In {HEAD ~ an alternate embodiment} {TAIL ~ the devices} are separated by sawing completely through the wafer while in the fixture 
In { HEAD ~ an alternate embodiment } { TAIL ~ the devices } are separated by sawing completely through the wafer while in the fixture
OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH