The device 1, wherein {HEAD ~ an inner layer} of the first section of the cover is bonded to {TAIL ~ the core} 
is bonded to
The device 1 , wherein { HEAD ~ an inner layer } of the first section of the cover is bonded to { TAIL ~ the core }
OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL