Yetholm-type shield of dots. The artist could not hope to show the fine detail of a Yetholm-type shield, but the similarity is striking. The impressive shields would have indicated high social status. The shields are made of a copper alloy sheet about 0.6 mm thick. The alloy is a high-tin bronze: copper with 11-14% tin. They are round with a central domed boss created by hammering out from the back. The shield face is covered in raised ridges in concentric rings, each a couple of millimetres high. Between the ridges are rings of small hemispherical bosses about 4 mm across. Decoration was
Printed circuit board coated with solder by hot air solder levelling (HASL). The HASL finish prevents oxidation from the underlying copper, thereby guaranteeing a solderable surface. This solder was a tin-lead alloy, however new solder compounds are now used to achieve compliance with the RoHS directive in the EU, which restricts the use of lead. One of these lead-free compounds is SN100CL, made up of 99.3% tin, 0.7% copper, 0.05% nickel, and a nominal of 60 ppm germanium. It is important to use solder compatible with both the PCB and the parts used. An example is ball grid array (BGA) using tin-lead solder