In more detail, as shown in FIG 6a, a new RCC 68 is stacked on the board manufactured by {TAIL ~ the process} of FIGS 4a to 4 f, and then the structure is heated and pressed Next, as shown in FIG 6b, the YAG laser is irradiated to the board with {HEAD ~ RCC} stacked thereon to form the via hole 
In more detail , as shown in FIG 6a , a new RCC 68 is stacked on the board manufactured by { TAIL ~ the process } of FIGS 4a to 4 f , and then the structure is heated and pressed Next , as shown in FIG 6b , the YAG laser is irradiated to the board with { HEAD ~ RCC } stacked thereon to form the via hole
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