A condition without using Ar as plasma gas is applied to processing of {HEAD ~ an organic anti reflection coating}, which suppresses a spatter effect and decreases {TAIL ~ the cleavage} of C—H and OC—O bonds in a resist 
decreases
A condition without using Ar as plasma gas is applied to processing of { HEAD ~ an organic anti reflection coating } , which suppresses a spatter effect and decreases { TAIL ~ the cleavage } of C — H and OC — O bonds in a resist
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH