{HEAD ~ The present invention} is aimed at overcoming {TAIL ~ the aforementioned problems} of the prior art, and it provides an aqueous dispersion for CMP that has an excellent balance between chemical etching and mechanical polishing ability 
is aimed at overcoming
{ HEAD ~ The present invention } is aimed at overcoming { TAIL ~ the aforementioned problems } of the prior art , and it provides an aqueous dispersion for CMP that has an excellent balance between chemical etching and mechanical polishing ability
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