Low-pressure area mesocyclones, but more often develop from environments of high instability and low vertical wind shear. In deserts, lack of ground and plant moisture that would normally provide evaporative cooling can lead to intense, rapid solar heating of the lower layers of air. The hot air is less dense than surrounding cooler air. This, combined with the rising of the hot air, results in a low-pressure area called a thermal low. Monsoon circulations are caused by thermal lows which form over large areas of land and their strength is driven by how land heats more quickly than the surrounding nearby ocean.
Low pressure molding Millions of circuit boards are successfully over-molded without causing any harm in the process. A low injection pressure does not stress a fragile solder joint. Low Pressure Molding process was initially invented in Europe in the 1970s by adhesives companies like Henkel AG & Co. KGaA in Germany and Bostik in France to seal connectors and create strain reliefs for wires. The first commercial use of the Low Pressure Molding process was in the automotive industry. The driving force was to replace toxic and cumbersome potting processes, faster cycle times, lighter parts and environmentally safe components and for some applications