{HEAD ~ The method} for manufacturing a nonreciprocal circuit device 2, wherein said device comprises a high temperature solder which melts at {TAIL ~ 230° C.} or higher 
{ HEAD ~ The method } for manufacturing a nonreciprocal circuit device 2 , wherein said device comprises a high temperature solder which melts at { TAIL ~ 230 ° C. } or higher
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH