In the above process, the component can be attached to the circuit board by wave soldering prior to {HEAD ~ application} of {TAIL ~ the material} 
In the above process , the component can be attached to the circuit board by wave soldering prior to { HEAD ~ application } of { TAIL ~ the material }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL