{TAIL ~ The present invention} provides {HEAD ~ a method} and an apparatus for increasing a deposition rate of dielectric films deposited on a substrate at a given temperature while providing good step coverage and gap fill properties 
{ TAIL ~ The present invention } provides { HEAD ~ a method } and an apparatus for increasing a deposition rate of dielectric films deposited on a substrate at a given temperature while providing good step coverage and gap fill properties
TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH