The aqueous dispersion for CMP according to the invention is therefore useful for {HEAD ~ CMP} of {TAIL ~ polished surfaces} with metal layers in manufacturing processes for semiconductor devices 
The aqueous dispersion for CMP according to the invention is therefore useful for { HEAD ~ CMP } of { TAIL ~ polished surfaces } with metal layers in manufacturing processes for semiconductor devices
OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH OTH HEAD HEAD HEAD HEAD HEAD REL TAIL TAIL TAIL TAIL TAIL TAIL OTH OTH OTH OTH OTH OTH OTH OTH OTH