These and other objects are provided according to the present invention by {HEAD ~ methods} including {TAIL ~ the steps} of forming a first insulating layer on an integrated circuit substrate, and forming a first capacitor electrode on the insulating layer opposite the substrate 
including
These and other objects are provided according to the present invention by { HEAD ~ methods } including { TAIL ~ the steps } of forming a first insulating layer on an integrated circuit substrate , and forming a first capacitor electrode on the insulating layer opposite the substrate
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