Dip soldering a small tank containing molten solder. PCB with mounted components is dipped manually into the tank when the molten solder sticks to the exposed metallic areas of the board. Dip soldering is accomplished by submerging parts to be joined into a molten solder bath. Thus, all components surfaces are coated with filler metal. Solders have low surface tension and high wetting capability. There are many types of solders, each used for different applications. Such as Lead-Silver for strength at higher than room temperature. Tin-Lead is used for General Purpose; Tin-Zinc is used for Aluminum; Cadmium-Silver is used for strength at
C-element particular, the so-called Maevsky's implementation is a non-distributive circuit loosely based on. Non-distributivity is introduced sometimes to increase concurrency. The 3NAND gate in this circuit can be replaced by two 2NAND gates. The C-element using only two-input gates has been proposed by Tsirlin and then synthesized by Starodoubtsev et al. using Taxogram language. This circuit coincides with that attributed (without reference) to Bartky and can operate without the input latch. Yet another version of the C-element built on two RS latches has been synthesized by Murphy using Petrify tool. However, this circuit includes inverter connected to one if the inputs.