Tin allowed for the much more complex shapes cast in closed moulds of the Bronze Age. Arsenical bronze objects appear first in the Near East where arsenic is commonly found in association with copper ore, but the health risks were quickly realized and the quest for sources of the much less hazardous tin ores began early in the Bronze Age. This created the demand for rare tin metal and formed a trade network that linked the distant sources of tin to the markets of Bronze Age cultures. Cassiterite (SnO), the tin oxide form of tin, was most likely the original source
Tin-silver-copper partially brittle joint separation to a ductile tearing with the SAC. Tin-silver-copper Tin-silver-copper (SnAgCu, also known as SAC), is a lead-free (Pb-free) alloy commonly used for electronic solder. The tin-silver-copper alloy has been the prevailing alloy system used to replace tin-lead because it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. Lead-free solder is gaining much attention as the environmental effects of lead in industrial products is recognized, and as a result of Europe’s RoHS legislation to remove lead and other hazardous materials from electronics. Japanese electronics companies have also looked at Pb-free solder for its industrial