Alloy are relatively similar in size, the atom exchange method usually happens, where some of the atoms composing the metallic crystals are substituted with atoms of the other constituent. This is called a "substitutional alloy". Examples of substitutional alloys include bronze and brass, in which some of the copper atoms are substituted with either tin or zinc atoms respectively. In the case of the interstitial mechanism, one atom is usually much smaller than the other and can not successfully substitute for the other type of atom in the crystals of the base metal. Instead, the smaller atoms become trapped in the
Tin-silver-copper been increasing. Large companies such as Sony and Intel switched from using lead-containing solder to a tin-silver-copper alloy. The process requirements for SAC solders (Pb-free) and Sn-Pb solders are different both materially and logistically for electronic assembly. In addition, the reliability of Sn-Pb solders is well established, while SAC solders are still undergoing study, (though much work has been done to justify the use of SAC solders, such as the iNEMI Lead Free Solder Project). One important difference is that Pb-free soldering requires higher temperatures and increased process control to achieve the same results as that of the tin-lead method.