A further object is to provide an improved method and {HEAD ~ apparatus} for applying {TAIL ~ solder paste} to thin, brittle substrates in a way that avoids subjecting the substrates to excessive bending and shear stresses that will cause the substrates .to break 
for applying
A further object is to provide an improved method and { HEAD ~ apparatus } for applying { TAIL ~ solder paste } to thin , brittle substrates in a way that avoids subjecting the substrates to excessive bending and shear stresses that will cause the substrates .to break
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