{HEAD ~ A wired circuit board} has {TAIL ~ a metal supporting board}, a metal foil formed on the metal supporting board to have a thickness of less than 2.0 μm, a first insulating layer formed on the metal supporting board to cover the metal foil, and a conductive pattern formed on the first insulating layer 
has
{ HEAD ~ A wired circuit board } has { TAIL ~ a metal supporting board } , a metal foil formed on the metal supporting board to have a thickness of less than 2.0 μm , a first insulating layer formed on the metal supporting board to cover the metal foil , and a conductive pattern formed on the first insulating layer
HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH