In another embodiment of the invention, {HEAD ~ the repulsive force} between any two such conductive materials allows {TAIL ~ the filling} of space between them by a third material that can be electronically insulating 
allows
In another embodiment of the invention , { HEAD ~ the repulsive force } between any two such conductive materials allows { TAIL ~ the filling } of space between them by a third material that can be electronically insulating
OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH