Bicycle wheel the form of buckling. The "most significant factor affecting the lateral spoke system stiffness" is the angle between the spokes and the wheel midplane. Thus any change that increases this angle, such as increasing the width of the hub, while keeping all other parameters constant, increases the resistance to buckling. Bicycle wheel A bicycle wheel is a wheel, most commonly a wire wheel, designed for a bicycle. A pair is often called a wheelset, especially in the context of ready built "off the shelf" performance-oriented wheels. Bicycle wheels are typically designed to fit into the frame and fork via dropouts,
Wire bonding Wire bonding Wire bonding is the method of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. If properly designed, wire bonding can be used at frequencies above 100 GHz. Bondwires usually consist of one of the following materials: Wire diameters