Because the peripheral edge portion of {HEAD ~ the protective sheet} is provided at the inside of the peripheral edge portion of the semiconductor chip, a dicing blade does not contact {TAIL ~ the protective member} when cutting the semiconductor wafer 
Because the peripheral edge portion of { HEAD ~ the protective sheet } is provided at the inside of the peripheral edge portion of the semiconductor chip , a dicing blade does not contact { TAIL ~ the protective member } when cutting the semiconductor wafer
OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH