The present invention relates to a cushion for {TAIL ~ a polishing pad} and {HEAD ~ a polishing pad} using the cushion, and the polishing pad is useful for polishing a material to be polished, for example, a semiconductor wafer and the like, at good precision and high polishing efficiency 
The present invention relates to a cushion for { TAIL ~ a polishing pad } and { HEAD ~ a polishing pad } using the cushion , and the polishing pad is useful for polishing a material to be polished , for example , a semiconductor wafer and the like , at good precision and high polishing efficiency
OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH