{TAIL ~ The present invention} is directed to a semiconductor device comprising a semiconductor element; a substrate; and a hot melt adhesive sheet bonding the semiconductor element to the substrate, wherein the hot melt adhesive sheet comprises a spacer having {HEAD ~ the form} of a sheet and a hot melt adhesive on both sides of the spacer 
{ TAIL ~ The present invention } is directed to a semiconductor device comprising a semiconductor element ; a substrate ; and a hot melt adhesive sheet bonding the semiconductor element to the substrate , wherein the hot melt adhesive sheet comprises a spacer having { HEAD ~ the form } of a sheet and a hot melt adhesive on both sides of the spacer
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