Moreover, the invention relates to {HEAD ~ a semiconductor device} using {TAIL ~ the dicing tape integrated wafer} back surface protective film and a process for producing the device 
Moreover , the invention relates to { HEAD ~ a semiconductor device } using { TAIL ~ the dicing tape integrated wafer } back surface protective film and a process for producing the device
OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH