The multi path feed thru lead according to the present invention includes an insulative substrate having {HEAD ~ a predetermined geometric configuration} and includes {TAIL ~ an extended intermediate portion} and first and second end portions configured to define a plurality of bonding pads that facilitate wire bonding to the circuitry housed in the package and to external circuitry, respectively 
The multi path feed thru lead according to the present invention includes an insulative substrate having { HEAD ~ a predetermined geometric configuration } and includes { TAIL ~ an extended intermediate portion } and first and second end portions configured to define a plurality of bonding pads that facilitate wire bonding to the circuitry housed in the package and to external circuitry , respectively
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