The thermal diffusion process may also be performed by heating the entire chip or multi chip module, for example, in an oven that has been heated to, for example, about 250° C. The oven heating technique is particularly useful when {HEAD ~ large areas} of {TAIL ~ the composite film} are to be heated or if multiple disconnections are to be made simultaneously 
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The thermal diffusion process may also be performed by heating the entire chip or multi chip module , for example , in an oven that has been heated to , for example , about 250 ° C. The oven heating technique is particularly useful when { HEAD ~ large areas } of { TAIL ~ the composite film } are to be heated or if multiple disconnections are to be made simultaneously
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