The multi path feed thru lead of the present invention has {TAIL ~ particular utility} in combination with microcircuit packages to increase the conductive pathway density thereof without any significant decrease in the structural integrity thereof and increase in the size and {HEAD ~ weight} thereof 
The multi path feed thru lead of the present invention has { TAIL ~ particular utility } in combination with microcircuit packages to increase the conductive pathway density thereof without any significant decrease in the structural integrity thereof and increase in the size and { HEAD ~ weight } thereof
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