Tahini cuneiform document written 4000 years ago that describes the custom of serving the gods sesame wine. The historian Herodotus writes about the cultivation of sesame 3500 years ago in the region of the Tigris and Euphrates in Mesopotamia. It was mainly used as a source of oil. Tahini is mentioned as an ingredient of "hummus kasa", a recipe transcribed in an anonymous 13th-century Arabic cookbook, "Kitab Wasf al-Atima al-Mutada". Sesame paste is an ingredient in some Chinese and Japanese dishes; Sichuan cuisine uses it in some recipes for dandan noodles. Sesame paste is also used in Indian cuisine. In the
Solder paste and fuses the parts together. The paste is a gray, putty-like material. The composition of the solder paste varies, depending upon its intended use. For example, when soldering plastic component packages to an FR-4 glass epoxy circuit board, the solder compositions used are eutectic Sn-Pb (63 percent tin, 37 percent lead) or SAC alloys (tin/silver/copper, named for the elemental symbols Sn/Ag/Cu). If one needs high tensile and shear strength, tin-antimony (Sn/Sb) alloys might be used with such a board. Generally, solder pastes are made of a tin-lead alloy, with possibly a third metal alloyed, although environmental protection legislation is forcing