{TAIL ~ A semiconductor device} comprising a semiconductor element; a substrate; and a hot melt adhesive sheet bonding the semiconductor element to the substrate, wherein the hot melt adhesive sheet comprises a spacer having the form of a sheet and a hot melt adhesive on {HEAD ~ both sides} of the spacer 
{ TAIL ~ A semiconductor device } comprising a semiconductor element ; a substrate ; and a hot melt adhesive sheet bonding the semiconductor element to the substrate , wherein the hot melt adhesive sheet comprises a spacer having the form of a sheet and a hot melt adhesive on { HEAD ~ both sides } of the spacer
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