The method in {HEAD ~ accordance} with the present invention is compatible with conventional CMOS fabrication processes to form {TAIL ~ a zener diode} and a lateral silicon controlled rectifier constituting an on chip ESD protection circuit in a semiconductor substrate 
The method in { HEAD ~ accordance } with the present invention is compatible with conventional CMOS fabrication processes to form { TAIL ~ a zener diode } and a lateral silicon controlled rectifier constituting an on chip ESD protection circuit in a semiconductor substrate
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