FIG 1 is {HEAD ~ a top view} of {TAIL ~ an individual chip} including bonding pad structures of the present invention 
of
FIG 1 is { HEAD ~ a top view } of { TAIL ~ an individual chip } including bonding pad structures of the present invention
OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH