Soldering other precipitation may wash the lead into the groundwater. Unfortunately, most lead-free solders are not eutectic formulations, melting at around , making it more difficult to create reliable joints with them. Other common solders include low-temperature formulations (often containing bismuth), which are often used to join previously-soldered assemblies without unsoldering earlier connections, and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations. Alloying silver with other metals changes the melting point, adhesion and wetting characteristics, and tensile strength. Of all the brazing alloys, silver
Parasitic element (electrical networks) Parasitic element (electrical networks) In electrical networks, a parasitic element is a circuit element (resistance, inductance or capacitance) that is possessed by an electrical component but which it is not desirable for it to have for its intended purpose. For instance, a resistor is designed to possess resistance, but will also possess unwanted parasitic capacitance. Parasitic elements are unavoidable. All conductors possess resistance and inductance and the principles of duality ensure that where there is inductance, there will also be capacitance. Component designers will strive to minimise parasitic elements but are unable to completely eliminate them. The most commonly seen