These and other objects are provided according to the present invention by methods including the steps of forming a first insulating layer on an integrated circuit substrate, and forming a first capacitor electrode on {HEAD ~ the insulating layer} opposite {TAIL ~ the substrate} 
opposite
These and other objects are provided according to the present invention by methods including the steps of forming a first insulating layer on an integrated circuit substrate , and forming a first capacitor electrode on { HEAD ~ the insulating layer } opposite { TAIL ~ the substrate }
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