{HEAD ~ The oxide application} includes a deposition component and {TAIL ~ a sputtering component}, and the sputtering component is configured to remove at least a part of an edge of the first silicon nitride layer 
includes
{ HEAD ~ The oxide application } includes a deposition component and { TAIL ~ a sputtering component } , and the sputtering component is configured to remove at least a part of an edge of the first silicon nitride layer
HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH