The present invention relates to {TAIL ~ a heat dissipator} that includes a conductive substrate and a plurality of nanostructures supported by {HEAD ~ the conductive substrate} 
The present invention relates to { TAIL ~ a heat dissipator } that includes a conductive substrate and a plurality of nanostructures supported by { HEAD ~ the conductive substrate }
OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD