The contact springs 20 provide {TAIL ~ a flexible conductive contact} between the pads 18 of {HEAD ~ the silicon chip package} 10 and the corresponding pads on the printed circuit board 
The contact springs 20 provide { TAIL ~ a flexible conductive contact } between the pads 18 of { HEAD ~ the silicon chip package } 10 and the corresponding pads on the printed circuit board
OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH