The heat sink is mounted on the solid state switching device such that a first portion of the heat sink is {HEAD ~ thermal communication} with {TAIL ~ the solid state switching device} and a second portion of the heat sink is in thermal communication with an exposed portion of a trace on the circuit board 
with
The heat sink is mounted on the solid state switching device such that a first portion of the heat sink is { HEAD ~ thermal communication } with { TAIL ~ the solid state switching device } and a second portion of the heat sink is in thermal communication with an exposed portion of a trace on the circuit board
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH