A resin sealing mold 1, wherein {HEAD ~ said semiconductor chip} is mounted on {TAIL ~ a die pad} of a lead flame and a mirror face region is formed in said external lead placing regions and a region for placing the die pad 
is mounted on
A resin sealing mold 1 , wherein { HEAD ~ said semiconductor chip } is mounted on { TAIL ~ a die pad } of a lead flame and a mirror face region is formed in said external lead placing regions and a region for placing the die pad
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