A ceramic slurry is applied onto a carrier film to form the thermistor film layer, a metal powder containing paste is applied onto the thermistor film layer to form the metal base material, and {HEAD ~ further an electrode paste} is applied onto {TAIL ~ the metal base material} to form the split electrodes 
is applied onto
A ceramic slurry is applied onto a carrier film to form the thermistor film layer , a metal powder containing paste is applied onto the thermistor film layer to form the metal base material , and { HEAD ~ further an electrode paste } is applied onto { TAIL ~ the metal base material } to form the split electrodes
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