Also in accordance with this invention there is provided an integrated circuit package including a leadless chip carrier having {TAIL ~ a plurality} of {HEAD ~ elctrically conductive pads} near the periphery of one of its surfaces 
Also in accordance with this invention there is provided an integrated circuit package including a leadless chip carrier having { TAIL ~ a plurality } of { HEAD ~ elctrically conductive pads } near the periphery of one of its surfaces
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH