{HEAD ~ The present invention} relates generally to memory devices and in particular to {TAIL ~ the circuit design}, device design, and processing technology of the high speed, high density, and low power physical constructs for memory cores, IO data buffer arrays, and control blocks 
{ HEAD ~ The present invention } relates generally to memory devices and in particular to { TAIL ~ the circuit design } , device design , and processing technology of the high speed , high density , and low power physical constructs for memory cores , IO data buffer arrays , and control blocks
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