Embodiments of the invention include {HEAD ~ apparatuses} and methods relating to {TAIL ~ dual layer dielectric stacks} for thick metal lines of microelectronic devices 
Embodiments of the invention include { HEAD ~ apparatuses } and methods relating to { TAIL ~ dual layer dielectric stacks } for thick metal lines of microelectronic devices
OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD OTH OTH REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH