The top and bottom of the substrate 26 are covered with {HEAD ~ a layer} of conductive material , and the conductive material is deposited in the holes, covering the surfaces of {TAIL ~ the substrate} in the hole  
The top and bottom of the substrate 26 are covered with { HEAD ~ a layer } of conductive material , and the conductive material is deposited in the holes , covering the surfaces of { TAIL ~ the substrate } in the hole
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH