{TAIL ~ at least one additional IC chip package} of similar construction to {HEAD ~ the first IC chip package} arrayed in a parallel relationship with the first IC chip package; and 
{ TAIL ~ at least one additional IC chip package } of similar construction to { HEAD ~ the first IC chip package } arrayed in a parallel relationship with the first IC chip package ; and
TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH