In {HEAD ~ an embodiment}, the diode 104, {TAIL ~ the backsheet} 102, the interconnects 106 and the heat spreader 110 are mounted above a substrate 116, such as a glass substrate, via an encapsulant 118, as depicted in FIG 1 
In { HEAD ~ an embodiment } , the diode 104 , { TAIL ~ the backsheet } 102 , the interconnects 106 and the heat spreader 110 are mounted above a substrate 116 , such as a glass substrate , via an encapsulant 118 , as depicted in FIG 1
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