Yetholm-type shield of dots. The artist could not hope to show the fine detail of a Yetholm-type shield, but the similarity is striking. The impressive shields would have indicated high social status. The shields are made of a copper alloy sheet about 0.6 mm thick. The alloy is a high-tin bronze: copper with 11-14% tin. They are round with a central domed boss created by hammering out from the back. The shield face is covered in raised ridges in concentric rings, each a couple of millimetres high. Between the ridges are rings of small hemispherical bosses about 4 mm across. Decoration was
Copper interconnect is to use Cu-Ge alloy as the interconnect material so that buffer layer (e.g. TiN) is no longer needed. Epitaxial CuGe layer has been fabricated with an average resistivity of 6 ± 1 μΩ cm and work function of ~4.47 ± 0.02 eV respectively, qualifying it as a good alternative to Cu. Resistance to electromigration, the process by which a metal conductor changes shape under the influence of an electric current flowing through it and which eventually leads to the breaking of the conductor, is significantly better with copper than with aluminium. This improvement in electromigration resistance allows higher currents