In particular, the novel construction of the invention eliminates {HEAD ~ the need} for soldering {TAIL ~ an IC chip} to a chip package and a chip package to a multi layer printed circuit board 
for soldering
In particular , the novel construction of the invention eliminates { HEAD ~ the need } for soldering { TAIL ~ an IC chip } to a chip package and a chip package to a multi layer printed circuit board
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH