A dicing tape integrated wafer back surface protective film is used for protecting a back surface of {TAIL ~ a chip} shaped {HEAD ~ workpiece} and enhancing strength 
A dicing tape integrated wafer back surface protective film is used for protecting a back surface of { TAIL ~ a chip } shaped { HEAD ~ workpiece } and enhancing strength
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD OTH OTH OTH