Alloy are relatively similar in size, the atom exchange method usually happens, where some of the atoms composing the metallic crystals are substituted with atoms of the other constituent. This is called a "substitutional alloy". Examples of substitutional alloys include bronze and brass, in which some of the copper atoms are substituted with either tin or zinc atoms respectively. In the case of the interstitial mechanism, one atom is usually much smaller than the other and can not successfully substitute for the other type of atom in the crystals of the base metal. Instead, the smaller atoms become trapped in the
Tin-silver-copper board. In 2000, there were several lead-free assemblies and chip products initiatives being driven by the Japan Electronic Industries Development Association (JEIDA) and Waste Electrical and Electronic Equipment Directive (WEEE). These initiatives resulted in tin-silver-copper alloys being considered and tested as lead-free solder ball alternatives for array product assemblies. In 2003, tin-silver-copper was being used as a lead-free solder. However, its performance was criticized because it left a dull, irregular finish and it was difficult to keep the copper content under control. In 2005, tin-silver-copper alloys constituted approximately 65% of lead-free alloys used in the industry and this percentage has