Alternatively, it is possible to apply the conductive termination material to the inside walls of the opening or {HEAD ~ cavity} formed in {TAIL ~ the LTCC dielectric tape} so as to facilitate the flow of electrical current from the electronic component to the LTCC dielectric tape 
Alternatively , it is possible to apply the conductive termination material to the inside walls of the opening or { HEAD ~ cavity } formed in { TAIL ~ the LTCC dielectric tape } so as to facilitate the flow of electrical current from the electronic component to the LTCC dielectric tape
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH