{HEAD ~ The leads} of {TAIL ~ the component} are then inserted into the plated through holes so as to position the component on a first side of the circuit board , after which a material is applied to the second side of the circuit board so that the material flows through the second through hole , contacts the component , and bonds the component to the first side of the circuit board  
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{ HEAD ~ The leads } of { TAIL ~ the component } are then inserted into the plated through holes so as to position the component on a first side of the circuit board , after which a material is applied to the second side of the circuit board so that the material flows through the second through hole , contacts the component , and bonds the component to the first side of the circuit board
HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH