The dicing tape integrated wafer back surface protective film 1, wherein said colored wafer back surface protective film has {TAIL ~ a laser} marking {HEAD ~ ability} 
The dicing tape integrated wafer back surface protective film 1 , wherein said colored wafer back surface protective film has { TAIL ~ a laser } marking { HEAD ~ ability }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD