{HEAD ~ The conductive particles} of the present invention can be used in {TAIL ~ electrical connection structures} of microelectrodes, anisotropic conductive adhesive films, and the like, in circuit board mounting applications 
used in
{ HEAD ~ The conductive particles } of the present invention can be used in { TAIL ~ electrical connection structures } of microelectrodes , anisotropic conductive adhesive films , and the like , in circuit board mounting applications
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