A process 1, wherein the plurality of patterned linear projections provide {HEAD ~ an uneven surface} which has a center line average surface roughness Ra of 15 300 nm when scanned in a direction parallel to the patterned linear projections, a center line average surface roughness Ra of 20 600 nm when scanned in a direction perpendicular to the patterned linear projections, and {TAIL ~ an Ra/Ra ratio} of at most 0.8 
A process 1 , wherein the plurality of patterned linear projections provide { HEAD ~ an uneven surface } which has a center line average surface roughness Ra of 15 300 nm when scanned in a direction parallel to the patterned linear projections , a center line average surface roughness Ra of 20 600 nm when scanned in a direction perpendicular to the patterned linear projections , and { TAIL ~ an Ra / Ra ratio } of at most 0.8
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH REL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH