Tin per kg over years: In 2006, about half of all tin produced was used in solder. The rest was divided between tin plating, tin chemicals, brass and bronze alloys, and niche uses. Tin has long been used in alloys with lead as solder, in amounts 5 to 70% w/w. Tin with lead forms a eutectic mixture at the weight proportion of 61.9% tin and 38.1% lead (the atomic proportion: 73.9% tin and 26.1% lead), with melting temperature of 183 °C (361.4 °F) . Such solders are primarily used for joining pipes or electric circuits. Since the European Union Waste Electrical
Solder structure they tend to be translucent or opaque. Devitrifying solders are frequently "thermosetting", as their melting temperature after recrystallization becomes significantly higher; this allows soldering the parts together at lower temperature than the subsequent bake-out without remelting the joint afterwards. Devitrifying solders frequently contain up to 25% zinc oxide. In production of cathode ray tubes, devitrifying solders based on PbO-BO-ZnO are used. Very low temperature melting glasses, fluid at 200–400 °C, were developed for sealing applications for electronics. They can consist of binary or ternary mixtures of thallium, arsenic and sulfur. Zinc-silicoborate glasses can also be used for passivation of