Finally, {HEAD ~ the two sided circuit boards} used in the module interconnection circuitry and in the layer replaceable multilayer circuit boards can be of {TAIL ~ materials} with lower dielectric constants, further reducing the capacitance of the interconnection circuitry 
of
Finally , { HEAD ~ the two sided circuit boards } used in the module interconnection circuitry and in the layer replaceable multilayer circuit boards can be of { TAIL ~ materials } with lower dielectric constants , further reducing the capacitance of the interconnection circuitry
OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH REL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH