Tin allowed for the much more complex shapes cast in closed moulds of the Bronze Age. Arsenical bronze objects appear first in the Near East where arsenic is commonly found in association with copper ore, but the health risks were quickly realized and the quest for sources of the much less hazardous tin ores began early in the Bronze Age. This created the demand for rare tin metal and formed a trade network that linked the distant sources of tin to the markets of Bronze Age cultures. Cassiterite (SnO), the tin oxide form of tin, was most likely the original source
Tin-silver-copper been increasing. Large companies such as Sony and Intel switched from using lead-containing solder to a tin-silver-copper alloy. The process requirements for SAC solders (Pb-free) and Sn-Pb solders are different both materially and logistically for electronic assembly. In addition, the reliability of Sn-Pb solders is well established, while SAC solders are still undergoing study, (though much work has been done to justify the use of SAC solders, such as the iNEMI Lead Free Solder Project). One important difference is that Pb-free soldering requires higher temperatures and increased process control to achieve the same results as that of the tin-lead method.