In particular, the present invention relates to an underfilling material which is used when a semiconductor package holding semiconductor elements on a carrier substrate is mounted onto a circuit board, a mounted board produced by such mounting, and {HEAD ~ a repairing method} of {TAIL ~ a mounted board} 
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In particular , the present invention relates to an underfilling material which is used when a semiconductor package holding semiconductor elements on a carrier substrate is mounted onto a circuit board , a mounted board produced by such mounting , and { HEAD ~ a repairing method } of { TAIL ~ a mounted board }
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