The contact springs 20 provide {HEAD ~ a flexible conductive contact} between the pads 18 of the silicon chip package 10 and {TAIL ~ the corresponding pads} on the printed circuit board 
between
The contact springs 20 provide { HEAD ~ a flexible conductive contact } between the pads 18 of the silicon chip package 10 and { TAIL ~ the corresponding pads } on the printed circuit board
OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH