Transmission lines 24 connecting to the via holes are etched onto the top conductive layer, and {HEAD ~ an outline} around {TAIL ~ each} via hole is etched out of the bottom conductive layer to form conductive pads 38 that are separated from the ground layer 28 
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Transmission lines 24 connecting to the via holes are etched onto the top conductive layer , and { HEAD ~ an outline } around { TAIL ~ each } via hole is etched out of the bottom conductive layer to form conductive pads 38 that are separated from the ground layer 28
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH