{HEAD ~ Embodiments} of the invention relate to {TAIL ~ contact pads} for silicon chip packages for attachment to circuit boards 
relate to
{ HEAD ~ Embodiments } of the invention relate to { TAIL ~ contact pads } for silicon chip packages for attachment to circuit boards
HEAD HEAD HEAD HEAD HEAD OTH OTH OTH REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH