Dip soldering a small tank containing molten solder. PCB with mounted components is dipped manually into the tank when the molten solder sticks to the exposed metallic areas of the board. Dip soldering is accomplished by submerging parts to be joined into a molten solder bath. Thus, all components surfaces are coated with filler metal. Solders have low surface tension and high wetting capability. There are many types of solders, each used for different applications. Such as Lead-Silver for strength at higher than room temperature. Tin-Lead is used for General Purpose; Tin-Zinc is used for Aluminum; Cadmium-Silver is used for strength at
C-element known, the C-element can be realized as a sum-of-product (SOP) circuit . Earlier techniques for implementing the C-element include Schmidt trigger, Eccles-Jordan flip-flop and last moving point flip-flop. For two input signals the C-element is defined by the equation formula_1, which corresponds to the following truth table: This table can be turned into a circuit using the Karnaugh map. However, the obtained implementation is naive, since nothing is said about delay assumptions. To understand under what conditions the obtained circuit is workable, it is necessary to do additional analysis, which reveals that Thus, the naive implementation is correct "only" for