{TAIL ~ The IC chips} and IC chip packages are mounted and interconnected using an insulating board having openings through it, and a number of connector elements in {HEAD ~ the form} of compressible wads of conductive wire 
{ TAIL ~ The IC chips } and IC chip packages are mounted and interconnected using an insulating board having openings through it , and a number of connector elements in { HEAD ~ the form } of compressible wads of conductive wire
TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH