{HEAD ~ The at least one metallization line} having {TAIL ~ a Lop surface and transition edges} leading to the semiconductor substrate, and the metallization line preferably has a first thickness measured between the semiconductor substrate surface and the top surface of the at least one metallization line 
having
{ HEAD ~ The at least one metallization line } having { TAIL ~ a Lop surface and transition edges } leading to the semiconductor substrate , and the metallization line preferably has a first thickness measured between the semiconductor substrate surface and the top surface of the at least one metallization line
HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH