A method 4 and further including {HEAD ~ the substeps} of squeezing {TAIL ~ a solder paste} through a plurality of template holes which are aligned with said I/O pads, and partially curing said paste on said I/O pads prior to forming joints with said leads 
A method 4 and further including { HEAD ~ the substeps } of squeezing { TAIL ~ a solder paste } through a plurality of template holes which are aligned with said I / O pads , and partially curing said paste on said I / O pads prior to forming joints with said leads
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