The ROM of the present invention is manufactured by laser annealing at the final step in the flow of {TAIL ~ wafer fabrication} so half finished goods having nonactivated resistances can be stocked when the specifications of {HEAD ~ users} are not yet determined 
The ROM of the present invention is manufactured by laser annealing at the final step in the flow of { TAIL ~ wafer fabrication } so half finished goods having nonactivated resistances can be stocked when the specifications of { HEAD ~ users } are not yet determined
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