Dip soldering a small tank containing molten solder. PCB with mounted components is dipped manually into the tank when the molten solder sticks to the exposed metallic areas of the board. Dip soldering is accomplished by submerging parts to be joined into a molten solder bath. Thus, all components surfaces are coated with filler metal. Solders have low surface tension and high wetting capability. There are many types of solders, each used for different applications. Such as Lead-Silver for strength at higher than room temperature. Tin-Lead is used for General Purpose; Tin-Zinc is used for Aluminum; Cadmium-Silver is used for strength at
C-element and the latch outputs its previous state. There are also versions of semistatic C-element built on devices with negative differential resistance (NDR). It should be noted however, that NDR is usually defined for small signal. So, it is difficult to expect that such a C-element will operate in full range of voltages or currents. Since the majority gate is a particular case of threshold gate, any of known realizations of threshold gate can in principle be used for building a C-element. In the multiple-valued case, however, connecting the output of majority gate to one or several inputs may have no