integrally molding, by a non high thermal conductive resin, the second semiconductor chip including {TAIL ~ the first semiconductor chip} molded by {HEAD ~ the high thermal conductive resin} 
integrally molding , by a non high thermal conductive resin , the second semiconductor chip including { TAIL ~ the first semiconductor chip } molded by { HEAD ~ the high thermal conductive resin }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD