In the manufacturing process the different distances between {TAIL ~ the plates} and {HEAD ~ the wafers} are adjusted and maintained via the spacer means comprising the adhesive layers 
In the manufacturing process the different distances between { TAIL ~ the plates } and { HEAD ~ the wafers } are adjusted and maintained via the spacer means comprising the adhesive layers
OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH