The method 3 further comprising the step of using {HEAD ~ a second probe} to contact {TAIL ~ the bond pad proximate} the first location to measure an electrical property 
The method 3 further comprising the step of using { HEAD ~ a second probe } to contact { TAIL ~ the bond pad proximate } the first location to measure an electrical property
OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH