Tin be toxic. Tin in combination with other elements forms a wide variety of useful alloys. Tin is most commonly alloyed with copper. Pewter is 85–99% tin; bearing metal has a high percentage of tin as well. Bronze is mostly copper (12% tin), while addition of phosphorus gives phosphor bronze. Bell metal is also a copper–tin alloy, containing 22% tin. Tin has sometimes been used in coinage; for example, it once formed a single-digit percentage (usually five percent or less) of American and Canadian pennies. Because copper is often the major metal in such coins, sometimes including zinc, these could be
Tin-silver-copper (95%+) tin. For example, the common "SAC305" solder is 3.0% silver and 0.5% copper. Cheaper alternatives with less silver are used in some applications, such as SAC105 and SAC0307 (0.3% silver, 0.7% copper), at the expense of a somewhat higher melting point. SAC alloys are the main choice for lead-free surface-mount technology (SMT) assembly in the electronics industry. SMT is a process where components of circuit assemblies are mounted directly onto the surface of a printed circuit board and soldered in place. SMT has largely replaced “through-hole technology” where components are fitted with wire leads into holes in the circuit