A process 1, wherein the plurality of patterned linear projections provide {HEAD ~ an uneven surface} which has {TAIL ~ a center line average surface roughness} Ra of 15 300 nm when scanned in a direction parallel to the patterned linear projections, a center line average surface roughness Ra of 20 600 nm when scanned in a direction perpendicular to the patterned linear projections, and an Ra/Ra ratio of at most 0.8 
has
A process 1 , wherein the plurality of patterned linear projections provide { HEAD ~ an uneven surface } which has { TAIL ~ a center line average surface roughness } Ra of 15 300 nm when scanned in a direction parallel to the patterned linear projections , a center line average surface roughness Ra of 20 600 nm when scanned in a direction perpendicular to the patterned linear projections , and an Ra / Ra ratio of at most 0.8
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH