According to the present invention, a polishing pad that is useful for polishing a material to be polished such as {TAIL ~ a semiconductor wafer} at good precision and high polishing efficiency, and {HEAD ~ a cushion} for a polishing pad used for producing the polishing pad 
According to the present invention , a polishing pad that is useful for polishing a material to be polished such as { TAIL ~ a semiconductor wafer } at good precision and high polishing efficiency , and { HEAD ~ a cushion } for a polishing pad used for producing the polishing pad
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH