A first mold insert is placed in the mold frame and {HEAD ~ light converting material} comprising a carrier and {TAIL ~ light converting particles} is injected into the first mold insert to form a light converting molding around each LED chip 
comprising
A first mold insert is placed in the mold frame and { HEAD ~ light converting material } comprising a carrier and { TAIL ~ light converting particles } is injected into the first mold insert to form a light converting molding around each LED chip
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH