In a three dimensional construction employing the principles of the invention, {HEAD ~ the IC chips} are arranged in modules, and interconnections may be made between {TAIL ~ IC chips} within each module, transversely between modules, and in a third direction between layers of modules 
In a three dimensional construction employing the principles of the invention , { HEAD ~ the IC chips } are arranged in modules , and interconnections may be made between { TAIL ~ IC chips } within each module , transversely between modules , and in a third direction between layers of modules
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH