Bicycle wheel other exotic spoke lacing patterns (such as "crow's foot", which is essentially a mix of radial and tangential lacing) as well as innovative hub geometries. Most of these designs take advantage of new high-strength materials or manufacturing methods to improve wheel performance. As with any structure, however, practical usefulness is not always agreed, and often nonstandard wheel designs may be opted for solely aesthetic reasons. There are three aspects of wheel geometry which must be brought into adjustment in order to true a wheel. "Lateral truing" refers to elimination of local deviations of the rim to the left or right
Wire bonding Wire bonding Wire bonding is the method of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. If properly designed, wire bonding can be used at frequencies above 100 GHz. Bondwires usually consist of one of the following materials: Wire diameters