{HEAD ~ Electrical contacts} between the IC chip contact areas and the multilayer circuit board contact areas are established by compressing {TAIL ~ the IC chip} toward the multilayer circuit board, thus compressing connector elements positioned in the openings of the insulating board against the contact areas 
are established by compressing
{ HEAD ~ Electrical contacts } between the IC chip contact areas and the multilayer circuit board contact areas are established by compressing { TAIL ~ the IC chip } toward the multilayer circuit board , thus compressing connector elements positioned in the openings of the insulating board against the contact areas
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH REL REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH