{HEAD ~ The present invention} utilizes {TAIL ~ a nanoindenter type device} obtaining mechanical properties as a function of displacement depth and applied load into the bond pad surface to accurately predict electrical property stability of the entire substrate or sample under test 
utilizes
{ HEAD ~ The present invention } utilizes { TAIL ~ a nanoindenter type device } obtaining mechanical properties as a function of displacement depth and applied load into the bond pad surface to accurately predict electrical property stability of the entire substrate or sample under test
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