Thermal conductivity the list of thermal conductivities. These should be considered approximate due to the uncertainties related to material definitions. High energy generation rates within electronics or turbines require the use of materials with high thermal conductivity such as copper "(see: Copper in heat exchangers)", aluminium, and silver. On the other hand, materials with low thermal conductance, such as polystyrene foam and fire brick, are used in building construction or in furnaces in an effort to slow the flow of heat, i.e. for insulation purposes. The reciprocal of thermal conductivity is "thermal resistivity", usually expressed in kelvin-meters per watt (K⋅m⋅W). For a
Thermal conductivity cause thermal resistance. At high temperatures ("T" > Θ), the mean free path and therefore "λ" has a temperature dependence "T", to which one arrives from formula formula_48 by making the following approximation formula_50 and writing formula_51. This dependency is known as Eucken's law and originates from the temperature dependency of the probability for the U-process to occur. Thermal conductivity is usually described by the Boltzmann equation with the relaxation time approximation in which phonon scattering is a limiting factor. Another approach is to use analytic models or molecular dynamics or Monte Carlo based methods to describe thermal conductivity in