Semiconductor package having grooves formed at side flash, groove forming method, and deflashing method using {HEAD ~ semiconductor package} formed with {TAIL ~ grooves} 
formed with
Semiconductor package having grooves formed at side flash , groove forming method , and deflashing method using { HEAD ~ semiconductor package } formed with { TAIL ~ grooves }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL