The top and bottom of {HEAD ~ the substrate} 26 are covered with a layer of conductive material , and the conductive material is deposited in the holes, covering the surfaces of the substrate in {TAIL ~ the hole}  
The top and bottom of { HEAD ~ the substrate } 26 are covered with a layer of conductive material , and the conductive material is deposited in the holes , covering the surfaces of the substrate in { TAIL ~ the hole }
OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH