The present invention relates to conductive particles for {HEAD ~ use} in {TAIL ~ conductive adhesives}, anisotropic conductive adhesive films, conductive connection structures and the like for mounting circuit boards, and polymer particles used in the conductive particles 
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The present invention relates to conductive particles for { HEAD ~ use } in { TAIL ~ conductive adhesives } , anisotropic conductive adhesive films , conductive connection structures and the like for mounting circuit boards , and polymer particles used in the conductive particles
OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH