High-pressure area to describe the weather systems generated by highs and lows were introduced in the mid-1800s, mostly by the British. The scientific theories which explain the general phenomena originated about two centuries earlier. The term cyclone was coined by Henry Piddington of the British East India Company to describe the devastating storm of December 1789 in Coringa, India. A cyclone forms around a low-pressure area. Anticyclone, the term for the kind of weather around a high-pressure area, was coined in 1877 by Francis Galton to indicate an area whose winds revolved in the opposite direction of a cyclone. In British English,
Low pressure molding Low pressure molding Low Pressure Molding (LPM) with polyamide and polyolefin (hot-melt) materials is a process typically used to encapsulate and environmentally protect electronic components (such as circuit boards). The purpose is to protect electronics against moisture, dust dirt and vibration. Low Pressure Molding is also used for sealing connectors and molding grommets and strain reliefs. Key to this process are the raw materials and specialized molding equipment. Dimer acid based polyamide materials, better known as hot-melts, are used as molding compounds. They are thermoplastics i.e. the material, when heated, becomes less viscous and is able to re-shaped, then hardens