The process comprises {HEAD ~ the steps} of applying the solution to {TAIL ~ the wafer surface} and spinning the wafer about the central axis at a spindle speed until the solution has dried 
The process comprises { HEAD ~ the steps } of applying the solution to { TAIL ~ the wafer surface } and spinning the wafer about the central axis at a spindle speed until the solution has dried
OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH