Glass-to-metal seal formation of lithium tungstate. Due to its low thermal expansion coefficient, matched to glass, tungsten is frequently used for glass-metal bonds. Tungsten forms satisfying bonds with glasses with similar thermal expansion coefficient such as high-borosilicate glass. The surface of both the metal and glass should be smooth, without scratches. Tungsten has the lowest expansion coefficient of metals and the highest melting point. 304 Stainless steel forms bonds with glass via an intermediate layer of chromium(III) oxide and iron(III) oxide. Further reactions of chromium, forming chromium silicide dendrites, are possible. The thermal expansion coefficient of steel is however fairly different from
Melting-point depression in Figure 1, and the shape of the curve is in general agreement with those obtained through experiment. Equation 2 gives the general relation between the melting point of a metal nanoparticle and its diameter. However, recent work indicates the melting point of semiconductor and covalently bonded nanoparticles may have a different dependence on particle size. The covalent character of the bonds changes the melting physics of these materials. Researchers have demonstrated that Equation 3 more accurately models melting point depression in covalently bonded materials. formula_3 Where: T=Bulk Melting temperature Equation 3 indicates that melting point depression is less pronounced