Following this CVD oxide deposition step, {HEAD ~ the semiconductor device} may be polished to planarize {TAIL ~ the surface}, to the form shown in FIG 6 
Following this CVD oxide deposition step , { HEAD ~ the semiconductor device } may be polished to planarize { TAIL ~ the surface } , to the form shown in FIG 6
OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH