In order to have a contact with {TAIL ~ a terminal} on the semiconductor die or other bonding pad site, {HEAD ~ windows} are formed in the insulative layer 
In order to have a contact with { TAIL ~ a terminal } on the semiconductor die or other bonding pad site , { HEAD ~ windows } are formed in the insulative layer
OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH