The multi path feed thru lead according to the present invention includes an insulative substrate having a predetermined geometric configuration and includes an extended intermediate portion and first and second end portions configured to define {HEAD ~ a plurality} of bonding pads that facilitate wire bonding to the circuitry housed in {TAIL ~ the package} and to external circuitry, respectively 
The multi path feed thru lead according to the present invention includes an insulative substrate having a predetermined geometric configuration and includes an extended intermediate portion and first and second end portions configured to define { HEAD ~ a plurality } of bonding pads that facilitate wire bonding to the circuitry housed in { TAIL ~ the package } and to external circuitry , respectively
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