The MEMS arrays include {HEAD ~ polysilicon or polysilicon germanium components} that are mechanically superior to {TAIL ~ metals} used in other MEMS applications, but that require process temperatures not compatible with conventional CMOS technologies 
The MEMS arrays include { HEAD ~ polysilicon or polysilicon germanium components } that are mechanically superior to { TAIL ~ metals } used in other MEMS applications , but that require process temperatures not compatible with conventional CMOS technologies
OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH REL REL REL REL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH