Tahini cuneiform document written 4000 years ago that describes the custom of serving the gods sesame wine. The historian Herodotus writes about the cultivation of sesame 3500 years ago in the region of the Tigris and Euphrates in Mesopotamia. It was mainly used as a source of oil. Tahini is mentioned as an ingredient of "hummus kasa", a recipe transcribed in an anonymous 13th-century Arabic cookbook, "Kitab Wasf al-Atima al-Mutada". Sesame paste is an ingredient in some Chinese and Japanese dishes; Sichuan cuisine uses it in some recipes for dandan noodles. Sesame paste is also used in Indian cuisine. In the
Solder paste However, these pastes need a very clean assembly environment and may need an inert reflow environment. In using solder paste for circuit assemblies, one needs to test and understand the various rheological properties of a solder paste. Solder paste is typically used in a stencil-printing process, in which paste is deposited over a stainless steel or polyester mask to create the desired pattern on a printed circuit board. The paste may be dispensed pneumatically, by pin transfer (where a grid of pins is dipped in solder paste and then applied to the board), or by jet printing (where the paste