Dip soldering a small tank containing molten solder. PCB with mounted components is dipped manually into the tank when the molten solder sticks to the exposed metallic areas of the board. Dip soldering is accomplished by submerging parts to be joined into a molten solder bath. Thus, all components surfaces are coated with filler metal. Solders have low surface tension and high wetting capability. There are many types of solders, each used for different applications. Such as Lead-Silver for strength at higher than room temperature. Tin-Lead is used for General Purpose; Tin-Zinc is used for Aluminum; Cadmium-Silver is used for strength at
Electrical element defined by a relation between the state variables of the network: current, formula_1; voltage, formula_2, charge, formula_3; and magnetic flux, formula_4. In reality, all circuit components are non-linear and can only be approximated to linear over a certain range. To more exactly describe the passive elements, their constitutive relation is used instead of simple proportionality. From any two of the circuit variables there are six constitutive relations that can be formed. From this it is supposed that there is a theoretical fourth passive element since there are only five elements in total (not including the various dependent sources) found in