The leads of the component are then inserted into the plated through holes so as to position the component on a first side of the circuit board , after which a material is applied to the second side of the circuit board so that the material flows through the second through hole , contacts {HEAD ~ the component} , and bonds the component to {TAIL ~ the first side} of the circuit board  
The leads of the component are then inserted into the plated through holes so as to position the component on a first side of the circuit board , after which a material is applied to the second side of the circuit board so that the material flows through the second through hole , contacts { HEAD ~ the component } , and bonds the component to { TAIL ~ the first side } of the circuit board
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