In another preferred embodiment, {HEAD ~ the present invention} relates to {TAIL ~ the curing composition} according to the above description, in which the curing composition includes 0.01 to 20 parts by weight of the component in relation to 100 parts by weight of the component  
relates to
In another preferred embodiment , { HEAD ~ the present invention } relates to { TAIL ~ the curing composition } according to the above description , in which the curing composition includes 0.01 to 20 parts by weight of the component in relation to 100 parts by weight of the component
OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH