{HEAD ~ An object} of {TAIL ~ the present invention} is to provide a method for bonding a semiconductor structure with a substrate and a high efficiency photonic device manufactured by using the same method, which are advantageous in increasing the yield, stability, and reliability of products by lowering the bonding temperature and by reducing the chance of oxidation of bonding interface layer by using a composite bonding layer 
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{ HEAD ~ An object } of { TAIL ~ the present invention } is to provide a method for bonding a semiconductor structure with a substrate and a high efficiency photonic device manufactured by using the same method , which are advantageous in increasing the yield , stability , and reliability of products by lowering the bonding temperature and by reducing the chance of oxidation of bonding interface layer by using a composite bonding layer
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