A method for bonding a semiconductor structure with a substrate and {HEAD ~ a high efficiency photonic device} manufactured by using {TAIL ~ the same method} are disclosed 
manufactured by using
A method for bonding a semiconductor structure with a substrate and { HEAD ~ a high efficiency photonic device } manufactured by using { TAIL ~ the same method } are disclosed
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH