The droplet ejection head 1 further comprising a third bonding film between the other surface of the sealing plate and the piezoelectric means, wherein {HEAD ~ the third bonding film} is constituted in {TAIL ~ the same manner} as the first bonding film, and the piezoelectric means is bonded to the sealing plate through the third bonding film 
is constituted in
The droplet ejection head 1 further comprising a third bonding film between the other surface of the sealing plate and the piezoelectric means , wherein { HEAD ~ the third bonding film } is constituted in { TAIL ~ the same manner } as the first bonding film , and the piezoelectric means is bonded to the sealing plate through the third bonding film
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH