Copper greater strength than monocrystalline forms. The softness of copper partly explains its high electrical conductivity (59.6×10 S/m) and high thermal conductivity, second highest (second only to silver) among pure metals at room temperature. This is because the resistivity to electron transport in metals at room temperature originates primarily from scattering of electrons on thermal vibrations of the lattice, which are relatively weak in a soft metal. The maximum permissible current density of copper in open air is approximately 3.1×10 A/m of cross-sectional area, above which it begins to heat excessively. Copper is one of a few metallic elements with a
Thermal management (electronics) by the product of R and C. This quantity can be used to calculate the dynamic heat dissipation capability of a device, in an analogous way to the electrical case. A thermal interface material or mastic (aka TIM) is used to fill the gaps between thermal transfer surfaces, such as between microprocessors and heatsinks, in order to increase thermal transfer efficiency. It has a higher thermal conductivity value in Z-direction than xy-direction. Due to recent technological developments and public interest, the retail heat sink market has reached an all-time high. In the early 2000s, CPUs were produced that emitted more