The first face of {HEAD ~ the secondary substrate} may include a first pattern of conductive lands formed on the first face corresponding to {TAIL ~ a plurality} of conductive leads of an electronic package 
The first face of { HEAD ~ the secondary substrate } may include a first pattern of conductive lands formed on the first face corresponding to { TAIL ~ a plurality } of conductive leads of an electronic package
OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH