{HEAD ~ The present invention} in {TAIL ~ its various embodiments} provides a flexible and effective way t accomplish ALD processing on semiconductor wafers, and the various aspects of the invention are taught below in enabling detail 
in
{ HEAD ~ The present invention } in { TAIL ~ its various embodiments } provides a flexible and effective way t accomplish ALD processing on semiconductor wafers , and the various aspects of the invention are taught below in enabling detail
HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH