A further object is to provide an improved method and apparatus for applying {HEAD ~ solder paste} to thin, brittle substrates in {TAIL ~ a way} that avoids subjecting the substrates to excessive bending and shear stresses that will cause the substrates .to break 
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A further object is to provide an improved method and apparatus for applying { HEAD ~ solder paste } to thin , brittle substrates in { TAIL ~ a way } that avoids subjecting the substrates to excessive bending and shear stresses that will cause the substrates .to break
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