{HEAD ~ The fixture} is operably positioned within a processing chamber and exposed to {TAIL ~ a conventional coating medium} before, during or immediately after cleaving the semiconductor sample 
is exposed to
{ HEAD ~ The fixture } is operably positioned within a processing chamber and exposed to { TAIL ~ a conventional coating medium } before , during or immediately after cleaving the semiconductor sample
HEAD HEAD HEAD HEAD HEAD HEAD REL OTH OTH OTH OTH OTH OTH OTH REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH