This removes the interconnect inductance of the fine wires used to connect {HEAD ~ the IC chip} with {TAIL ~ the ceramic chip package} and the dielectric capacitance of the ceramic chip package 
with
This removes the interconnect inductance of the fine wires used to connect { HEAD ~ the IC chip } with { TAIL ~ the ceramic chip package } and the dielectric capacitance of the ceramic chip package
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH