The top and bottom of the substrate 26 are covered with a layer of conductive material , and the conductive material is deposited in the holes, covering the surfaces of {HEAD ~ the substrate} in {TAIL ~ the hole}  
in
The top and bottom of the substrate 26 are covered with a layer of conductive material , and the conductive material is deposited in the holes , covering the surfaces of { HEAD ~ the substrate } in { TAIL ~ the hole }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH