A method of constructing a conductive via spacer within {HEAD ~ a dielectric layer} located between a first metal layer and {TAIL ~ a second metal layer} includes the steps of depositing a conductive spacer layer within the opening and over the first metal layer 
located between
A method of constructing a conductive via spacer within { HEAD ~ a dielectric layer } located between a first metal layer and { TAIL ~ a second metal layer } includes the steps of depositing a conductive spacer layer within the opening and over the first metal layer
OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH