The method may include mounting a memory package including a second optical window formed at a surface and a built in memory die on {HEAD ~ a PCB} including {TAIL ~ a first optical window} formed at a surface and a built in optical waveguide 
including
The method may include mounting a memory package including a second optical window formed at a surface and a built in memory die on { HEAD ~ a PCB } including { TAIL ~ a first optical window } formed at a surface and a built in optical waveguide
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH