{HEAD ~ A method} of forming solder bumps includes {TAIL ~ the steps} of applying a thick layer of solder resist to a substrate 
includes
{ HEAD ~ A method } of forming solder bumps includes { TAIL ~ the steps } of applying a thick layer of solder resist to a substrate
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH