Glass-to-metal seal formation of lithium tungstate. Due to its low thermal expansion coefficient, matched to glass, tungsten is frequently used for glass-metal bonds. Tungsten forms satisfying bonds with glasses with similar thermal expansion coefficient such as high-borosilicate glass. The surface of both the metal and glass should be smooth, without scratches. Tungsten has the lowest expansion coefficient of metals and the highest melting point. 304 Stainless steel forms bonds with glass via an intermediate layer of chromium(III) oxide and iron(III) oxide. Further reactions of chromium, forming chromium silicide dendrites, are possible. The thermal expansion coefficient of steel is however fairly different from
Melting point graphically to the right, but also of Si, Ge, Ga, Bi. With extremely large changes in pressure, substantial changes to the melting point are observed. For example, the melting point of silicon at ambient pressure (0.1 MPa) is 1415 °C, but at pressures in excess of 10 GPa it decreases to 1000 °C. Melting points are often used to characterize organic and inorganic compounds and to ascertain their purity. The melting point of a pure substance is always higher and has a smaller range than the melting point of an impure substance or, more generally, of mixtures. The higher the