All through the FIGS 6 a to 6 d there is {HEAD ~ a silicon wafer} 211, comprising {TAIL ~ an array} of SSIS dies and a covering glass layer 231, preferable made of an IR glass 
comprising
All through the FIGS 6 a to 6 d there is { HEAD ~ a silicon wafer } 211 , comprising { TAIL ~ an array } of SSIS dies and a covering glass layer 231 , preferable made of an IR glass
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH