FIGS 20 through 23 show {HEAD ~ a seventh embodiment} wherein {TAIL ~ each semiconductor device} is made to have four leads by using a modified leadframe 31 
wherein
FIGS 20 through 23 show { HEAD ~ a seventh embodiment } wherein { TAIL ~ each semiconductor device } is made to have four leads by using a modified leadframe 31
OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH