The present invention surmounts {HEAD ~ the inherent disadvantages} of {TAIL ~ prior art flat packs} by providing a multi path feed thru lead that efficiently and economically permits an increase in the conductive pathway density without a significant increase in the overall size of the lead member 
The present invention surmounts { HEAD ~ the inherent disadvantages } of { TAIL ~ prior art flat packs } by providing a multi path feed thru lead that efficiently and economically permits an increase in the conductive pathway density without a significant increase in the overall size of the lead member
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