Point groups in three dimensions the finite subgroups of SO(3), are: the cyclic groups "C" (the rotation group of a canonical pyramid), the dihedral groups "D" (the rotation group of a uniform prism, or canonical bipyramid), and the rotation groups "T", "O" and "I" of a regular tetrahedron, octahedron/cube and icosahedron/dodecahedron. In particular, the dihedral groups "D", "D" etc. are the rotation groups of plane regular polygons embedded in three-dimensional space, and such a figure may be considered as a degenerate regular prism. Therefore, it is also called a "dihedron" (Greek: solid with two faces), which explains the name "dihedral group". The rotation group of
Three-dimensional integrated circuit Computer Science at University of Michigan called Centip3De, a near-threshold design based on ARM Cortex-M3 cores. Three-dimensional integrated circuit In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes. 3D IC is just one of a host of 3D integration schemes that exploit the z-direction to achieve electrical performance benefits. 3D integrated circuits can be