{HEAD ~ A method} for fabricating a semiconductor heat spreader from {TAIL ~ a unitary metallic plate} is provided 
{ HEAD ~ A method } for fabricating a semiconductor heat spreader from { TAIL ~ a unitary metallic plate } is provided
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH