The ROM of the present invention is manufactured by laser annealing at the final step in {HEAD ~ the flow} of {TAIL ~ wafer fabrication} so half finished goods having nonactivated resistances can be stocked when the specifications of users are not yet determined 
The ROM of the present invention is manufactured by laser annealing at the final step in { HEAD ~ the flow } of { TAIL ~ wafer fabrication } so half finished goods having nonactivated resistances can be stocked when the specifications of users are not yet determined
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