A method and apparatus for selectively disconnecting two electrical conductors either on the surface or below the surface of a semiconductor chip or a thin film interconnection module connecting several semiconductor chips utilizes {HEAD ~ a thin metal film} such as {TAIL ~ a silver film} that is deposited over the ends of two conductors that it may become necessary to disconnect in the future 
A method and apparatus for selectively disconnecting two electrical conductors either on the surface or below the surface of a semiconductor chip or a thin film interconnection module connecting several semiconductor chips utilizes { HEAD ~ a thin metal film } such as { TAIL ~ a silver film } that is deposited over the ends of two conductors that it may become necessary to disconnect in the future
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