{HEAD ~ a composite substrate} formed by bonding {TAIL ~ the main surface} of a first semiconductor substrate and the main surface of a second semiconductor substrate together with an insulation film interposed therebetween 
formed by bonding
{ HEAD ~ a composite substrate } formed by bonding { TAIL ~ the main surface } of a first semiconductor substrate and the main surface of a second semiconductor substrate together with an insulation film interposed therebetween
HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH