Glass-to-metal seal formation of lithium tungstate. Due to its low thermal expansion coefficient, matched to glass, tungsten is frequently used for glass-metal bonds. Tungsten forms satisfying bonds with glasses with similar thermal expansion coefficient such as high-borosilicate glass. The surface of both the metal and glass should be smooth, without scratches. Tungsten has the lowest expansion coefficient of metals and the highest melting point. 304 Stainless steel forms bonds with glass via an intermediate layer of chromium(III) oxide and iron(III) oxide. Further reactions of chromium, forming chromium silicide dendrites, are possible. The thermal expansion coefficient of steel is however fairly different from
Group 12 element elements. Very little is known about copernicium, and none of its physical properties have been confirmed except for its boiling point (tentative). Zinc is somewhat less dense than iron and has a hexagonal crystal structure. The metal is hard and brittle at most temperatures but becomes malleable between 100 and 150 °C. Above 210 °C, the metal becomes brittle again and can be pulverized by beating. Zinc is a fair conductor of electricity. For a metal, zinc has relatively low melting (419.5 °C, 787.1 F) and boiling points (907 °C). Cadmium is similar in many respects to zinc but forms