In order to make the high frequency power amplifier module small in size, a substrate side bonding electrode electrically connected to {HEAD ~ a wire} set at a fixed reference electric potential is place at a location farther from a side of the semiconductor chip than a substrate side output electrode electrically connected to {TAIL ~ an output wire} 
In order to make the high frequency power amplifier module small in size , a substrate side bonding electrode electrically connected to { HEAD ~ a wire } set at a fixed reference electric potential is place at a location farther from a side of the semiconductor chip than a substrate side output electrode electrically connected to { TAIL ~ an output wire }
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL