{HEAD ~ A multi path feed} thru {TAIL ~ lead} is disclosed that provides increased conductive pathway density and that has particular utility in combination with microcircuit packages housing hybrid and semiconductor discrete and integrated circuit chips 
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{ HEAD ~ A multi path feed } thru { TAIL ~ lead } is disclosed that provides increased conductive pathway density and that has particular utility in combination with microcircuit packages housing hybrid and semiconductor discrete and integrated circuit chips
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