In {HEAD ~ a further embodiment}, the nanoindenter type instrument is modified to further include a localized electrical measurement capability whereby {TAIL ~ the measured electrical property} is correlated to the mechanical property measurement and displacement depth or applied load to understand substrate or thin film surface composition and its subsequent suitability for multi probe testing 
In { HEAD ~ a further embodiment } , the nanoindenter type instrument is modified to further include a localized electrical measurement capability whereby { TAIL ~ the measured electrical property } is correlated to the mechanical property measurement and displacement depth or applied load to understand substrate or thin film surface composition and its subsequent suitability for multi probe testing
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