The heat sink is mounted on the solid state switching device such that a first portion of the heat sink is thermal communication with the solid state switching device and a second portion of the heat sink is in {HEAD ~ thermal communication} with {TAIL ~ an exposed portion} of a trace on the circuit board 
with
The heat sink is mounted on the solid state switching device such that a first portion of the heat sink is thermal communication with the solid state switching device and a second portion of the heat sink is in { HEAD ~ thermal communication } with { TAIL ~ an exposed portion } of a trace on the circuit board
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