{HEAD ~ The LKD materials} disclosed in this invention are particularly useful for {TAIL ~ <0.18 μm ICs}, or when copper is used as conductor in future ICs 
are particularly useful for
{ HEAD ~ The LKD materials } disclosed in this invention are particularly useful for { TAIL ~ < 0.18 μm ICs } , or when copper is used as conductor in future ICs
HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH REL REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH