A film of the resist solution is formed with {HEAD ~ a uniform film thickness} to the edge of {TAIL ~ the semiconductor wafer} W 
A film of the resist solution is formed with { HEAD ~ a uniform film thickness } to the edge of { TAIL ~ the semiconductor wafer } W
OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH