Alloy are relatively similar in size, the atom exchange method usually happens, where some of the atoms composing the metallic crystals are substituted with atoms of the other constituent. This is called a "substitutional alloy". Examples of substitutional alloys include bronze and brass, in which some of the copper atoms are substituted with either tin or zinc atoms respectively. In the case of the interstitial mechanism, one atom is usually much smaller than the other and can not successfully substitute for the other type of atom in the crystals of the base metal. Instead, the smaller atoms become trapped in the
Copper interconnect is to use Cu-Ge alloy as the interconnect material so that buffer layer (e.g. TiN) is no longer needed. Epitaxial CuGe layer has been fabricated with an average resistivity of 6 ± 1 μΩ cm and work function of ~4.47 ± 0.02 eV respectively, qualifying it as a good alternative to Cu. Resistance to electromigration, the process by which a metal conductor changes shape under the influence of an electric current flowing through it and which eventually leads to the breaking of the conductor, is significantly better with copper than with aluminium. This improvement in electromigration resistance allows higher currents