Rim Blow $37. A rubber pad encasing wires was mounted around the entire inner surface of the steering wheel rim. Rather than pressing a suspended horn ring, a center horn pad, or switches on the spokes, to make the electrical contact, the inside of the rim could be pressed anywhere on its circumference. Applying pressure to soft rubber inner rim of the steering wheel, a driver could activate the car's horn without moving their hands from the wheel rims. Technical issues, such as hardening (difficult to activate) and shrinking (causing the horn to sound without activation) of the rubber, and a lack
Wire bonding Wire bonding Wire bonding is the method of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. If properly designed, wire bonding can be used at frequencies above 100 GHz. Bondwires usually consist of one of the following materials: Wire diameters