The present invention achieves technical advantages by providing for the accurate prediction of whether or not contact {HEAD ~ resistance stability} of {TAIL ~ a bond pad}, rendered due to a change in process control or a current process control, leads to bond pads that are well suited for subsequent multi probe testing 
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The present invention achieves technical advantages by providing for the accurate prediction of whether or not contact { HEAD ~ resistance stability } of { TAIL ~ a bond pad } , rendered due to a change in process control or a current process control , leads to bond pads that are well suited for subsequent multi probe testing
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