The IC chips and IC chip packages are mounted and interconnected using an insulating board having openings through it, and a number of connector elements in the form of {HEAD ~ compressible wads} of {TAIL ~ conductive wire} 
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The IC chips and IC chip packages are mounted and interconnected using an insulating board having openings through it , and a number of connector elements in the form of { HEAD ~ compressible wads } of { TAIL ~ conductive wire }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL