After that, the substrate 2 and the composite bonding layer 3 are pressurized at {HEAD ~ the temperature} between 60° C. to 500° C. to form {TAIL ~ a composite alloyed bonding layer} 4 
to form
After that , the substrate 2 and the composite bonding layer 3 are pressurized at { HEAD ~ the temperature } between 60 ° C. to 500 ° C. to form { TAIL ~ a composite alloyed bonding layer } 4
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH