{HEAD ~ A preferred embodiment} of {TAIL ~ the present invention} includes depositing a thin film having a uniform film thickness distribution by taking advantage of the relation between the plasma density and the DC bias voltage described above 
of
{ HEAD ~ A preferred embodiment } of { TAIL ~ the present invention } includes depositing a thin film having a uniform film thickness distribution by taking advantage of the relation between the plasma density and the DC bias voltage described above
HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH