second means for connecting said conductive pads and {HEAD ~ ground layer} to a circuit board, wherein said second means includes a ball grid array, wherein said {TAIL ~ ball grid array} includes a plurality of solder balls, at least one solder ball attached to each conductive pad and at least one solder ball attached to said ground; and 
second means for connecting said conductive pads and { HEAD ~ ground layer } to a circuit board , wherein said second means includes a ball grid array , wherein said { TAIL ~ ball grid array } includes a plurality of solder balls , at least one solder ball attached to each conductive pad and at least one solder ball attached to said ground ; and
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