The edge metallization of the present invention may be fabricated by drilling holes into a wafer of {HEAD ~ ferrite substrate} 26, at {TAIL ~ the edge metallization locations} 36 
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The edge metallization of the present invention may be fabricated by drilling holes into a wafer of { HEAD ~ ferrite substrate } 26 , at { TAIL ~ the edge metallization locations } 36
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH