Copper than less-developed countries (30–40 kg per capita). The process of recycling copper is roughly the same as is used to extract copper but requires fewer steps. High-purity scrap copper is melted in a furnace and then reduced and cast into billets and ingots; lower-purity scrap is refined by electroplating in a bath of sulfuric acid. Numerous copper alloys have been formulated, many with important uses. Brass is an alloy of copper and zinc. Bronze usually refers to copper-tin alloys, but can refer to any alloy of copper such as aluminium bronze. Copper is one of the most important constituents of
Printed circuit board coated with solder by hot air solder levelling (HASL). The HASL finish prevents oxidation from the underlying copper, thereby guaranteeing a solderable surface. This solder was a tin-lead alloy, however new solder compounds are now used to achieve compliance with the RoHS directive in the EU, which restricts the use of lead. One of these lead-free compounds is SN100CL, made up of 99.3% tin, 0.7% copper, 0.05% nickel, and a nominal of 60 ppm germanium. It is important to use solder compatible with both the PCB and the parts used. An example is ball grid array (BGA) using tin-lead solder