{HEAD ~ The region} around the bumps 8 between the semiconductor element 1 and the circuit substrate 7 can be filled by {TAIL ~ a resin} 9 
filled by
{ HEAD ~ The region } around the bumps 8 between the semiconductor element 1 and the circuit substrate 7 can be filled by { TAIL ~ a resin } 9
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH