A method for bonding {HEAD ~ a semiconductor structure} with {TAIL ~ a substrate} and a high efficiency photonic device manufactured by using the same method are disclosed 
A method for bonding { HEAD ~ a semiconductor structure } with { TAIL ~ a substrate } and a high efficiency photonic device manufactured by using the same method are disclosed
OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH