{TAIL ~ The removal} is accomplished by patterning the first conductor 106 by depositing a layer of photoresist 112 and, by {HEAD ~ conventional photolithographic techniques}, forming a resist pattern on the surface of the first conductor 
{ TAIL ~ The removal } is accomplished by patterning the first conductor 106 by depositing a layer of photoresist 112 and , by { HEAD ~ conventional photolithographic techniques } , forming a resist pattern on the surface of the first conductor
TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH