Hub-and-spoke conspiracy in the conspiracy. My colleagues believe, and I believe, that there was no such evidence in this record. In short, there was no rim to this wheel, or to put it in more conventional antitrust language, there was no proof of a horizontal conspiracy. However, he considered it proper to find a single conspiracy as in "Poliafico". He found "Kotteakos" inapplicable because that was a ruling to protect the spokes from being tarred with one another's conduct after the hub had pleaded guilty. Here, in contrast, the supplier spokes are not in court, "and the case proceeds against the central
Wire bonding Wire bonding Wire bonding is the method of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. If properly designed, wire bonding can be used at frequencies above 100 GHz. Bondwires usually consist of one of the following materials: Wire diameters