{TAIL ~ An interconnect device} for connecting an electronic package, whether it be a single chip or a multi component device, to a primary substrate requiring the mating of dissimilar solder patterns includes a secondary substrate having a first face and {HEAD ~ a second face} 
{ TAIL ~ An interconnect device } for connecting an electronic package , whether it be a single chip or a multi component device , to a primary substrate requiring the mating of dissimilar solder patterns includes a secondary substrate having a first face and { HEAD ~ a second face }
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