In one preferred method of forming {HEAD ~ the multi path feed} thru {TAIL ~ lead} of the present invention, the external surface of the insulative substrate is first metalized and then selected portions of metalization are removed to form the plurality of discrete conductive pathways 
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In one preferred method of forming { HEAD ~ the multi path feed } thru { TAIL ~ lead } of the present invention , the external surface of the insulative substrate is first metalized and then selected portions of metalization are removed to form the plurality of discrete conductive pathways
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