In {TAIL ~ a presently preferred embodiment} of the invention, {HEAD ~ an IC chip} is mounted and interconnected with a multilayer printed circuit board, to effect a Level 2 interconnect, without a ceramic chip package, soldered wires, special tooling or special labor 
In
In { TAIL ~ a presently preferred embodiment } of the invention , { HEAD ~ an IC chip } is mounted and interconnected with a multilayer printed circuit board , to effect a Level 2 interconnect , without a ceramic chip package , soldered wires , special tooling or special labor
REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH