Dip soldering a small tank containing molten solder. PCB with mounted components is dipped manually into the tank when the molten solder sticks to the exposed metallic areas of the board. Dip soldering is accomplished by submerging parts to be joined into a molten solder bath. Thus, all components surfaces are coated with filler metal. Solders have low surface tension and high wetting capability. There are many types of solders, each used for different applications. Such as Lead-Silver for strength at higher than room temperature. Tin-Lead is used for General Purpose; Tin-Zinc is used for Aluminum; Cadmium-Silver is used for strength at
Glass-to-metal seal absorb the stresses from thermal expansion mismatches. Due to its very low vapor pressure, indium finds use in glass-metal seals used in vacuum technology. Gallium is a soft metal with melting point at 30 °C. It readily wets glasses and most metals and can be used for seals that can be assembled/disassembled by just slight heating. It can be used as a liquid seal up to high temperatures or even at lower temperatures when alloyed with other metals (e.g. as galinstan). Mercury is a metal liquid at normal temperature. It was used as the earliest glass-to-metal seal and is still