TO-3 at Motorola around 1955. The lead spacing was originally intended to allow plugging the device into a then-common tube socket. The metal package can be attached to a heat sink, making it suitable for devices dissipating several watts of heat. Thermal compound is used to improve heat transfer between the device case and the heat sink. Since the device case is one of the electrical connections, an insulator may be required to electrically isolate the component from the heatsink. Insulating washers may be made of mica or other materials with good thermal conductivity. The case is used with high-power and
Hard and soft C or an alveolo-palatal , and occurs before not only , and , but also , , and . Another similar system with hard and soft is found in Faroese with the hard being and the soft being , and Turkish where the soft is . The Vietnamese alphabet does not have a hard or a soft per se. However, since it was inherited from European languages, the letter never occurs in "soft positions", i.e. before , and where is used instead, while never occurs elsewhere except in the digraph and a few loanwords. Hồ Chí Minh had proposed a simplified