{HEAD ~ The apparatus} also includes a second vacuum processing chamber adapted to perform a process selected from {TAIL ~ the group} consisting of CVD, PVD, sputtering, and etching of a workpiece 
{ HEAD ~ The apparatus } also includes a second vacuum processing chamber adapted to perform a process selected from { TAIL ~ the group } consisting of CVD , PVD , sputtering , and etching of a workpiece
HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH