Metalloid suggested that compounds of silicon, germanium, arsenic, and antimony with B metals, "are probably best classed as alloys". Among the lighter metalloids, alloys with transition metals are well-represented. Boron can form intermetallic compounds and alloys with such metals of the composition MB, if "n" > 2. Ferroboron (15% boron) is used to introduce boron into steel; nickel-boron alloys are ingredients in welding alloys and case hardening compositions for the engineering industry. Alloys of silicon with iron and with aluminium are widely used by the steel and automotive industries, respectively. Germanium forms many alloys, most importantly with the coinage metals. The
Silicon-germanium silicon-only technology. Silicon Germanium-on-insulator (SGOI) is a technology analogous to the Silicon-On-Insulator (SOI) technology currently employed in computer chips. SGOI increases the speed of the transistors inside microchips by straining the crystal lattice under the MOS transistor gate, resulting in improved electron mobility and higher drive currents. SiGe MOSFETs can also provide lower junction leakage due to the lower band gap value of SiGe. However, a major issue with SGOI MOSFETs is the inability to form stable oxides with silicon germanium using standard silicon oxidation processing. A silicon germanium thermoelectric device, MHW-RTG3, was used in the Voyager 1 and 2