The dicing tape integrated wafer back surface protective film 1, wherein said {HEAD ~ colored wafer back surface protective film} has {TAIL ~ a laser} marking ability 
has
The dicing tape integrated wafer back surface protective film 1 , wherein said { HEAD ~ colored wafer back surface protective film } has { TAIL ~ a laser } marking ability
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH