{HEAD ~ The pattern} of {TAIL ~ the partially etched cavities} is determined in accordance with the pattern of dies on the device wafer  
of
{ HEAD ~ The pattern } of { TAIL ~ the partially etched cavities } is determined in accordance with the pattern of dies on the device wafer
HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH