{HEAD ~ A socket} for {TAIL ~ a solder bumped member} is obtained by first providing a substrate having metalized pads corresponding to the solder bumps of the member 
for
{ HEAD ~ A socket } for { TAIL ~ a solder bumped member } is obtained by first providing a substrate having metalized pads corresponding to the solder bumps of the member
HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH