The top and {HEAD ~ bottom} of the substrate 26 are covered with {TAIL ~ a layer} of conductive material , and the conductive material is deposited in the holes, covering the surfaces of the substrate in the hole  
covered with
The top and { HEAD ~ bottom } of the substrate 26 are covered with { TAIL ~ a layer } of conductive material , and the conductive material is deposited in the holes , covering the surfaces of the substrate in the hole
OTH OTH OTH HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH