{HEAD ~ An IC} to be tested having solder bumps is mounted on an IC socket mounted on {TAIL ~ a test board} 
{ HEAD ~ An IC } to be tested having solder bumps is mounted on an IC socket mounted on { TAIL ~ a test board }
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL