Antimicrobial copper-alloy touch surfaces follows: The following claims are now legally permitted when marketing EPA-registered antimicrobial copper alloys in the U.S.: The registrations state that “antimicrobial copper alloys may be used in hospitals, other healthcare facilities, and various public, commercial and residential buildings.” The EPA copper alloy registrations were granted “with public health claims,” meaning that they permit manufacturers of copper-based products sold in the U.S. to claim on their labels the ability of copper, brass, and bronze to kill harmful, potentially deadly bacteria. As a condition of registration established by EPA, the Copper Development Association (CDA) in the U.S. is responsible for the
Tin-silver-copper Tin-silver-copper Tin-silver-copper (SnAgCu, also known as SAC), is a lead-free (Pb-free) alloy commonly used for electronic solder. The tin-silver-copper alloy has been the prevailing alloy system used to replace tin-lead because it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. Lead-free solder is gaining much attention as the environmental effects of lead in industrial products is recognized, and as a result of Europe’s RoHS legislation to remove lead and other hazardous materials from electronics. Japanese electronics companies have also looked at Pb-free solder for its industrial advantages. Typical alloys are 3–4% silver, 0.5–0.7% copper, and the balance