{TAIL ~ A method} 4 and further including the substeps of squeezing a solder paste through a plurality of template holes which are aligned with said I/O pads, and partially curing {HEAD ~ said paste} on said I/O pads prior to forming joints with said leads 
{ TAIL ~ A method } 4 and further including the substeps of squeezing a solder paste through a plurality of template holes which are aligned with said I / O pads , and partially curing { HEAD ~ said paste } on said I / O pads prior to forming joints with said leads
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