Embodiments of the invention relate to {HEAD ~ contact pads} for {TAIL ~ silicon chip packages} for attachment to circuit boards 
for
Embodiments of the invention relate to { HEAD ~ contact pads } for { TAIL ~ silicon chip packages } for attachment to circuit boards
OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH