{HEAD ~ The metallization line} defining {TAIL ~ at least one interconnect feature} having a first thickness, and depositing a first silicon nitride barrier layer having a second thickness over the substrate and the metallization line 
defining
{ HEAD ~ The metallization line } defining { TAIL ~ at least one interconnect feature } having a first thickness , and depositing a first silicon nitride barrier layer having a second thickness over the substrate and the metallization line
HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH