The method includes forming {HEAD ~ a first interconnect structure} having a first interfacial structure and forming a second interconnect structure adjacent to {TAIL ~ the first structure} 
The method includes forming { HEAD ~ a first interconnect structure } having a first interfacial structure and forming a second interconnect structure adjacent to { TAIL ~ the first structure }
OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL