{HEAD ~ This invention} relates generally to pads used in semiconductor device fabrication, such as in chemical mechanical polishing , and more particularly to cleaning {TAIL ~ such pads} 
relates particularly to cleaning
{ HEAD ~ This invention } relates generally to pads used in semiconductor device fabrication , such as in chemical mechanical polishing , and more particularly to cleaning { TAIL ~ such pads }
HEAD HEAD HEAD HEAD HEAD HEAD REL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL