{HEAD ~ A solvent} of a resist solution is dropped from a solvent supply nozzle onto {TAIL ~ the surface} of a semiconductor wafer held by a spin chuck 
is dropped onto
{ HEAD ~ A solvent } of a resist solution is dropped from a solvent supply nozzle onto { TAIL ~ the surface } of a semiconductor wafer held by a spin chuck
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH REL REL OTH OTH OTH OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH