Bell metal metal used is a high-tin alloy of copper and tin with approximately a 4:1 ratio of copper to tin (78% copper, 22% tin). This is a much higher tin component than that used in statuary bronze. A range of percentages of tin content can vary from 20 to 26%, depending on the founder who has arrived empirically at their own alloy ratio. It has been found that increasing the tin content increases the decay time of the bell strike, thus making the bell more sonorous. Taking into consideration overall properties, such as tensile strength, hardness, wear resistance, cast quality, sound,
Tin-silver-copper been increasing. Large companies such as Sony and Intel switched from using lead-containing solder to a tin-silver-copper alloy. The process requirements for SAC solders (Pb-free) and Sn-Pb solders are different both materially and logistically for electronic assembly. In addition, the reliability of Sn-Pb solders is well established, while SAC solders are still undergoing study, (though much work has been done to justify the use of SAC solders, such as the iNEMI Lead Free Solder Project). One important difference is that Pb-free soldering requires higher temperatures and increased process control to achieve the same results as that of the tin-lead method.