The present invention relates generally to image correction and inspection technologies, and more particularly to a method and apparatus for correcting ultrafine pattern images as formed on reticles for use in the manufacture of {HEAD ~ highly integrated semiconductor circuit devices}, such as {TAIL ~ LSI chips} 
such as
The present invention relates generally to image correction and inspection technologies , and more particularly to a method and apparatus for correcting ultrafine pattern images as formed on reticles for use in the manufacture of { HEAD ~ highly integrated semiconductor circuit devices } , such as { TAIL ~ LSI chips }
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