In view of such aspects, it is {HEAD ~ an object} of {TAIL ~ the present invention} to provide methods of manufacturing a lead frame and an integrated circuit package which prevent a solder resist film from being peeled off and can make sizes of projecting electrodes uniform 
of
In view of such aspects , it is { HEAD ~ an object } of { TAIL ~ the present invention } to provide methods of manufacturing a lead frame and an integrated circuit package which prevent a solder resist film from being peeled off and can make sizes of projecting electrodes uniform
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