{HEAD ~ Gases}, e.g., hydrogen or nitrogen can be in {TAIL ~ the deposited films} by creating a background plasma of the desired gas using either RF energy, thermionic emission, or consequential ionization of the gas passing through the arc or around the substrate 
in
{ HEAD ~ Gases } , e.g. , hydrogen or nitrogen can be in { TAIL ~ the deposited films } by creating a background plasma of the desired gas using either RF energy , thermionic emission , or consequential ionization of the gas passing through the arc or around the substrate
HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH