In turn, the tape enables the manufacturer to overcome physical limitations in forming conduction paths, including permitting {HEAD ~ the connection} of {TAIL ~ multiple die} where the terminals of the one die are obscured by the other die 
of
In turn , the tape enables the manufacturer to overcome physical limitations in forming conduction paths , including permitting { HEAD ~ the connection } of { TAIL ~ multiple die } where the terminals of the one die are obscured by the other die
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH