Alternatively, the semiconductor chip or the thin film interconnection module may be heated in {TAIL ~ an oven} to cause {HEAD ~ the conductors} to be disconnected 
Alternatively , the semiconductor chip or the thin film interconnection module may be heated in { TAIL ~ an oven } to cause { HEAD ~ the conductors } to be disconnected
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH