Dip soldering a small tank containing molten solder. PCB with mounted components is dipped manually into the tank when the molten solder sticks to the exposed metallic areas of the board. Dip soldering is accomplished by submerging parts to be joined into a molten solder bath. Thus, all components surfaces are coated with filler metal. Solders have low surface tension and high wetting capability. There are many types of solders, each used for different applications. Such as Lead-Silver for strength at higher than room temperature. Tin-Lead is used for General Purpose; Tin-Zinc is used for Aluminum; Cadmium-Silver is used for strength at
Mechanical–electrical analogies using a topological network diagram even when components needing a distributed element analysis are present. In the electrical domain, a transmission line, a basic distributed element component, can be included in the model with the introduction of the additional element of electrical length. The transmission line is a special case because it is invariant along its length and hence the full geometry need not be modelled. Another way of dealing with distributed elements is to use a finite element analysis whereaby the distributed element is approximated by a large number of small lumped elements. Just such an approach was used