Post-transition metal packing structure. Tin forms Zintl phases such as NaSn, BaSn, KSn and CaSn. It has good corrosion resistance in air on account of forming a thin protective oxide layer. Pure tin has no structural uses. It is used in lead-free solders, and as a hardening agent in alloys of other metals, such as copper, lead, titanium and zinc. Lead is a soft metal (MH 1.5, but hardens close to melting) which, in many cases, is unable to support its own weight. It has a close-packed structure (BCN 12) but an abnormally large inter-atomic distance that has been attributed to partial
C-element and the latch outputs its previous state. There are also versions of semistatic C-element built on devices with negative differential resistance (NDR). It should be noted however, that NDR is usually defined for small signal. So, it is difficult to expect that such a C-element will operate in full range of voltages or currents. Since the majority gate is a particular case of threshold gate, any of known realizations of threshold gate can in principle be used for building a C-element. In the multiple-valued case, however, connecting the output of majority gate to one or several inputs may have no