According to the object of the invention, {TAIL ~ a bonding pad structure} comprises a substrate having a bonding region and {HEAD ~ a sensing region} 
According to the object of the invention , { TAIL ~ a bonding pad structure } comprises a substrate having a bonding region and { HEAD ~ a sensing region }
OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD