{HEAD ~ The method} 1, wherein {TAIL ~ the first and second electrodes} are mounted on a substrate via one of a solder weld and a metal interconnect 
wherein
{ HEAD ~ The method } 1 , wherein { TAIL ~ the first and second electrodes } are mounted on a substrate via one of a solder weld and a metal interconnect
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH