Tandem bicycle stem that is clamped around the captain's seatpost. The stoker handlebars are typically bullhorns or drop bars with "dummy levers" instead of brake levers for gripping. Because of the extra weight and stresses, tandem wheels may use a higher spoke count, sturdier rims, higher pressure tires, a stronger freewheel, dishless spoke configuration, or asymmetric wheels. Tandems wear out rear wheels faster than front wheels; therefore, they may use non-symmetrical wheel setups, such as more spokes or a sturdier rim on the rear wheel. The dish of a wheel measures the amount of asymmetry between the rim and the hub flanges.
Wire bonding Wire bonding Wire bonding is the method of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. If properly designed, wire bonding can be used at frequencies above 100 GHz. Bondwires usually consist of one of the following materials: Wire diameters