Embodiments of the invention relate to contact pads for silicon chip packages for {HEAD ~ attachment} to {TAIL ~ circuit boards} 
Embodiments of the invention relate to contact pads for silicon chip packages for { HEAD ~ attachment } to { TAIL ~ circuit boards }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL