All through the FIGS 6 a to 6 d there is {HEAD ~ a silicon wafer} 211, comprising an array of SSIS dies and {TAIL ~ a covering glass layer} 231, preferable made of an IR glass 
All through the FIGS 6 a to 6 d there is { HEAD ~ a silicon wafer } 211 , comprising an array of SSIS dies and { TAIL ~ a covering glass layer } 231 , preferable made of an IR glass
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH REL OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH