Wheel rise, eventually, to classical Greece after the breaking of Minoan dominance and consolidations led by pre-classical Sparta and Athens. Celtic chariots introduced an iron rim around the wheel in the 1st millennium BCE. The spoked wheel was in continued use without major modification until the 1870s, when wire-spoked wheels and pneumatic tires were invented. The wire spokes are under tension, not compression, making it possible for the wheel to be both stiff and light. Early radially-spoked wire wheels gave rise to tangentially-spoked wire wheels, which were widely used on cars into the late 20th century. Cast alloy wheels are now
Wire bonding Wire bonding Wire bonding is the method of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. If properly designed, wire bonding can be used at frequencies above 100 GHz. Bondwires usually consist of one of the following materials: Wire diameters