In another aspect of the present invention there is provided a semiconductor device comprising a chip region, a sealing ring region which surrounds the chip region in plan, and a dummy region which surrounds an outer periphery of {HEAD ~ the sealing ring region} in {TAIL ~ plan} 
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In another aspect of the present invention there is provided a semiconductor device comprising a chip region , a sealing ring region which surrounds the chip region in plan , and a dummy region which surrounds an outer periphery of { HEAD ~ the sealing ring region } in { TAIL ~ plan }
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