{HEAD ~ The process} comprises {TAIL ~ the steps} of applying the solution to the wafer surface and spinning the wafer about the central axis at a spindle speed until the solution has dried 
comprises
{ HEAD ~ The process } comprises { TAIL ~ the steps } of applying the solution to the wafer surface and spinning the wafer about the central axis at a spindle speed until the solution has dried
HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH