The present invention relates to a substrate processing method; and, more particularly, to a substrate processing method for reducing a width of an opening formed on {TAIL ~ a layer} used as {HEAD ~ a mask} 
The present invention relates to a substrate processing method ; and , more particularly , to a substrate processing method for reducing a width of an opening formed on { TAIL ~ a layer } used as { HEAD ~ a mask }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD