wherein {HEAD ~ the output matching circuit} utilizes, as a passive device, {TAIL ~ a bonding inductor} used for connecting a module to a monolithic microwave integrated circuit chip in which the power amplifiers are embedded 
utilizes
wherein { HEAD ~ the output matching circuit } utilizes , as a passive device , { TAIL ~ a bonding inductor } used for connecting a module to a monolithic microwave integrated circuit chip in which the power amplifiers are embedded
OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH