A method 4 and further including {HEAD ~ the substeps} of squeezing a solder paste through a plurality of template holes which are aligned with said I/O pads, and partially curing {TAIL ~ said paste} on said I/O pads prior to forming joints with said leads 
of partially curing
A method 4 and further including { HEAD ~ the substeps } of squeezing a solder paste through a plurality of template holes which are aligned with said I / O pads , and partially curing { TAIL ~ said paste } on said I / O pads prior to forming joints with said leads
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