Dip soldering a small tank containing molten solder. PCB with mounted components is dipped manually into the tank when the molten solder sticks to the exposed metallic areas of the board. Dip soldering is accomplished by submerging parts to be joined into a molten solder bath. Thus, all components surfaces are coated with filler metal. Solders have low surface tension and high wetting capability. There are many types of solders, each used for different applications. Such as Lead-Silver for strength at higher than room temperature. Tin-Lead is used for General Purpose; Tin-Zinc is used for Aluminum; Cadmium-Silver is used for strength at
Distributed element circuit led to wider applications. Distributed element circuits are those circuits designed using the distributed element model. This model is an alternative to the lumped element model in which the passive electrical elements of electrical resistance, capacitance and inductance are assumed to be "lumped" at one point in space in, respectively, a resistor, capacitor or inductor lumped component. The distributed element model is used when this assumption no longer holds and those quantities are considered to be distributed in space. The assumption breaks down when there is a significant time taken for electromagnetic waves to travel from one terminal of the