{HEAD ~ A solder} resist {TAIL ~ layer} having an opening portion is then formed on the wiring portion, and the support board is removed to expose a surface of the electrode or a surface of the electrode and insulating layer 
resist
{ HEAD ~ A solder } resist { TAIL ~ layer } having an opening portion is then formed on the wiring portion , and the support board is removed to expose a surface of the electrode or a surface of the electrode and insulating layer
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