Ceramic based multi site electrode arrays of a polished ceramic substrate patterned with recording sites and {HEAD ~ bonding pads} which are connected via conducting {TAIL ~ lines} are provided 
are connected via conducting
Ceramic based multi site electrode arrays of a polished ceramic substrate patterned with recording sites and { HEAD ~ bonding pads } which are connected via conducting { TAIL ~ lines } are provided
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH REL REL REL REL TAIL TAIL TAIL TAIL TAIL OTH OTH