Furthermore, it is preferred to extend the conductive resin composition filling the through hole through the interlayer adhesive surface in {HEAD ~ the form} of {TAIL ~ a projection} of the conductive resin composition 
of
Furthermore , it is preferred to extend the conductive resin composition filling the through hole through the interlayer adhesive surface in { HEAD ~ the form } of { TAIL ~ a projection } of the conductive resin composition
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH