Soldering each type of solder and alloy has different melting temperatures. The term "silver solder" denotes the type of solder that is used. Some soft solders are "silver-bearing" alloys used to solder silver-plated items. Lead-based solders should not be used on precious metals because the lead dissolves the metal and disfigures it. The distinction between soldering and brazing is based on the melting temperature of the filler alloy. A temperature of 450 °C is usually used as a practical demarcation between soldering and brazing. Soft soldering can be done with a heated iron whereas the other methods typically require a higher
C-element known, the C-element can be realized as a sum-of-product (SOP) circuit . Earlier techniques for implementing the C-element include Schmidt trigger, Eccles-Jordan flip-flop and last moving point flip-flop. For two input signals the C-element is defined by the equation formula_1, which corresponds to the following truth table: This table can be turned into a circuit using the Karnaugh map. However, the obtained implementation is naive, since nothing is said about delay assumptions. To understand under what conditions the obtained circuit is workable, it is necessary to do additional analysis, which reveals that Thus, the naive implementation is correct "only" for