According to one aspect of the present invention, {HEAD ~ an integrated circuit device} includes {TAIL ~ a semiconductor die} and a first housing encapsulating the semiconductor die 
includes
According to one aspect of the present invention , { HEAD ~ an integrated circuit device } includes { TAIL ~ a semiconductor die } and a first housing encapsulating the semiconductor die
OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH