Semiconductors 5 a and {HEAD ~ 5 b} are bonded on the flexible printed board 2 by {TAIL ~ a so called flip chip bonding method} 
Semiconductors 5 a and { HEAD ~ 5 b } are bonded on the flexible printed board 2 by { TAIL ~ a so called flip chip bonding method }
OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL REL OTH OTH OTH OTH OTH OTH REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL