{HEAD ~ The present invention} relates to a cushion for a polishing pad and a polishing pad using the cushion, and the polishing pad is useful for polishing {TAIL ~ a material} to be polished, for example, a semiconductor wafer and the like, at good precision and high polishing efficiency 
{ HEAD ~ The present invention } relates to a cushion for a polishing pad and a polishing pad using the cushion , and the polishing pad is useful for polishing { TAIL ~ a material } to be polished , for example , a semiconductor wafer and the like , at good precision and high polishing efficiency
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