and therefore, when a solder bump is used, the solder bump is melt bonded to the substrate electrode while conforming to the concave surface thereof to alleviate the deformation of and {HEAD ~ the stress concentration} to {TAIL ~ the locally deformed portion} in the boundary surface between the solder bump and the substrate electrode so that the reliability of interlayer interconnection is improved 
to
and therefore , when a solder bump is used , the solder bump is melt bonded to the substrate electrode while conforming to the concave surface thereof to alleviate the deformation of and { HEAD ~ the stress concentration } to { TAIL ~ the locally deformed portion } in the boundary surface between the solder bump and the substrate electrode so that the reliability of interlayer interconnection is improved
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