The conductive particles of {TAIL ~ the present invention} can be used in {HEAD ~ electrical connection structures} of microelectrodes, anisotropic conductive adhesive films, and the like, in circuit board mounting applications 
The conductive particles of { TAIL ~ the present invention } can be used in { HEAD ~ electrical connection structures } of microelectrodes , anisotropic conductive adhesive films , and the like , in circuit board mounting applications
OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH