{HEAD ~ The backside} of the wafer 22 is then ground down to {TAIL ~ the saw kerfs} 24 to separate the devices 32 
is ground down to
{ HEAD ~ The backside } of the wafer 22 is then ground down to { TAIL ~ the saw kerfs } 24 to separate the devices 32
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH REL OTH REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH