Dip soldering a small tank containing molten solder. PCB with mounted components is dipped manually into the tank when the molten solder sticks to the exposed metallic areas of the board. Dip soldering is accomplished by submerging parts to be joined into a molten solder bath. Thus, all components surfaces are coated with filler metal. Solders have low surface tension and high wetting capability. There are many types of solders, each used for different applications. Such as Lead-Silver for strength at higher than room temperature. Tin-Lead is used for General Purpose; Tin-Zinc is used for Aluminum; Cadmium-Silver is used for strength at
Asymmetric C-element into account the common and the asymmetric minus inputs. All these inputs must be low for the down transition to happen. The figure shows the gate-level and transistor-level implementations and symbol of the asymmetric C-element. In the figure the plus inputs are marked with a 'P', the minus inputs are marked with an 'm' and the common inputs are marked with a 'C'. In addition, it is possible to extend the asymmetric input convention to inverted C-elements, where a plus (minus) on an input port means that an input is required for the inverted output to fall (rise). Asymmetric C-element