Yetholm-type shield of dots. The artist could not hope to show the fine detail of a Yetholm-type shield, but the similarity is striking. The impressive shields would have indicated high social status. The shields are made of a copper alloy sheet about 0.6 mm thick. The alloy is a high-tin bronze: copper with 11-14% tin. They are round with a central domed boss created by hammering out from the back. The shield face is covered in raised ridges in concentric rings, each a couple of millimetres high. Between the ridges are rings of small hemispherical bosses about 4 mm across. Decoration was
Tin-silver-copper board. In 2000, there were several lead-free assemblies and chip products initiatives being driven by the Japan Electronic Industries Development Association (JEIDA) and Waste Electrical and Electronic Equipment Directive (WEEE). These initiatives resulted in tin-silver-copper alloys being considered and tested as lead-free solder ball alternatives for array product assemblies. In 2003, tin-silver-copper was being used as a lead-free solder. However, its performance was criticized because it left a dull, irregular finish and it was difficult to keep the copper content under control. In 2005, tin-silver-copper alloys constituted approximately 65% of lead-free alloys used in the industry and this percentage has