According to another aspect of the present invention, a semiconductor device has a semiconductor chip provided by cutting a semiconductor wafer by dicing, and {HEAD ~ a protective member} disposed on {TAIL ~ the semiconductor chip} 
disposed on
According to another aspect of the present invention , a semiconductor device has a semiconductor chip provided by cutting a semiconductor wafer by dicing , and { HEAD ~ a protective member } disposed on { TAIL ~ the semiconductor chip }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL