This invention relates generally to electronic packaging leads, and more particularly to a multi path feed thru lead providing {HEAD ~ a plurality} of {TAIL ~ discrete conductive pathways} on a single substrate member 
of
This invention relates generally to electronic packaging leads , and more particularly to a multi path feed thru lead providing { HEAD ~ a plurality } of { TAIL ~ discrete conductive pathways } on a single substrate member
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH