Period 5 element other metal is not easily oxidized in air and is used to coat other metals to prevent corrosion. The firstalloy, used in large scale since 3000 BC, was bronze, an alloy of tin and copper. After 600 BC pure metallic tin was produced. Pewter, which is an alloy of 85–90% tin with the remainder commonly consisting of copper, antimony and lead, was used for tableware from the Bronze Age until the 20th century. In modern times tin is used in many alloys, most notably tin/lead soft solders, typically containing 60% or more of tin. Another large application for tin is
Tin-silver-copper (95%+) tin. For example, the common "SAC305" solder is 3.0% silver and 0.5% copper. Cheaper alternatives with less silver are used in some applications, such as SAC105 and SAC0307 (0.3% silver, 0.7% copper), at the expense of a somewhat higher melting point. SAC alloys are the main choice for lead-free surface-mount technology (SMT) assembly in the electronics industry. SMT is a process where components of circuit assemblies are mounted directly onto the surface of a printed circuit board and soldered in place. SMT has largely replaced “through-hole technology” where components are fitted with wire leads into holes in the circuit