In one aspect of the invention a solder paste is applied to the substrate in {HEAD ~ the wells}, and {TAIL ~ the solder paste} is reflowed to form solder bumps 
In one aspect of the invention a solder paste is applied to the substrate in { HEAD ~ the wells } , and { TAIL ~ the solder paste } is reflowed to form solder bumps
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH