The present invention surmounts the inherent disadvantages of {TAIL ~ prior art flat packs} by providing a multi path feed thru {HEAD ~ lead} that efficiently and economically permits an increase in the conductive pathway density without a significant increase in the overall size of the lead member 
The present invention surmounts the inherent disadvantages of { TAIL ~ prior art flat packs } by providing a multi path feed thru { HEAD ~ lead } that efficiently and economically permits an increase in the conductive pathway density without a significant increase in the overall size of the lead member
OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH