High-pressure area radiation and temperatures rise. At night, the absence of clouds means that outgoing longwave radiation (i.e. heat energy from the surface) is not absorbed, giving cooler diurnal low temperatures in all seasons. When surface winds become light, the subsidence produced directly under a high-pressure system can lead to a buildup of particulates in urban areas under the ridge, leading to widespread haze. If the low level relative humidity rises towards 100 percent overnight, fog can form. Strong, vertically shallow high-pressure systems moving from higher latitudes to lower latitudes in the northern hemisphere are associated with continental arctic air masses. Once
Low pressure molding Low pressure molding Low Pressure Molding (LPM) with polyamide and polyolefin (hot-melt) materials is a process typically used to encapsulate and environmentally protect electronic components (such as circuit boards). The purpose is to protect electronics against moisture, dust dirt and vibration. Low Pressure Molding is also used for sealing connectors and molding grommets and strain reliefs. Key to this process are the raw materials and specialized molding equipment. Dimer acid based polyamide materials, better known as hot-melts, are used as molding compounds. They are thermoplastics i.e. the material, when heated, becomes less viscous and is able to re-shaped, then hardens