The leads of the component are then inserted into the plated through holes so as to position the component on a first side of the circuit board , after which {HEAD ~ a material} is applied to {TAIL ~ the second side} of the circuit board so that the material flows through the second through hole , contacts the component , and bonds the component to the first side of the circuit board  
The leads of the component are then inserted into the plated through holes so as to position the component on a first side of the circuit board , after which { HEAD ~ a material } is applied to { TAIL ~ the second side } of the circuit board so that the material flows through the second through hole , contacts the component , and bonds the component to the first side of the circuit board
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