The cap wafer is aligned with {TAIL ~ the device wafer} and bonded to the device wafer using a glass frit as {HEAD ~ a bonding agent} 
The cap wafer is aligned with { TAIL ~ the device wafer } and bonded to the device wafer using a glass frit as { HEAD ~ a bonding agent }
OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD