The edge metallization of the present invention may be fabricated by drilling {HEAD ~ holes} into a wafer of ferrite substrate 26, at {TAIL ~ the edge metallization locations} 36 
The edge metallization of the present invention may be fabricated by drilling { HEAD ~ holes } into a wafer of ferrite substrate 26 , at { TAIL ~ the edge metallization locations } 36
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH