In the present invention, it is also preferable to set the film thickness of {TAIL ~ the metal layer} so that {HEAD ~ the metal layer} fuses totally into the alloy solder when fusing the alloy solder, and so that when cooling the alloy solder at least some of the alloy solder is deposited 
In the present invention , it is also preferable to set the film thickness of { TAIL ~ the metal layer } so that { HEAD ~ the metal layer } fuses totally into the alloy solder when fusing the alloy solder , and so that when cooling the alloy solder at least some of the alloy solder is deposited
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH