Post-transition metal packing structure. Tin forms Zintl phases such as NaSn, BaSn, KSn and CaSn. It has good corrosion resistance in air on account of forming a thin protective oxide layer. Pure tin has no structural uses. It is used in lead-free solders, and as a hardening agent in alloys of other metals, such as copper, lead, titanium and zinc. Lead is a soft metal (MH 1.5, but hardens close to melting) which, in many cases, is unable to support its own weight. It has a close-packed structure (BCN 12) but an abnormally large inter-atomic distance that has been attributed to partial
C-element known, the C-element can be realized as a sum-of-product (SOP) circuit . Earlier techniques for implementing the C-element include Schmidt trigger, Eccles-Jordan flip-flop and last moving point flip-flop. For two input signals the C-element is defined by the equation formula_1, which corresponds to the following truth table: This table can be turned into a circuit using the Karnaugh map. However, the obtained implementation is naive, since nothing is said about delay assumptions. To understand under what conditions the obtained circuit is workable, it is necessary to do additional analysis, which reveals that Thus, the naive implementation is correct "only" for