This invention relates to semiconductor die packaging and more specifically relates to a novel five layer tape which enables the mounting and {HEAD ~ interconnection} of {TAIL ~ plural semiconductor} die relative to one another and to a lead frame support 
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This invention relates to semiconductor die packaging and more specifically relates to a novel five layer tape which enables the mounting and { HEAD ~ interconnection } of { TAIL ~ plural semiconductor } die relative to one another and to a lead frame support
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