TO-3 at Motorola around 1955. The lead spacing was originally intended to allow plugging the device into a then-common tube socket. The metal package can be attached to a heat sink, making it suitable for devices dissipating several watts of heat. Thermal compound is used to improve heat transfer between the device case and the heat sink. Since the device case is one of the electrical connections, an insulator may be required to electrically isolate the component from the heatsink. Insulating washers may be made of mica or other materials with good thermal conductivity. The case is used with high-power and
C-element known, the C-element can be realized as a sum-of-product (SOP) circuit . Earlier techniques for implementing the C-element include Schmidt trigger, Eccles-Jordan flip-flop and last moving point flip-flop. For two input signals the C-element is defined by the equation formula_1, which corresponds to the following truth table: This table can be turned into a circuit using the Karnaugh map. However, the obtained implementation is naive, since nothing is said about delay assumptions. To understand under what conditions the obtained circuit is workable, it is necessary to do additional analysis, which reveals that Thus, the naive implementation is correct "only" for