Alloy is sometimes a result of the sizes of the atoms in the alloy, because larger atoms exert a compressive force on neighboring atoms, and smaller atoms exert a tensile force on their neighbors, helping the alloy resist deformation. Sometimes alloys may exhibit marked differences in behavior even when small amounts of one element are present. For example, impurities in semiconducting ferromagnetic alloys lead to different properties, as first predicted by White, Hogan, Suhl, Tian Abrie and Nakamura. Some alloys are made by melting and mixing two or more metals. Bronze, an alloy of copper and tin, was the first alloy
Tin-silver-copper Tin-silver-copper Tin-silver-copper (SnAgCu, also known as SAC), is a lead-free (Pb-free) alloy commonly used for electronic solder. The tin-silver-copper alloy has been the prevailing alloy system used to replace tin-lead because it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. Lead-free solder is gaining much attention as the environmental effects of lead in industrial products is recognized, and as a result of Europe’s RoHS legislation to remove lead and other hazardous materials from electronics. Japanese electronics companies have also looked at Pb-free solder for its industrial advantages. Typical alloys are 3–4% silver, 0.5–0.7% copper, and the balance