{HEAD ~ The IC chips} and IC chip packages are mounted and interconnected using {TAIL ~ an insulating board} having openings through it, and a number of connector elements in the form of compressible wads of conductive wire 
mounted using
{ HEAD ~ The IC chips } and IC chip packages are mounted and interconnected using { TAIL ~ an insulating board } having openings through it , and a number of connector elements in the form of compressible wads of conductive wire
HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH REL OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH