The flow of reactant gases is maintained and the temperature of 425° C. is maintained until {HEAD ~ a desired thickness} of borophosphosilicate glass is formed on {TAIL ~ the wafer} 
The flow of reactant gases is maintained and the temperature of 425 ° C. is maintained until { HEAD ~ a desired thickness } of borophosphosilicate glass is formed on { TAIL ~ the wafer }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL