The material is preferably {TAIL ~ a curable composition} that is cured to form a strong bond between {HEAD ~ the component and circuit board} 
The material is preferably { TAIL ~ a curable composition } that is cured to form a strong bond between { HEAD ~ the component and circuit board }
OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD