In accordance with the invention, a novel five layer sandwich of adhesive, insulation, metal, {TAIL ~ insulation} and {HEAD ~ adhesive layers} provides a whole new variety of potential applications such as bonding, interconnection and mutual insulation of different parts of the semiconductor package at the same time 
In accordance with the invention , a novel five layer sandwich of adhesive , insulation , metal , { TAIL ~ insulation } and { HEAD ~ adhesive layers } provides a whole new variety of potential applications such as bonding , interconnection and mutual insulation of different parts of the semiconductor package at the same time
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH