Copper in architecture used in residential and commercial building structures. Variations in color stem primarily from differences in the alloy chemical composition. Some of the more popular copper alloys and their associated Unified Numbering System (UNS) numbers developed by ASTM and SAE are as follows: In practice, the term ‘bronze’ may be used for a variety of copper alloys with little or no tin if they resemble true bronzes in color. Further information on architectural copper alloys is available. The criteria by which copper and copper alloys are selected for architectural projects include color, strength, hardness, resistance to fatigue and corrosion, electrical and
Tin-silver-copper (95%+) tin. For example, the common "SAC305" solder is 3.0% silver and 0.5% copper. Cheaper alternatives with less silver are used in some applications, such as SAC105 and SAC0307 (0.3% silver, 0.7% copper), at the expense of a somewhat higher melting point. SAC alloys are the main choice for lead-free surface-mount technology (SMT) assembly in the electronics industry. SMT is a process where components of circuit assemblies are mounted directly onto the surface of a printed circuit board and soldered in place. SMT has largely replaced “through-hole technology” where components are fitted with wire leads into holes in the circuit