A substrate wafer processing method and {HEAD ~ apparatus} is disclosed utilizing {TAIL ~ a bowl} having a central axis, a baffle surface positioned above the inside bottom surface of the bowl and a chuck member having a top surface for supporting and spinning substrate and positionable coaxially within the bowl closely spaced from the baffle surface 
A substrate wafer processing method and { HEAD ~ apparatus } is disclosed utilizing { TAIL ~ a bowl } having a central axis , a baffle surface positioned above the inside bottom surface of the bowl and a chuck member having a top surface for supporting and spinning substrate and positionable coaxially within the bowl closely spaced from the baffle surface
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