In {HEAD ~ magnetron sputtering systems}, {TAIL ~ deposition rates} greater than those achieved with DC and RF sputtering systems can be achieved by using magnetic fields to confine the electrons near the target surface 
In { HEAD ~ magnetron sputtering systems } , { TAIL ~ deposition rates } greater than those achieved with DC and RF sputtering systems can be achieved by using magnetic fields to confine the electrons near the target surface
OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH