In an embodiment, the diode 104, the backsheet 102, the interconnects 106 and the heat spreader 110 are mounted above {HEAD ~ a substrate} 116, such as {TAIL ~ a glass substrate}, via an encapsulant 118, as depicted in FIG 1 
such as
In an embodiment , the diode 104 , the backsheet 102 , the interconnects 106 and the heat spreader 110 are mounted above { HEAD ~ a substrate } 116 , such as { TAIL ~ a glass substrate } , via an encapsulant 118 , as depicted in FIG 1
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH