A semiconductor device comprising a semiconductor element; a substrate; and a hot melt adhesive sheet bonding the semiconductor element to {HEAD ~ the substrate}, wherein {TAIL ~ the hot melt} adhesive sheet comprises a spacer having the form of a sheet and a hot melt adhesive on both sides of the spacer 
wherein
A semiconductor device comprising a semiconductor element ; a substrate ; and a hot melt adhesive sheet bonding the semiconductor element to { HEAD ~ the substrate } , wherein { TAIL ~ the hot melt } adhesive sheet comprises a spacer having the form of a sheet and a hot melt adhesive on both sides of the spacer
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH