{TAIL ~ The integrated circuit} 1, wherein {HEAD ~ the third conductive layer} includes at least one of Mo, W, Ti, and Co 
{ TAIL ~ The integrated circuit } 1 , wherein { HEAD ~ the third conductive layer } includes at least one of Mo , W , Ti , and Co
TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH