Besides, {HEAD ~ the composite bonding layer} can be formed on the substrate or formed on {TAIL ~ both the semiconductor structure} and substrate simultaneously 
Besides , { HEAD ~ the composite bonding layer } can be formed on the substrate or formed on { TAIL ~ both the semiconductor structure } and substrate simultaneously
OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH