A dicing tape integrated wafer back surface protective film is used for protecting a back surface of {TAIL ~ a chip} shaped workpiece and enhancing {HEAD ~ strength} 
A dicing tape integrated wafer back surface protective film is used for protecting a back surface of { TAIL ~ a chip } shaped workpiece and enhancing { HEAD ~ strength }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD