{TAIL ~ The apparatus} of the present invention preferably includes {HEAD ~ first and second vacuum processing chambers} , wherein the first chamber performs the plasma cleaning of the workpiece according to the method of the invention, and the second chamber performs an additional process step, e.g., depositing a metal 
{ TAIL ~ The apparatus } of the present invention preferably includes { HEAD ~ first and second vacuum processing chambers } , wherein the first chamber performs the plasma cleaning of the workpiece according to the method of the invention , and the second chamber performs an additional process step , e.g. , depositing a metal
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