The method 1, wherein {TAIL ~ the first and second electrodes} are mounted on {HEAD ~ a substrate} via one of a solder weld and a metal interconnect 
The method 1 , wherein { TAIL ~ the first and second electrodes } are mounted on { HEAD ~ a substrate } via one of a solder weld and a metal interconnect
OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH