According to the present invention, a polishing pad that is useful for polishing a material to be polished such as a semiconductor wafer at good precision and high polishing efficiency, and a cushion for {HEAD ~ a polishing pad} used for producing {TAIL ~ the polishing pad} 
used for producing
According to the present invention , a polishing pad that is useful for polishing a material to be polished such as a semiconductor wafer at good precision and high polishing efficiency , and a cushion for { HEAD ~ a polishing pad } used for producing { TAIL ~ the polishing pad }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL