A combined solder alloy layer composed of a combination of intermetallic compounds, one of tin and {TAIL ~ the solder alloy} making {HEAD ~ layer}, and one of tin and the UBM layer, is formed by heating and melting 
A combined solder alloy layer composed of a combination of intermetallic compounds , one of tin and { TAIL ~ the solder alloy } making { HEAD ~ layer } , and one of tin and the UBM layer , is formed by heating and melting
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH