Wire wheel 6 rigid spokes began to appear in the Olympic Games and professional racing: these have advantages in specialized applications, such as time trials, but wire-spoked wheels are used for most purposes. The reaction to a radial load of a well-tensioned wire spoked wheel, such as by a rider sitting on a bicycle, is that the wheel flattens slightly near the ground contact area. The rest of the wheel remains approximately circular. The tension of all the spokes does not increase significantly. Instead, only the spokes directly under the hub decrease their tension. The issue of how best to describe this
Wire bonding Wire bonding Wire bonding is the method of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. If properly designed, wire bonding can be used at frequencies above 100 GHz. Bondwires usually consist of one of the following materials: Wire diameters