In more detail, as shown in FIG 6a, a new RCC 68 is stacked on the board manufactured by the process of FIGS 4a to 4 f, and then the structure is heated and pressed Next, as shown in FIG 6b, {HEAD ~ the YAG laser} is irradiated to {TAIL ~ the board} with RCC stacked thereon to form the via hole 
is irradiated to
In more detail , as shown in FIG 6a , a new RCC 68 is stacked on the board manufactured by the process of FIGS 4a to 4 f , and then the structure is heated and pressed Next , as shown in FIG 6b , { HEAD ~ the YAG laser } is irradiated to { TAIL ~ the board } with RCC stacked thereon to form the via hole
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