Also in accordance with this invention there is provided an integrated circuit package including {HEAD ~ a leadless chip carrier} having {TAIL ~ a plurality} of elctrically conductive pads near the periphery of one of its surfaces 
having
Also in accordance with this invention there is provided an integrated circuit package including { HEAD ~ a leadless chip carrier } having { TAIL ~ a plurality } of elctrically conductive pads near the periphery of one of its surfaces
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH