{HEAD ~ The fixture} is operably positioned within {TAIL ~ a processing chamber} and exposed to a conventional coating medium before, during or immediately after cleaving the semiconductor sample 
is operably positioned within
{ HEAD ~ The fixture } is operably positioned within { TAIL ~ a processing chamber } and exposed to a conventional coating medium before , during or immediately after cleaving the semiconductor sample
HEAD HEAD HEAD HEAD HEAD HEAD REL REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH