The invention further relates to a method for mounting {HEAD ~ the removed semiconductor chips} on {TAIL ~ a substrate} 
on
The invention further relates to a method for mounting { HEAD ~ the removed semiconductor chips } on { TAIL ~ a substrate }
OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL