Further, when {HEAD ~ the second step} includes {TAIL ~ a step} of forming a recess portion by etching the support board and the electrode is formed to correspond to the recess portion, the electrode can be constituted by a structure of being projected from the first solder resist layer 
Further , when { HEAD ~ the second step } includes { TAIL ~ a step } of forming a recess portion by etching the support board and the electrode is formed to correspond to the recess portion , the electrode can be constituted by a structure of being projected from the first solder resist layer
OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH