Low-pressure area This generates a steady wind blowing toward the land, bringing the moist near-surface air over the oceans with it. Similar rainfall is caused by the moist ocean-air being lifted upwards by mountains, surface heating, convergence at the surface, divergence aloft, or from storm-produced outflows at the surface. However the lifting occurs, the air cools due to expansion in lower pressure, which in turn produces condensation. In winter, the land cools off quickly, but the ocean keeps the heat longer due to its higher specific heat. The hot air over the ocean rises, creating a low-pressure area and a breeze from
Low pressure molding to keep the desired form upon cooling down. These polyamide materials differ from other thermoplastics in two main areas: One: Viscosity: At processing temperature (410F/210C) the viscosity is very low, typically around 3,000 centipoise (similar to pancake syrup). Low viscosity materials require low injection pressure in order to inject into a cavity. In fact it is normal to use a simple gear pump to inject the polyamide material. Low injection pressure is paramount, when over-molding relatively fragile electronic component. Two: Adhesion: Polyamide materials are basically high performance hot-melt adhesives. The adhesive properties of polyamide is what seals a chosen substrate.