TO-3 at Motorola around 1955. The lead spacing was originally intended to allow plugging the device into a then-common tube socket. The metal package can be attached to a heat sink, making it suitable for devices dissipating several watts of heat. Thermal compound is used to improve heat transfer between the device case and the heat sink. Since the device case is one of the electrical connections, an insulator may be required to electrically isolate the component from the heatsink. Insulating washers may be made of mica or other materials with good thermal conductivity. The case is used with high-power and
C-element by Varshavsky et al. Semistatic C-element stores its previous state using two cross-coupled inverters, similar to an SRAM cell. One of the inverters is weaker than the rest of the circuit, so it can be overpowered by the pull-up and pull-down networks. If both inputs are 0, then the pull-up network changes the latch's state, and the C-element outputs a 0. If both inputs are 1, then the pull-down network changes the latch's state, making the C-element output a 1. Otherwise, the input of the latch is not connected to either formula_4 or ground, and so the weak inverter dominates