{HEAD ~ A highly reliable semiconductor chip electrode structure} allowing {TAIL ~ control} of interface reaction of bonding sections even in the case of using two or three element solder used conventionally is disclosed 
allowing
{ HEAD ~ A highly reliable semiconductor chip electrode structure } allowing { TAIL ~ control } of interface reaction of bonding sections even in the case of using two or three element solder used conventionally is disclosed
HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH