{HEAD ~ The present invention} relates to retainer assemblies for clamping a printed circuit board between {TAIL ~ spaced surfaces} within a chassis and more particularly to a retainer having reduced weight and improved thermal conductance 
{ HEAD ~ The present invention } relates to retainer assemblies for clamping a printed circuit board between { TAIL ~ spaced surfaces } within a chassis and more particularly to a retainer having reduced weight and improved thermal conductance
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