A wired circuit board has a metal supporting board, a metal foil formed on the metal supporting board to have a thickness of less than 2.0 μm, a first insulating layer formed on the metal supporting board to cover the metal foil, and {HEAD ~ a conductive pattern} formed on {TAIL ~ the first insulating layer} 
formed on
A wired circuit board has a metal supporting board , a metal foil formed on the metal supporting board to have a thickness of less than 2.0 μm , a first insulating layer formed on the metal supporting board to cover the metal foil , and { HEAD ~ a conductive pattern } formed on { TAIL ~ the first insulating layer }
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