An integrated circuit chip packaging construction for mounting and interconnecting IC chips and IC chip packages with a multilayer printed circuit board, without {HEAD ~ soldering}, special tooling or special labor, and for interconnecting IC chips with minimized interconnection lead lengths between {TAIL ~ the IC chips}, without cable harnesses or back panel wiring 
An integrated circuit chip packaging construction for mounting and interconnecting IC chips and IC chip packages with a multilayer printed circuit board , without { HEAD ~ soldering } , special tooling or special labor , and for interconnecting IC chips with minimized interconnection lead lengths between { TAIL ~ the IC chips } , without cable harnesses or back panel wiring
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