{HEAD ~ The present invention} relates to retainer assemblies for clamping a printed circuit board between spaced surfaces within a chassis and more particularly to a retainer having reduced {TAIL ~ weight} and improved thermal conductance 
{ HEAD ~ The present invention } relates to retainer assemblies for clamping a printed circuit board between spaced surfaces within a chassis and more particularly to a retainer having reduced { TAIL ~ weight } and improved thermal conductance
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