The present invention surmounts the inherent disadvantages of prior art flat packs by providing a multi path feed thru lead that efficiently and economically permits an increase in {HEAD ~ the conductive pathway density} without a significant increase in the overall size of {TAIL ~ the lead member} 
The present invention surmounts the inherent disadvantages of prior art flat packs by providing a multi path feed thru lead that efficiently and economically permits an increase in { HEAD ~ the conductive pathway density } without a significant increase in the overall size of { TAIL ~ the lead member }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL