{HEAD ~ An insulating board}, having a plurality of openings at positions corresponding to the IC chip contact areas, is interposed between the IC chip and {TAIL ~ the multilayer circuit board} 
is interposed between
{ HEAD ~ An insulating board } , having a plurality of openings at positions corresponding to the IC chip contact areas , is interposed between the IC chip and { TAIL ~ the multilayer circuit board }
HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH REL REL REL OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL