A method of forming solder bumps includes {TAIL ~ the steps} of applying a thick layer of {HEAD ~ solder resist} to a substrate 
A method of forming solder bumps includes { TAIL ~ the steps } of applying a thick layer of { HEAD ~ solder resist } to a substrate
OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH