Soldering other precipitation may wash the lead into the groundwater. Unfortunately, most lead-free solders are not eutectic formulations, melting at around , making it more difficult to create reliable joints with them. Other common solders include low-temperature formulations (often containing bismuth), which are often used to join previously-soldered assemblies without unsoldering earlier connections, and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations. Alloying silver with other metals changes the melting point, adhesion and wetting characteristics, and tensile strength. Of all the brazing alloys, silver
C-element by Varshavsky et al. Semistatic C-element stores its previous state using two cross-coupled inverters, similar to an SRAM cell. One of the inverters is weaker than the rest of the circuit, so it can be overpowered by the pull-up and pull-down networks. If both inputs are 0, then the pull-up network changes the latch's state, and the C-element outputs a 0. If both inputs are 1, then the pull-down network changes the latch's state, making the C-element output a 1. Otherwise, the input of the latch is not connected to either formula_4 or ground, and so the weak inverter dominates