{HEAD ~ An objective} of the present invention is to provide {TAIL ~ a method} for processing a high k dielectric layer to improve the quality of the high k dielectric layer 
is to provide
{ HEAD ~ An objective } of the present invention is to provide { TAIL ~ a method } for processing a high k dielectric layer to improve the quality of the high k dielectric layer
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH