Elimination of the ceramic chip package also removed the main source of {HEAD ~ resistance} to {TAIL ~ heat transfer} between the IC chip and the heat sink 
to
Elimination of the ceramic chip package also removed the main source of { HEAD ~ resistance } to { TAIL ~ heat transfer } between the IC chip and the heat sink
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH