This is because when the feed is high, the load resistance imposed by the single crystal ingot being sliced increases and causes the blade to wobble more roughly and thus the displacement of the blade is increased, and, on the other hand, when the feed is low, the load resistance decreases and causes the blade to wobble less roughly and thus {HEAD ~ the displacement} of {TAIL ~ the blade} is decreased; as a result, the wafer will easily have an irregular surface 
of
This is because when the feed is high , the load resistance imposed by the single crystal ingot being sliced increases and causes the blade to wobble more roughly and thus the displacement of the blade is increased , and , on the other hand , when the feed is low , the load resistance decreases and causes the blade to wobble less roughly and thus { HEAD ~ the displacement } of { TAIL ~ the blade } is decreased ; as a result , the wafer will easily have an irregular surface
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH