The edge metallization of the present invention may be fabricated by drilling {HEAD ~ holes} into a wafer of {TAIL ~ ferrite substrate} 26, at the edge metallization locations 36 
The edge metallization of the present invention may be fabricated by drilling { HEAD ~ holes } into a wafer of { TAIL ~ ferrite substrate } 26 , at the edge metallization locations 36
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH