In the wired circuit board, {HEAD ~ the first metal thin film} is formed between {TAIL ~ the metal supporting board} and the metal foil 
In the wired circuit board , { HEAD ~ the first metal thin film } is formed between { TAIL ~ the metal supporting board } and the metal foil
OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL REL REL TAIL TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH