{HEAD ~ The oxide application} includes a deposition component and a sputtering component, and the sputtering component is configured to remove {TAIL ~ at least a part} of an edge of the first silicon nitride layer 
{ HEAD ~ The oxide application } includes a deposition component and a sputtering component , and the sputtering component is configured to remove { TAIL ~ at least a part } of an edge of the first silicon nitride layer
HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH