The present invention is directed to a semiconductor device comprising a semiconductor element; a substrate; and a hot melt adhesive sheet bonding {HEAD ~ the semiconductor element} to {TAIL ~ the substrate}, wherein the hot melt adhesive sheet comprises a spacer having the form of a sheet and a hot melt adhesive on both sides of the spacer 
to
The present invention is directed to a semiconductor device comprising a semiconductor element ; a substrate ; and a hot melt adhesive sheet bonding { HEAD ~ the semiconductor element } to { TAIL ~ the substrate } , wherein the hot melt adhesive sheet comprises a spacer having the form of a sheet and a hot melt adhesive on both sides of the spacer
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