Dip soldering a small tank containing molten solder. PCB with mounted components is dipped manually into the tank when the molten solder sticks to the exposed metallic areas of the board. Dip soldering is accomplished by submerging parts to be joined into a molten solder bath. Thus, all components surfaces are coated with filler metal. Solders have low surface tension and high wetting capability. There are many types of solders, each used for different applications. Such as Lead-Silver for strength at higher than room temperature. Tin-Lead is used for General Purpose; Tin-Zinc is used for Aluminum; Cadmium-Silver is used for strength at
C-element slow environment. Note that the definition of C-element can be easily generalized for multiple-valued logic or even for continuous signals: For example, the truth table for a balanced ternary C-element with two inputs is Depending on the requirements to the switching speed and power consumption, the C-element can be realized as a coarse- or fine-grain circuit. Also, one should distinguish between single-output and differential realizations of C-element. Differential realization is possible using only NANDs (only NORs). A single-output realization is workable if and only if: There is a number of different single-output circuits of C-element built on logic gates. In