{TAIL ~ The present invention} is generally related to {HEAD ~ the field} of semiconductor material testing and analysis, and more particularly to the field of surface characterization and assessing the surface properties of a semiconductor material including thin films for a semiconductor die under test 
{ TAIL ~ The present invention } is generally related to { HEAD ~ the field } of semiconductor material testing and analysis , and more particularly to the field of surface characterization and assessing the surface properties of a semiconductor material including thin films for a semiconductor die under test
TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH