{HEAD ~ The top} and bottom of {TAIL ~ the substrate} 26 are covered with a layer of conductive material , and the conductive material is deposited in the holes, covering the surfaces of the substrate in the hole  
{ HEAD ~ The top } and bottom of { TAIL ~ the substrate } 26 are covered with a layer of conductive material , and the conductive material is deposited in the holes , covering the surfaces of the substrate in the hole
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH