Low-pressure area This generates a steady wind blowing toward the land, bringing the moist near-surface air over the oceans with it. Similar rainfall is caused by the moist ocean-air being lifted upwards by mountains, surface heating, convergence at the surface, divergence aloft, or from storm-produced outflows at the surface. However the lifting occurs, the air cools due to expansion in lower pressure, which in turn produces condensation. In winter, the land cools off quickly, but the ocean keeps the heat longer due to its higher specific heat. The hot air over the ocean rises, creating a low-pressure area and a breeze from
Low pressure molding Millions of circuit boards are successfully over-molded without causing any harm in the process. A low injection pressure does not stress a fragile solder joint. Low Pressure Molding process was initially invented in Europe in the 1970s by adhesives companies like Henkel AG & Co. KGaA in Germany and Bostik in France to seal connectors and create strain reliefs for wires. The first commercial use of the Low Pressure Molding process was in the automotive industry. The driving force was to replace toxic and cumbersome potting processes, faster cycle times, lighter parts and environmentally safe components and for some applications