In {TAIL ~ the case} of large electronic computer, it can exhibit sufficient performances by application of the semiconductor module made by bonding a semiconductor to {HEAD ~ the ceramic laminated circuit substrate} of the present invention with high accuracy 
In { TAIL ~ the case } of large electronic computer , it can exhibit sufficient performances by application of the semiconductor module made by bonding a semiconductor to { HEAD ~ the ceramic laminated circuit substrate } of the present invention with high accuracy
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