The method comprises steps of: providing a semiconductor structure and a substrate; forming a composite bonding layer on the semiconductor structure; and bonding {HEAD ~ the substrate} with {TAIL ~ the composite bonding layer} on the semiconductor structure to form a composite alloyed bonding layer 
with
The method comprises steps of : providing a semiconductor structure and a substrate ; forming a composite bonding layer on the semiconductor structure ; and bonding { HEAD ~ the substrate } with { TAIL ~ the composite bonding layer } on the semiconductor structure to form a composite alloyed bonding layer
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH