{HEAD ~ The first face} of the secondary substrate may include {TAIL ~ a first pattern} of conductive lands formed on the first face corresponding to a plurality of conductive leads of an electronic package 
include
{ HEAD ~ The first face } of the secondary substrate may include { TAIL ~ a first pattern } of conductive lands formed on the first face corresponding to a plurality of conductive leads of an electronic package
HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH