In a semiconductor device such as a high frequency power amplifier module, a plurality of {TAIL ~ amplifying means} are formed on a semiconductor chip which is mounted on a main surface of a wiring substrate, and electrodes of the semiconductor chip are electrically connected by wires to {HEAD ~ electrodes} of the wiring substrate 
In a semiconductor device such as a high frequency power amplifier module , a plurality of { TAIL ~ amplifying means } are formed on a semiconductor chip which is mounted on a main surface of a wiring substrate , and electrodes of the semiconductor chip are electrically connected by wires to { HEAD ~ electrodes } of the wiring substrate
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