With {HEAD ~ a semiconductor apparatus package} of {TAIL ~ example embodiments} of the technology disclosed herein and a method of producing the semiconductor apparatus package, the semiconductor apparatus package includes a circuit board and a semiconductor device sealed with sealing resin 
of
With { HEAD ~ a semiconductor apparatus package } of { TAIL ~ example embodiments } of the technology disclosed herein and a method of producing the semiconductor apparatus package , the semiconductor apparatus package includes a circuit board and a semiconductor device sealed with sealing resin
OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH