In accordance with the invention, {HEAD ~ a novel five layer sandwich} of adhesive, insulation, metal, insulation and adhesive layers provides {TAIL ~ a whole new variety} of potential applications such as bonding, interconnection and mutual insulation of different parts of the semiconductor package at the same time 
provides
In accordance with the invention , { HEAD ~ a novel five layer sandwich } of adhesive , insulation , metal , insulation and adhesive layers provides { TAIL ~ a whole new variety } of potential applications such as bonding , interconnection and mutual insulation of different parts of the semiconductor package at the same time
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