The top and bottom of the substrate 26 are covered with a layer of conductive material , and the conductive material is deposited in the holes, covering {HEAD ~ the surfaces} of {TAIL ~ the substrate} in the hole  
The top and bottom of the substrate 26 are covered with a layer of conductive material , and the conductive material is deposited in the holes , covering { HEAD ~ the surfaces } of { TAIL ~ the substrate } in the hole
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH