In one embodiment, {HEAD ~ the low profile, surface mount diode} 104 is attached directly to each of {TAIL ~ the ribbon interconnects} by a technique such as, but not limited to, bonding, soldering, or welding 
In one embodiment , { HEAD ~ the low profile , surface mount diode } 104 is attached directly to each of { TAIL ~ the ribbon interconnects } by a technique such as , but not limited to , bonding , soldering , or welding
OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH