After that, the substrate 2 and {TAIL ~ the composite bonding layer} 3 are pressurized at the temperature between 60° C. to 500° C. to form {HEAD ~ a composite alloyed bonding layer} 4 
After that , the substrate 2 and { TAIL ~ the composite bonding layer } 3 are pressurized at the temperature between 60 ° C. to 500 ° C. to form { HEAD ~ a composite alloyed bonding layer } 4
OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH