Bicycle wheel how well the wheel transmits propulsive and braking forces, if applied at the hub, as in the case of hub or disc brakes. Several factors affect these stiffnesses to varying degrees. These include wheel radius, rim bending and torsional stiffness, number of spokes, spoke gauge, lacing pattern, hub stiffness, hub flange spacing, hub radius. In general lateral and radial stiffness decreases with the number of spoke crossings and torsional stiffness increases with the number of spoke crossings. One factor that has little influence on these stiffnesses is spoke tension. Too much spoke tension, however, can lead to catastrophic failure in
Wire bonding Wire bonding Wire bonding is the method of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. If properly designed, wire bonding can be used at frequencies above 100 GHz. Bondwires usually consist of one of the following materials: Wire diameters