As seen from the figure, where the package for a semiconductor device is to be formed, the region where {TAIL ~ the external leads} 18 of a lead frame 12 are placed and {HEAD ~ their peripheral regions} having a width of 0.1 mm are mirror finished to form a mirror face region 22 
As seen from the figure , where the package for a semiconductor device is to be formed , the region where { TAIL ~ the external leads } 18 of a lead frame 12 are placed and { HEAD ~ their peripheral regions } having a width of 0.1 mm are mirror finished to form a mirror face region 22
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH