{HEAD ~ A first mold insert} is placed in {TAIL ~ the mold frame} and light converting material comprising a carrier and light converting particles is injected into the first mold insert to form a light converting molding around each LED chip 
is placed in
{ HEAD ~ A first mold insert } is placed in { TAIL ~ the mold frame } and light converting material comprising a carrier and light converting particles is injected into the first mold insert to form a light converting molding around each LED chip
HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH