Bell metal metal used is a high-tin alloy of copper and tin with approximately a 4:1 ratio of copper to tin (78% copper, 22% tin). This is a much higher tin component than that used in statuary bronze. A range of percentages of tin content can vary from 20 to 26%, depending on the founder who has arrived empirically at their own alloy ratio. It has been found that increasing the tin content increases the decay time of the bell strike, thus making the bell more sonorous. Taking into consideration overall properties, such as tensile strength, hardness, wear resistance, cast quality, sound,
Printed circuit board coated with solder by hot air solder levelling (HASL). The HASL finish prevents oxidation from the underlying copper, thereby guaranteeing a solderable surface. This solder was a tin-lead alloy, however new solder compounds are now used to achieve compliance with the RoHS directive in the EU, which restricts the use of lead. One of these lead-free compounds is SN100CL, made up of 99.3% tin, 0.7% copper, 0.05% nickel, and a nominal of 60 ppm germanium. It is important to use solder compatible with both the PCB and the parts used. An example is ball grid array (BGA) using tin-lead solder