forming a plurality of metalized conductive pathways on {TAIL ~ said intermediate portion} and said first and second plurality of bonding pads of said first and second end portions, respectively, of said insulative substrate, adjacent ones of said metalized conductive pathways being defined and separated by {HEAD ~ respective exposed strips} of said insulative substrate; and 
forming a plurality of metalized conductive pathways on { TAIL ~ said intermediate portion } and said first and second plurality of bonding pads of said first and second end portions , respectively , of said insulative substrate , adjacent ones of said metalized conductive pathways being defined and separated by { HEAD ~ respective exposed strips } of said insulative substrate ; and
OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH