The method in accordance 1 wherein said depositing of said copper layer and said {TAIL ~ layer} of {HEAD ~ conductive metal} is performed by vapor depositing 
The method in accordance 1 wherein said depositing of said copper layer and said { TAIL ~ layer } of { HEAD ~ conductive metal } is performed by vapor depositing
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH