The ROM of the present invention is manufactured by laser annealing at the final step in the flow of wafer fabrication so {HEAD ~ half finished goods} having {TAIL ~ nonactivated resistances} can be stocked when the specifications of users are not yet determined 
having
The ROM of the present invention is manufactured by laser annealing at the final step in the flow of wafer fabrication so { HEAD ~ half finished goods } having { TAIL ~ nonactivated resistances } can be stocked when the specifications of users are not yet determined
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH