Dip soldering a small tank containing molten solder. PCB with mounted components is dipped manually into the tank when the molten solder sticks to the exposed metallic areas of the board. Dip soldering is accomplished by submerging parts to be joined into a molten solder bath. Thus, all components surfaces are coated with filler metal. Solders have low surface tension and high wetting capability. There are many types of solders, each used for different applications. Such as Lead-Silver for strength at higher than room temperature. Tin-Lead is used for General Purpose; Tin-Zinc is used for Aluminum; Cadmium-Silver is used for strength at
C-rich stability element been mapped to a pyrimidine-rich segment of its 3' UTR. This region confers stability by directing the assembly of a specific alpha ribonucleoprotein complex at this site. Subsequently Holcik and Liebhaber identified three other highly stable eukaryotic mRNAs that assemble the alpha globin protein complex at homologous pyrimidine-rich regions within their 3'UTRs (rabbit lipoxygenase, rat tyrosine hydroxylase, and human alpha(I)-collagen). There is some debate as to the number and identity of trans-acting factors recruited to the C-rich element. However the alpha globin poly(C)-binding protein (alphaCP) is agreed to be the core constituent of what is known as the alpha complex.