{HEAD ~ The Si forming solution} may be coated on {TAIL ~ a substrate} and a solvent in the Si forming solution may be coated on the substrate 
coated on
{ HEAD ~ The Si forming solution } may be coated on { TAIL ~ a substrate } and a solvent in the Si forming solution may be coated on the substrate
HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH