When {HEAD ~ the wafer} is diced to form {TAIL ~ individual circulators}, the via holes are sliced in half, leaving a conductive trace 36 on the side of the circulator substrate 26 that connects the transmission lines 24 on the top to the conductive pads 38 on the bottom 
is diced to form
When { HEAD ~ the wafer } is diced to form { TAIL ~ individual circulators } , the via holes are sliced in half , leaving a conductive trace 36 on the side of the circulator substrate 26 that connects the transmission lines 24 on the top to the conductive pads 38 on the bottom
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