In accordance with the invention, a novel five layer sandwich of adhesive, insulation, metal, insulation and adhesive layers provides a whole new variety of {HEAD ~ potential applications} such as bonding, interconnection and {TAIL ~ mutual insulation} of different parts of the semiconductor package at the same time 
such as
In accordance with the invention , a novel five layer sandwich of adhesive , insulation , metal , insulation and adhesive layers provides a whole new variety of { HEAD ~ potential applications } such as bonding , interconnection and { TAIL ~ mutual insulation } of different parts of the semiconductor package at the same time
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