Dip soldering a small tank containing molten solder. PCB with mounted components is dipped manually into the tank when the molten solder sticks to the exposed metallic areas of the board. Dip soldering is accomplished by submerging parts to be joined into a molten solder bath. Thus, all components surfaces are coated with filler metal. Solders have low surface tension and high wetting capability. There are many types of solders, each used for different applications. Such as Lead-Silver for strength at higher than room temperature. Tin-Lead is used for General Purpose; Tin-Zinc is used for Aluminum; Cadmium-Silver is used for strength at
Glass-ceramic-to-metal seals equivalents including more refractory behaviour, in addition to their ability to seal successfully to many different metals and alloys. They have been used in electrical feed-through seals for such applications as vacuum interrupter envelopes and pyrotechnic actuators, in addition to many applications where a higher temperature capability than is possible with glass-to-metal seals is required, including solid oxide fuel cells. In the formation of a glass-ceramic-to-metal seal, the parts to be joined are first heated, normally under inert atmosphere, in order to melt the glass and allow it to wet and flow into the metal parts, in much the same