FIG 1 is a top view of an individual chip including bonding {HEAD ~ pad structures} of {TAIL ~ the present invention} 
of
FIG 1 is a top view of an individual chip including bonding { HEAD ~ pad structures } of { TAIL ~ the present invention }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL