The method 1, wherein {HEAD ~ the grooves} are formed by irradiating {TAIL ~ the laser beams} while changing irradiation directions in a state wherein the semiconductor package is fixed 
The method 1 , wherein { HEAD ~ the grooves } are formed by irradiating { TAIL ~ the laser beams } while changing irradiation directions in a state wherein the semiconductor package is fixed
OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD REL REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH