In addition, using the method of the present invention, it is possible to add the encapsulated material to {HEAD ~ a wellbore} above {TAIL ~ ground} and flow the material to the desired location in the subterranean formation without releasing the material to the fracturing fluid prior to the desired time or until it reaches the desired location 
above
In addition , using the method of the present invention , it is possible to add the encapsulated material to { HEAD ~ a wellbore } above { TAIL ~ ground } and flow the material to the desired location in the subterranean formation without releasing the material to the fracturing fluid prior to the desired time or until it reaches the desired location
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH