An interconnect device for connecting an electronic package, whether it be a single chip or a multi component device, to a primary substrate requiring the mating of dissimilar solder patterns includes {HEAD ~ a secondary substrate} having {TAIL ~ a first face} and a second face 
An interconnect device for connecting an electronic package , whether it be a single chip or a multi component device , to a primary substrate requiring the mating of dissimilar solder patterns includes { HEAD ~ a secondary substrate } having { TAIL ~ a first face } and a second face
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