{HEAD ~ A semiconductor device} that includes {TAIL ~ a metal substrate} including a top surface, a bottom surface and four side surfaces, a conductive pattern insulated from the metal substrate, and a semiconductor element mounted on and electrically connected to the conductive pattern 
{ HEAD ~ A semiconductor device } that includes { TAIL ~ a metal substrate } including a top surface , a bottom surface and four side surfaces , a conductive pattern insulated from the metal substrate , and a semiconductor element mounted on and electrically connected to the conductive pattern
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