In the embodiments, {TAIL ~ a semiconductor wafer} means a wafer before and after a dicing cut step is carried out provided that the wafer has a contour of {HEAD ~ its initial state} 
In the embodiments , { TAIL ~ a semiconductor wafer } means a wafer before and after a dicing cut step is carried out provided that the wafer has a contour of { HEAD ~ its initial state }
OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD