A process for forming {HEAD ~ a low dielectric constant insulation layer} on {TAIL ~ an integrated circuit structure} on a semiconductor wafer which comprises: 
A process for forming { HEAD ~ a low dielectric constant insulation layer } on { TAIL ~ an integrated circuit structure } on a semiconductor wafer which comprises :
OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH