The present invention relates generally to {HEAD ~ a method} and apparatus for {TAIL ~ forming substrates} used in the electronic circuit industry 
for
The present invention relates generally to { HEAD ~ a method } and apparatus for { TAIL ~ forming substrates } used in the electronic circuit industry
OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH