The invention is an apparatus and method for cleaving {HEAD ~ a semiconductor bar} and coating the cleaved facets within {TAIL ~ a vacuum environment} 
The invention is an apparatus and method for cleaving { HEAD ~ a semiconductor bar } and coating the cleaved facets within { TAIL ~ a vacuum environment }
OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL