Tahini cuneiform document written 4000 years ago that describes the custom of serving the gods sesame wine. The historian Herodotus writes about the cultivation of sesame 3500 years ago in the region of the Tigris and Euphrates in Mesopotamia. It was mainly used as a source of oil. Tahini is mentioned as an ingredient of "hummus kasa", a recipe transcribed in an anonymous 13th-century Arabic cookbook, "Kitab Wasf al-Atima al-Mutada". Sesame paste is an ingredient in some Chinese and Japanese dishes; Sichuan cuisine uses it in some recipes for dandan noodles. Sesame paste is also used in Indian cuisine. In the
Solder paste Solder paste Solder paste (or solder cream) is a material used in the manufacture of printed circuit boards to connect surface mount components to pads on the board. It is also possible to solder through hole pin in paste components by printing solder paste in/over the holes. The paste initially adheres components in place by being sticky, it is then heated (along with the rest of the board) melting the paste and forming a mechanical bond as well as an electrical connection. The paste is applied to the board by jet printing, stencil printing or syringe and then the components