A method for manufacturing a build up multi layer printed circuit board is disclosed in which a YAG laser is used upon the formation of a via hole in the multi layer printed circuit board, such that it can have the following advantages: the manufacturing process would become simple; the component packaging density and {HEAD ~ freedom} for {TAIL ~ the design} of the board would be improved; and a high speed of signal process would be ensured 
for
A method for manufacturing a build up multi layer printed circuit board is disclosed in which a YAG laser is used upon the formation of a via hole in the multi layer printed circuit board , such that it can have the following advantages : the manufacturing process would become simple ; the component packaging density and { HEAD ~ freedom } for { TAIL ~ the design } of the board would be improved ; and a high speed of signal process would be ensured
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