Bicycle wheel to counteract the leading spokes. When forward torque is applied (i.e., during acceleration ), the trailing spokes experience a higher tension, while leading spokes are relieved, thus forcing the rim to rotate. While braking, leading spokes tighten and trailing spokes are relieved. The wheel can thus transfer the hub torque in either direction with the least amount of change in spoke tension, allowing the wheel to stay true while torque is applied. Wheels that are not required to transfer any significant amount of torque from the hub to the rim are often laced radially. Here, the spokes leave the hub
Wire bonding Wire bonding Wire bonding is the method of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. If properly designed, wire bonding can be used at frequencies above 100 GHz. Bondwires usually consist of one of the following materials: Wire diameters