Post-transition metal packing structure. Tin forms Zintl phases such as NaSn, BaSn, KSn and CaSn. It has good corrosion resistance in air on account of forming a thin protective oxide layer. Pure tin has no structural uses. It is used in lead-free solders, and as a hardening agent in alloys of other metals, such as copper, lead, titanium and zinc. Lead is a soft metal (MH 1.5, but hardens close to melting) which, in many cases, is unable to support its own weight. It has a close-packed structure (BCN 12) but an abnormally large inter-atomic distance that has been attributed to partial
Parasitic element (electrical networks) is not always adequate. For instance, the inter-winding capacitance mentioned above is really a distributed element along the whole length of the winding and not a capacitor in one particular place. Designers sometimes take advantage of parasitic effects to achieve a function in a component, see for instance helical resonator. Non-linear parasitic elements can also arise. The term is commonly used to describe parasitic structures formed on an integrated circuit whereby an unwanted semiconductor device is formed from p-n junctions which belong to two or more intended devices or functions. Parasitic element (electrical networks) In electrical networks, a parasitic element