A via filling method that provides superior filling properties and {HEAD ~ superior planarization} of {TAIL ~ the deposited metal layer} is provided 
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A via filling method that provides superior filling properties and { HEAD ~ superior planarization } of { TAIL ~ the deposited metal layer } is provided
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH