{HEAD ~ Each package} encapsulates, for example {TAIL ~ a semiconductor chip} containing an integrated circuit, which for example may be a memory 
encapsulates
{ HEAD ~ Each package } encapsulates , for example { TAIL ~ a semiconductor chip } containing an integrated circuit , which for example may be a memory
HEAD HEAD HEAD HEAD HEAD HEAD REL OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH