{HEAD ~ An insulating board}, having a plurality of openings at positions corresponding to the IC chip contact areas, is interposed between {TAIL ~ the IC chip} and the multilayer circuit board 
{ HEAD ~ An insulating board } , having a plurality of openings at positions corresponding to the IC chip contact areas , is interposed between { TAIL ~ the IC chip } and the multilayer circuit board
HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH