Electrical resistivity and conductivity conductivity in a solution. A rough summary is as follows: This table shows the resistivity (ρ), conductivity and temperature coefficient of various materials at 20 °C (68 °F, 293 K) The effective temperature coefficient varies with temperature and purity level of the material. The 20 °C value is only an approximation when used at other temperatures. For example, the coefficient becomes lower at higher temperatures for copper, and the value 0.00427 is commonly specified at . The extremely low resistivity (high conductivity) of silver is characteristic of metals. George Gamow tidily summed up the nature of the metals' dealings with
Thermal management (electronics) by the product of R and C. This quantity can be used to calculate the dynamic heat dissipation capability of a device, in an analogous way to the electrical case. A thermal interface material or mastic (aka TIM) is used to fill the gaps between thermal transfer surfaces, such as between microprocessors and heatsinks, in order to increase thermal transfer efficiency. It has a higher thermal conductivity value in Z-direction than xy-direction. Due to recent technological developments and public interest, the retail heat sink market has reached an all-time high. In the early 2000s, CPUs were produced that emitted more