After that, the semiconductor wafer is cut into {HEAD ~ semiconductor chips} by dicing along {TAIL ~ the grooves} of the protective sheet 
After that , the semiconductor wafer is cut into { HEAD ~ semiconductor chips } by dicing along { TAIL ~ the grooves } of the protective sheet
OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH