Spoke butted (double or even triple) to reduce weight while maintaining strength. A variation on the wire-spoked wheel was Tioga's "Tension Disk", which appeared superficially to be a solid disk but was in fact constructed using the same principles as a normal tension-spoked wheel. Instead of individual wire spokes, a continuous thread of Kevlar (aramid) was used to lace the hub to the rim under high tension. The threads were encased in a translucent disk for protection and some aerodynamic benefit, but this was not a structural component. Wire spokes can be radial to the hub but are more often mounted
Wire bonding Wire bonding Wire bonding is the method of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. If properly designed, wire bonding can be used at frequencies above 100 GHz. Bondwires usually consist of one of the following materials: Wire diameters