The cap wafer is aligned with the device wafer and bonded to the device wafer using {HEAD ~ a glass frit} as {TAIL ~ a bonding agent} 
The cap wafer is aligned with the device wafer and bonded to the device wafer using { HEAD ~ a glass frit } as { TAIL ~ a bonding agent }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL