Soldering each type of solder and alloy has different melting temperatures. The term "silver solder" denotes the type of solder that is used. Some soft solders are "silver-bearing" alloys used to solder silver-plated items. Lead-based solders should not be used on precious metals because the lead dissolves the metal and disfigures it. The distinction between soldering and brazing is based on the melting temperature of the filler alloy. A temperature of 450 °C is usually used as a practical demarcation between soldering and brazing. Soft soldering can be done with a heated iron whereas the other methods typically require a higher
C-rich stability element been mapped to a pyrimidine-rich segment of its 3' UTR. This region confers stability by directing the assembly of a specific alpha ribonucleoprotein complex at this site. Subsequently Holcik and Liebhaber identified three other highly stable eukaryotic mRNAs that assemble the alpha globin protein complex at homologous pyrimidine-rich regions within their 3'UTRs (rabbit lipoxygenase, rat tyrosine hydroxylase, and human alpha(I)-collagen). There is some debate as to the number and identity of trans-acting factors recruited to the C-rich element. However the alpha globin poly(C)-binding protein (alphaCP) is agreed to be the core constituent of what is known as the alpha complex.