The present invention relates to a substrate processing method; and, more particularly, to a substrate processing method for reducing a width of {HEAD ~ an opening} formed on {TAIL ~ a layer} used as a mask 
The present invention relates to a substrate processing method ; and , more particularly , to a substrate processing method for reducing a width of { HEAD ~ an opening } formed on { TAIL ~ a layer } used as a mask
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH