Copper in architecture used in residential and commercial building structures. Variations in color stem primarily from differences in the alloy chemical composition. Some of the more popular copper alloys and their associated Unified Numbering System (UNS) numbers developed by ASTM and SAE are as follows: In practice, the term ‘bronze’ may be used for a variety of copper alloys with little or no tin if they resemble true bronzes in color. Further information on architectural copper alloys is available. The criteria by which copper and copper alloys are selected for architectural projects include color, strength, hardness, resistance to fatigue and corrosion, electrical and
Tin-silver-copper board. In 2000, there were several lead-free assemblies and chip products initiatives being driven by the Japan Electronic Industries Development Association (JEIDA) and Waste Electrical and Electronic Equipment Directive (WEEE). These initiatives resulted in tin-silver-copper alloys being considered and tested as lead-free solder ball alternatives for array product assemblies. In 2003, tin-silver-copper was being used as a lead-free solder. However, its performance was criticized because it left a dull, irregular finish and it was difficult to keep the copper content under control. In 2005, tin-silver-copper alloys constituted approximately 65% of lead-free alloys used in the industry and this percentage has