A preferred embodiment of the present invention includes depositing a thin film having a uniform film thickness distribution by taking advantage of {HEAD ~ the relation} between {TAIL ~ the plasma density} and the DC bias voltage described above 
between
A preferred embodiment of the present invention includes depositing a thin film having a uniform film thickness distribution by taking advantage of { HEAD ~ the relation } between { TAIL ~ the plasma density } and the DC bias voltage described above
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH