In an embodiment, the diode 104, the backsheet 102, {HEAD ~ the interconnects} 106 and the heat spreader 110 are mounted above {TAIL ~ a substrate} 116, such as a glass substrate, via an encapsulant 118, as depicted in FIG 1 
are mounted above
In an embodiment , the diode 104 , the backsheet 102 , { HEAD ~ the interconnects } 106 and the heat spreader 110 are mounted above { TAIL ~ a substrate } 116 , such as a glass substrate , via an encapsulant 118 , as depicted in FIG 1
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH