{HEAD ~ A method} of forming {TAIL ~ an integrated circuit device} includes the steps of forming a first insulating layer on an integrated circuit substrate, forming a first capacitor electrode on the insulating layer opposite the substrate, and forming a second insulating layer on the first capacitor electrode and on the insulating layer opposite the substrate 
of forming
{ HEAD ~ A method } of forming { TAIL ~ an integrated circuit device } includes the steps of forming a first insulating layer on an integrated circuit substrate , forming a first capacitor electrode on the insulating layer opposite the substrate , and forming a second insulating layer on the first capacitor electrode and on the insulating layer opposite the substrate
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