Soldering (see RoHS), has led to a change in formulation of both solders and fluxes. Water-soluble non-rosin-based fluxes have been increasingly used since the 1980s so that soldered boards can be cleaned with water or water-based cleaners. This eliminates hazardous solvents from the production environment, and from factory effluents. Those regulations have also reduced the use of lead based solders, and caused the melting temperatures of solders in use to increase by up to . "Hot-bar reflow" is a selective soldering process where two pre-fluxed, solder coated parts are heated with heating element (called a thermode) to a sufficient temperature to
Glass-to-metal seal for nickel and iron and their alloys. This is achieved by heating the metal in vacuum or sometimes in hydrogen atmosphere or in some cases even in air at temperatures above those used during the sealing process. Oxidizing of the metal surface also reduces gas evolution. Most of the evolved gas is produced due to the presence of carbon impurities in the metals; these can be removed by heating in hydrogen. The glass-oxide bond is stronger than glass-metal. The oxide forms a layer on the metal surface, with the proportion of oxygen changing from zero in the metal to the