{HEAD ~ A socket} for a solder bumped member is obtained by first providing a substrate having {TAIL ~ metalized pads} corresponding to the solder bumps of the member 
{ HEAD ~ A socket } for a solder bumped member is obtained by first providing a substrate having { TAIL ~ metalized pads } corresponding to the solder bumps of the member
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH