In the case of large electronic computer, it can exhibit sufficient performances by application of the semiconductor module made by bonding a semiconductor to the ceramic laminated circuit substrate of {HEAD ~ the present invention} with {TAIL ~ high accuracy} 
with
In the case of large electronic computer , it can exhibit sufficient performances by application of the semiconductor module made by bonding a semiconductor to the ceramic laminated circuit substrate of { HEAD ~ the present invention } with { TAIL ~ high accuracy }
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