Glass-to-metal seal little lower than that of the soda-lime glass. Classically high lead containing glasses are used, but it is also possible to substitute these by multi-component glasses e.g. based on the system ---------. Glass-to-metal seal Glass-to-metal seals are a very important element of the construction of vacuum tubes, electric discharge tubes, incandescent light bulbs, glass encapsulated semiconductor diodes, reed switches, pressure tight glass windows in metal cases, and metal or ceramic packages of electronic components. Properly done, such a seal is hermetic (vacuum tight, good electrical insulation, special optical properties e.g. UV lamps). To achieve such a seal, two properties must
Thermal copper pillar bump both having copper pillars and solder connections. The primary difference between the two is the introduction of either a P- or N-type thermoelectric layer between two solder layers. The solders used with CPBs and thermal bumps can be any one of a number of commonly used solders including, but not limited to, Sn, SnPb eutectic, SnAg or AuSn. Figure 5 shows a device equipped with a thermal bump. The thermal flow is shown by the arrows labeled “heat.” Metal traces, which can be several micrometres high, can be stacked or interdigitated to provide highly conductive pathways for collecting heat from