In {HEAD ~ another aspect} of the present invention there is provided a semiconductor device comprising a chip region, a sealing ring region which surrounds the chip region in plan, and a dummy region which surrounds an outer periphery of {TAIL ~ the sealing ring region} in plan 
In { HEAD ~ another aspect } of the present invention there is provided a semiconductor device comprising a chip region , a sealing ring region which surrounds the chip region in plan , and a dummy region which surrounds an outer periphery of { TAIL ~ the sealing ring region } in plan
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