{HEAD ~ A method} for manufacturing {TAIL ~ a semiconductor device} 1, wherein said circuit board is a multi layer printed circuit board 
for manufacturing
{ HEAD ~ A method } for manufacturing { TAIL ~ a semiconductor device } 1 , wherein said circuit board is a multi layer printed circuit board
HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH