{TAIL ~ The backside} of the wafer 22 is then ground down to the saw kerfs 24 to separate {HEAD ~ the devices} 32 
{ TAIL ~ The backside } of the wafer 22 is then ground down to the saw kerfs 24 to separate { HEAD ~ the devices } 32
TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH