A pattern of {HEAD ~ the damage layer} is defined by photolithography, and {TAIL ~ the damage layer} having a depth of about 20 to 5,000 Å is formed using CF4, CHF3, or Ar gas at a pressure of 900 mTorr or less, or using Cl2 or HBr 
A pattern of { HEAD ~ the damage layer } is defined by photolithography , and { TAIL ~ the damage layer } having a depth of about 20 to 5,000 Å is formed using CF4 , CHF3 , or Ar gas at a pressure of 900 mTorr or less , or using Cl2 or HBr
OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH