{HEAD ~ The dicing tape integrated wafer back surface protective film} can be suitably used for {TAIL ~ a flip chip} mounted semiconductor device 
suitably used for
{ HEAD ~ The dicing tape integrated wafer back surface protective film } can be suitably used for { TAIL ~ a flip chip } mounted semiconductor device
HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH