Embodiments of the invention relate to {TAIL ~ contact pads} for silicon chip packages for attachment to {HEAD ~ circuit boards} 
Embodiments of the invention relate to { TAIL ~ contact pads } for silicon chip packages for attachment to { HEAD ~ circuit boards }
OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD