{HEAD ~ A rotating or vibrating disk} or pad is moved relative to the semiconductor wafer surface in {TAIL ~ the presence} of a chemical mechanical polishing slurry 
{ HEAD ~ A rotating or vibrating disk } or pad is moved relative to the semiconductor wafer surface in { TAIL ~ the presence } of a chemical mechanical polishing slurry
HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH