The apparatus also includes a second vacuum processing chamber adapted to perform a process selected from {HEAD ~ the group} consisting of CVD, {TAIL ~ PVD}, sputtering, and etching of a workpiece 
consisting of
The apparatus also includes a second vacuum processing chamber adapted to perform a process selected from { HEAD ~ the group } consisting of CVD , { TAIL ~ PVD } , sputtering , and etching of a workpiece
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL REL OTH OTH TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH