wherein {TAIL ~ the output matching circuit} utilizes, as a passive device, a bonding inductor used for connecting a module to {HEAD ~ a monolithic microwave integrated circuit chip} in which the power amplifiers are embedded 
wherein { TAIL ~ the output matching circuit } utilizes , as a passive device , a bonding inductor used for connecting a module to { HEAD ~ a monolithic microwave integrated circuit chip } in which the power amplifiers are embedded
OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH