TO-3 at Motorola around 1955. The lead spacing was originally intended to allow plugging the device into a then-common tube socket. The metal package can be attached to a heat sink, making it suitable for devices dissipating several watts of heat. Thermal compound is used to improve heat transfer between the device case and the heat sink. Since the device case is one of the electrical connections, an insulator may be required to electrically isolate the component from the heatsink. Insulating washers may be made of mica or other materials with good thermal conductivity. The case is used with high-power and
C-rich stability element been mapped to a pyrimidine-rich segment of its 3' UTR. This region confers stability by directing the assembly of a specific alpha ribonucleoprotein complex at this site. Subsequently Holcik and Liebhaber identified three other highly stable eukaryotic mRNAs that assemble the alpha globin protein complex at homologous pyrimidine-rich regions within their 3'UTRs (rabbit lipoxygenase, rat tyrosine hydroxylase, and human alpha(I)-collagen). There is some debate as to the number and identity of trans-acting factors recruited to the C-rich element. However the alpha globin poly(C)-binding protein (alphaCP) is agreed to be the core constituent of what is known as the alpha complex.