{HEAD ~ The method} for manufacturing {TAIL ~ a thermistor} 1, wherein a thickness of the metal base material after firing is 10 to 80 μm, and a thickness of the thermistor film layer after firing is 1 to 10 μm 
for manufacturing
{ HEAD ~ The method } for manufacturing { TAIL ~ a thermistor } 1 , wherein a thickness of the metal base material after firing is 10 to 80 μm , and a thickness of the thermistor film layer after firing is 1 to 10 μm
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