TO-3 at Motorola around 1955. The lead spacing was originally intended to allow plugging the device into a then-common tube socket. The metal package can be attached to a heat sink, making it suitable for devices dissipating several watts of heat. Thermal compound is used to improve heat transfer between the device case and the heat sink. Since the device case is one of the electrical connections, an insulator may be required to electrically isolate the component from the heatsink. Insulating washers may be made of mica or other materials with good thermal conductivity. The case is used with high-power and
Sopormetal Sopormetal Sopormetal International Group was founded on February 2, 1985. It began as a Portuguese company supplying brazing materials, silver and copper brazing solders. SOPORMETAL is a producer of brazing materials such as silver solders, copper/phosphorus, soft solders and fluxes. Cadmium-free silver solder, special alloys and tri-metal alloys for the entire industry, as well as several special alloys in the form of rod, strips, rings and various preforms. Coated silver solders with different ratios having regard the technology used for brazing and fusion technical parameters. Copper phosphorus alloys with and without silver for all sectors, as well with different types