{HEAD ~ A process} 1, wherein {TAIL ~ the plurality} of patterned linear projections provide an uneven surface which has a center line average surface roughness Ra of 15 300 nm when scanned in a direction parallel to the patterned linear projections, a center line average surface roughness Ra of 20 600 nm when scanned in a direction perpendicular to the patterned linear projections, and an Ra/Ra ratio of at most 0.8 
{ HEAD ~ A process } 1 , wherein { TAIL ~ the plurality } of patterned linear projections provide an uneven surface which has a center line average surface roughness Ra of 15 300 nm when scanned in a direction parallel to the patterned linear projections , a center line average surface roughness Ra of 20 600 nm when scanned in a direction perpendicular to the patterned linear projections , and an Ra / Ra ratio of at most 0.8
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