There is provided a method of forming a damascene pattern including a via and {TAIL ~ a trench} in a damascene process of forming {HEAD ~ a copper metal interconnection} 
There is provided a method of forming a damascene pattern including a via and { TAIL ~ a trench } in a damascene process of forming { HEAD ~ a copper metal interconnection }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD