Restriction of Hazardous Substances Directive a disadvantage because it can lead to lower quality electrical connections – can be used to place components more tightly than they used to be placed due to the properties of lead-containing solders. For example, Motorola reports that their new RoHS wireless device assembly techniques are "...enabling a smaller, thinner, lighter unit." Their Motorola Q phone would not have been possible without the new solder. The lead-free solder allows for tighter pad spacing. Research into new alloys and technologies is allowing companies to release RoHS products that are currently exempt from compliance, "e.g." computer servers. IBM has announced a RoHS
Glass-to-metal seal for nickel and iron and their alloys. This is achieved by heating the metal in vacuum or sometimes in hydrogen atmosphere or in some cases even in air at temperatures above those used during the sealing process. Oxidizing of the metal surface also reduces gas evolution. Most of the evolved gas is produced due to the presence of carbon impurities in the metals; these can be removed by heating in hydrogen. The glass-oxide bond is stronger than glass-metal. The oxide forms a layer on the metal surface, with the proportion of oxygen changing from zero in the metal to the