According to the object of the invention, a bonding pad structure comprises {HEAD ~ a substrate} having {TAIL ~ a bonding region} and a sensing region 
having
According to the object of the invention , a bonding pad structure comprises { HEAD ~ a substrate } having { TAIL ~ a bonding region } and a sensing region
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH