The present invention relates to a curing composition including an organic polymer which has silicon containing groups having one or more hydroxyl or hydrolyzable groups bonded to the silicon atom or atoms and capable of {HEAD ~ cross} linking by forming {TAIL ~ siloxane bonds} 
The present invention relates to a curing composition including an organic polymer which has silicon containing groups having one or more hydroxyl or hydrolyzable groups bonded to the silicon atom or atoms and capable of { HEAD ~ cross } linking by forming { TAIL ~ siloxane bonds }
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