a composite substrate formed by bonding the main surface of a first semiconductor substrate and the main surface of {HEAD ~ a second semiconductor substrate} together with {TAIL ~ an insulation film} interposed therebetween 
with
a composite substrate formed by bonding the main surface of a first semiconductor substrate and the main surface of { HEAD ~ a second semiconductor substrate } together with { TAIL ~ an insulation film } interposed therebetween
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH