In {TAIL ~ one preferred method} of forming the multi path feed thru lead of the present invention, the external surface of {HEAD ~ the insulative substrate} is first metalized and then selected portions of metalization are removed to form the plurality of discrete conductive pathways 
In { TAIL ~ one preferred method } of forming the multi path feed thru lead of the present invention , the external surface of { HEAD ~ the insulative substrate } is first metalized and then selected portions of metalization are removed to form the plurality of discrete conductive pathways
OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH