The IC chips and {HEAD ~ IC chip packages} are mounted and interconnected using {TAIL ~ an insulating board} having openings through it, and a number of connector elements in the form of compressible wads of conductive wire 
interconnected using
The IC chips and { HEAD ~ IC chip packages } are mounted and interconnected using { TAIL ~ an insulating board } having openings through it , and a number of connector elements in the form of compressible wads of conductive wire
OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH