In the above process, the component can be attached to the circuit board by {HEAD ~ wave soldering} prior to {TAIL ~ application} of the material 
In the above process , the component can be attached to the circuit board by { HEAD ~ wave soldering } prior to { TAIL ~ application } of the material
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH