{HEAD ~ A condition} without using Ar as plasma gas is applied to {TAIL ~ processing} of an organic anti reflection coating, which suppresses a spatter effect and decreases the cleavage of C—H and OC—O bonds in a resist 
is applied to
{ HEAD ~ A condition } without using Ar as plasma gas is applied to { TAIL ~ processing } of an organic anti reflection coating , which suppresses a spatter effect and decreases the cleavage of C — H and OC — O bonds in a resist
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH REL REL REL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH