{TAIL ~ The connector elements} are disposed in selected openings in the insulating board and compressed into contact with {HEAD ~ the contact areas} on the IC chips and IC chip packages 
{ TAIL ~ The connector elements } are disposed in selected openings in the insulating board and compressed into contact with { HEAD ~ the contact areas } on the IC chips and IC chip packages
TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH