According to the object of the invention, {HEAD ~ a bonding pad structure} comprises {TAIL ~ a substrate} having a bonding region and a sensing region 
According to the object of the invention , { HEAD ~ a bonding pad structure } comprises { TAIL ~ a substrate } having a bonding region and a sensing region
OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH