The aqueous dispersion for CMP according to the invention has an excellent balance between chemical etching and mechanical polishing ability, and when used for polishing of polishing surfaces with {TAIL ~ metal layers} it can give highly precise polished surfaces with no corrosion, dishing or keyholes on {HEAD ~ the polished surfaces} 
The aqueous dispersion for CMP according to the invention has an excellent balance between chemical etching and mechanical polishing ability , and when used for polishing of polishing surfaces with { TAIL ~ metal layers } it can give highly precise polished surfaces with no corrosion , dishing or keyholes on { HEAD ~ the polished surfaces }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD