{TAIL ~ A film} of {HEAD ~ the resist solution} is formed with a uniform film thickness to the edge of the semiconductor wafer W 
{ TAIL ~ A film } of { HEAD ~ the resist solution } is formed with a uniform film thickness to the edge of the semiconductor wafer W
TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH