Elimination of the ceramic chip package also reduces the conventional multiple interconnections between each chip contact area and the multilayer circuit board to {HEAD ~ just one interconnection}, resulting in {TAIL ~ a higher quality electrical connection} 
resulting in
Elimination of the ceramic chip package also reduces the conventional multiple interconnections between each chip contact area and the multilayer circuit board to { HEAD ~ just one interconnection } , resulting in { TAIL ~ a higher quality electrical connection }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL