With a semiconductor apparatus package of example embodiments of the technology disclosed herein and a method of producing the semiconductor apparatus package, {HEAD ~ the semiconductor apparatus package} includes {TAIL ~ a circuit board} and a semiconductor device sealed with sealing resin 
includes
With a semiconductor apparatus package of example embodiments of the technology disclosed herein and a method of producing the semiconductor apparatus package , { HEAD ~ the semiconductor apparatus package } includes { TAIL ~ a circuit board } and a semiconductor device sealed with sealing resin
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH