{HEAD ~ Elimination} of {TAIL ~ the ceramic chip package} also reduces the conventional multiple interconnections between each chip contact area and the multilayer circuit board to just one interconnection, resulting in a higher quality electrical connection 
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{ HEAD ~ Elimination } of { TAIL ~ the ceramic chip package } also reduces the conventional multiple interconnections between each chip contact area and the multilayer circuit board to just one interconnection , resulting in a higher quality electrical connection
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