Soldering other precipitation may wash the lead into the groundwater. Unfortunately, most lead-free solders are not eutectic formulations, melting at around , making it more difficult to create reliable joints with them. Other common solders include low-temperature formulations (often containing bismuth), which are often used to join previously-soldered assemblies without unsoldering earlier connections, and high-temperature formulations (usually containing silver) which are used for high-temperature operation or for first assembly of items which must not become unsoldered during subsequent operations. Alloying silver with other metals changes the melting point, adhesion and wetting characteristics, and tensile strength. Of all the brazing alloys, silver
Electrical element and they are assumed to have ideal properties, while actual electrical components have less than ideal properties, a degree of uncertainty in their values and some degree of nonlinearity. To model the nonideal behavior of a real circuit component may require a combination of multiple ideal electrical elements in order to approximate its function. For example, an inductor circuit element is assumed to have inductance but no resistance or capacitance, while a real inductor, a coil of wire, has some resistance in addition to its inductance. This may be modeled by an ideal inductance element in series with a resistance.