Transmission lines 24 connecting to the via holes are etched onto the top conductive layer, and an outline around each via hole is etched out of {HEAD ~ the bottom conductive layer} to form {TAIL ~ conductive pads} 38 that are separated from the ground layer 28 
to form
Transmission lines 24 connecting to the via holes are etched onto the top conductive layer , and an outline around each via hole is etched out of { HEAD ~ the bottom conductive layer } to form { TAIL ~ conductive pads } 38 that are separated from the ground layer 28
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH