In {TAIL ~ yet another aspect} of the invention the solder paste is applied directly to {HEAD ~ the substrate} with a squeegee 
In { TAIL ~ yet another aspect } of the invention the solder paste is applied directly to { HEAD ~ the substrate } with a squeegee
OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH