{HEAD ~ The present invention} also provides a process for forming a resist pattern and {TAIL ~ a process} for manufacturing a semiconductor device, wherein the resist pattern thickening material of the present invention is suitably utilized 
provides
{ HEAD ~ The present invention } also provides a process for forming a resist pattern and { TAIL ~ a process } for manufacturing a semiconductor device , wherein the resist pattern thickening material of the present invention is suitably utilized
HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH REL OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH