The method 1, wherein the bonding finger is {HEAD ~ a portion} of {TAIL ~ the interconnection pattern} electrically connected to a bonding pad of the chip 
of
The method 1 , wherein the bonding finger is { HEAD ~ a portion } of { TAIL ~ the interconnection pattern } electrically connected to a bonding pad of the chip
OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH