According to the invention, vibrational damping of the component 12 is achieved by the application of {HEAD ~ a material} 14 to {TAIL ~ the surface} of the circuit board 10 opposite the component 12 
to
According to the invention , vibrational damping of the component 12 is achieved by the application of { HEAD ~ a material } 14 to { TAIL ~ the surface } of the circuit board 10 opposite the component 12
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH