{HEAD ~ A method} of constructing a conductive via spacer within a dielectric layer located between a first metal layer and a second metal layer includes {TAIL ~ the steps} of depositing a conductive spacer layer within the opening and over the first metal layer 
includes
{ HEAD ~ A method } of constructing a conductive via spacer within a dielectric layer located between a first metal layer and a second metal layer includes { TAIL ~ the steps } of depositing a conductive spacer layer within the opening and over the first metal layer
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH