A first high frequency transmission line connected to the semiconductor element is formed on {HEAD ~ the surface} of said {TAIL ~ dielectric board} in said cavity and a second high frequency transmission line is formed on the bottom surface of said dielectric board, so that said first high frequency transmission line and said second high frequency transmission line are electromagnetically coupled together 
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A first high frequency transmission line connected to the semiconductor element is formed on { HEAD ~ the surface } of said { TAIL ~ dielectric board } in said cavity and a second high frequency transmission line is formed on the bottom surface of said dielectric board , so that said first high frequency transmission line and said second high frequency transmission line are electromagnetically coupled together
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH