The present invention resides in an integrated circuit packaging construction for mounting and interconnecting {HEAD ~ IC chips} and IC chip packages with a multilayer printed circuit board and for interconnecting IC chips with {TAIL ~ minimized interconnection} lead lengths between the IC chips 
The present invention resides in an integrated circuit packaging construction for mounting and interconnecting { HEAD ~ IC chips } and IC chip packages with a multilayer printed circuit board and for interconnecting IC chips with { TAIL ~ minimized interconnection } lead lengths between the IC chips
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH