Bicycle wheel To accomplish this, wheel designs are employing lighter rim materials, moving the spoke nipples to the hub or using lighter nipples such as aluminum. Note however that rotational inertia is a factor only during acceleration (and deceleration/braking). At constant speed, aerodynamics are a significant factor. For climbing, total mass remains important. See Bicycle performance for more detail. The hub flanges of modern tension-spoked bicycle wheels are always spaced wider than where the spokes attach to the rim. When viewed in cross section, the spokes and hub form a triangle, a structure that is stiff both vertically and laterally. In three
Wire bonding Wire bonding Wire bonding is the method of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. If properly designed, wire bonding can be used at frequencies above 100 GHz. Bondwires usually consist of one of the following materials: Wire diameters