Post-transition metal packing structure. Tin forms Zintl phases such as NaSn, BaSn, KSn and CaSn. It has good corrosion resistance in air on account of forming a thin protective oxide layer. Pure tin has no structural uses. It is used in lead-free solders, and as a hardening agent in alloys of other metals, such as copper, lead, titanium and zinc. Lead is a soft metal (MH 1.5, but hardens close to melting) which, in many cases, is unable to support its own weight. It has a close-packed structure (BCN 12) but an abnormally large inter-atomic distance that has been attributed to partial
Asymmetric C-element into account the common and the asymmetric minus inputs. All these inputs must be low for the down transition to happen. The figure shows the gate-level and transistor-level implementations and symbol of the asymmetric C-element. In the figure the plus inputs are marked with a 'P', the minus inputs are marked with an 'm' and the common inputs are marked with a 'C'. In addition, it is possible to extend the asymmetric input convention to inverted C-elements, where a plus (minus) on an input port means that an input is required for the inverted output to fall (rise). Asymmetric C-element