As described above, according to the invention, {TAIL ~ the feed} of the single crystal ingot to {HEAD ~ the blade} of the ID saw slicing machine is increased and decreased alternately in accordance with a predetermined control pattern, so that it is possible to intentionally give slight irregularity to the faces of the wafer sliced from the single crystal ingot; as a result, the wafer will have less bow even after removing the irregularity through conventional lapping and etching processes 
As described above , according to the invention , { TAIL ~ the feed } of the single crystal ingot to { HEAD ~ the blade } of the ID saw slicing machine is increased and decreased alternately in accordance with a predetermined control pattern , so that it is possible to intentionally give slight irregularity to the faces of the wafer sliced from the single crystal ingot ; as a result , the wafer will have less bow even after removing the irregularity through conventional lapping and etching processes
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