After that, the semiconductor wafer is cut into semiconductor chips by dicing along {HEAD ~ the grooves} of {TAIL ~ the protective sheet} 
of
After that , the semiconductor wafer is cut into semiconductor chips by dicing along { HEAD ~ the grooves } of { TAIL ~ the protective sheet }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL