Soldering other precipitation may wash the lead into the groundwater. Unfortunately, most lead-free solders are not eutectic formulations, melting at around , making it more difficult to create reliable joints with them. Other common solders include low-temperature formulations (often containing bismuth), which are often used to join previously-soldered assemblies without unsoldering earlier connections, and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations. Alloying silver with other metals changes the melting point, adhesion and wetting characteristics, and tensile strength. Of all the brazing alloys, silver
Liquid metal (Fr)(estimated at 27 °C [81 °F]), and gallium (Ga)(30 °C [86 °F]). Alloy systems that are liquid at room temperature have thermal conductivity far superior to ordinary non-metallic liquids, allowing liquid metal to efficiently transfer energy from the heat source to the liquid. They also have a higher electrical conductivity that allows the liquid to be pumped by more efficient, electromagnetic pumps. This results in the use of these materials for specific heat conducting and/or dissipation applications. Another advantage of liquid alloy systems is their inherent high densities. Once oxides have been removed from the substrate surface, most liquid metals