{HEAD ~ The present invention} relates generally to a memory module assembly, and more particularly to {TAIL ~ a memory module assembly} including a clip and a heat sink, where the heat sink is mounted to an electronic component attached on a surface of a printed circuit board of the memory module assembly via the clip 
relates particularly to
{ HEAD ~ The present invention } relates generally to a memory module assembly , and more particularly to { TAIL ~ a memory module assembly } including a clip and a heat sink , where the heat sink is mounted to an electronic component attached on a surface of a printed circuit board of the memory module assembly via the clip
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