The method includes forming {HEAD ~ a first interconnect structure} having {TAIL ~ a first interfacial structure} and forming a second interconnect structure adjacent to the first structure 
having
The method includes forming { HEAD ~ a first interconnect structure } having { TAIL ~ a first interfacial structure } and forming a second interconnect structure adjacent to the first structure
OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH