{HEAD ~ At least one embodiment} provides {TAIL ~ a silicon chip package} for a circuit board assembly having a package substrate with a silicon chip 
provides
{ HEAD ~ At least one embodiment } provides { TAIL ~ a silicon chip package } for a circuit board assembly having a package substrate with a silicon chip
HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH