Copper in architecture used in residential and commercial building structures. Variations in color stem primarily from differences in the alloy chemical composition. Some of the more popular copper alloys and their associated Unified Numbering System (UNS) numbers developed by ASTM and SAE are as follows: In practice, the term ‘bronze’ may be used for a variety of copper alloys with little or no tin if they resemble true bronzes in color. Further information on architectural copper alloys is available. The criteria by which copper and copper alloys are selected for architectural projects include color, strength, hardness, resistance to fatigue and corrosion, electrical and
Copper interconnect is to use Cu-Ge alloy as the interconnect material so that buffer layer (e.g. TiN) is no longer needed. Epitaxial CuGe layer has been fabricated with an average resistivity of 6 ± 1 μΩ cm and work function of ~4.47 ± 0.02 eV respectively, qualifying it as a good alternative to Cu. Resistance to electromigration, the process by which a metal conductor changes shape under the influence of an electric current flowing through it and which eventually leads to the breaking of the conductor, is significantly better with copper than with aluminium. This improvement in electromigration resistance allows higher currents