A process 5 which includes the further steps of removing {HEAD ~ the component} from {TAIL ~ the package} and installing the component into a furnace used for processing semiconductor wafers 
from
A process 5 which includes the further steps of removing { HEAD ~ the component } from { TAIL ~ the package } and installing the component into a furnace used for processing semiconductor wafers
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH