The region around {TAIL ~ the bumps} 8 between {HEAD ~ the semiconductor element} 1 and the circuit substrate 7 can be filled by a resin 9 
The region around { TAIL ~ the bumps } 8 between { HEAD ~ the semiconductor element } 1 and the circuit substrate 7 can be filled by a resin 9
OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH