A resin sealing mold 1, wherein {HEAD ~ said semiconductor chip} is mounted on a die pad of {TAIL ~ a lead flame} and a mirror face region is formed in said external lead placing regions and a region for placing the die pad 
A resin sealing mold 1 , wherein { HEAD ~ said semiconductor chip } is mounted on a die pad of { TAIL ~ a lead flame } and a mirror face region is formed in said external lead placing regions and a region for placing the die pad
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