In {TAIL ~ order} to have a contact with a terminal on the semiconductor die or other bonding pad site, windows are formed in {HEAD ~ the insulative layer} 
In { TAIL ~ order } to have a contact with a terminal on the semiconductor die or other bonding pad site , windows are formed in { HEAD ~ the insulative layer }
OTH TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD