A method of manufacturing {HEAD ~ a semiconductor device} 6, wherein {TAIL ~ the semiconductor die} is a flip chip 
A method of manufacturing { HEAD ~ a semiconductor device } 6 , wherein { TAIL ~ the semiconductor die } is a flip chip
OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH