A socket for {TAIL ~ a solder bumped member} is obtained by first providing {HEAD ~ a substrate} having metalized pads corresponding to the solder bumps of the member 
A socket for { TAIL ~ a solder bumped member } is obtained by first providing { HEAD ~ a substrate } having metalized pads corresponding to the solder bumps of the member
OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH