The conductive pad 32, which is formed of a conductive metallic material such as aluminum or aluminum alloys, is embedded in the top surface of {HEAD ~ the silicon substrate} 12 to provide {TAIL ~ electrical connection} to the inductor coil 20 
The conductive pad 32 , which is formed of a conductive metallic material such as aluminum or aluminum alloys , is embedded in the top surface of { HEAD ~ the silicon substrate } 12 to provide { TAIL ~ electrical connection } to the inductor coil 20
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH