An IC to be tested having solder bumps is mounted on {HEAD ~ an IC socket} mounted on {TAIL ~ a test board} 
mounted on
An IC to be tested having solder bumps is mounted on { HEAD ~ an IC socket } mounted on { TAIL ~ a test board }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL