Each package encapsulates, for example {HEAD ~ a semiconductor chip} containing {TAIL ~ an integrated circuit}, which for example may be a memory 
containing
Each package encapsulates , for example { HEAD ~ a semiconductor chip } containing { TAIL ~ an integrated circuit } , which for example may be a memory
OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH