The multi path feed thru {HEAD ~ lead} of the present invention has {TAIL ~ particular utility} in combination with microcircuit packages to increase the conductive pathway density thereof without any significant decrease in the structural integrity thereof and increase in the size and weight thereof 
has
The multi path feed thru { HEAD ~ lead } of the present invention has { TAIL ~ particular utility } in combination with microcircuit packages to increase the conductive pathway density thereof without any significant decrease in the structural integrity thereof and increase in the size and weight thereof
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