Moreover, the curing composition of the present invention can adhere, by itself or with {HEAD ~ the aid} of a primer, to a wide variety of substrates including glass, porcelain, woods, {TAIL ~ metals} and molded resin substances, and accordingly, can be used as various types of hermetically sealing compositions and adhesive compositions 
Moreover , the curing composition of the present invention can adhere , by itself or with { HEAD ~ the aid } of a primer , to a wide variety of substrates including glass , porcelain , woods , { TAIL ~ metals } and molded resin substances , and accordingly , can be used as various types of hermetically sealing compositions and adhesive compositions
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