Tahini cuneiform document written 4000 years ago that describes the custom of serving the gods sesame wine. The historian Herodotus writes about the cultivation of sesame 3500 years ago in the region of the Tigris and Euphrates in Mesopotamia. It was mainly used as a source of oil. Tahini is mentioned as an ingredient of "hummus kasa", a recipe transcribed in an anonymous 13th-century Arabic cookbook, "Kitab Wasf al-Atima al-Mutada". Sesame paste is an ingredient in some Chinese and Japanese dishes; Sichuan cuisine uses it in some recipes for dandan noodles. Sesame paste is also used in Indian cuisine. In the
Solder paste and poor solder pastes. If multiple solder pastes are evaluated, the procedure can be used to eliminate the poor pastes from their poor printing quality. Further testing, such as solder reflow performance, solder joint quality, and reliability testing can then be performed on the solder paste finalists. The main concerns about solder paste are: These three concerns helped to spawn three enclosed systems for printing. Solder paste Solder paste (or solder cream) is a material used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through