The ternary alloy system of silver aluminum copper contemplated by this invention has {HEAD ~ a eutectic liquid valley} with {TAIL ~ low melting temperatures} as indicated by referring to points A, B and C in the graph of FIG 1 
with
The ternary alloy system of silver aluminum copper contemplated by this invention has { HEAD ~ a eutectic liquid valley } with { TAIL ~ low melting temperatures } as indicated by referring to points A , B and C in the graph of FIG 1
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH