According to the invention, vibrational damping of the component 12 is achieved by the application of a material 14 to the surface of {HEAD ~ the circuit board} 10 opposite {TAIL ~ the component} 12 
opposite
According to the invention , vibrational damping of the component 12 is achieved by the application of a material 14 to the surface of { HEAD ~ the circuit board } 10 opposite { TAIL ~ the component } 12
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH REL TAIL TAIL TAIL TAIL TAIL TAIL OTH