TO-3 at Motorola around 1955. The lead spacing was originally intended to allow plugging the device into a then-common tube socket. The metal package can be attached to a heat sink, making it suitable for devices dissipating several watts of heat. Thermal compound is used to improve heat transfer between the device case and the heat sink. Since the device case is one of the electrical connections, an insulator may be required to electrically isolate the component from the heatsink. Insulating washers may be made of mica or other materials with good thermal conductivity. The case is used with high-power and
Asymmetric C-element into account the common and the asymmetric minus inputs. All these inputs must be low for the down transition to happen. The figure shows the gate-level and transistor-level implementations and symbol of the asymmetric C-element. In the figure the plus inputs are marked with a 'P', the minus inputs are marked with an 'm' and the common inputs are marked with a 'C'. In addition, it is possible to extend the asymmetric input convention to inverted C-elements, where a plus (minus) on an input port means that an input is required for the inverted output to fall (rise). Asymmetric C-element