The present invention provides {HEAD ~ a method} and an apparatus for increasing {TAIL ~ a deposition rate} of dielectric films deposited on a substrate at a given temperature while providing good step coverage and gap fill properties 
for increasing
The present invention provides { HEAD ~ a method } and an apparatus for increasing { TAIL ~ a deposition rate } of dielectric films deposited on a substrate at a given temperature while providing good step coverage and gap fill properties
OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH