The present invention resides in an integrated circuit packaging construction for mounting and interconnecting IC chips and IC chip packages with a multilayer printed circuit board and for interconnecting {HEAD ~ IC chips} with {TAIL ~ minimized interconnection} lead lengths between the IC chips 
with
The present invention resides in an integrated circuit packaging construction for mounting and interconnecting IC chips and IC chip packages with a multilayer printed circuit board and for interconnecting { HEAD ~ IC chips } with { TAIL ~ minimized interconnection } lead lengths between the IC chips
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