{HEAD ~ An integrated circuit chip packaging construction} for mounting and interconnecting IC chips and IC chip packages with a multilayer printed circuit board, without soldering, special tooling or special labor, and for interconnecting {TAIL ~ IC chips} with minimized interconnection lead lengths between the IC chips, without cable harnesses or back panel wiring 
{ HEAD ~ An integrated circuit chip packaging construction } for mounting and interconnecting IC chips and IC chip packages with a multilayer printed circuit board , without soldering , special tooling or special labor , and for interconnecting { TAIL ~ IC chips } with minimized interconnection lead lengths between the IC chips , without cable harnesses or back panel wiring
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