The present invention relates to conductive particles for {HEAD ~ use} in conductive adhesives, {TAIL ~ anisotropic conductive adhesive films}, conductive connection structures and the like for mounting circuit boards, and polymer particles used in the conductive particles 
The present invention relates to conductive particles for { HEAD ~ use } in conductive adhesives , { TAIL ~ anisotropic conductive adhesive films } , conductive connection structures and the like for mounting circuit boards , and polymer particles used in the conductive particles
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