This additional electrical measurement is correlated with {HEAD ~ the mechanical property measurements} to accurately predict {TAIL ~ electrical property stability} of the entire conductive substrate, preferably by predicting the presence of an unwanted material surface layer 
to accurately predict
This additional electrical measurement is correlated with { HEAD ~ the mechanical property measurements } to accurately predict { TAIL ~ electrical property stability } of the entire conductive substrate , preferably by predicting the presence of an unwanted material surface layer
OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH