The method comprises steps of: providing a semiconductor structure and a substrate; forming a composite bonding layer on the semiconductor structure; and bonding the substrate with the composite bonding layer on {TAIL ~ the semiconductor structure} to form {HEAD ~ a composite} alloyed bonding layer 
The method comprises steps of : providing a semiconductor structure and a substrate ; forming a composite bonding layer on the semiconductor structure ; and bonding the substrate with the composite bonding layer on { TAIL ~ the semiconductor structure } to form { HEAD ~ a composite } alloyed bonding layer
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH