Also in accordance with this invention there is provided an integrated circuit package including a leadless chip carrier having a plurality of {HEAD ~ elctrically conductive pads} near {TAIL ~ the periphery} of one of its surfaces 
near
Also in accordance with this invention there is provided an integrated circuit package including a leadless chip carrier having a plurality of { HEAD ~ elctrically conductive pads } near { TAIL ~ the periphery } of one of its surfaces
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH