{HEAD ~ The heat sink} is mounted on the solid state switching device such that a first portion of the heat sink is thermal communication with the solid state switching device and a second portion of the heat sink is in thermal communication with {TAIL ~ an exposed portion} of a trace on the circuit board 
{ HEAD ~ The heat sink } is mounted on the solid state switching device such that a first portion of the heat sink is thermal communication with the solid state switching device and a second portion of the heat sink is in thermal communication with { TAIL ~ an exposed portion } of a trace on the circuit board
HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH