In order to have a contact with {HEAD ~ a terminal} on {TAIL ~ the semiconductor die} or other bonding pad site, windows are formed in the insulative layer 
on
In order to have a contact with { HEAD ~ a terminal } on { TAIL ~ the semiconductor die } or other bonding pad site , windows are formed in the insulative layer
OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH