Dip soldering a small tank containing molten solder. PCB with mounted components is dipped manually into the tank when the molten solder sticks to the exposed metallic areas of the board. Dip soldering is accomplished by submerging parts to be joined into a molten solder bath. Thus, all components surfaces are coated with filler metal. Solders have low surface tension and high wetting capability. There are many types of solders, each used for different applications. Such as Lead-Silver for strength at higher than room temperature. Tin-Lead is used for General Purpose; Tin-Zinc is used for Aluminum; Cadmium-Silver is used for strength at
Glass-to-metal seal for nickel and iron and their alloys. This is achieved by heating the metal in vacuum or sometimes in hydrogen atmosphere or in some cases even in air at temperatures above those used during the sealing process. Oxidizing of the metal surface also reduces gas evolution. Most of the evolved gas is produced due to the presence of carbon impurities in the metals; these can be removed by heating in hydrogen. The glass-oxide bond is stronger than glass-metal. The oxide forms a layer on the metal surface, with the proportion of oxygen changing from zero in the metal to the