Semiconductors 5 a and {HEAD ~ 5 b} are bonded on {TAIL ~ the flexible printed board} 2 by a so called flip chip bonding method 
are bonded on
Semiconductors 5 a and { HEAD ~ 5 b } are bonded on { TAIL ~ the flexible printed board } 2 by a so called flip chip bonding method
OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH