The method comprises {HEAD ~ steps} of: providing a semiconductor structure and {TAIL ~ a substrate}; forming a composite bonding layer on the semiconductor structure; and bonding the substrate with the composite bonding layer on the semiconductor structure to form a composite alloyed bonding layer 
The method comprises { HEAD ~ steps } of : providing a semiconductor structure and { TAIL ~ a substrate } ; forming a composite bonding layer on the semiconductor structure ; and bonding the substrate with the composite bonding layer on the semiconductor structure to form a composite alloyed bonding layer
OTH OTH OTH HEAD HEAD HEAD HEAD HEAD REL OTH REL OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH