In {TAIL ~ turn}, {HEAD ~ the tape} enables the manufacturer to overcome physical limitations in forming conduction paths, including permitting the connection of multiple die where the terminals of the one die are obscured by the other die 
In { TAIL ~ turn } , { HEAD ~ the tape } enables the manufacturer to overcome physical limitations in forming conduction paths , including permitting the connection of multiple die where the terminals of the one die are obscured by the other die
REL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH