FIG 1 is {TAIL ~ a top view} of {HEAD ~ an individual chip} including bonding pad structures of the present invention 
FIG 1 is { TAIL ~ a top view } of { HEAD ~ an individual chip } including bonding pad structures of the present invention
OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH