{HEAD ~ An array} of contact pads on {TAIL ~ the package substrate} are provided by a conductive material 
{ HEAD ~ An array } of contact pads on { TAIL ~ the package substrate } are provided by a conductive material
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH