The first laminate is provided over the semiconductor substrate and includes {HEAD ~ a first interlayer dielectric film} having {TAIL ~ a first mechanical strength} 
having
The first laminate is provided over the semiconductor substrate and includes { HEAD ~ a first interlayer dielectric film } having { TAIL ~ a first mechanical strength }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL