This invention generally relates to metallic electrodeposition and more particularly to a method for reducing {TAIL ~ surface defects} including attached metal particles in an electrodeposition process, {HEAD ~ the method} particularly useful for semiconductor wafer electrodeposition processes 
This invention generally relates to metallic electrodeposition and more particularly to a method for reducing { TAIL ~ surface defects } including attached metal particles in an electrodeposition process , { HEAD ~ the method } particularly useful for semiconductor wafer electrodeposition processes
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