An interconnect device for connecting an electronic package, whether it be a single chip or a multi component device, to {HEAD ~ a primary substrate} requiring the mating of dissimilar solder patterns includes {TAIL ~ a secondary substrate} having a first face and a second face 
An interconnect device for connecting an electronic package , whether it be a single chip or a multi component device , to { HEAD ~ a primary substrate } requiring the mating of dissimilar solder patterns includes { TAIL ~ a secondary substrate } having a first face and a second face
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH