The multi path feed thru leads have a configuration that facilitates sealing thereof in the apertures of {HEAD ~ microcircuit packages} to provide {TAIL ~ increased conductive path density} 
to provide
The multi path feed thru leads have a configuration that facilitates sealing thereof in the apertures of { HEAD ~ microcircuit packages } to provide { TAIL ~ increased conductive path density }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL