{HEAD ~ The method} 1, wherein {TAIL ~ the bonding finger} is a portion of the interconnection pattern electrically connected to a bonding pad of the chip 
wherein
{ HEAD ~ The method } 1 , wherein { TAIL ~ the bonding finger } is a portion of the interconnection pattern electrically connected to a bonding pad of the chip
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH