More particularly, through {HEAD ~ holes} 20 are provided in {TAIL ~ the circuit board} 10 adjacent the plated through holes, and the material 14 is applied such that it flows through the through holes 20 and contacts the surface of the component 12 nearest the circuit board 10 
are provided in
More particularly , through { HEAD ~ holes } 20 are provided in { TAIL ~ the circuit board } 10 adjacent the plated through holes , and the material 14 is applied such that it flows through the through holes 20 and contacts the surface of the component 12 nearest the circuit board 10
OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD OTH REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH