Thus, in the semiconductor apparatus package including the circuit board, which is exposed from the resin sealing section, and the semiconductor device sealed on the circuit board with the sealing resin, {HEAD ~ the spread} of {TAIL ~ a thin resin film} onto that exposed circuit board resulting from seepage of resin sealing the semiconductor device is prevented 
of
Thus , in the semiconductor apparatus package including the circuit board , which is exposed from the resin sealing section , and the semiconductor device sealed on the circuit board with the sealing resin , { HEAD ~ the spread } of { TAIL ~ a thin resin film } onto that exposed circuit board resulting from seepage of resin sealing the semiconductor device is prevented
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