A pattern of {TAIL ~ the damage layer} is defined by photolithography, and the damage layer having a depth of about 20 to 5,000 Å is formed using CF4, CHF3, or Ar gas at a pressure of 900 mTorr or less, or using Cl2 or {HEAD ~ HBr} 
A pattern of { TAIL ~ the damage layer } is defined by photolithography , and the damage layer having a depth of about 20 to 5,000 Å is formed using CF4 , CHF3 , or Ar gas at a pressure of 900 mTorr or less , or using Cl2 or { HEAD ~ HBr }
OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD