Dip soldering a small tank containing molten solder. PCB with mounted components is dipped manually into the tank when the molten solder sticks to the exposed metallic areas of the board. Dip soldering is accomplished by submerging parts to be joined into a molten solder bath. Thus, all components surfaces are coated with filler metal. Solders have low surface tension and high wetting capability. There are many types of solders, each used for different applications. Such as Lead-Silver for strength at higher than room temperature. Tin-Lead is used for General Purpose; Tin-Zinc is used for Aluminum; Cadmium-Silver is used for strength at
Liquid metal (Fr)(estimated at 27 °C [81 °F]), and gallium (Ga)(30 °C [86 °F]). Alloy systems that are liquid at room temperature have thermal conductivity far superior to ordinary non-metallic liquids, allowing liquid metal to efficiently transfer energy from the heat source to the liquid. They also have a higher electrical conductivity that allows the liquid to be pumped by more efficient, electromagnetic pumps. This results in the use of these materials for specific heat conducting and/or dissipation applications. Another advantage of liquid alloy systems is their inherent high densities. Once oxides have been removed from the substrate surface, most liquid metals