{HEAD ~ A solvent} of {TAIL ~ a resist solution} is dropped from a solvent supply nozzle onto the surface of a semiconductor wafer held by a spin chuck 
{ HEAD ~ A solvent } of { TAIL ~ a resist solution } is dropped from a solvent supply nozzle onto the surface of a semiconductor wafer held by a spin chuck
HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH