Post-transition metal packing structure. Tin forms Zintl phases such as NaSn, BaSn, KSn and CaSn. It has good corrosion resistance in air on account of forming a thin protective oxide layer. Pure tin has no structural uses. It is used in lead-free solders, and as a hardening agent in alloys of other metals, such as copper, lead, titanium and zinc. Lead is a soft metal (MH 1.5, but hardens close to melting) which, in many cases, is unable to support its own weight. It has a close-packed structure (BCN 12) but an abnormally large inter-atomic distance that has been attributed to partial
Distributed element circuit led to wider applications. Distributed element circuits are those circuits designed using the distributed element model. This model is an alternative to the lumped element model in which the passive electrical elements of electrical resistance, capacitance and inductance are assumed to be "lumped" at one point in space in, respectively, a resistor, capacitor or inductor lumped component. The distributed element model is used when this assumption no longer holds and those quantities are considered to be distributed in space. The assumption breaks down when there is a significant time taken for electromagnetic waves to travel from one terminal of the