The present invention resides in {HEAD ~ an integrated circuit packaging construction} for mounting and interconnecting IC chips and {TAIL ~ IC chip packages} with a multilayer printed circuit board and for interconnecting IC chips with minimized interconnection lead lengths between the IC chips 
for interconnecting
The present invention resides in { HEAD ~ an integrated circuit packaging construction } for mounting and interconnecting IC chips and { TAIL ~ IC chip packages } with a multilayer printed circuit board and for interconnecting IC chips with minimized interconnection lead lengths between the IC chips
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