{HEAD ~ A solder} resist layer having an opening portion is then formed on {TAIL ~ the wiring portion}, and the support board is removed to expose a surface of the electrode or a surface of the electrode and insulating layer 
{ HEAD ~ A solder } resist layer having an opening portion is then formed on { TAIL ~ the wiring portion } , and the support board is removed to expose a surface of the electrode or a surface of the electrode and insulating layer
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