{TAIL ~ The present invention} allows the die block to be transversely adjustable by a combination of a U shaped mounting block, an inverted T shaped profile plate and {HEAD ~ an eccentric adjustment pin}, assembled in a fashion so that the eccentric pin can be rotated to adjust transversely the gap through which the profile base passes just before joining the film 
{ TAIL ~ The present invention } allows the die block to be transversely adjustable by a combination of a U shaped mounting block , an inverted T shaped profile plate and { HEAD ~ an eccentric adjustment pin } , assembled in a fashion so that the eccentric pin can be rotated to adjust transversely the gap through which the profile base passes just before joining the film
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