Thermal conductivity heat flow may not be exactly the same as the direction of the thermal gradient. In metals, thermal conductivity approximately tracks electrical conductivity according to the Wiedemann–Franz law, as freely moving valence electrons transfer not only electric current but also heat energy. However, the general correlation between electrical and thermal conductance does not hold for other materials, due to the increased importance of phonon carriers for heat in non-metals. Highly electrically conductive silver is less thermally conductive than diamond, which is an electrical insulator, but due to its orderly array of atoms it is conductive of heat via phonons. The
Thermal management (electronics) by the product of R and C. This quantity can be used to calculate the dynamic heat dissipation capability of a device, in an analogous way to the electrical case. A thermal interface material or mastic (aka TIM) is used to fill the gaps between thermal transfer surfaces, such as between microprocessors and heatsinks, in order to increase thermal transfer efficiency. It has a higher thermal conductivity value in Z-direction than xy-direction. Due to recent technological developments and public interest, the retail heat sink market has reached an all-time high. In the early 2000s, CPUs were produced that emitted more