Besides, {HEAD ~ the composite bonding layer} can be formed on {TAIL ~ the substrate} or formed on both the semiconductor structure and substrate simultaneously 
formed on
Besides , { HEAD ~ the composite bonding layer } can be formed on { TAIL ~ the substrate } or formed on both the semiconductor structure and substrate simultaneously
OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH