Although not shown in FIG 1, each bond pad is connected to {HEAD ~ the central major surface region} by {TAIL ~ a conductive trace} such as shown in FIGS 2, 3, and 4 
by
Although not shown in FIG 1 , each bond pad is connected to { HEAD ~ the central major surface region } by { TAIL ~ a conductive trace } such as shown in FIGS 2 , 3 , and 4
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH