According to {TAIL ~ the object} of the invention, {HEAD ~ a bonding pad structure} comprises a substrate having a bonding region and a sensing region 
According to
According to { TAIL ~ the object } of the invention , { HEAD ~ a bonding pad structure } comprises a substrate having a bonding region and a sensing region
REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH