In one aspect of the invention a solder paste is applied to the substrate in the wells, and {HEAD ~ the solder paste} is reflowed to form {TAIL ~ solder bumps} 
is reflowed to form
In one aspect of the invention a solder paste is applied to the substrate in the wells , and { HEAD ~ the solder paste } is reflowed to form { TAIL ~ solder bumps }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL