The present invention was made in view of these problems, and it is an object of the invention to provide {HEAD ~ a method} of using {TAIL ~ an ID} saw slicing machine for slicing a single crystal ingot into wafers in which the amount of bow is reduced, and also to provide a slicing apparatus for effecting this method 
of using
The present invention was made in view of these problems , and it is an object of the invention to provide { HEAD ~ a method } of using { TAIL ~ an ID } saw slicing machine for slicing a single crystal ingot into wafers in which the amount of bow is reduced , and also to provide a slicing apparatus for effecting this method
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH