The method 18, wherein {HEAD ~ said step} of removing portions of the cap wafer between the plurality of cavities and the back surface of the cap wafer further includes {TAIL ~ the step} of grinding the cap wafer from the back surface of the cap wafer until the back surface of the cap wafer reaches the plurality of cavities 
The method 18 , wherein { HEAD ~ said step } of removing portions of the cap wafer between the plurality of cavities and the back surface of the cap wafer further includes { TAIL ~ the step } of grinding the cap wafer from the back surface of the cap wafer until the back surface of the cap wafer reaches the plurality of cavities
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