In the above process, {HEAD ~ the component} can be attached to {TAIL ~ the circuit board} by wave soldering prior to application of the material 
attached to
In the above process , { HEAD ~ the component } can be attached to { TAIL ~ the circuit board } by wave soldering prior to application of the material
OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH