In addition, {HEAD ~ a dry etching method} with {TAIL ~ less critical dimension shift} and excellence in both apparatus cost and throughput can be provided by performing resist modification and etching by turns 
with
In addition , { HEAD ~ a dry etching method } with { TAIL ~ less critical dimension shift } and excellence in both apparatus cost and throughput can be provided by performing resist modification and etching by turns
OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH