{HEAD ~ The method} further includes maintaining a first un etched portion of the substrate between the first dry etching mask after the first dry etching process and removing {TAIL ~ the first dry etching mask} in a mask removing process after the first dry etching process 
includes removing
{ HEAD ~ The method } further includes maintaining a first un etched portion of the substrate between the first dry etching mask after the first dry etching process and removing { TAIL ~ the first dry etching mask } in a mask removing process after the first dry etching process
HEAD HEAD HEAD HEAD HEAD HEAD OTH REL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH