Wire wheel situation is debated. Some authors conclude from this that the hub "stands" on those spokes immediately below it that experience a reduction in tension, even though the spokes below the hub exert no upward force on the hub and can be replaced by chains without much changing the physics of the wheel. Other authors conclude that the hub "hangs" from those spokes above it that exert an upward force on the hub, and that have higher tension than the spokes below the hub, which pull down on the hub. Despite being composed of thin and relatively flexible spokes, wire wheels
Wire bonding Wire bonding Wire bonding is the method of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. If properly designed, wire bonding can be used at frequencies above 100 GHz. Bondwires usually consist of one of the following materials: Wire diameters