{HEAD ~ A process} 5 which includes the further steps of removing {TAIL ~ the component} from the package and installing the component into a furnace used for processing semiconductor wafers 
{ HEAD ~ A process } 5 which includes the further steps of removing { TAIL ~ the component } from the package and installing the component into a furnace used for processing semiconductor wafers
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH