{TAIL ~ A semiconductor package} facilitates {HEAD ~ package connection} due to different locations of input/output pads in each interlayer die depending on coding information in a multi chip package 
{ TAIL ~ A semiconductor package } facilitates { HEAD ~ package connection } due to different locations of input / output pads in each interlayer die depending on coding information in a multi chip package
TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH