Referring now to FIG 8, a lift off {HEAD ~ resist layer} 30 is formed on the layered structure T1, and side portions of {TAIL ~ the layered structure T1} not covered with the lift off resist layer 30 are removed by etching or the like 
Referring now to FIG 8 , a lift off { HEAD ~ resist layer } 30 is formed on the layered structure T1 , and side portions of { TAIL ~ the layered structure T1 } not covered with the lift off resist layer 30 are removed by etching or the like
OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH