{HEAD ~ The method} 1, wherein the bonding finger is a portion of the interconnection pattern electrically connected to a bonding pad of {TAIL ~ the chip} 
{ HEAD ~ The method } 1 , wherein the bonding finger is a portion of the interconnection pattern electrically connected to a bonding pad of { TAIL ~ the chip }
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL