Carbon fiber reinforced polymer as epoxy, but other thermoset or thermoplastic polymers, such as polyester, vinyl ester, or nylon, are sometimes used. The composite material may contain aramid (e.g. Kevlar, Twaron), ultra-high-molecular-weight polyethylene (UHMWPE), aluminium, or glass fibers in addition to carbon fibers. The properties of the final CFRP product can also be affected by the type of additives introduced to the binding matrix (resin). The most common additive is silica, but other additives such as rubber and carbon nanotubes can be used. The material is also referred to as "graphite-reinforced polymer" or "graphite fiber-reinforced polymer" ("GFRP" is less common, as it clashes with
Polymer capacitor useful in compact devices such as laptops and cell phones they competed with tantalum chip capacitors as well. Tantalum electrolytic capacitors with PPy polymer electrolyte cathode followed three years later. In 1993 NEC introduced its SMD polymer Ta-e-caps called "NeoCap". In 1997 Sanyo followed with the "POSCAP" polymer tantalum chips. A new conductive polymer for tantalum polymer capacitors was presented by Kemet at the "1999 Carts" conference. This capacitor used the newly developed organic conductive polymer PEDT (Poly(3,4-ethylenedioxythiophene)), also known as PEDOT (trade name Baytron®). Two years later at the 2001 APEC Conference, Kemet introduced PEDOT polymer aluminum e-caps to