{HEAD ~ This invention} relates generally to electronic packaging leads, and more particularly to a multi path feed thru lead providing a plurality of {TAIL ~ discrete conductive pathways} on a single substrate member 
{ HEAD ~ This invention } relates generally to electronic packaging leads , and more particularly to a multi path feed thru lead providing a plurality of { TAIL ~ discrete conductive pathways } on a single substrate member
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH