Furthermore, it is preferred to extend the conductive resin composition filling the through hole through {TAIL ~ the interlayer adhesive surface} in {HEAD ~ the form} of a projection of the conductive resin composition 
Furthermore , it is preferred to extend the conductive resin composition filling the through hole through { TAIL ~ the interlayer adhesive surface } in { HEAD ~ the form } of a projection of the conductive resin composition
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH