{HEAD ~ A method} for manufacturing a semiconductor device 1, wherein said circuit board is {TAIL ~ a multi layer printed circuit board} 
{ HEAD ~ A method } for manufacturing a semiconductor device 1 , wherein said circuit board is { TAIL ~ a multi layer printed circuit board }
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL