The present invention relates to a method for bonding a semiconductor structure with a substrate and a high efficiency photonic device manufactured by using the same method and, more particularly, to a method for bonding a semiconductor structure with a substrate and a manufactured structure by using the same method where the temperature at which a semiconductor is bonded with a substrate can be reduced effectively by {HEAD ~ means} of providing {TAIL ~ a composite bonding layer} on the semiconductor structure, the substrate, or both on the semiconductor structure and the substrate 
of providing
The present invention relates to a method for bonding a semiconductor structure with a substrate and a high efficiency photonic device manufactured by using the same method and , more particularly , to a method for bonding a semiconductor structure with a substrate and a manufactured structure by using the same method where the temperature at which a semiconductor is bonded with a substrate can be reduced effectively by { HEAD ~ means } of providing { TAIL ~ a composite bonding layer } on the semiconductor structure , the substrate , or both on the semiconductor structure and the substrate
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