An interconnect device for connecting an electronic package, whether it be a single chip or a multi component device, to {HEAD ~ a primary substrate} requiring {TAIL ~ the mating} of dissimilar solder patterns includes a secondary substrate having a first face and a second face 
An interconnect device for connecting an electronic package , whether it be a single chip or a multi component device , to { HEAD ~ a primary substrate } requiring { TAIL ~ the mating } of dissimilar solder patterns includes a secondary substrate having a first face and a second face
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