A ceramic slurry is applied onto a carrier film to form the thermistor film layer, a metal powder containing paste is applied onto {TAIL ~ the thermistor film layer} to form the metal base material, and further an electrode paste is applied onto the metal base material to form {HEAD ~ the split electrodes} 
A ceramic slurry is applied onto a carrier film to form the thermistor film layer , a metal powder containing paste is applied onto { TAIL ~ the thermistor film layer } to form the metal base material , and further an electrode paste is applied onto the metal base material to form { HEAD ~ the split electrodes }
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