The method 1 further comprising forming {HEAD ~ the feet} to accommodate {TAIL ~ respective set volumes} of adhesive therebeneath for attaching the semiconductor heat spreader to a substrate 
to accommodate
The method 1 further comprising forming { HEAD ~ the feet } to accommodate { TAIL ~ respective set volumes } of adhesive therebeneath for attaching the semiconductor heat spreader to a substrate
OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH