A process is described for fabricating various optical devices including photodiodes in which {HEAD ~ a protective dielectric layer} is put down on {TAIL ~ the surface} of the device prior to heating to temperatures over about 250 300 degrees C 
is put down on
A process is described for fabricating various optical devices including photodiodes in which { HEAD ~ a protective dielectric layer } is put down on { TAIL ~ the surface } of the device prior to heating to temperatures over about 250 300 degrees C
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH