{HEAD ~ A semiconductor device} comprising {TAIL ~ a semiconductor element}; a substrate; and a hot melt adhesive sheet bonding the semiconductor element to the substrate, wherein the hot melt adhesive sheet comprises a spacer having the form of a sheet and a hot melt adhesive on both sides of the spacer 
comprising
{ HEAD ~ A semiconductor device } comprising { TAIL ~ a semiconductor element } ; a substrate ; and a hot melt adhesive sheet bonding the semiconductor element to the substrate , wherein the hot melt adhesive sheet comprises a spacer having the form of a sheet and a hot melt adhesive on both sides of the spacer
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