The edge metallization of the present invention may be fabricated by drilling {HEAD ~ holes} into {TAIL ~ a wafer} of ferrite substrate 26, at the edge metallization locations 36 
into
The edge metallization of the present invention may be fabricated by drilling { HEAD ~ holes } into { TAIL ~ a wafer } of ferrite substrate 26 , at the edge metallization locations 36
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH