e) forming {HEAD ~ one or more contact openings} in said {TAIL ~ one or more lower solid insulation layers}, said low dielectric constant insulation layer, and said one or more upper solid insulation layers 
e ) forming { HEAD ~ one or more contact openings } in said { TAIL ~ one or more lower solid insulation layers } , said low dielectric constant insulation layer , and said one or more upper solid insulation layers
OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH