Copper in architecture used in residential and commercial building structures. Variations in color stem primarily from differences in the alloy chemical composition. Some of the more popular copper alloys and their associated Unified Numbering System (UNS) numbers developed by ASTM and SAE are as follows: In practice, the term ‘bronze’ may be used for a variety of copper alloys with little or no tin if they resemble true bronzes in color. Further information on architectural copper alloys is available. The criteria by which copper and copper alloys are selected for architectural projects include color, strength, hardness, resistance to fatigue and corrosion, electrical and
Tin-silver-copper been increasing. Large companies such as Sony and Intel switched from using lead-containing solder to a tin-silver-copper alloy. The process requirements for SAC solders (Pb-free) and Sn-Pb solders are different both materially and logistically for electronic assembly. In addition, the reliability of Sn-Pb solders is well established, while SAC solders are still undergoing study, (though much work has been done to justify the use of SAC solders, such as the iNEMI Lead Free Solder Project). One important difference is that Pb-free soldering requires higher temperatures and increased process control to achieve the same results as that of the tin-lead method.