The aqueous dispersion for CMP according to the invention has an excellent balance between chemical etching and mechanical polishing ability, and when used for polishing of polishing surfaces with {HEAD ~ metal layers} it can give highly precise polished surfaces with no corrosion, dishing or keyholes on {TAIL ~ the polished surfaces} 
The aqueous dispersion for CMP according to the invention has an excellent balance between chemical etching and mechanical polishing ability , and when used for polishing of polishing surfaces with { HEAD ~ metal layers } it can give highly precise polished surfaces with no corrosion , dishing or keyholes on { TAIL ~ the polished surfaces }
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