Bicycle wheel of a wheel, it is becoming increasingly common to find specialty wheels with different lacing patterns on each side. A spoke can connect the hub to the rim in a radial fashion, which creates the lightest and most aerodynamic wheel. However, to efficiently transfer torque from the hub to the rim, as with driven wheels or wheels with drum or disc brakes, durability dictates that spokes be mounted at an angle to the hub flange up to a "tangential lacing pattern" to achieve maximum torque capability (but minimum vertical wheel stiffness). Names for various lacing patterns are commonly referenced to
Wire bonding Wire bonding Wire bonding is the method of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. If properly designed, wire bonding can be used at frequencies above 100 GHz. Bondwires usually consist of one of the following materials: Wire diameters