{HEAD ~ An electrode} is formed directly on {TAIL ~ the support board} within the opening portion, and the plating resist layer, when used, is removed 
{ HEAD ~ An electrode } is formed directly on { TAIL ~ the support board } within the opening portion , and the plating resist layer , when used , is removed
HEAD HEAD HEAD HEAD HEAD HEAD REL REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH