A semiconductor device wherein destruction of {TAIL ~ a sealing ring} caused by cracking of an interlayer dielectric film is difficult to occur, as well as {HEAD ~ a method} for manufacturing the semiconductor device, are provided 
A semiconductor device wherein destruction of { TAIL ~ a sealing ring } caused by cracking of an interlayer dielectric film is difficult to occur , as well as { HEAD ~ a method } for manufacturing the semiconductor device , are provided
OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH