In addition, the conductive particles exhibit enhanced conducting properties without being ruptured when interposed and compressed between connection substrates, thereby achieving {TAIL ~ a sufficient contact area} between {HEAD ~ the particles} and the connection substrates 
In addition , the conductive particles exhibit enhanced conducting properties without being ruptured when interposed and compressed between connection substrates , thereby achieving { TAIL ~ a sufficient contact area } between { HEAD ~ the particles } and the connection substrates
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH