At least one embodiment provides a silicon chip package for {HEAD ~ a circuit board assembly} having {TAIL ~ a package substrate} with a silicon chip 
having
At least one embodiment provides a silicon chip package for { HEAD ~ a circuit board assembly } having { TAIL ~ a package substrate } with a silicon chip
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH