In one preferred method of forming the multi path feed thru lead of the present invention, the external surface of the insulative substrate is first metalized and then selected portions of metalization are removed to form {HEAD ~ the plurality} of {TAIL ~ discrete conductive pathways} 
of
In one preferred method of forming the multi path feed thru lead of the present invention , the external surface of the insulative substrate is first metalized and then selected portions of metalization are removed to form { HEAD ~ the plurality } of { TAIL ~ discrete conductive pathways }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL