Thermal conductivity the list of thermal conductivities. These should be considered approximate due to the uncertainties related to material definitions. High energy generation rates within electronics or turbines require the use of materials with high thermal conductivity such as copper "(see: Copper in heat exchangers)", aluminium, and silver. On the other hand, materials with low thermal conductance, such as polystyrene foam and fire brick, are used in building construction or in furnaces in an effort to slow the flow of heat, i.e. for insulation purposes. The reciprocal of thermal conductivity is "thermal resistivity", usually expressed in kelvin-meters per watt (K⋅m⋅W). For a
Chemical bond freely-moving or delocalization of bonding electrons leads to classical metallic properties such as luster (surface light reflectivity), electrical and thermal conductivity, ductility, and high tensile strength. There are four basic types of bonds that can be formed between two or more (otherwise non-associated) molecules, ions or atoms. Intermolecular forces cause molecules to be attracted or repulsed by each other. Often, these define some of the physical characteristics (such as the melting point) of a substance. In the (unrealistic) limit of "pure" ionic bonding, electrons are perfectly localized on one of the two atoms in the bond. Such bonds can be