During {HEAD ~ a first cycle} any of the aforementioned conventional chemical vapor deposition methods may be employed to deposit {TAIL ~ the interlayers} 2, 4  
During { HEAD ~ a first cycle } any of the aforementioned conventional chemical vapor deposition methods may be employed to deposit { TAIL ~ the interlayers } 2 , 4
OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH