The process comprises the steps of applying {HEAD ~ the solution} to the wafer surface and spinning the wafer about {TAIL ~ the central axis} at a spindle speed until the solution has dried 
The process comprises the steps of applying { HEAD ~ the solution } to the wafer surface and spinning the wafer about { TAIL ~ the central axis } at a spindle speed until the solution has dried
OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH