture
REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH