In {HEAD ~ one preferred method} of forming {TAIL ~ the multi path feed} thru lead of the present invention, the external surface of the insulative substrate is first metalized and then selected portions of metalization are removed to form the plurality of discrete conductive pathways 
In { HEAD ~ one preferred method } of forming { TAIL ~ the multi path feed } thru lead of the present invention , the external surface of the insulative substrate is first metalized and then selected portions of metalization are removed to form the plurality of discrete conductive pathways
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