Dip soldering a small tank containing molten solder. PCB with mounted components is dipped manually into the tank when the molten solder sticks to the exposed metallic areas of the board. Dip soldering is accomplished by submerging parts to be joined into a molten solder bath. Thus, all components surfaces are coated with filler metal. Solders have low surface tension and high wetting capability. There are many types of solders, each used for different applications. Such as Lead-Silver for strength at higher than room temperature. Tin-Lead is used for General Purpose; Tin-Zinc is used for Aluminum; Cadmium-Silver is used for strength at
C-rich stability element and U-rich compared to the predominantly C-rich human element. Despite this shift the murine alpha globin mRNA is still as stable due to a complementary change in the specificity of the poly(C)-binding protein. C-rich stability element The C-rich stability element is a short part of a gene sequence important for the proper synthesis of globin and several other human proteins. Differences in the stabilities of individual mRNAs can dramatically affect the overall level of expression for genes. Eukaryotic mRNAs can have half-lives that vary from as short as several minutes to as long as several days. In differentiating human erythroid