That is, the object of the present invention is to provide an aqueous dispersion for CMP with a high removal rate that allows {HEAD ~ efficient polishing}, while also producing minimal excessive etching, thinning, dishing, keyholes and scratches, to give finished surfaces with {TAIL ~ satisfactory high precision} 
That is , the object of the present invention is to provide an aqueous dispersion for CMP with a high removal rate that allows { HEAD ~ efficient polishing } , while also producing minimal excessive etching , thinning , dishing , keyholes and scratches , to give finished surfaces with { TAIL ~ satisfactory high precision }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL