{HEAD ~ a layer} of a first conductive metallization located between said pair of layers of the electrodisplacive material, wherein {TAIL ~ said layer} of the first conductive metallization is comprised of one of platinum, palladium and palladium/silver; and 
{ HEAD ~ a layer } of a first conductive metallization located between said pair of layers of the electrodisplacive material , wherein { TAIL ~ said layer } of the first conductive metallization is comprised of one of platinum , palladium and palladium / silver ; and
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH