Tin allowed for the much more complex shapes cast in closed moulds of the Bronze Age. Arsenical bronze objects appear first in the Near East where arsenic is commonly found in association with copper ore, but the health risks were quickly realized and the quest for sources of the much less hazardous tin ores began early in the Bronze Age. This created the demand for rare tin metal and formed a trade network that linked the distant sources of tin to the markets of Bronze Age cultures. Cassiterite (SnO), the tin oxide form of tin, was most likely the original source
Tin-silver-copper (95%+) tin. For example, the common "SAC305" solder is 3.0% silver and 0.5% copper. Cheaper alternatives with less silver are used in some applications, such as SAC105 and SAC0307 (0.3% silver, 0.7% copper), at the expense of a somewhat higher melting point. SAC alloys are the main choice for lead-free surface-mount technology (SMT) assembly in the electronics industry. SMT is a process where components of circuit assemblies are mounted directly onto the surface of a printed circuit board and soldered in place. SMT has largely replaced “through-hole technology” where components are fitted with wire leads into holes in the circuit