The system 1, where in {TAIL ~ the pad} is used in {HEAD ~ chemical mechanical polishing} of a semiconductor wafer 
The system 1 , where in { TAIL ~ the pad } is used in { HEAD ~ chemical mechanical polishing } of a semiconductor wafer
OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH