Tin allowed for the much more complex shapes cast in closed moulds of the Bronze Age. Arsenical bronze objects appear first in the Near East where arsenic is commonly found in association with copper ore, but the health risks were quickly realized and the quest for sources of the much less hazardous tin ores began early in the Bronze Age. This created the demand for rare tin metal and formed a trade network that linked the distant sources of tin to the markets of Bronze Age cultures. Cassiterite (SnO), the tin oxide form of tin, was most likely the original source
Tin-silver-copper board. In 2000, there were several lead-free assemblies and chip products initiatives being driven by the Japan Electronic Industries Development Association (JEIDA) and Waste Electrical and Electronic Equipment Directive (WEEE). These initiatives resulted in tin-silver-copper alloys being considered and tested as lead-free solder ball alternatives for array product assemblies. In 2003, tin-silver-copper was being used as a lead-free solder. However, its performance was criticized because it left a dull, irregular finish and it was difficult to keep the copper content under control. In 2005, tin-silver-copper alloys constituted approximately 65% of lead-free alloys used in the industry and this percentage has