{HEAD ~ A particularly useful procedure} is to deposit {TAIL ~ a limited thickness} of dielectric at a temperature less than 250 degrees C. and then the remaining thickness at less than 400 degrees C 
is to deposit
{ HEAD ~ A particularly useful procedure } is to deposit { TAIL ~ a limited thickness } of dielectric at a temperature less than 250 degrees C. and then the remaining thickness at less than 400 degrees C
HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH