A method of making an IC device includes providing a stack of leadframe sheets each including a plurality of leadframes and {HEAD ~ an interleaf member} interposed between {TAIL ~ adjacent ones} of the leadframe sheets 
interposed between
A method of making an IC device includes providing a stack of leadframe sheets each including a plurality of leadframes and { HEAD ~ an interleaf member } interposed between { TAIL ~ adjacent ones } of the leadframe sheets
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH