The droplet ejection head 1 further comprising a third bonding film between {TAIL ~ the other surface} of the sealing plate and the piezoelectric means, wherein {HEAD ~ the third bonding film} is constituted in the same manner as the first bonding film, and the piezoelectric means is bonded to the sealing plate through the third bonding film 
The droplet ejection head 1 further comprising a third bonding film between { TAIL ~ the other surface } of the sealing plate and the piezoelectric means , wherein { HEAD ~ the third bonding film } is constituted in the same manner as the first bonding film , and the piezoelectric means is bonded to the sealing plate through the third bonding film
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH