The present invention provides a method and an apparatus for increasing a deposition rate of {HEAD ~ dielectric films} deposited on {TAIL ~ a substrate} at a given temperature while providing good step coverage and gap fill properties 
deposited on
The present invention provides a method and an apparatus for increasing a deposition rate of { HEAD ~ dielectric films } deposited on { TAIL ~ a substrate } at a given temperature while providing good step coverage and gap fill properties
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH