A film of the resist solution is formed with {HEAD ~ a uniform film thickness} to {TAIL ~ the edge} of the semiconductor wafer W 
to
A film of the resist solution is formed with { HEAD ~ a uniform film thickness } to { TAIL ~ the edge } of the semiconductor wafer W
OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH