A preferred embodiment of the present invention includes depositing {HEAD ~ a thin film} having {TAIL ~ a uniform film thickness distribution} by taking advantage of the relation between the plasma density and the DC bias voltage described above 
having
A preferred embodiment of the present invention includes depositing { HEAD ~ a thin film } having { TAIL ~ a uniform film thickness distribution } by taking advantage of the relation between the plasma density and the DC bias voltage described above
OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH