Low-pressure area mesocyclones, but more often develop from environments of high instability and low vertical wind shear. In deserts, lack of ground and plant moisture that would normally provide evaporative cooling can lead to intense, rapid solar heating of the lower layers of air. The hot air is less dense than surrounding cooler air. This, combined with the rising of the hot air, results in a low-pressure area called a thermal low. Monsoon circulations are caused by thermal lows which form over large areas of land and their strength is driven by how land heats more quickly than the surrounding nearby ocean.
Low pressure molding to keep the desired form upon cooling down. These polyamide materials differ from other thermoplastics in two main areas: One: Viscosity: At processing temperature (410F/210C) the viscosity is very low, typically around 3,000 centipoise (similar to pancake syrup). Low viscosity materials require low injection pressure in order to inject into a cavity. In fact it is normal to use a simple gear pump to inject the polyamide material. Low injection pressure is paramount, when over-molding relatively fragile electronic component. Two: Adhesion: Polyamide materials are basically high performance hot-melt adhesives. The adhesive properties of polyamide is what seals a chosen substrate.