Period 5 element with most production coming from the Xikuangshan Mine in Hunan. Antimony compounds are prominent additives for chlorine and bromine containing fire retardants found in many commercial and domestic products. The largest application for metallic antimony is as alloying material for lead and tin. It improves the properties of the alloys which are used as in solders, bullets and ball bearings. An emerging application is the use of antimony in microelectronics. Tellurium is a chemical element that has the symbol Te and atomic number 52. A brittle, mildly toxic, rare, silver-white metalloid which looks similar to tin, tellurium is chemically related
Thermal copper pillar bump both having copper pillars and solder connections. The primary difference between the two is the introduction of either a P- or N-type thermoelectric layer between two solder layers. The solders used with CPBs and thermal bumps can be any one of a number of commonly used solders including, but not limited to, Sn, SnPb eutectic, SnAg or AuSn. Figure 5 shows a device equipped with a thermal bump. The thermal flow is shown by the arrows labeled “heat.” Metal traces, which can be several micrometres high, can be stacked or interdigitated to provide highly conductive pathways for collecting heat from