When surface grinding of a wafer is performed such that a grinding wheel, likewise, cuts into {HEAD ~ the wafer} at {TAIL ~ the central portion} thereof and moves away from the wafer at the outer peripheral edge portion thereof (FIG 14), surface grinding is preferably applied to a chuck surface of the chuck table such that the grinding wheel, likewise, cuts into the chuck table at the central portion thereof and moves away from the chuck table at the outer peripheral edge portion thereof (FIG 14) 
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When surface grinding of a wafer is performed such that a grinding wheel , likewise , cuts into { HEAD ~ the wafer } at { TAIL ~ the central portion } thereof and moves away from the wafer at the outer peripheral edge portion thereof ( FIG 14 ) , surface grinding is preferably applied to a chuck surface of the chuck table such that the grinding wheel , likewise , cuts into the chuck table at the central portion thereof and moves away from the chuck table at the outer peripheral edge portion thereof ( FIG 14 )
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH