A wired circuit board has a metal supporting board, a metal foil formed on {TAIL ~ the metal supporting board} to have a thickness of less than 2.0 μm, a first insulating layer formed on {HEAD ~ the metal supporting board} to cover the metal foil, and a conductive pattern formed on the first insulating layer 
A wired circuit board has a metal supporting board , a metal foil formed on { TAIL ~ the metal supporting board } to have a thickness of less than 2.0 μm , a first insulating layer formed on { HEAD ~ the metal supporting board } to cover the metal foil , and a conductive pattern formed on the first insulating layer
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH