The present invention surmounts {TAIL ~ the inherent disadvantages} of prior art flat packs by providing a multi path feed thru lead that efficiently and economically permits an increase in the conductive pathway density without a significant increase in {HEAD ~ the overall size} of the lead member 
The present invention surmounts { TAIL ~ the inherent disadvantages } of prior art flat packs by providing a multi path feed thru lead that efficiently and economically permits an increase in the conductive pathway density without a significant increase in { HEAD ~ the overall size } of the lead member
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