at least one additional IC chip package of similar construction to {HEAD ~ the first IC chip package} arrayed in {TAIL ~ a parallel relationship} with the first IC chip package; and 
arrayed in
at least one additional IC chip package of similar construction to { HEAD ~ the first IC chip package } arrayed in { TAIL ~ a parallel relationship } with the first IC chip package ; and
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH