D. providing additional layers of green low temperature cofired ceramic dielectric tape and placing {TAIL ~ such additional layers} on top of such first layer of green low temperature cofired ceramic dielectric tape so as to provide a structure having an opening that at least partially encloses the green electronic component at least one layer of said layers of {HEAD ~ green low temperature} cofired ceramic dielectric tape having an unfired metallized circuit path formed along at least one side of such one layer; and 
D. providing additional layers of green low temperature cofired ceramic dielectric tape and placing { TAIL ~ such additional layers } on top of such first layer of green low temperature cofired ceramic dielectric tape so as to provide a structure having an opening that at least partially encloses the green electronic component at least one layer of said layers of { HEAD ~ green low temperature } cofired ceramic dielectric tape having an unfired metallized circuit path formed along at least one side of such one layer ; and
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH