Thus, {HEAD ~ a semiconductor device} comprising {TAIL ~ copper wiring} of high reliability and with less wiring delay time can be provided 
comprising
Thus , { HEAD ~ a semiconductor device } comprising { TAIL ~ copper wiring } of high reliability and with less wiring delay time can be provided
OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH