A method of making an IC device includes providing a stack of leadframe sheets each including a plurality of {HEAD ~ leadframes} and {TAIL ~ an interleaf member} interposed between adjacent ones of the leadframe sheets 
A method of making an IC device includes providing a stack of leadframe sheets each including a plurality of { HEAD ~ leadframes } and { TAIL ~ an interleaf member } interposed between adjacent ones of the leadframe sheets
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH