Referring to FIG 4J, conductive material is provided to the window 240 and formed therein, then {HEAD ~ an etching process} is performed to form {TAIL ~ a self aligned contact pad} 300 a 
is performed to form
Referring to FIG 4J , conductive material is provided to the window 240 and formed therein , then { HEAD ~ an etching process } is performed to form { TAIL ~ a self aligned contact pad } 300 a
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH