A ceramic slurry is applied onto a carrier film to form the thermistor film layer, a metal powder containing paste is applied onto the thermistor film layer to form {HEAD ~ the metal base material}, and {TAIL ~ further an electrode paste} is applied onto the metal base material to form the split electrodes 
A ceramic slurry is applied onto a carrier film to form the thermistor film layer , a metal powder containing paste is applied onto the thermistor film layer to form { HEAD ~ the metal base material } , and { TAIL ~ further an electrode paste } is applied onto the metal base material to form the split electrodes
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH