A further object is to provide an improved method and apparatus for applying solder paste to thin, brittle substrates in a way that avoids subjecting {HEAD ~ the substrates} to {TAIL ~ excessive bending and shear stresses} that will cause the substrates .to break 
A further object is to provide an improved method and apparatus for applying solder paste to thin , brittle substrates in a way that avoids subjecting { HEAD ~ the substrates } to { TAIL ~ excessive bending and shear stresses } that will cause the substrates .to break
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