{HEAD ~ The top} and bottom of the substrate 26 are covered with a layer of conductive material , and {TAIL ~ the conductive material} is deposited in the holes, covering the surfaces of the substrate in the hole  
{ HEAD ~ The top } and bottom of the substrate 26 are covered with a layer of conductive material , and { TAIL ~ the conductive material } is deposited in the holes , covering the surfaces of the substrate in the hole
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH