{HEAD ~ A wafer processing cluster tool}, having one or more load locks, is provided with {TAIL ~ one or more batch preheating modules} that receive wafers only from the cluster tool transport module at the internal vacuum pressure of the machine 
is provided with
{ HEAD ~ A wafer processing cluster tool } , having one or more load locks , is provided with { TAIL ~ one or more batch preheating modules } that receive wafers only from the cluster tool transport module at the internal vacuum pressure of the machine
HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH