More particularly, {HEAD ~ the present invention} applies industrially to dry {TAIL ~ plasma} etching processes for etching multiple layers of semiconductor material formed on a semiconductor wafer in order to produce vertical sidewall structures 
applies industrially to dry
More particularly , { HEAD ~ the present invention } applies industrially to dry { TAIL ~ plasma } etching processes for etching multiple layers of semiconductor material formed on a semiconductor wafer in order to produce vertical sidewall structures
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