{HEAD ~ The cap wafer} is aligned with {TAIL ~ the device wafer} and bonded to the device wafer using a glass frit as a bonding agent 
is aligned with
{ HEAD ~ The cap wafer } is aligned with { TAIL ~ the device wafer } and bonded to the device wafer using a glass frit as a bonding agent
HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH