According to another aspect of the present invention, a semiconductor device has a semiconductor chip provided by cutting {TAIL ~ a semiconductor wafer} by dicing, and {HEAD ~ a protective member} disposed on the semiconductor chip 
According to another aspect of the present invention , a semiconductor device has a semiconductor chip provided by cutting { TAIL ~ a semiconductor wafer } by dicing , and { HEAD ~ a protective member } disposed on the semiconductor chip
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH