Alloy is sometimes a result of the sizes of the atoms in the alloy, because larger atoms exert a compressive force on neighboring atoms, and smaller atoms exert a tensile force on their neighbors, helping the alloy resist deformation. Sometimes alloys may exhibit marked differences in behavior even when small amounts of one element are present. For example, impurities in semiconducting ferromagnetic alloys lead to different properties, as first predicted by White, Hogan, Suhl, Tian Abrie and Nakamura. Some alloys are made by melting and mixing two or more metals. Bronze, an alloy of copper and tin, was the first alloy
Tin-silver-copper been increasing. Large companies such as Sony and Intel switched from using lead-containing solder to a tin-silver-copper alloy. The process requirements for SAC solders (Pb-free) and Sn-Pb solders are different both materially and logistically for electronic assembly. In addition, the reliability of Sn-Pb solders is well established, while SAC solders are still undergoing study, (though much work has been done to justify the use of SAC solders, such as the iNEMI Lead Free Solder Project). One important difference is that Pb-free soldering requires higher temperatures and increased process control to achieve the same results as that of the tin-lead method.