FIGS 20 through 23 show {HEAD ~ a seventh embodiment} wherein each semiconductor device is made to have four leads by using {TAIL ~ a modified leadframe} 31 
FIGS 20 through 23 show { HEAD ~ a seventh embodiment } wherein each semiconductor device is made to have four leads by using { TAIL ~ a modified leadframe } 31
OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH