A method and an apparatus for increasing {HEAD ~ a deposition rate} of dielectric films deposited on {TAIL ~ a substrate} for a given temperature while providing the same with good step coverage and gap fill properties 
A method and an apparatus for increasing { HEAD ~ a deposition rate } of dielectric films deposited on { TAIL ~ a substrate } for a given temperature while providing the same with good step coverage and gap fill properties
OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH