Electrical contacts between the IC chip contact areas and the multilayer circuit board contact areas are established by compressing {TAIL ~ the IC chip} toward the multilayer circuit board, thus compressing connector elements positioned in the openings of the insulating board against {HEAD ~ the contact areas} 
Electrical contacts between the IC chip contact areas and the multilayer circuit board contact areas are established by compressing { TAIL ~ the IC chip } toward the multilayer circuit board , thus compressing connector elements positioned in the openings of the insulating board against { HEAD ~ the contact areas }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD