{HEAD ~ The ROM} of the present invention is manufactured by laser annealing at the final step in {TAIL ~ the flow} of wafer fabrication so half finished goods having nonactivated resistances can be stocked when the specifications of users are not yet determined 
is manufactured in
{ HEAD ~ The ROM } of the present invention is manufactured by laser annealing at the final step in { TAIL ~ the flow } of wafer fabrication so half finished goods having nonactivated resistances can be stocked when the specifications of users are not yet determined
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