FIG 1 is {TAIL ~ a top view} of an individual chip including bonding {HEAD ~ pad structures} of the present invention 
FIG 1 is { TAIL ~ a top view } of an individual chip including bonding { HEAD ~ pad structures } of the present invention
OTH OTH OTH TAIL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD HEAD OTH OTH OTH OTH