The region around {HEAD ~ the bumps} 8 between the semiconductor element 1 and {TAIL ~ the circuit substrate} 7 can be filled by a resin 9 
between
The region around { HEAD ~ the bumps } 8 between the semiconductor element 1 and { TAIL ~ the circuit substrate } 7 can be filled by a resin 9
OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH REL OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH