In {TAIL ~ one embodiment}, {HEAD ~ the dual layer dielectric stack} includes a first dielectric layer that is planar and mechanically strong and the second dielectric layer can be patterned by photolithography to the required critical dimensions 
In
In { TAIL ~ one embodiment } , { HEAD ~ the dual layer dielectric stack } includes a first dielectric layer that is planar and mechanically strong and the second dielectric layer can be patterned by photolithography to the required critical dimensions
REL TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH