As shown, resin 42 encapsulates {TAIL ~ semiconductor die} 15, lead frame pad 24, wire bonding connections 32, and {HEAD ~ a portion} of first leads 14 
As shown , resin 42 encapsulates { TAIL ~ semiconductor die } 15 , lead frame pad 24 , wire bonding connections 32 , and { HEAD ~ a portion } of first leads 14
OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH