The conductive pad 32, which is formed of a conductive metallic material such as aluminum or aluminum alloys, is embedded in the top surface of {TAIL ~ the silicon substrate} 12 to provide electrical connection to {HEAD ~ the inductor coil} 20 
The conductive pad 32 , which is formed of a conductive metallic material such as aluminum or aluminum alloys , is embedded in the top surface of { TAIL ~ the silicon substrate } 12 to provide electrical connection to { HEAD ~ the inductor coil } 20
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH