{HEAD ~ This invention} relates to semiconductor die packaging and more specifically relates to {TAIL ~ a novel five layer tape} which enables the mounting and interconnection of plural semiconductor die relative to one another and to a lead frame support 
specifically relates to
{ HEAD ~ This invention } relates to semiconductor die packaging and more specifically relates to { TAIL ~ a novel five layer tape } which enables the mounting and interconnection of plural semiconductor die relative to one another and to a lead frame support
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