Dip soldering a small tank containing molten solder. PCB with mounted components is dipped manually into the tank when the molten solder sticks to the exposed metallic areas of the board. Dip soldering is accomplished by submerging parts to be joined into a molten solder bath. Thus, all components surfaces are coated with filler metal. Solders have low surface tension and high wetting capability. There are many types of solders, each used for different applications. Such as Lead-Silver for strength at higher than room temperature. Tin-Lead is used for General Purpose; Tin-Zinc is used for Aluminum; Cadmium-Silver is used for strength at
Period 6 element with a hard-steel hacksaw. The unalloyed elemental form is used mainly in electrical applications. Tungsten's many alloys have numerous applications, most notably in incandescent light bulb filaments, X-ray tubes (as both the filament and target), electrodes in TIG welding, and superalloys. Tungsten's hardness and high density give it military applications in penetrating projectiles. Tungsten compounds are most often used industrially as catalysts. Tungsten is the only metal from the third transition series that is known to occur in biomolecules, where it is used in a few species of bacteria. It is the heaviest element known to be used by any