{HEAD ~ The method} comprises {TAIL ~ steps} of: providing a semiconductor structure and a substrate; forming a composite bonding layer on the semiconductor structure; and bonding the substrate with the composite bonding layer on the semiconductor structure to form a composite alloyed bonding layer 
{ HEAD ~ The method } comprises { TAIL ~ steps } of : providing a semiconductor structure and a substrate ; forming a composite bonding layer on the semiconductor structure ; and bonding the substrate with the composite bonding layer on the semiconductor structure to form a composite alloyed bonding layer
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