Spoke tangentially to the hub. Tangential spoking allows for the transfer of torque between the rim and the hub. Tangential spokes are thus necessary for the drive wheel, which has torque at the hub from pedalling, and any wheels using hub-mounted brakes such as disk or band brakes, which transfer torque from the rim to the brake in the opposite direction—(via the hub) when braking. Constructing a tension-spoked wheel from its constituent parts is called wheelbuilding and requires the correct building procedure for a strong and long-lasting end product. Tensioned spokes are usually attached to the rim or sometimes the hub
Wire bonding Wire bonding Wire bonding is the method of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. If properly designed, wire bonding can be used at frequencies above 100 GHz. Bondwires usually consist of one of the following materials: Wire diameters