Soldering (see RoHS), has led to a change in formulation of both solders and fluxes. Water-soluble non-rosin-based fluxes have been increasingly used since the 1980s so that soldered boards can be cleaned with water or water-based cleaners. This eliminates hazardous solvents from the production environment, and from factory effluents. Those regulations have also reduced the use of lead based solders, and caused the melting temperatures of solders in use to increase by up to . "Hot-bar reflow" is a selective soldering process where two pre-fluxed, solder coated parts are heated with heating element (called a thermode) to a sufficient temperature to
C-element known, the C-element can be realized as a sum-of-product (SOP) circuit . Earlier techniques for implementing the C-element include Schmidt trigger, Eccles-Jordan flip-flop and last moving point flip-flop. For two input signals the C-element is defined by the equation formula_1, which corresponds to the following truth table: This table can be turned into a circuit using the Karnaugh map. However, the obtained implementation is naive, since nothing is said about delay assumptions. To understand under what conditions the obtained circuit is workable, it is necessary to do additional analysis, which reveals that Thus, the naive implementation is correct "only" for