In one embodiment, {HEAD ~ the dual layer dielectric stack} includes a first dielectric layer that is planar and mechanically strong and the second dielectric layer can be patterned by {TAIL ~ photolithography} to the required critical dimensions 
In one embodiment , { HEAD ~ the dual layer dielectric stack } includes a first dielectric layer that is planar and mechanically strong and the second dielectric layer can be patterned by { TAIL ~ photolithography } to the required critical dimensions
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