Post-transition metal packing structure. Tin forms Zintl phases such as NaSn, BaSn, KSn and CaSn. It has good corrosion resistance in air on account of forming a thin protective oxide layer. Pure tin has no structural uses. It is used in lead-free solders, and as a hardening agent in alloys of other metals, such as copper, lead, titanium and zinc. Lead is a soft metal (MH 1.5, but hardens close to melting) which, in many cases, is unable to support its own weight. It has a close-packed structure (BCN 12) but an abnormally large inter-atomic distance that has been attributed to partial
C-element slow environment. Note that the definition of C-element can be easily generalized for multiple-valued logic or even for continuous signals: For example, the truth table for a balanced ternary C-element with two inputs is Depending on the requirements to the switching speed and power consumption, the C-element can be realized as a coarse- or fine-grain circuit. Also, one should distinguish between single-output and differential realizations of C-element. Differential realization is possible using only NANDs (only NORs). A single-output realization is workable if and only if: There is a number of different single-output circuits of C-element built on logic gates. In