The method for manufacturing a nonreciprocal circuit device 2, wherein {TAIL ~ said device} comprises {HEAD ~ a high temperature solder} which melts at 230° C. or higher 
The method for manufacturing a nonreciprocal circuit device 2 , wherein { TAIL ~ said device } comprises { HEAD ~ a high temperature solder } which melts at 230 ° C. or higher
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH