With a semiconductor apparatus package of {HEAD ~ example embodiments} of the technology disclosed herein and {TAIL ~ a method} of producing the semiconductor apparatus package, the semiconductor apparatus package includes a circuit board and a semiconductor device sealed with sealing resin 
With a semiconductor apparatus package of { HEAD ~ example embodiments } of the technology disclosed herein and { TAIL ~ a method } of producing the semiconductor apparatus package , the semiconductor apparatus package includes a circuit board and a semiconductor device sealed with sealing resin
OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH