According to the object of {TAIL ~ the invention}, {HEAD ~ a bonding pad structure} comprises a substrate having a bonding region and a sensing region 
According to the object of { TAIL ~ the invention } , { HEAD ~ a bonding pad structure } comprises a substrate having a bonding region and a sensing region
OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH