The method further includes selectively irradiating the at least one electrical element with the one or more laser pulses focused into at least one spot having a non uniform intensity profile along a direction and a spot diameter as small as about 6 microns to about 15 microns so as to cause {HEAD ~ the one or more laser pulses} to selectively remove {TAIL ~ material} from the at least one element and laser trim the at least one element while avoiding substantial microcracking within the at least one element 
to selectively remove
The method further includes selectively irradiating the at least one electrical element with the one or more laser pulses focused into at least one spot having a non uniform intensity profile along a direction and a spot diameter as small as about 6 microns to about 15 microns so as to cause { HEAD ~ the one or more laser pulses } to selectively remove { TAIL ~ material } from the at least one element and laser trim the at least one element while avoiding substantial microcracking within the at least one element
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