Moreover, the curing composition of the present invention can adhere, by itself or with the aid of a primer, to a wide variety of substrates including glass, porcelain, woods, metals and molded resin substances, and accordingly, can be used as {HEAD ~ various types} of hermetically sealing compositions and {TAIL ~ adhesive compositions} 
Moreover , the curing composition of the present invention can adhere , by itself or with the aid of a primer , to a wide variety of substrates including glass , porcelain , woods , metals and molded resin substances , and accordingly , can be used as { HEAD ~ various types } of hermetically sealing compositions and { TAIL ~ adhesive compositions }
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