The method 1, wherein the bonding finger is a portion of {HEAD ~ the interconnection pattern} electrically connected to {TAIL ~ a bonding pad} of the chip 
The method 1 , wherein the bonding finger is a portion of { HEAD ~ the interconnection pattern } electrically connected to { TAIL ~ a bonding pad } of the chip
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH