Gases, e.g., hydrogen or {TAIL ~ nitrogen} can be in the deposited films by creating a background plasma of the desired gas using either RF energy, thermionic emission, or consequential ionization of the gas passing through the arc or around {HEAD ~ the substrate} 
Gases , e.g. , hydrogen or { TAIL ~ nitrogen } can be in the deposited films by creating a background plasma of the desired gas using either RF energy , thermionic emission , or consequential ionization of the gas passing through the arc or around { HEAD ~ the substrate }
OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD