The present invention provides a dicing tape integrated wafer back surface protective film including: a dicing tape including a base material and a pressure sensitive adhesive layer formed on the base material; and a wafer back surface protective film formed on {HEAD ~ the pressure sensitive adhesive layer} of {TAIL ~ the dicing tape}, in which the wafer back surface protective film is colored 
The present invention provides a dicing tape integrated wafer back surface protective film including : a dicing tape including a base material and a pressure sensitive adhesive layer formed on the base material ; and a wafer back surface protective film formed on { HEAD ~ the pressure sensitive adhesive layer } of { TAIL ~ the dicing tape } , in which the wafer back surface protective film is colored
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