a composite substrate formed by bonding {HEAD ~ the main surface} of {TAIL ~ a first semiconductor substrate} and the main surface of a second semiconductor substrate together with an insulation film interposed therebetween 
of
a composite substrate formed by bonding { HEAD ~ the main surface } of { TAIL ~ a first semiconductor substrate } and the main surface of a second semiconductor substrate together with an insulation film interposed therebetween
OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH