A method of making an IC device includes providing a stack of {HEAD ~ leadframe sheets} each including a plurality of leadframes and an interleaf member interposed between {TAIL ~ adjacent ones} of the leadframe sheets 
A method of making an IC device includes providing a stack of { HEAD ~ leadframe sheets } each including a plurality of leadframes and an interleaf member interposed between { TAIL ~ adjacent ones } of the leadframe sheets
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH