A semiconductor package facilitates package connection due to {TAIL ~ different locations} of input/output pads in each interlayer die depending on {HEAD ~ coding information} in a multi chip package 
A semiconductor package facilitates package connection due to { TAIL ~ different locations } of input / output pads in each interlayer die depending on { HEAD ~ coding information } in a multi chip package
OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH