The present invention is aimed at overcoming {HEAD ~ the aforementioned problems} of {TAIL ~ the prior art}, and it provides an aqueous dispersion for CMP that has an excellent balance between chemical etching and mechanical polishing ability 
of
The present invention is aimed at overcoming { HEAD ~ the aforementioned problems } of { TAIL ~ the prior art } , and it provides an aqueous dispersion for CMP that has an excellent balance between chemical etching and mechanical polishing ability
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