A method for manufacturing a silicon chip package for a circuit board assembly is provided with {TAIL ~ a package substrate} having a silicon chip and {HEAD ~ an array} of contact pads provided by conductive material 
A method for manufacturing a silicon chip package for a circuit board assembly is provided with { TAIL ~ a package substrate } having a silicon chip and { HEAD ~ an array } of contact pads provided by conductive material
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH