{HEAD ~ A processing fixture} and method of fabricating micromechanical devices, such as digital micromirror devices, that allows {TAIL ~ fragile structures} on wafer 22 to be protected from debris during the saw operation and subsequent cleaning operations 
allows
{ HEAD ~ A processing fixture } and method of fabricating micromechanical devices , such as digital micromirror devices , that allows { TAIL ~ fragile structures } on wafer 22 to be protected from debris during the saw operation and subsequent cleaning operations
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