The method 1 further comprising forming the feet to accommodate respective set volumes of adhesive therebeneath for attaching {HEAD ~ the semiconductor heat spreader} to {TAIL ~ a substrate} 
to
The method 1 further comprising forming the feet to accommodate respective set volumes of adhesive therebeneath for attaching { HEAD ~ the semiconductor heat spreader } to { TAIL ~ a substrate }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL