A ceramic laminated circuit substrate 1, wherein {HEAD ~ the conductor layer} comprises {TAIL ~ Cu}, Au, Ag, Ag Pd, W, or an alloy of at least two of them and ceramic material of the ceramic insulating layers softens at a temperature lower than the melting point of the conductor layer 
comprises
A ceramic laminated circuit substrate 1 , wherein { HEAD ~ the conductor layer } comprises { TAIL ~ Cu } , Au , Ag , Ag Pd , W , or an alloy of at least two of them and ceramic material of the ceramic insulating layers softens at a temperature lower than the melting point of the conductor layer
OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH