A solder resist layer having an opening portion is then formed on {HEAD ~ the wiring portion}, and {TAIL ~ the support board} is removed to expose a surface of the electrode or a surface of the electrode and insulating layer 
A solder resist layer having an opening portion is then formed on { HEAD ~ the wiring portion } , and { TAIL ~ the support board } is removed to expose a surface of the electrode or a surface of the electrode and insulating layer
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH