{TAIL ~ An arc} spraying coating film and {HEAD ~ a plasma} spraying coating film over the former are formed on the sputtering target, a backing plate, or another surface in the sputtering apparatus, where an unwanted film might be formed 
{ TAIL ~ An arc } spraying coating film and { HEAD ~ a plasma } spraying coating film over the former are formed on the sputtering target , a backing plate , or another surface in the sputtering apparatus , where an unwanted film might be formed
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