Thus, a semiconductor device comprising {HEAD ~ copper wiring} of high reliability and with {TAIL ~ less wiring delay time} can be provided 
with
Thus , a semiconductor device comprising { HEAD ~ copper wiring } of high reliability and with { TAIL ~ less wiring delay time } can be provided
OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH