{HEAD ~ The material} is preferably {TAIL ~ a curable composition} that is cured to form a strong bond between the component and circuit board 
is preferably
{ HEAD ~ The material } is preferably { TAIL ~ a curable composition } that is cured to form a strong bond between the component and circuit board
HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH