A film of {HEAD ~ the resist solution} is formed with a uniform film thickness to {TAIL ~ the edge} of the semiconductor wafer W 
A film of { HEAD ~ the resist solution } is formed with a uniform film thickness to { TAIL ~ the edge } of the semiconductor wafer W
OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH