Dip soldering a small tank containing molten solder. PCB with mounted components is dipped manually into the tank when the molten solder sticks to the exposed metallic areas of the board. Dip soldering is accomplished by submerging parts to be joined into a molten solder bath. Thus, all components surfaces are coated with filler metal. Solders have low surface tension and high wetting capability. There are many types of solders, each used for different applications. Such as Lead-Silver for strength at higher than room temperature. Tin-Lead is used for General Purpose; Tin-Zinc is used for Aluminum; Cadmium-Silver is used for strength at
Electrical contacts operation is logically inverted from Form A. An alternate notation for "Form B" is SPST-NC. "Form C" contacts ("change over" or "transfer" contacts) are composed of a normally closed contact pair and a normally open contact pair that are operated by the same device; there is a common electrical connection between a contact of each pair that results in only three connection terminals. These terminals are usually labelled as "normally open", "common", and "normally closed" ("NO-C-NC"). An alternate notation for "Form C" is SPDT. These contacts are quite frequently found in electrical switches and relays as the common contact element