{TAIL ~ Other embodiments} of the invention provide for arrangements of vias in via arrays where {HEAD ~ diagonal wiring paths} are facilitated near the edges of the via arrays 
{ TAIL ~ Other embodiments } of the invention provide for arrangements of vias in via arrays where { HEAD ~ diagonal wiring paths } are facilitated near the edges of the via arrays
TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH