The IC chips and IC chip packages are mounted and interconnected using an insulating board having {TAIL ~ openings} through it, and a number of connector elements in the form of {HEAD ~ compressible wads} of conductive wire 
The IC chips and IC chip packages are mounted and interconnected using an insulating board having { TAIL ~ openings } through it , and a number of connector elements in the form of { HEAD ~ compressible wads } of conductive wire
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH