In {TAIL ~ a three dimensional construction} employing the principles of the invention, {HEAD ~ the IC chips} are arranged in modules, and interconnections may be made between IC chips within each module, transversely between modules, and in a third direction between layers of modules 
In { TAIL ~ a three dimensional construction } employing the principles of the invention , { HEAD ~ the IC chips } are arranged in modules , and interconnections may be made between IC chips within each module , transversely between modules , and in a third direction between layers of modules
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