Low-pressure area This generates a steady wind blowing toward the land, bringing the moist near-surface air over the oceans with it. Similar rainfall is caused by the moist ocean-air being lifted upwards by mountains, surface heating, convergence at the surface, divergence aloft, or from storm-produced outflows at the surface. However the lifting occurs, the air cools due to expansion in lower pressure, which in turn produces condensation. In winter, the land cools off quickly, but the ocean keeps the heat longer due to its higher specific heat. The hot air over the ocean rises, creating a low-pressure area and a breeze from
Low pressure molding Low pressure molding Low Pressure Molding (LPM) with polyamide and polyolefin (hot-melt) materials is a process typically used to encapsulate and environmentally protect electronic components (such as circuit boards). The purpose is to protect electronics against moisture, dust dirt and vibration. Low Pressure Molding is also used for sealing connectors and molding grommets and strain reliefs. Key to this process are the raw materials and specialized molding equipment. Dimer acid based polyamide materials, better known as hot-melts, are used as molding compounds. They are thermoplastics i.e. the material, when heated, becomes less viscous and is able to re-shaped, then hardens