That is, the object of the present invention is to provide an aqueous dispersion for {HEAD ~ CMP} with {TAIL ~ a high removal rate} that allows efficient polishing, while also producing minimal excessive etching, thinning, dishing, keyholes and scratches, to give finished surfaces with satisfactory high precision 
with
That is , the object of the present invention is to provide an aqueous dispersion for { HEAD ~ CMP } with { TAIL ~ a high removal rate } that allows efficient polishing , while also producing minimal excessive etching , thinning , dishing , keyholes and scratches , to give finished surfaces with satisfactory high precision
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH