{HEAD ~ The present invention} relates to {TAIL ~ a semiconductor apparatus package} and a method of producing the semiconductor apparatus package, which semiconductor apparatus package is to be used in semiconductor apparatuses that can be mounted at high density 
relates to
{ HEAD ~ The present invention } relates to { TAIL ~ a semiconductor apparatus package } and a method of producing the semiconductor apparatus package , which semiconductor apparatus package is to be used in semiconductor apparatuses that can be mounted at high density
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