Semiconductors 5 a and {TAIL ~ 5 b} are bonded on the flexible printed board 2 by {HEAD ~ a so called flip chip bonding method} 
Semiconductors 5 a and { TAIL ~ 5 b } are bonded on the flexible printed board 2 by { HEAD ~ a so called flip chip bonding method }
OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD