A method of manufacturing {TAIL ~ a semiconductor device} 6, wherein the semiconductor die is {HEAD ~ a flip chip} 
A method of manufacturing { TAIL ~ a semiconductor device } 6 , wherein the semiconductor die is { HEAD ~ a flip chip }
OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD