The loading, unloading, handling and {TAIL ~ processing} of {HEAD ~ wafers} in the machine can occur while other wafers are being preheated 
The loading , unloading , handling and { TAIL ~ processing } of { HEAD ~ wafers } in the machine can occur while other wafers are being preheated
OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL OTH HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH