The method 1, wherein the bonding finger is {HEAD ~ a portion} of the interconnection pattern electrically connected to {TAIL ~ a bonding pad} of the chip 
electrically connected to
The method 1 , wherein the bonding finger is { HEAD ~ a portion } of the interconnection pattern electrically connected to { TAIL ~ a bonding pad } of the chip
OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH