Copper greater strength than monocrystalline forms. The softness of copper partly explains its high electrical conductivity (59.6×10 S/m) and high thermal conductivity, second highest (second only to silver) among pure metals at room temperature. This is because the resistivity to electron transport in metals at room temperature originates primarily from scattering of electrons on thermal vibrations of the lattice, which are relatively weak in a soft metal. The maximum permissible current density of copper in open air is approximately 3.1×10 A/m of cross-sectional area, above which it begins to heat excessively. Copper is one of a few metallic elements with a
Thermal resistance be derived, and is valid as long as all of the parameters (x and k) are constant throughout the sample. where: A 2008 review paper written by Philips researcher Clemens J. M. Lasance notes that: "Although there is an analogy between heat flow by conduction (Fourier’s law) and the flow of an electric current (Ohm’s law), the corresponding physical properties of thermal conductivity and electrical conductivity conspire to make the behavior of heat flow quite unlike the flow of electricity in normal situations. [...] Unfortunately, although the electrical and thermal differential equations are analogous, it is erroneous to conclude that