It is {TAIL ~ a second object} of {HEAD ~ the present invention} to provide a flexible printed board, although a semiconductor element is flip chip bonded on the flexible printed board, which can easily prevent a change in performance, an erroneous operation, or the like caused by the photo electric effect of an element on a semiconductor 
It is { TAIL ~ a second object } of { HEAD ~ the present invention } to provide a flexible printed board , although a semiconductor element is flip chip bonded on the flexible printed board , which can easily prevent a change in performance , an erroneous operation , or the like caused by the photo electric effect of an element on a semiconductor
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