When {HEAD ~ dry etching} is performed after {TAIL ~ wet etching}, a rinse and drying process is not necessary, so water does not present on the sidewalls of the storage nodes 
When { HEAD ~ dry etching } is performed after { TAIL ~ wet etching } , a rinse and drying process is not necessary , so water does not present on the sidewalls of the storage nodes
OTH HEAD HEAD HEAD HEAD HEAD HEAD REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH