A diameter of the plurality of contact pins is configured to be sufficiently small for the plurality of contact pins to pierce the respective solder bumps so that an electrical connection is established by the upper end of {HEAD ~ each} of {TAIL ~ the plurality} of solder bumps piercing an associated one of the solder bumps 
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A diameter of the plurality of contact pins is configured to be sufficiently small for the plurality of contact pins to pierce the respective solder bumps so that an electrical connection is established by the upper end of { HEAD ~ each } of { TAIL ~ the plurality } of solder bumps piercing an associated one of the solder bumps
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