Dip soldering a small tank containing molten solder. PCB with mounted components is dipped manually into the tank when the molten solder sticks to the exposed metallic areas of the board. Dip soldering is accomplished by submerging parts to be joined into a molten solder bath. Thus, all components surfaces are coated with filler metal. Solders have low surface tension and high wetting capability. There are many types of solders, each used for different applications. Such as Lead-Silver for strength at higher than room temperature. Tin-Lead is used for General Purpose; Tin-Zinc is used for Aluminum; Cadmium-Silver is used for strength at
Parasitic element (electrical networks) is not always adequate. For instance, the inter-winding capacitance mentioned above is really a distributed element along the whole length of the winding and not a capacitor in one particular place. Designers sometimes take advantage of parasitic effects to achieve a function in a component, see for instance helical resonator. Non-linear parasitic elements can also arise. The term is commonly used to describe parasitic structures formed on an integrated circuit whereby an unwanted semiconductor device is formed from p-n junctions which belong to two or more intended devices or functions. Parasitic element (electrical networks) In electrical networks, a parasitic element