The MEMS arrays include {TAIL ~ polysilicon or polysilicon germanium components} that are mechanically superior to metals used in other MEMS applications, but that require process temperatures not compatible with {HEAD ~ conventional CMOS technologies} 
The MEMS arrays include { TAIL ~ polysilicon or polysilicon germanium components } that are mechanically superior to metals used in other MEMS applications , but that require process temperatures not compatible with { HEAD ~ conventional CMOS technologies }
OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD