{HEAD ~ The complementary microstructures} may be superimposed in a controlled manner by operation of micro alignment means also formed in {TAIL ~ the foldable substrate} by an etching or similar process 
formed in
{ HEAD ~ The complementary microstructures } may be superimposed in a controlled manner by operation of micro alignment means also formed in { TAIL ~ the foldable substrate } by an etching or similar process
HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH