Electrical contacts between the IC chip contact areas and the multilayer circuit board contact areas are established by compressing the IC chip toward the multilayer circuit board, thus compressing connector elements positioned in the openings of {HEAD ~ the insulating board} against {TAIL ~ the contact areas} 
against
Electrical contacts between the IC chip contact areas and the multilayer circuit board contact areas are established by compressing the IC chip toward the multilayer circuit board , thus compressing connector elements positioned in the openings of { HEAD ~ the insulating board } against { TAIL ~ the contact areas }
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