{HEAD ~ The present invention} resides in {TAIL ~ an integrated circuit packaging construction} for mounting and interconnecting IC chips and IC chip packages with a multilayer printed circuit board and for interconnecting IC chips with minimized interconnection lead lengths between the IC chips 
resides in
{ HEAD ~ The present invention } resides in { TAIL ~ an integrated circuit packaging construction } for mounting and interconnecting IC chips and IC chip packages with a multilayer printed circuit board and for interconnecting IC chips with minimized interconnection lead lengths between the IC chips
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