Referring to FIGS 1 3, a memory module assembly in accordance with a preferred embodiment of the present invention comprises a heat sink 10, {HEAD ~ a clip} 20 mounting {TAIL ~ the heat sink} 10 onto a printed circuit board 30 with a heat generating electronic component 32 mounted on a top surface thereof 
mounting
Referring to FIGS 1 3 , a memory module assembly in accordance with a preferred embodiment of the present invention comprises a heat sink 10 , { HEAD ~ a clip } 20 mounting { TAIL ~ the heat sink } 10 onto a printed circuit board 30 with a heat generating electronic component 32 mounted on a top surface thereof
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH