{HEAD ~ An object} of the present invention is to provide a polishing pad that is excellent in flatness of a surface to be polished and evenness of a film thickness after polishing and also excellent in a polishing rate, and can achieve excellent polishing to a material to be polished such as an insulating film, a metallic film, etc, and a cushion using for {TAIL ~ the polishing pad} 
{ HEAD ~ An object } of the present invention is to provide a polishing pad that is excellent in flatness of a surface to be polished and evenness of a film thickness after polishing and also excellent in a polishing rate , and can achieve excellent polishing to a material to be polished such as an insulating film , a metallic film , etc , and a cushion using for { TAIL ~ the polishing pad }
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