The position and orientation of {TAIL ~ the substrate place} on which {HEAD ~ the semiconductor chip} will be mounted are determined by means of a second camera and made available in the form of positional data relating to a second system of coordinates 
on
The position and orientation of { TAIL ~ the substrate place } on which { HEAD ~ the semiconductor chip } will be mounted are determined by means of a second camera and made available in the form of positional data relating to a second system of coordinates
OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL REL OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH