This removes the interconnect inductance of the fine wires used to connect {TAIL ~ the IC chip} with the ceramic chip package and the dielectric capacitance of {HEAD ~ the ceramic chip package} 
This removes the interconnect inductance of the fine wires used to connect { TAIL ~ the IC chip } with the ceramic chip package and the dielectric capacitance of { HEAD ~ the ceramic chip package }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD