In the case of large electronic computer, it can exhibit sufficient performances by application of {HEAD ~ the semiconductor module} made by bonding {TAIL ~ a semiconductor} to the ceramic laminated circuit substrate of the present invention with high accuracy 
made by bonding
In the case of large electronic computer , it can exhibit sufficient performances by application of { HEAD ~ the semiconductor module } made by bonding { TAIL ~ a semiconductor } to the ceramic laminated circuit substrate of the present invention with high accuracy
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH