The multi path feed thru lead of the present invention has particular utility in combination with microcircuit packages to increase {HEAD ~ the conductive pathway density} thereof without any significant decrease in the structural integrity thereof and increase in the size and {TAIL ~ weight} thereof 
without increase in
The multi path feed thru lead of the present invention has particular utility in combination with microcircuit packages to increase { HEAD ~ the conductive pathway density } thereof without any significant decrease in the structural integrity thereof and increase in the size and { TAIL ~ weight } thereof
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