{TAIL ~ The material} is preferably {HEAD ~ a curable composition} that is cured to form a strong bond between the component and circuit board 
{ TAIL ~ The material } is preferably { HEAD ~ a curable composition } that is cured to form a strong bond between the component and circuit board
TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH