For this purpose, the material preferably contacts the entire surface of {HEAD ~ the component} facing {TAIL ~ a near surface region} of the circuit board and bonds the component surface to the surface region 
facing
For this purpose , the material preferably contacts the entire surface of { HEAD ~ the component } facing { TAIL ~ a near surface region } of the circuit board and bonds the component surface to the surface region
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH