The present invention utilizes a nanoindenter type device obtaining mechanical properties as a function of displacement depth and applied load into the bond pad surface to accurately predict electrical property stability of {HEAD ~ the entire substrate} or sample under {TAIL ~ test} 
The present invention utilizes a nanoindenter type device obtaining mechanical properties as a function of displacement depth and applied load into the bond pad surface to accurately predict electrical property stability of { HEAD ~ the entire substrate } or sample under { TAIL ~ test }
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