Post-transition metal packing structure. Tin forms Zintl phases such as NaSn, BaSn, KSn and CaSn. It has good corrosion resistance in air on account of forming a thin protective oxide layer. Pure tin has no structural uses. It is used in lead-free solders, and as a hardening agent in alloys of other metals, such as copper, lead, titanium and zinc. Lead is a soft metal (MH 1.5, but hardens close to melting) which, in many cases, is unable to support its own weight. It has a close-packed structure (BCN 12) but an abnormally large inter-atomic distance that has been attributed to partial
C-element by Varshavsky et al. Semistatic C-element stores its previous state using two cross-coupled inverters, similar to an SRAM cell. One of the inverters is weaker than the rest of the circuit, so it can be overpowered by the pull-up and pull-down networks. If both inputs are 0, then the pull-up network changes the latch's state, and the C-element outputs a 0. If both inputs are 1, then the pull-down network changes the latch's state, making the C-element output a 1. Otherwise, the input of the latch is not connected to either formula_4 or ground, and so the weak inverter dominates