An improved method of using an ID saw slicing machine for slicing {HEAD ~ a single crystal ingot} in {TAIL ~ a direction} normal to the axis of the ingot to obtain wafers 
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An improved method of using an ID saw slicing machine for slicing { HEAD ~ a single crystal ingot } in { TAIL ~ a direction } normal to the axis of the ingot to obtain wafers
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH