The apparatus of the present invention preferably includes {HEAD ~ first and second vacuum processing chambers} , wherein {TAIL ~ the first chamber} performs the plasma cleaning of the workpiece according to the method of the invention, and the second chamber performs an additional process step, e.g., depositing a metal 
wherein
The apparatus of the present invention preferably includes { HEAD ~ first and second vacuum processing chambers } , wherein { TAIL ~ the first chamber } performs the plasma cleaning of the workpiece according to the method of the invention , and the second chamber performs an additional process step , e.g. , depositing a metal
OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH