{TAIL ~ Semiconductor package} having {HEAD ~ grooves} formed at side flash, groove forming method, and deflashing method using semiconductor package formed with grooves 
{ TAIL ~ Semiconductor package } having { HEAD ~ grooves } formed at side flash , groove forming method , and deflashing method using semiconductor package formed with grooves
TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH