According to the invention, {TAIL ~ vibrational damping} of the component 12 is achieved by the application of a material 14 to {HEAD ~ the surface} of the circuit board 10 opposite the component 12 
According to the invention , { TAIL ~ vibrational damping } of the component 12 is achieved by the application of a material 14 to { HEAD ~ the surface } of the circuit board 10 opposite the component 12
OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH