Antimicrobial copper-alloy touch surfaces follows: The following claims are now legally permitted when marketing EPA-registered antimicrobial copper alloys in the U.S.: The registrations state that “antimicrobial copper alloys may be used in hospitals, other healthcare facilities, and various public, commercial and residential buildings.” The EPA copper alloy registrations were granted “with public health claims,” meaning that they permit manufacturers of copper-based products sold in the U.S. to claim on their labels the ability of copper, brass, and bronze to kill harmful, potentially deadly bacteria. As a condition of registration established by EPA, the Copper Development Association (CDA) in the U.S. is responsible for the
Copper interconnect is to use Cu-Ge alloy as the interconnect material so that buffer layer (e.g. TiN) is no longer needed. Epitaxial CuGe layer has been fabricated with an average resistivity of 6 ± 1 μΩ cm and work function of ~4.47 ± 0.02 eV respectively, qualifying it as a good alternative to Cu. Resistance to electromigration, the process by which a metal conductor changes shape under the influence of an electric current flowing through it and which eventually leads to the breaking of the conductor, is significantly better with copper than with aluminium. This improvement in electromigration resistance allows higher currents