The present invention provides a dicing tape integrated wafer back {HEAD ~ surface protective film} including: a dicing tape including a base material and a pressure sensitive adhesive layer formed on the base material; and {TAIL ~ a wafer back surface protective film} formed on the pressure sensitive adhesive layer of the dicing tape, in which the wafer back surface protective film is colored 
including
The present invention provides a dicing tape integrated wafer back { HEAD ~ surface protective film } including : a dicing tape including a base material and a pressure sensitive adhesive layer formed on the base material ; and { TAIL ~ a wafer back surface protective film } formed on the pressure sensitive adhesive layer of the dicing tape , in which the wafer back surface protective film is colored
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