Herein, a mixture of the high thermal conductive resin and {TAIL ~ non high thermal conductive resin} shown in the center of the table of FIG 4 is superior in the thermal conductivity to {HEAD ~ the conventional non high thermal conductive resin}; nevertheless the thermal conductivity is insufficient to swiftly release heat generated in the first semiconductor chip 15 
Herein , a mixture of the high thermal conductive resin and { TAIL ~ non high thermal conductive resin } shown in the center of the table of FIG 4 is superior in the thermal conductivity to { HEAD ~ the conventional non high thermal conductive resin } ; nevertheless the thermal conductivity is insufficient to swiftly release heat generated in the first semiconductor chip 15
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