In the above metal compound powder, preferably, compound is not dissociated under the irradiation with {TAIL ~ a carbon dioxide gas laser}, and therefore, no adverse influence is caused on a semiconductor chip and the intimate contact capability of {HEAD ~ a hole wall} 
In the above metal compound powder , preferably , compound is not dissociated under the irradiation with { TAIL ~ a carbon dioxide gas laser } , and therefore , no adverse influence is caused on a semiconductor chip and the intimate contact capability of { HEAD ~ a hole wall }
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