An array of {HEAD ~ contact pads} on {TAIL ~ the package substrate} are provided by a conductive material 
on
An array of { HEAD ~ contact pads } on { TAIL ~ the package substrate } are provided by a conductive material
OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH