{HEAD ~ The position} and orientation of {TAIL ~ the substrate place} on which the semiconductor chip will be mounted are determined by means of a second camera and made available in the form of positional data relating to a second system of coordinates 
of
{ HEAD ~ The position } and orientation of { TAIL ~ the substrate place } on which the semiconductor chip will be mounted are determined by means of a second camera and made available in the form of positional data relating to a second system of coordinates
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH