A resin sealing mold 1, wherein {TAIL ~ said semiconductor chip} is mounted on a die pad of a lead flame and a mirror face region is formed in said external lead placing regions and {HEAD ~ a region} for placing the die pad 
A resin sealing mold 1 , wherein { TAIL ~ said semiconductor chip } is mounted on a die pad of a lead flame and a mirror face region is formed in said external lead placing regions and { HEAD ~ a region } for placing the die pad
OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH