Low-pressure area it rises, although the low-pressure area typically brings cloudy skies, which act to minimize diurnal temperature extremes. Since clouds reflect sunlight, incoming shortwave solar radiation decreases, which causes lower temperatures during the day. At night the absorptive effect of clouds on outgoing longwave radiation, such as heat energy from the surface, allows for warmer diurnal low temperatures in all seasons. The stronger the area of low pressure, the stronger the winds experienced in its vicinity. Globally, low-pressure systems are most frequently located over the Tibetan Plateau and in the lee of the Rocky mountains. In Europe (particularly in the British
Low pressure molding Low pressure molding Low Pressure Molding (LPM) with polyamide and polyolefin (hot-melt) materials is a process typically used to encapsulate and environmentally protect electronic components (such as circuit boards). The purpose is to protect electronics against moisture, dust dirt and vibration. Low Pressure Molding is also used for sealing connectors and molding grommets and strain reliefs. Key to this process are the raw materials and specialized molding equipment. Dimer acid based polyamide materials, better known as hot-melts, are used as molding compounds. They are thermoplastics i.e. the material, when heated, becomes less viscous and is able to re-shaped, then hardens