Furthermore, it is preferred to extend {HEAD ~ the conductive resin composition} filling {TAIL ~ the through hole} through the interlayer adhesive surface in the form of a projection of the conductive resin composition 
filling
Furthermore , it is preferred to extend { HEAD ~ the conductive resin composition } filling { TAIL ~ the through hole } through the interlayer adhesive surface in the form of a projection of the conductive resin composition
OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH