In the semiconductor device depicted in FIG 3, {TAIL ~ a semiconductor element} 1 is bonded to a circuit substrate 7 by the hot melt adhesive sheet 2, and in this case the semiconductor element 1 and the interconnects 4 on the circuit substrate 7 are electrically connected by {HEAD ~ the bumps} 8  
In the semiconductor device depicted in FIG 3 , { TAIL ~ a semiconductor element } 1 is bonded to a circuit substrate 7 by the hot melt adhesive sheet 2 , and in this case the semiconductor element 1 and the interconnects 4 on the circuit substrate 7 are electrically connected by { HEAD ~ the bumps } 8
OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH