These and other objects are provided according to the present invention by methods including the steps of forming {HEAD ~ a first insulating layer} on {TAIL ~ an integrated circuit substrate}, and forming a first capacitor electrode on the insulating layer opposite the substrate 
These and other objects are provided according to the present invention by methods including the steps of forming { HEAD ~ a first insulating layer } on { TAIL ~ an integrated circuit substrate } , and forming a first capacitor electrode on the insulating layer opposite the substrate
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH