A resin sealing mold 1, wherein said semiconductor chip is mounted on {HEAD ~ a die pad} of {TAIL ~ a lead flame} and a mirror face region is formed in said external lead placing regions and a region for placing the die pad 
A resin sealing mold 1 , wherein said semiconductor chip is mounted on { HEAD ~ a die pad } of { TAIL ~ a lead flame } and a mirror face region is formed in said external lead placing regions and a region for placing the die pad
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