{HEAD ~ Electrical contacts} between {TAIL ~ the IC chip contact areas} and the multilayer circuit board contact areas are established by compressing the IC chip toward the multilayer circuit board, thus compressing connector elements positioned in the openings of the insulating board against the contact areas 
between
{ HEAD ~ Electrical contacts } between { TAIL ~ the IC chip contact areas } and the multilayer circuit board contact areas are established by compressing the IC chip toward the multilayer circuit board , thus compressing connector elements positioned in the openings of the insulating board against the contact areas
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