FIGS 20 through 23 show a seventh embodiment wherein each semiconductor device is made to have {HEAD ~ four leads} by using {TAIL ~ a modified leadframe} 31 
by using
FIGS 20 through 23 show a seventh embodiment wherein each semiconductor device is made to have { HEAD ~ four leads } by using { TAIL ~ a modified leadframe } 31
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH