{TAIL ~ The first face} of {HEAD ~ the secondary substrate} may include a first pattern of conductive lands formed on the first face corresponding to a plurality of conductive leads of an electronic package 
{ TAIL ~ The first face } of { HEAD ~ the secondary substrate } may include a first pattern of conductive lands formed on the first face corresponding to a plurality of conductive leads of an electronic package
TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH