{HEAD ~ A method} 4 and further including {TAIL ~ the substeps} of squeezing a solder paste through a plurality of template holes which are aligned with said I/O pads, and partially curing said paste on said I/O pads prior to forming joints with said leads 
including
{ HEAD ~ A method } 4 and further including { TAIL ~ the substeps } of squeezing a solder paste through a plurality of template holes which are aligned with said I / O pads , and partially curing said paste on said I / O pads prior to forming joints with said leads
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH