Moreover, the curing composition of {HEAD ~ the present invention} can adhere, by itself or with the aid of a primer, to a wide variety of substrates including glass, porcelain, woods, metals and molded resin substances, and accordingly, can be used as various types of hermetically sealing {TAIL ~ compositions} and adhesive compositions 
Moreover , the curing composition of { HEAD ~ the present invention } can adhere , by itself or with the aid of a primer , to a wide variety of substrates including glass , porcelain , woods , metals and molded resin substances , and accordingly , can be used as various types of hermetically sealing { TAIL ~ compositions } and adhesive compositions
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