{HEAD ~ A method} of forming solder bumps includes the steps of applying {TAIL ~ a thick layer} of solder resist to a substrate 
{ HEAD ~ A method } of forming solder bumps includes the steps of applying { TAIL ~ a thick layer } of solder resist to a substrate
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH