All through the FIGS 6 a to 6 d there is a silicon wafer 211, comprising {HEAD ~ an array} of {TAIL ~ SSIS dies} and a covering glass layer 231, preferable made of an IR glass 
of
All through the FIGS 6 a to 6 d there is a silicon wafer 211 , comprising { HEAD ~ an array } of { TAIL ~ SSIS dies } and a covering glass layer 231 , preferable made of an IR glass
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH