Low-pressure area most active tropical cyclone basin on Earth. Wind is initially accelerated from areas of high pressure to areas of low pressure. This is due to density (or temperature and moisture) differences between two air masses. Since stronger high-pressure systems contain cooler or drier air, the air mass is denser and flows towards areas that are warm or moist, which are in the vicinity of low-pressure areas in advance of their associated cold fronts. The stronger the pressure difference, or pressure gradient, between a high-pressure system and a low-pressure system, the stronger the wind. Thus, stronger areas of low pressure are
Low pressure molding Low pressure molding Low Pressure Molding (LPM) with polyamide and polyolefin (hot-melt) materials is a process typically used to encapsulate and environmentally protect electronic components (such as circuit boards). The purpose is to protect electronics against moisture, dust dirt and vibration. Low Pressure Molding is also used for sealing connectors and molding grommets and strain reliefs. Key to this process are the raw materials and specialized molding equipment. Dimer acid based polyamide materials, better known as hot-melts, are used as molding compounds. They are thermoplastics i.e. the material, when heated, becomes less viscous and is able to re-shaped, then hardens