Further, when the second step includes {HEAD ~ a step} of forming {TAIL ~ a recess portion} by etching the support board and the electrode is formed to correspond to the recess portion, the electrode can be constituted by a structure of being projected from the first solder resist layer 
of forming
Further , when the second step includes { HEAD ~ a step } of forming { TAIL ~ a recess portion } by etching the support board and the electrode is formed to correspond to the recess portion , the electrode can be constituted by a structure of being projected from the first solder resist layer
OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH