Bicycle wheel rims meant for use with disc brakes or hub brakes sometimes lack this surface. The Westwood pattern rim was one of the first rim designs, and rod-actuated brakes, which press against the inside surface of the rim were designed for this rim. These rims cannot be used with caliper rim brakes. The cross-section of a rim can have a wide range of geometry, each optimized for particular performance goals. Aerodynamics, mass and inertia, stiffness, durability, tubeless tire compatibility, brake compatibility, and cost are all considerations. If the part of the cross-section of the rim is hollow where the spokes attached,
Wire bonding Wire bonding Wire bonding is the method of making interconnections (ATJ) between an integrated circuit (IC) or other semiconductor device and its packaging during semiconductor device fabrication. Although less common, wire bonding can be used to connect an IC to other electronics or to connect from one printed circuit board (PCB) to another. Wire bonding is generally considered the most cost-effective and flexible interconnect technology and is used to assemble the vast majority of semiconductor packages. If properly designed, wire bonding can be used at frequencies above 100 GHz. Bondwires usually consist of one of the following materials: Wire diameters