Thermal conductivity the list of thermal conductivities. These should be considered approximate due to the uncertainties related to material definitions. High energy generation rates within electronics or turbines require the use of materials with high thermal conductivity such as copper "(see: Copper in heat exchangers)", aluminium, and silver. On the other hand, materials with low thermal conductance, such as polystyrene foam and fire brick, are used in building construction or in furnaces in an effort to slow the flow of heat, i.e. for insulation purposes. The reciprocal of thermal conductivity is "thermal resistivity", usually expressed in kelvin-meters per watt (K⋅m⋅W). For a
Metallic bonding Metallic bonding Metallic bonding is a type of chemical bonding that rises from the electrostatic attractive force between conduction electrons (in the form of an electron cloud of delocalized electrons) and positively charged metal ions. It may be described as the sharing of "free" electrons among a structure of positively charged ions (cations). Metallic bonding accounts for many physical properties of metals, such as strength, ductility, thermal and electrical resistivity and conductivity, opacity, and luster. Metallic bonding is not the only type of chemical bonding a metal can exhibit, even as a pure substance. For example, elemental gallium consists of