Low-pressure area area of wind divergence aloft occurs ahead of embedded shortwave troughs, which are of smaller wavelength. Diverging winds aloft ahead of these troughs cause atmospheric lift within the troposphere below, which lowers surface pressures as upward motion partially counteracts the force of gravity. Thermal lows form due to localized heating caused by greater sunshine over deserts and other land masses. Since localized areas of warm air are less dense than their surroundings, this warmer air rises, which lowers atmospheric pressure near that portion of the Earth's surface. Large-scale thermal lows over continents help drive monsoon circulations. Low-pressure areas can also
Low pressure molding to keep the desired form upon cooling down. These polyamide materials differ from other thermoplastics in two main areas: One: Viscosity: At processing temperature (410F/210C) the viscosity is very low, typically around 3,000 centipoise (similar to pancake syrup). Low viscosity materials require low injection pressure in order to inject into a cavity. In fact it is normal to use a simple gear pump to inject the polyamide material. Low injection pressure is paramount, when over-molding relatively fragile electronic component. Two: Adhesion: Polyamide materials are basically high performance hot-melt adhesives. The adhesive properties of polyamide is what seals a chosen substrate.