{TAIL ~ The method} may include mounting a memory package including {HEAD ~ a second optical window} formed at a surface and a built in memory die on a PCB including a first optical window formed at a surface and a built in optical waveguide 
{ TAIL ~ The method } may include mounting a memory package including { HEAD ~ a second optical window } formed at a surface and a built in memory die on a PCB including a first optical window formed at a surface and a built in optical waveguide
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