In turn, the tape enables {HEAD ~ the manufacturer} to overcome {TAIL ~ physical limitations} in forming conduction paths, including permitting the connection of multiple die where the terminals of the one die are obscured by the other die 
to overcome
In turn , the tape enables { HEAD ~ the manufacturer } to overcome { TAIL ~ physical limitations } in forming conduction paths , including permitting the connection of multiple die where the terminals of the one die are obscured by the other die
OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH