Dip soldering a small tank containing molten solder. PCB with mounted components is dipped manually into the tank when the molten solder sticks to the exposed metallic areas of the board. Dip soldering is accomplished by submerging parts to be joined into a molten solder bath. Thus, all components surfaces are coated with filler metal. Solders have low surface tension and high wetting capability. There are many types of solders, each used for different applications. Such as Lead-Silver for strength at higher than room temperature. Tin-Lead is used for General Purpose; Tin-Zinc is used for Aluminum; Cadmium-Silver is used for strength at
C-element by Varshavsky et al. Semistatic C-element stores its previous state using two cross-coupled inverters, similar to an SRAM cell. One of the inverters is weaker than the rest of the circuit, so it can be overpowered by the pull-up and pull-down networks. If both inputs are 0, then the pull-up network changes the latch's state, and the C-element outputs a 0. If both inputs are 1, then the pull-down network changes the latch's state, making the C-element output a 1. Otherwise, the input of the latch is not connected to either formula_4 or ground, and so the weak inverter dominates