These manufacturing methods facilitate control of the oxygen concentration in {TAIL ~ the SRO}, the relative thicknesses of the silicon oxide and silicon layers, and provides improved step coverage, thus allowing {HEAD ~ the manufacturing} of high quality semiconductor devices 
These manufacturing methods facilitate control of the oxygen concentration in { TAIL ~ the SRO } , the relative thicknesses of the silicon oxide and silicon layers , and provides improved step coverage , thus allowing { HEAD ~ the manufacturing } of high quality semiconductor devices
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