According to one aspect of the present invention, an integrated circuit device includes a semiconductor die and {HEAD ~ a first housing} encapsulating {TAIL ~ the semiconductor die} 
encapsulating
According to one aspect of the present invention , an integrated circuit device includes a semiconductor die and { HEAD ~ a first housing } encapsulating { TAIL ~ the semiconductor die }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL