{TAIL ~ The first laminate} is provided over {HEAD ~ the semiconductor substrate} and includes a first interlayer dielectric film having a first mechanical strength 
{ TAIL ~ The first laminate } is provided over { HEAD ~ the semiconductor substrate } and includes a first interlayer dielectric film having a first mechanical strength
TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH