{HEAD ~ This CMP slurry} includes suspended solids as well as {TAIL ~ a chemical solution component} which attacks the material being polished 
includes
{ HEAD ~ This CMP slurry } includes suspended solids as well as { TAIL ~ a chemical solution component } which attacks the material being polished
HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH