{HEAD ~ The ternary alloy system} of {TAIL ~ silver aluminum copper} contemplated by this invention has a eutectic liquid valley with low melting temperatures as indicated by referring to points A, B and C in the graph of FIG 1 
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{ HEAD ~ The ternary alloy system } of { TAIL ~ silver aluminum copper } contemplated by this invention has a eutectic liquid valley with low melting temperatures as indicated by referring to points A , B and C in the graph of FIG 1
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