TO-3 at Motorola around 1955. The lead spacing was originally intended to allow plugging the device into a then-common tube socket. The metal package can be attached to a heat sink, making it suitable for devices dissipating several watts of heat. Thermal compound is used to improve heat transfer between the device case and the heat sink. Since the device case is one of the electrical connections, an insulator may be required to electrically isolate the component from the heatsink. Insulating washers may be made of mica or other materials with good thermal conductivity. The case is used with high-power and
C-element particular, the so-called Maevsky's implementation is a non-distributive circuit loosely based on. Non-distributivity is introduced sometimes to increase concurrency. The 3NAND gate in this circuit can be replaced by two 2NAND gates. The C-element using only two-input gates has been proposed by Tsirlin and then synthesized by Starodoubtsev et al. using Taxogram language. This circuit coincides with that attributed (without reference) to Bartky and can operate without the input latch. Yet another version of the C-element built on two RS latches has been synthesized by Murphy using Petrify tool. However, this circuit includes inverter connected to one if the inputs.