{TAIL ~ An array} of contact pads on the package substrate are provided by {HEAD ~ a conductive material} 
{ TAIL ~ An array } of contact pads on the package substrate are provided by { HEAD ~ a conductive material }
TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD