Bicycle wheel at perpendicular to the axle and go straight to the rim, without crossing any other spokes - e.g., "cross-0". This lacing pattern can not transfer torque as efficiently as tangential lacing. Thus it is generally preferred to build a crossed-spoke wheel where torque forces, whether driving or braking, issue from the hub. Where braking is concerned, the older-style caliper devices that contact the rims to apply braking force are not affected by lacing patterns in this way because braking forces are transferred from the calipers directly to the rim, then to the tires and then to the roadway. Disc brakes,
Wire bonding Wire bonding Wire bonding is the method of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. If properly designed, wire bonding can be used at frequencies above 100 GHz. Bondwires usually consist of one of the following materials: Wire diameters