Dip soldering a small tank containing molten solder. PCB with mounted components is dipped manually into the tank when the molten solder sticks to the exposed metallic areas of the board. Dip soldering is accomplished by submerging parts to be joined into a molten solder bath. Thus, all components surfaces are coated with filler metal. Solders have low surface tension and high wetting capability. There are many types of solders, each used for different applications. Such as Lead-Silver for strength at higher than room temperature. Tin-Lead is used for General Purpose; Tin-Zinc is used for Aluminum; Cadmium-Silver is used for strength at
Period 6 element between barium and hafnium, and radium and rutherfordium, respectively. This convention is entirely a matter of aesthetics and formatting practicality; a rarely used wide-formatted periodic table inserts the lanthanide and actinide series in their proper places, as parts of the table's sixth and seventh rows (periods). Lanthanum is a chemical element with the symbol La and atomic number 57. It is the first element in the lanthanide series. It is a soft, ductile, silvery-white metal that tarnishes rapidly when exposed to air and is soft enough to be cut with a knife. It is the eponym of the lanthanide series,