In contrast, following the reversed current treatment according to one embodiment of the present invention, using {HEAD ~ a current density} of about 50 mA/cm2 for about 10 seconds, the number of copper particles were reduced by {TAIL ~ about 90 to 100 percent}, more frequently completely eliminating the presence of the copper particles from the electrodeposition surface 
In contrast , following the reversed current treatment according to one embodiment of the present invention , using { HEAD ~ a current density } of about 50 mA / cm2 for about 10 seconds , the number of copper particles were reduced by { TAIL ~ about 90 to 100 percent } , more frequently completely eliminating the presence of the copper particles from the electrodeposition surface
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