At least one embodiment provides {TAIL ~ a silicon chip package} for {HEAD ~ a circuit board assembly} having a package substrate with a silicon chip 
At least one embodiment provides { TAIL ~ a silicon chip package } for { HEAD ~ a circuit board assembly } having a package substrate with a silicon chip
OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH