TO-3 at Motorola around 1955. The lead spacing was originally intended to allow plugging the device into a then-common tube socket. The metal package can be attached to a heat sink, making it suitable for devices dissipating several watts of heat. Thermal compound is used to improve heat transfer between the device case and the heat sink. Since the device case is one of the electrical connections, an insulator may be required to electrically isolate the component from the heatsink. Insulating washers may be made of mica or other materials with good thermal conductivity. The case is used with high-power and
C-element and the latch outputs its previous state. There are also versions of semistatic C-element built on devices with negative differential resistance (NDR). It should be noted however, that NDR is usually defined for small signal. So, it is difficult to expect that such a C-element will operate in full range of voltages or currents. Since the majority gate is a particular case of threshold gate, any of known realizations of threshold gate can in principle be used for building a C-element. In the multiple-valued case, however, connecting the output of majority gate to one or several inputs may have no