The present invention relates to a semiconductor apparatus package and a method of producing the semiconductor apparatus package, which semiconductor apparatus package is to be used in {HEAD ~ semiconductor apparatuses} that can be mounted at {TAIL ~ high density} 
mounted at
The present invention relates to a semiconductor apparatus package and a method of producing the semiconductor apparatus package , which semiconductor apparatus package is to be used in { HEAD ~ semiconductor apparatuses } that can be mounted at { TAIL ~ high density }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH REL REL TAIL TAIL TAIL TAIL TAIL TAIL