In a semiconductor device such as a high frequency power amplifier module, a plurality of amplifying means are formed on a semiconductor chip which is mounted on a main surface of a wiring substrate, and electrodes of the semiconductor chip are electrically connected by wires to {HEAD ~ electrodes} of {TAIL ~ the wiring substrate} 
of
In a semiconductor device such as a high frequency power amplifier module , a plurality of amplifying means are formed on a semiconductor chip which is mounted on a main surface of a wiring substrate , and electrodes of the semiconductor chip are electrically connected by wires to { HEAD ~ electrodes } of { TAIL ~ the wiring substrate }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL