The lead frame 104 where the semiconductor chip is loaded is positioned above the lower die 104, and {HEAD ~ the external leads} 18 of the lead frame 12 are placed on {TAIL ~ the mirror finished region} 22 formed on the surface of the lower die 104 
are placed on
The lead frame 104 where the semiconductor chip is loaded is positioned above the lower die 104 , and { HEAD ~ the external leads } 18 of the lead frame 12 are placed on { TAIL ~ the mirror finished region } 22 formed on the surface of the lower die 104
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH