The method 3 further comprising {HEAD ~ the step} of using a second probe to contact the bond pad proximate {TAIL ~ the first location} to measure an electrical property 
The method 3 further comprising { HEAD ~ the step } of using a second probe to contact the bond pad proximate { TAIL ~ the first location } to measure an electrical property
OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH