A method of manufacturing {TAIL ~ a semiconductor device} 6, wherein {HEAD ~ the semiconductor die} is a flip chip 
A method of manufacturing { TAIL ~ a semiconductor device } 6 , wherein { HEAD ~ the semiconductor die } is a flip chip
OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH