The method 18, wherein {HEAD ~ said step} of removing portions of the cap wafer between the plurality of cavities and {TAIL ~ the back surface} of the cap wafer further includes the step of grinding the cap wafer from the back surface of the cap wafer until the back surface of the cap wafer reaches the plurality of cavities 
The method 18 , wherein { HEAD ~ said step } of removing portions of the cap wafer between the plurality of cavities and { TAIL ~ the back surface } of the cap wafer further includes the step of grinding the cap wafer from the back surface of the cap wafer until the back surface of the cap wafer reaches the plurality of cavities
OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH