The present invention utilizes a nanoindenter type device obtaining mechanical properties as a function of displacement depth and applied load into the bond pad surface to accurately predict {HEAD ~ electrical property stability} of the entire substrate or {TAIL ~ sample} under test 
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The present invention utilizes a nanoindenter type device obtaining mechanical properties as a function of displacement depth and applied load into the bond pad surface to accurately predict { HEAD ~ electrical property stability } of the entire substrate or { TAIL ~ sample } under test
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