High-pressure area are alternatively referred to as anticyclones. On English-language weather maps, high-pressure centers are identified by the letter H in English, within the isobar with the highest pressure value. On constant pressure upper level charts, it is located within the highest height line contour. Highs are frequently associated with light winds at the surface and subsidence through the lower portion of the troposphere. In general, subsidence will dry out an air mass by adiabatic, or compressional, heating. Thus, high pressure typically brings clear skies. During the day, since no clouds are present to reflect sunlight, there is more incoming shortwave solar
Low pressure molding Low pressure molding Low Pressure Molding (LPM) with polyamide and polyolefin (hot-melt) materials is a process typically used to encapsulate and environmentally protect electronic components (such as circuit boards). The purpose is to protect electronics against moisture, dust dirt and vibration. Low Pressure Molding is also used for sealing connectors and molding grommets and strain reliefs. Key to this process are the raw materials and specialized molding equipment. Dimer acid based polyamide materials, better known as hot-melts, are used as molding compounds. They are thermoplastics i.e. the material, when heated, becomes less viscous and is able to re-shaped, then hardens