Referring to FIG 2E, in one embodiment of the invention the oxygen containing plasma treatment is carried out for a sufficient period of time to substantially remove any remaining polymeric residue remaining in the dual damascene opening including {HEAD ~ polymeric residues} surrounding {TAIL ~ an upper portion} of the via opening 28A also referred to as ‘via fences’ 
surrounding
Referring to FIG 2E , in one embodiment of the invention the oxygen containing plasma treatment is carried out for a sufficient period of time to substantially remove any remaining polymeric residue remaining in the dual damascene opening including { HEAD ~ polymeric residues } surrounding { TAIL ~ an upper portion } of the via opening 28A also referred to as ‘ via fences ’
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH