The contact springs 20 provide {HEAD ~ a flexible conductive contact} between {TAIL ~ the pads} 18 of the silicon chip package 10 and the corresponding pads on the printed circuit board 
between
The contact springs 20 provide { HEAD ~ a flexible conductive contact } between { TAIL ~ the pads } 18 of the silicon chip package 10 and the corresponding pads on the printed circuit board
OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH