The present invention relates generally to {HEAD ~ image correction} and inspection technologies, and more particularly to {TAIL ~ a method} and apparatus for correcting ultrafine pattern images as formed on reticles for use in the manufacture of highly integrated semiconductor circuit devices, such as LSI chips 
The present invention relates generally to { HEAD ~ image correction } and inspection technologies , and more particularly to { TAIL ~ a method } and apparatus for correcting ultrafine pattern images as formed on reticles for use in the manufacture of highly integrated semiconductor circuit devices , such as LSI chips
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