In the manufacturing process {HEAD ~ the different distances} between the plates and {TAIL ~ the wafers} are adjusted and maintained via the spacer means comprising the adhesive layers 
between
In the manufacturing process { HEAD ~ the different distances } between the plates and { TAIL ~ the wafers } are adjusted and maintained via the spacer means comprising the adhesive layers
OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH