Moreover, the invention relates to a semiconductor device using {HEAD ~ the dicing tape integrated wafer} back surface protective film and a process for producing {TAIL ~ the device} 
Moreover , the invention relates to a semiconductor device using { HEAD ~ the dicing tape integrated wafer } back surface protective film and a process for producing { TAIL ~ the device }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL