The multi path feed thru {HEAD ~ lead} according to the present invention includes {TAIL ~ an insulative substrate} having a predetermined geometric configuration and includes an extended intermediate portion and first and second end portions configured to define a plurality of bonding pads that facilitate wire bonding to the circuitry housed in the package and to external circuitry, respectively 
includes
The multi path feed thru { HEAD ~ lead } according to the present invention includes { TAIL ~ an insulative substrate } having a predetermined geometric configuration and includes an extended intermediate portion and first and second end portions configured to define a plurality of bonding pads that facilitate wire bonding to the circuitry housed in the package and to external circuitry , respectively
OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH