Bicycle wheel locate the spokes unequally into the rim, which requires a stiff rim hoop and correct tension of the spokes. Conventional wheels with spokes distributed evenly across the circumference of the rim are considered more durable and forgiving to poor maintenance. The more general trend in wheel design suggests technological advancement in rim materials may result in further reduction in the number of spokes per wheel. Lacing is the process of threading spokes through holes in the hub and rim so that they form a spoke pattern. While most manufacturers use the same lacing pattern on both left and right sides
Wire bonding Wire bonding Wire bonding is the method of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. If properly designed, wire bonding can be used at frequencies above 100 GHz. Bondwires usually consist of one of the following materials: Wire diameters