The method 1 further comprising forming the feet to accommodate {HEAD ~ respective set volumes} of adhesive therebeneath for attaching {TAIL ~ the semiconductor heat spreader} to a substrate 
for attaching
The method 1 further comprising forming the feet to accommodate { HEAD ~ respective set volumes } of adhesive therebeneath for attaching { TAIL ~ the semiconductor heat spreader } to a substrate
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH