Post-transition metal packing structure. Tin forms Zintl phases such as NaSn, BaSn, KSn and CaSn. It has good corrosion resistance in air on account of forming a thin protective oxide layer. Pure tin has no structural uses. It is used in lead-free solders, and as a hardening agent in alloys of other metals, such as copper, lead, titanium and zinc. Lead is a soft metal (MH 1.5, but hardens close to melting) which, in many cases, is unable to support its own weight. It has a close-packed structure (BCN 12) but an abnormally large inter-atomic distance that has been attributed to partial
C-element C-element The Muller C-element (C-gate, hysteresis flip-flop, or sometimes coincident flip-flop, two-hand safety circuit) is a small digital block widely used in design of asynchronous circuits and systems. It has been specified formally in 1955 by David E. Muller and first used in ILLIAC II computer. In terms of the theory of lattices, the C-element is a semimodular distributive circuit, whose operation in time is described by a Hasse diagram. The C-element is closely related to the "rendezvous" and "join" elements, where an input is not allowed to change twice in succession. In some cases, when relations between delays are