at least one additional IC chip package of similar construction to the first IC chip package arrayed in {HEAD ~ a parallel relationship} with {TAIL ~ the first IC chip package}; and 
with
at least one additional IC chip package of similar construction to the first IC chip package arrayed in { HEAD ~ a parallel relationship } with { TAIL ~ the first IC chip package } ; and
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH