Conductive via 170 and conductive bump 165 are then plated within the opening, conforming to {TAIL ~ the shape} of {HEAD ~ the opening} in the resist layer 
Conductive via 170 and conductive bump 165 are then plated within the opening , conforming to { TAIL ~ the shape } of { HEAD ~ the opening } in the resist layer
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH