The present invention relates to {TAIL ~ a taping apparatus} and process for electronic components, arid in particular, for storing chip type electronic components in storage compartments within a tape, which is wound to a tape reel, and for sealing the upper opening of {HEAD ~ the storage compartment} with a cover tape 
The present invention relates to { TAIL ~ a taping apparatus } and process for electronic components , arid in particular , for storing chip type electronic components in storage compartments within a tape , which is wound to a tape reel , and for sealing the upper opening of { HEAD ~ the storage compartment } with a cover tape
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