Dip soldering a small tank containing molten solder. PCB with mounted components is dipped manually into the tank when the molten solder sticks to the exposed metallic areas of the board. Dip soldering is accomplished by submerging parts to be joined into a molten solder bath. Thus, all components surfaces are coated with filler metal. Solders have low surface tension and high wetting capability. There are many types of solders, each used for different applications. Such as Lead-Silver for strength at higher than room temperature. Tin-Lead is used for General Purpose; Tin-Zinc is used for Aluminum; Cadmium-Silver is used for strength at
Electrical element and they are assumed to have ideal properties, while actual electrical components have less than ideal properties, a degree of uncertainty in their values and some degree of nonlinearity. To model the nonideal behavior of a real circuit component may require a combination of multiple ideal electrical elements in order to approximate its function. For example, an inductor circuit element is assumed to have inductance but no resistance or capacitance, while a real inductor, a coil of wire, has some resistance in addition to its inductance. This may be modeled by an ideal inductance element in series with a resistance.