In view of such aspects, it is an object of the present invention to provide {HEAD ~ methods} of manufacturing a lead frame and {TAIL ~ an integrated circuit package} which prevent a solder resist film from being peeled off and can make sizes of projecting electrodes uniform 
In view of such aspects , it is an object of the present invention to provide { HEAD ~ methods } of manufacturing a lead frame and { TAIL ~ an integrated circuit package } which prevent a solder resist film from being peeled off and can make sizes of projecting electrodes uniform
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