Glass-to-metal seal formation of lithium tungstate. Due to its low thermal expansion coefficient, matched to glass, tungsten is frequently used for glass-metal bonds. Tungsten forms satisfying bonds with glasses with similar thermal expansion coefficient such as high-borosilicate glass. The surface of both the metal and glass should be smooth, without scratches. Tungsten has the lowest expansion coefficient of metals and the highest melting point. 304 Stainless steel forms bonds with glass via an intermediate layer of chromium(III) oxide and iron(III) oxide. Further reactions of chromium, forming chromium silicide dendrites, are possible. The thermal expansion coefficient of steel is however fairly different from
Melting-point depression which affects the cohesive energy and thermal properties of a nanostructure. Equation 7 gives a general shape corrected formula for the theoretical melting point of a nanoparticle based on its size and shape. formula_7 Where: c=materials constant The shape parameter is 1 for sphere and 3/2 for a very long wire, indicating that melting-point depression is suppressed in nanowires compared to nanoparticles. Past experimental data show that nanoscale tin platelets melt within a narrow range of 10 C of the bulk melting temperature. The melting point depression of these platelets was suppressed compared to spherical tin nanoparticles. Several nanoparticle melting