{TAIL ~ An integrated circuit chip packaging construction} for mounting and interconnecting IC chips and IC chip packages with {HEAD ~ a multilayer printed circuit board}, without soldering, special tooling or special labor, and for interconnecting IC chips with minimized interconnection lead lengths between the IC chips, without cable harnesses or back panel wiring 
{ TAIL ~ An integrated circuit chip packaging construction } for mounting and interconnecting IC chips and IC chip packages with { HEAD ~ a multilayer printed circuit board } , without soldering , special tooling or special labor , and for interconnecting IC chips with minimized interconnection lead lengths between the IC chips , without cable harnesses or back panel wiring
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