{HEAD ~ A diameter} of the plurality of contact pins is configured to be sufficiently small for the plurality of contact pins to pierce the respective solder bumps so that an electrical connection is established by {TAIL ~ the upper end} of each of the plurality of solder bumps piercing an associated one of the solder bumps 
{ HEAD ~ A diameter } of the plurality of contact pins is configured to be sufficiently small for the plurality of contact pins to pierce the respective solder bumps so that an electrical connection is established by { TAIL ~ the upper end } of each of the plurality of solder bumps piercing an associated one of the solder bumps
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