The present invention surmounts the inherent disadvantages of prior art flat packs by providing a multi path feed thru lead that efficiently and economically permits {HEAD ~ an increase} in {TAIL ~ the conductive pathway density} without a significant increase in the overall size of the lead member 
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The present invention surmounts the inherent disadvantages of prior art flat packs by providing a multi path feed thru lead that efficiently and economically permits { HEAD ~ an increase } in { TAIL ~ the conductive pathway density } without a significant increase in the overall size of the lead member
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH