{HEAD ~ A method} of fabricating a wiring board includes forming a resist layer, such as {TAIL ~ a solder} or plating resist layer, defining an opening portion on a support board such that a portion of the support board is exposed 
{ HEAD ~ A method } of fabricating a wiring board includes forming a resist layer , such as { TAIL ~ a solder } or plating resist layer , defining an opening portion on a support board such that a portion of the support board is exposed
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