{HEAD ~ The present invention} relates to a substrate processing method; and, more particularly, to {TAIL ~ a substrate processing method} for reducing a width of an opening formed on a layer used as a mask 
relates to
{ HEAD ~ The present invention } relates to a substrate processing method ; and , more particularly , to { TAIL ~ a substrate processing method } for reducing a width of an opening formed on a layer used as a mask
HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH