Period 5 element other metal is not easily oxidized in air and is used to coat other metals to prevent corrosion. The firstalloy, used in large scale since 3000 BC, was bronze, an alloy of tin and copper. After 600 BC pure metallic tin was produced. Pewter, which is an alloy of 85–90% tin with the remainder commonly consisting of copper, antimony and lead, was used for tableware from the Bronze Age until the 20th century. In modern times tin is used in many alloys, most notably tin/lead soft solders, typically containing 60% or more of tin. Another large application for tin is
Thermal copper pillar bump both having copper pillars and solder connections. The primary difference between the two is the introduction of either a P- or N-type thermoelectric layer between two solder layers. The solders used with CPBs and thermal bumps can be any one of a number of commonly used solders including, but not limited to, Sn, SnPb eutectic, SnAg or AuSn. Figure 5 shows a device equipped with a thermal bump. The thermal flow is shown by the arrows labeled “heat.” Metal traces, which can be several micrometres high, can be stacked or interdigitated to provide highly conductive pathways for collecting heat from