Dip soldering a small tank containing molten solder. PCB with mounted components is dipped manually into the tank when the molten solder sticks to the exposed metallic areas of the board. Dip soldering is accomplished by submerging parts to be joined into a molten solder bath. Thus, all components surfaces are coated with filler metal. Solders have low surface tension and high wetting capability. There are many types of solders, each used for different applications. Such as Lead-Silver for strength at higher than room temperature. Tin-Lead is used for General Purpose; Tin-Zinc is used for Aluminum; Cadmium-Silver is used for strength at
Post-transition metal sulfide (AsS). Arsenic forms a series of anionic arsenates such as NaAsO and PbHAsO, and Zintl phases such as NaAs, CaAs and SrAs. Antimony is a soft (MH 3.0) and brittle semi-metallic element. It is commonly regarded as a metalloid, or by some other authors as either a metal or a non-metal. It exhibits poor electrical conductivity which, like a metal, decreases with temperature. It has a relatively open and partially covalent crystalline structure (BCN 3+3). Antimony forms covalent bonds with most other elements. The oxide in its preferred oxidation state (SbO, +3) is amphoteric. Antimony forms a series of