A substrate wafer processing method and apparatus is disclosed utilizing a bowl having a central axis, a baffle surface positioned above the inside bottom surface of {TAIL ~ the bowl} and a chuck member having {HEAD ~ a top surface} for supporting and spinning substrate and positionable coaxially within the bowl closely spaced from the baffle surface 
A substrate wafer processing method and apparatus is disclosed utilizing a bowl having a central axis , a baffle surface positioned above the inside bottom surface of { TAIL ~ the bowl } and a chuck member having { HEAD ~ a top surface } for supporting and spinning substrate and positionable coaxially within the bowl closely spaced from the baffle surface
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