Thermal conductivity the list of thermal conductivities. These should be considered approximate due to the uncertainties related to material definitions. High energy generation rates within electronics or turbines require the use of materials with high thermal conductivity such as copper "(see: Copper in heat exchangers)", aluminium, and silver. On the other hand, materials with low thermal conductance, such as polystyrene foam and fire brick, are used in building construction or in furnaces in an effort to slow the flow of heat, i.e. for insulation purposes. The reciprocal of thermal conductivity is "thermal resistivity", usually expressed in kelvin-meters per watt (K⋅m⋅W). For a
Two-dimensional materials material. This is due to the two forms of molybdenum sulfide monolayers having different electrical properties. The 1T polymorph of molybednum sulfide is metallic in character while the 2H form is more semiconducting. However, molybdenum disulfide layers produced by electrochemical lithium intercalation are predominantly 1T and thus metallic in character as there is no conversion to the 2H form from the 1T form. The thermal conductivity of molybdenum disulfide monolayers at room temperature is 34.5W/mK while the thermal conductivity of few-layer molybdenum disulfide is 52W/mK. The thermal conductivity of graphene, on the other hand, is 5300W/mK. Due to the rather