A semiconductor device comprising a semiconductor element; a substrate; and a hot melt adhesive sheet bonding the semiconductor element to the substrate, wherein {TAIL ~ the hot melt adhesive sheet} comprises a mixture of a hot melt adhesive and a spacer, wherein the adhesive is selected from a silicone modified epoxy resin adhesive, a silicone adhesive, and a silicone modified {HEAD ~ polyimide} adhesive, and the spacer has the form of particles 
A semiconductor device comprising a semiconductor element ; a substrate ; and a hot melt adhesive sheet bonding the semiconductor element to the substrate , wherein { TAIL ~ the hot melt adhesive sheet } comprises a mixture of a hot melt adhesive and a spacer , wherein the adhesive is selected from a silicone modified epoxy resin adhesive , a silicone adhesive , and a silicone modified { HEAD ~ polyimide } adhesive , and the spacer has the form of particles
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