{HEAD ~ A process} is described for fabricating {TAIL ~ various optical devices} including photodiodes in which a protective dielectric layer is put down on the surface of the device prior to heating to temperatures over about 250 300 degrees C 
is described for fabricating
{ HEAD ~ A process } is described for fabricating { TAIL ~ various optical devices } including photodiodes in which a protective dielectric layer is put down on the surface of the device prior to heating to temperatures over about 250 300 degrees C
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