Antimicrobial copper-alloy touch surfaces follows: The following claims are now legally permitted when marketing EPA-registered antimicrobial copper alloys in the U.S.: The registrations state that “antimicrobial copper alloys may be used in hospitals, other healthcare facilities, and various public, commercial and residential buildings.” The EPA copper alloy registrations were granted “with public health claims,” meaning that they permit manufacturers of copper-based products sold in the U.S. to claim on their labels the ability of copper, brass, and bronze to kill harmful, potentially deadly bacteria. As a condition of registration established by EPA, the Copper Development Association (CDA) in the U.S. is responsible for the
Tin-silver-copper board. In 2000, there were several lead-free assemblies and chip products initiatives being driven by the Japan Electronic Industries Development Association (JEIDA) and Waste Electrical and Electronic Equipment Directive (WEEE). These initiatives resulted in tin-silver-copper alloys being considered and tested as lead-free solder ball alternatives for array product assemblies. In 2003, tin-silver-copper was being used as a lead-free solder. However, its performance was criticized because it left a dull, irregular finish and it was difficult to keep the copper content under control. In 2005, tin-silver-copper alloys constituted approximately 65% of lead-free alloys used in the industry and this percentage has