Bicycle wheel the hub or the bike. Since the rim must be centered, but the hub flanges are not, there is a difference in dish between the two sides. Such an asymmetrical wheel is called a "dished" wheel. The side of the wheel with less dish has slightly shorter but significantly higher-tensioned spokes than the side with more dish. Several different techniques have been tried to minimize this spoke asymmetry. In addition to modified hub geometry, some rims have off-center spoke holes, and the mounting of common J-bend spokes at the hub flange can be altered "inboard" or "outboard". A truing stand
Wire bonding Wire bonding Wire bonding is the method of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. If properly designed, wire bonding can be used at frequencies above 100 GHz. Bondwires usually consist of one of the following materials: Wire diameters