Tahini cuneiform document written 4000 years ago that describes the custom of serving the gods sesame wine. The historian Herodotus writes about the cultivation of sesame 3500 years ago in the region of the Tigris and Euphrates in Mesopotamia. It was mainly used as a source of oil. Tahini is mentioned as an ingredient of "hummus kasa", a recipe transcribed in an anonymous 13th-century Arabic cookbook, "Kitab Wasf al-Atima al-Mutada". Sesame paste is an ingredient in some Chinese and Japanese dishes; Sichuan cuisine uses it in some recipes for dandan noodles. Sesame paste is also used in Indian cuisine. In the
Solder paste a move to lead-free solder. Solder paste is thixotropic, meaning that its viscosity changes over time with applied shear force (e.g., stirring). The "thixotropic index" is a measure of the viscosity of the solder paste at rest, compared to "worked" paste. Depending upon the formulation of the paste, it may be very important to stir the paste before it is used, to ensure that the viscosity is appropriate for proper application. The size and shape of the metal particles in the solder paste determines how well the paste will "print". A solder ball is spherical in shape; this helps in