Thus, in the semiconductor apparatus package including {HEAD ~ the circuit board}, which is exposed from {TAIL ~ the resin sealing section}, and the semiconductor device sealed on the circuit board with the sealing resin, the spread of a thin resin film onto that exposed circuit board resulting from seepage of resin sealing the semiconductor device is prevented 
Thus , in the semiconductor apparatus package including { HEAD ~ the circuit board } , which is exposed from { TAIL ~ the resin sealing section } , and the semiconductor device sealed on the circuit board with the sealing resin , the spread of a thin resin film onto that exposed circuit board resulting from seepage of resin sealing the semiconductor device is prevented
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