thereafter annealing said structure at a lower temperature in the range of {TAIL ~ 700° C.} to 900° C. to induce an extension of the diffusion profile deeper into {HEAD ~ said structure}, 
thereafter annealing said structure at a lower temperature in the range of { TAIL ~ 700 ° C. } to 900 ° C. to induce an extension of the diffusion profile deeper into { HEAD ~ said structure } ,
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH