Further, in accordance with a preferred embodiment of the present invention, {HEAD ~ the wafer transfer device} has a first unit receives a first group of semiconductor wafers and {TAIL ~ a second unit} which receives a second group of semiconductor wafers 
Further , in accordance with a preferred embodiment of the present invention , { HEAD ~ the wafer transfer device } has a first unit receives a first group of semiconductor wafers and { TAIL ~ a second unit } which receives a second group of semiconductor wafers
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD HEAD HEAD REL OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH