As shown, resin 42 encapsulates semiconductor die 15, {TAIL ~ lead frame pad} 24, {HEAD ~ wire bonding connections} 32, and a portion of first leads 14 
As shown , resin 42 encapsulates semiconductor die 15 , { TAIL ~ lead frame pad } 24 , { HEAD ~ wire bonding connections } 32 , and a portion of first leads 14
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH