The present invention relates to a substrate processing method; and, more particularly, to a substrate processing method for reducing a width of {HEAD ~ an opening} formed on a layer used as {TAIL ~ a mask} 
The present invention relates to a substrate processing method ; and , more particularly , to a substrate processing method for reducing a width of { HEAD ~ an opening } formed on a layer used as { TAIL ~ a mask }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL