A multilayer wiring board assembly component comprises: an insulating substrate component ; a conductive layer 112 formed on one surface of said insulating substrate component 111 in {HEAD ~ the form} of {TAIL ~ an electrode pattern}; an adhesive layer 113 formed on the other surface of said insulating substrate component 111; and a conductive resin composition 115 with which is filled a through hole passing through said insulating substrate component 111, 
A multilayer wiring board assembly component comprises : an insulating substrate component ; a conductive layer 112 formed on one surface of said insulating substrate component 111 in { HEAD ~ the form } of { TAIL ~ an electrode pattern } ; an adhesive layer 113 formed on the other surface of said insulating substrate component 111 ; and a conductive resin composition 115 with which is filled a through hole passing through said insulating substrate component 111 ,
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