TO-3 at Motorola around 1955. The lead spacing was originally intended to allow plugging the device into a then-common tube socket. The metal package can be attached to a heat sink, making it suitable for devices dissipating several watts of heat. Thermal compound is used to improve heat transfer between the device case and the heat sink. Since the device case is one of the electrical connections, an insulator may be required to electrically isolate the component from the heatsink. Insulating washers may be made of mica or other materials with good thermal conductivity. The case is used with high-power and
Glass-to-metal seal for nickel and iron and their alloys. This is achieved by heating the metal in vacuum or sometimes in hydrogen atmosphere or in some cases even in air at temperatures above those used during the sealing process. Oxidizing of the metal surface also reduces gas evolution. Most of the evolved gas is produced due to the presence of carbon impurities in the metals; these can be removed by heating in hydrogen. The glass-oxide bond is stronger than glass-metal. The oxide forms a layer on the metal surface, with the proportion of oxygen changing from zero in the metal to the