The present invention relates to a semiconductor apparatus package and a method of producing {HEAD ~ the semiconductor apparatus package}, which semiconductor apparatus package is to be used in {TAIL ~ semiconductor apparatuses} that can be mounted at high density 
The present invention relates to a semiconductor apparatus package and a method of producing { HEAD ~ the semiconductor apparatus package } , which semiconductor apparatus package is to be used in { TAIL ~ semiconductor apparatuses } that can be mounted at high density
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH