Low-pressure area area of wind divergence aloft occurs ahead of embedded shortwave troughs, which are of smaller wavelength. Diverging winds aloft ahead of these troughs cause atmospheric lift within the troposphere below, which lowers surface pressures as upward motion partially counteracts the force of gravity. Thermal lows form due to localized heating caused by greater sunshine over deserts and other land masses. Since localized areas of warm air are less dense than their surroundings, this warmer air rises, which lowers atmospheric pressure near that portion of the Earth's surface. Large-scale thermal lows over continents help drive monsoon circulations. Low-pressure areas can also
Low pressure molding Low pressure molding Low Pressure Molding (LPM) with polyamide and polyolefin (hot-melt) materials is a process typically used to encapsulate and environmentally protect electronic components (such as circuit boards). The purpose is to protect electronics against moisture, dust dirt and vibration. Low Pressure Molding is also used for sealing connectors and molding grommets and strain reliefs. Key to this process are the raw materials and specialized molding equipment. Dimer acid based polyamide materials, better known as hot-melts, are used as molding compounds. They are thermoplastics i.e. the material, when heated, becomes less viscous and is able to re-shaped, then hardens