{HEAD ~ An object} of {TAIL ~ the subject invention} is to provide an improved method for deposition on a semiconductor wafer 
of
{ HEAD ~ An object } of { TAIL ~ the subject invention } is to provide an improved method for deposition on a semiconductor wafer
HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH