Elimination of the ceramic chip package also removed the main source of resistance to {HEAD ~ heat transfer} between {TAIL ~ the IC chip} and the heat sink 
between
Elimination of the ceramic chip package also removed the main source of resistance to { HEAD ~ heat transfer } between { TAIL ~ the IC chip } and the heat sink
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH