Furthermore, there is no interconnection fanout between the IC chip contact areas and the ultimate connection to the multilayer circuit board, thus dramatically increasing, by three or four times, the number of {HEAD ~ IC chips} that can be mounted on {TAIL ~ a single multilayer circuit board} or packaged in a one dimensional or three dimensional packaging construction 
mounted on
Furthermore , there is no interconnection fanout between the IC chip contact areas and the ultimate connection to the multilayer circuit board , thus dramatically increasing , by three or four times , the number of { HEAD ~ IC chips } that can be mounted on { TAIL ~ a single multilayer circuit board } or packaged in a one dimensional or three dimensional packaging construction
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