{HEAD ~ An interconnect device} for connecting {TAIL ~ an electronic package}, whether it be a single chip or a multi component device, to a primary substrate requiring the mating of dissimilar solder patterns includes a secondary substrate having a first face and a second face 
for connecting
{ HEAD ~ An interconnect device } for connecting { TAIL ~ an electronic package } , whether it be a single chip or a multi component device , to a primary substrate requiring the mating of dissimilar solder patterns includes a secondary substrate having a first face and a second face
HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH