In addition, the conductive particles exhibit enhanced conducting properties without being ruptured when interposed and compressed between connection substrates, thereby achieving {HEAD ~ a sufficient contact area} between the particles and {TAIL ~ the connection} substrates 
between
In addition , the conductive particles exhibit enhanced conducting properties without being ruptured when interposed and compressed between connection substrates , thereby achieving { HEAD ~ a sufficient contact area } between the particles and { TAIL ~ the connection } substrates
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH