Copper in architecture used in residential and commercial building structures. Variations in color stem primarily from differences in the alloy chemical composition. Some of the more popular copper alloys and their associated Unified Numbering System (UNS) numbers developed by ASTM and SAE are as follows: In practice, the term ‘bronze’ may be used for a variety of copper alloys with little or no tin if they resemble true bronzes in color. Further information on architectural copper alloys is available. The criteria by which copper and copper alloys are selected for architectural projects include color, strength, hardness, resistance to fatigue and corrosion, electrical and
Tin-silver-copper partially brittle joint separation to a ductile tearing with the SAC. Tin-silver-copper Tin-silver-copper (SnAgCu, also known as SAC), is a lead-free (Pb-free) alloy commonly used for electronic solder. The tin-silver-copper alloy has been the prevailing alloy system used to replace tin-lead because it is near eutectic, with adequate thermal fatigue properties, strength, and wettability. Lead-free solder is gaining much attention as the environmental effects of lead in industrial products is recognized, and as a result of Europe’s RoHS legislation to remove lead and other hazardous materials from electronics. Japanese electronics companies have also looked at Pb-free solder for its industrial