As to the performance of {HEAD ~ the camera devices} that are obtained by separating {TAIL ~ the wafer scale package}, this will be referred to in FIGS 7 a to 7 d 
are obtained by separating
As to the performance of { HEAD ~ the camera devices } that are obtained by separating { TAIL ~ the wafer scale package } , this will be referred to in FIGS 7 a to 7 d
OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH REL REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH