{HEAD ~ A resin sealing mold} 1, wherein said semiconductor chip is mounted on a die pad of a lead flame and {TAIL ~ a mirror face region} is formed in said external lead placing regions and a region for placing the die pad 
wherein
{ HEAD ~ A resin sealing mold } 1 , wherein said semiconductor chip is mounted on a die pad of a lead flame and { TAIL ~ a mirror face region } is formed in said external lead placing regions and a region for placing the die pad
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