The present invention was made in view of these problems, and it is an object of the invention to provide a method of using {TAIL ~ an ID} saw slicing machine for slicing a single crystal ingot into wafers in which the amount of bow is reduced, and also to provide a slicing apparatus for effecting {HEAD ~ this method} 
The present invention was made in view of these problems , and it is an object of the invention to provide a method of using { TAIL ~ an ID } saw slicing machine for slicing a single crystal ingot into wafers in which the amount of bow is reduced , and also to provide a slicing apparatus for effecting { HEAD ~ this method }
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