FIG 1 is a top view of {HEAD ~ an individual chip} including bonding {TAIL ~ pad structures} of the present invention 
including bonding
FIG 1 is a top view of { HEAD ~ an individual chip } including bonding { TAIL ~ pad structures } of the present invention
OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH