{TAIL ~ Successive etching processes} form a plurality of partially etched cavities extending from {HEAD ~ a front surface} of the cap wafer into the cap wafer  
{ TAIL ~ Successive etching processes } form a plurality of partially etched cavities extending from { HEAD ~ a front surface } of the cap wafer into the cap wafer
TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH