{HEAD ~ The vertical via lines} may be realized by etching holes vertically into {TAIL ~ the substrate} such that they partially overlap and contact the metal lines 
{ HEAD ~ The vertical via lines } may be realized by etching holes vertically into { TAIL ~ the substrate } such that they partially overlap and contact the metal lines
HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH