Bicycle wheel the number of spokes that any one spoke crosses. Conventionally laced 36- or 32-spoke wheels are most commonly built as a cross-3 or a cross-2, however other cross-numbers are also possible. The angle at which the spoke interfaces the hub is not solely determined by the cross-number; as spoke count and hub diameter will lead to significantly different spoke angles. For all common tension-spoke wheels with crossed spokes, a torque applied to the hub will result in one half of the spokes - called "leading spokes" tensioned to drive the rim, while other half - "trailing spokes" are tensioned only
Wire bonding Wire bonding Wire bonding is the method of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. If properly designed, wire bonding can be used at frequencies above 100 GHz. Bondwires usually consist of one of the following materials: Wire diameters