An improved method of using an ID saw slicing machine for slicing {HEAD ~ a single crystal ingot} in a direction normal to the axis of the ingot to obtain {TAIL ~ wafers} 
An improved method of using an ID saw slicing machine for slicing { HEAD ~ a single crystal ingot } in a direction normal to the axis of the ingot to obtain { TAIL ~ wafers }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH REL REL TAIL TAIL TAIL TAIL TAIL