Further, in {HEAD ~ accordance} with {TAIL ~ a preferred embodiment} of the present invention, the wafer transfer device has a first unit receives a first group of semiconductor wafers and a second unit which receives a second group of semiconductor wafers 
with
Further , in { HEAD ~ accordance } with { TAIL ~ a preferred embodiment } of the present invention , the wafer transfer device has a first unit receives a first group of semiconductor wafers and a second unit which receives a second group of semiconductor wafers
OTH OTH OTH HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH