A novel five layer tape is provided for applications such as bonding, {HEAD ~ interconnection} and insulation of {TAIL ~ different parts} of a semiconductor package at the same time 
A novel five layer tape is provided for applications such as bonding , { HEAD ~ interconnection } and insulation of { TAIL ~ different parts } of a semiconductor package at the same time
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH