Referring to FIG 4J, {HEAD ~ conductive material} is provided to {TAIL ~ the window} 240 and formed therein, then an etching process is performed to form a self aligned contact pad 300 a 
is provided to
Referring to FIG 4J , { HEAD ~ conductive material } is provided to { TAIL ~ the window } 240 and formed therein , then an etching process is performed to form a self aligned contact pad 300 a
OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH