For example, before the reversed current treatment according to {HEAD ~ one embodiment} of the present invention following a high current electrodeposition process , about 200 copper particle defects remaining on {TAIL ~ the electrodeposition surface} were determined to be present according to optical scanning 
For example , before the reversed current treatment according to { HEAD ~ one embodiment } of the present invention following a high current electrodeposition process , about 200 copper particle defects remaining on { TAIL ~ the electrodeposition surface } were determined to be present according to optical scanning
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH