FIGS 20 through 23 show a seventh embodiment wherein {HEAD ~ each semiconductor device} is made to have {TAIL ~ four leads} by using a modified leadframe 31 
is made to have
FIGS 20 through 23 show a seventh embodiment wherein { HEAD ~ each semiconductor device } is made to have { TAIL ~ four leads } by using a modified leadframe 31
OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH