The lead frame 104 where the semiconductor chip is loaded is positioned above the lower die 104, and the external leads 18 of the lead frame 12 are placed on the mirror finished region 22 formed on {HEAD ~ the surface} of {TAIL ~ the lower die} 104 
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The lead frame 104 where the semiconductor chip is loaded is positioned above the lower die 104 , and the external leads 18 of the lead frame 12 are placed on the mirror finished region 22 formed on { HEAD ~ the surface } of { TAIL ~ the lower die } 104
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