The present invention relates generally to image correction and inspection technologies, and more particularly to a method and {HEAD ~ apparatus} for correcting {TAIL ~ ultrafine pattern images} as formed on reticles for use in the manufacture of highly integrated semiconductor circuit devices, such as LSI chips 
for correcting
The present invention relates generally to image correction and inspection technologies , and more particularly to a method and { HEAD ~ apparatus } for correcting { TAIL ~ ultrafine pattern images } as formed on reticles for use in the manufacture of highly integrated semiconductor circuit devices , such as LSI chips
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