{HEAD ~ The method} 1, wherein {TAIL ~ the grooves} are formed by irradiating the laser beams while changing irradiation directions in a state wherein the semiconductor package is fixed 
wherein
{ HEAD ~ The method } 1 , wherein { TAIL ~ the grooves } are formed by irradiating the laser beams while changing irradiation directions in a state wherein the semiconductor package is fixed
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH