{HEAD ~ An apparatus} is fabricated with a plurality of semiconductor device substrates and {TAIL ~ MEMS substrates} with micromachined sensors, circuits, transducers, and MEMS devices fabricated on the plurality of substrates 
is fabricated with
{ HEAD ~ An apparatus } is fabricated with a plurality of semiconductor device substrates and { TAIL ~ MEMS substrates } with micromachined sensors , circuits , transducers , and MEMS devices fabricated on the plurality of substrates
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