High-pressure area of their associated cold fronts. The stronger the pressure difference, or pressure gradient, between a high-pressure system and a low-pressure system, the stronger the wind. The coriolis force caused by the Earth's rotation is what gives winds within high-pressure systems their clockwise circulation in the northern hemisphere (as the wind moves outward and is deflected right from the center of high pressure) and counterclockwise circulation in the southern hemisphere (as the wind moves outward and is deflected left from the center of high pressure). Friction with land slows down the wind flowing out of high-pressure systems and causes wind to
Low pressure molding Low pressure molding Low Pressure Molding (LPM) with polyamide and polyolefin (hot-melt) materials is a process typically used to encapsulate and environmentally protect electronic components (such as circuit boards). The purpose is to protect electronics against moisture, dust dirt and vibration. Low Pressure Molding is also used for sealing connectors and molding grommets and strain reliefs. Key to this process are the raw materials and specialized molding equipment. Dimer acid based polyamide materials, better known as hot-melts, are used as molding compounds. They are thermoplastics i.e. the material, when heated, becomes less viscous and is able to re-shaped, then hardens