And while maintaining that slight downward pressure, the squeegee is drawn across {HEAD ~ the surface} of the crystal wafer from behind the epoxy paste 21 wherein the edge of the rubber blade sweeps or spreads {TAIL ~ the paste} along the surface and hydraulically forces some portion into slots 20, displacing air, which is forced out 
And while maintaining that slight downward pressure , the squeegee is drawn across { HEAD ~ the surface } of the crystal wafer from behind the epoxy paste 21 wherein the edge of the rubber blade sweeps or spreads { TAIL ~ the paste } along the surface and hydraulically forces some portion into slots 20 , displacing air , which is forced out
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