For this reason, the resist pattern thickening material of the present invention can also be preferably used in forming {HEAD ~ resist patterns} such as {TAIL ~ a lines} & spaces pattern on an interconnection layer of a LOGIC LSI where not only a contact hole pattern but also various sizes of thickened resist patterns are utilized 
such as
For this reason , the resist pattern thickening material of the present invention can also be preferably used in forming { HEAD ~ resist patterns } such as { TAIL ~ a lines } & spaces pattern on an interconnection layer of a LOGIC LSI where not only a contact hole pattern but also various sizes of thickened resist patterns are utilized
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH