These manufacturing methods facilitate {HEAD ~ control} of the oxygen concentration in the SRO, {TAIL ~ the relative thicknesses} of the silicon oxide and silicon layers, and provides improved step coverage, thus allowing the manufacturing of high quality semiconductor devices 
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These manufacturing methods facilitate { HEAD ~ control } of the oxygen concentration in the SRO , { TAIL ~ the relative thicknesses } of the silicon oxide and silicon layers , and provides improved step coverage , thus allowing the manufacturing of high quality semiconductor devices
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