{TAIL ~ The first face} of the secondary substrate may include a first pattern of conductive lands formed on the first face corresponding to a plurality of conductive leads of {HEAD ~ an electronic package} 
{ TAIL ~ The first face } of the secondary substrate may include a first pattern of conductive lands formed on the first face corresponding to a plurality of conductive leads of { HEAD ~ an electronic package }
TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD