Dip soldering a small tank containing molten solder. PCB with mounted components is dipped manually into the tank when the molten solder sticks to the exposed metallic areas of the board. Dip soldering is accomplished by submerging parts to be joined into a molten solder bath. Thus, all components surfaces are coated with filler metal. Solders have low surface tension and high wetting capability. There are many types of solders, each used for different applications. Such as Lead-Silver for strength at higher than room temperature. Tin-Lead is used for General Purpose; Tin-Zinc is used for Aluminum; Cadmium-Silver is used for strength at
C-element C-element The Muller C-element (C-gate, hysteresis flip-flop, or sometimes coincident flip-flop, two-hand safety circuit) is a small digital block widely used in design of asynchronous circuits and systems. It has been specified formally in 1955 by David E. Muller and first used in ILLIAC II computer. In terms of the theory of lattices, the C-element is a semimodular distributive circuit, whose operation in time is described by a Hasse diagram. The C-element is closely related to the "rendezvous" and "join" elements, where an input is not allowed to change twice in succession. In some cases, when relations between delays are