In an exemplary implementation of one embodiment of {HEAD ~ the present invention}, an optical scanning tool for automated detection of the copper metal particles was used to determine the number of copper particles present following an exemplary high current electrodeposition process and following the implementation of one embodiment of {TAIL ~ the present invention} 
In an exemplary implementation of one embodiment of { HEAD ~ the present invention } , an optical scanning tool for automated detection of the copper metal particles was used to determine the number of copper particles present following an exemplary high current electrodeposition process and following the implementation of one embodiment of { TAIL ~ the present invention }
OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL