By reflowing the solder paste at {HEAD ~ a temperature} lower than {TAIL ~ the melting temperature} of the solder bumps, the paste can wet to and blend with the solder bumps while not causing the solder bumps to reflow 
lower than
By reflowing the solder paste at { HEAD ~ a temperature } lower than { TAIL ~ the melting temperature } of the solder bumps , the paste can wet to and blend with the solder bumps while not causing the solder bumps to reflow
OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH