A novel five layer tape is provided for {HEAD ~ applications} such as {TAIL ~ bonding}, interconnection and insulation of different parts of a semiconductor package at the same time 
such as
A novel five layer tape is provided for { HEAD ~ applications } such as { TAIL ~ bonding } , interconnection and insulation of different parts of a semiconductor package at the same time
OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH