The apparatus 2 wherein {HEAD ~ the pitch} of the array of mounting holes in {TAIL ~ each} of two orthogonal directions is an integral submultiple of the expected minimum center to center distance of the chips arranged on the circuit board 
The apparatus 2 wherein { HEAD ~ the pitch } of the array of mounting holes in { TAIL ~ each } of two orthogonal directions is an integral submultiple of the expected minimum center to center distance of the chips arranged on the circuit board
OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH REL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH