{HEAD ~ A method} and an apparatus for increasing a deposition rate of dielectric films deposited on a substrate for {TAIL ~ a given temperature} while providing the same with good step coverage and gap fill properties 
{ HEAD ~ A method } and an apparatus for increasing a deposition rate of dielectric films deposited on a substrate for { TAIL ~ a given temperature } while providing the same with good step coverage and gap fill properties
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH