Wheel wagon wheel were made by carving a spoke (from a log) into their finished shape. A spokeshave is a tool originally developed for this purpose. Eventually, the term spoke was more commonly applied to the finished product of the wheelwright's work, than to the materials used. The rims of wire wheels (or "wire spoked wheels") are connected to their hubs by wire spokes. Although these wires are generally stiffer than a typical wire rope, they function mechanically the same as tensioned flexible wires, keeping the rim true while supporting applied loads. Wire wheels are used on most bicycles and still
Wire bonding Wire bonding Wire bonding is the method of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. If properly designed, wire bonding can be used at frequencies above 100 GHz. Bondwires usually consist of one of the following materials: Wire diameters