Tin of protons. It has two main allotropes: at room temperature, the stable allotrope is β-tin, a silvery-white, malleable metal, but at low temperatures it transforms into the less dense grey α-tin, which has the diamond cubic structure. Metallic tin does not easily oxidize in air. The first tin alloy used on a large scale was bronze, made of tin and copper, from as early as 3000 BC. After 600 BC, pure metallic tin was produced. Pewter, which is an alloy of 85–90% tin with the remainder commonly consisting of copper, antimony, and lead, was used for flatware from the Bronze
Tin-silver-copper board. In 2000, there were several lead-free assemblies and chip products initiatives being driven by the Japan Electronic Industries Development Association (JEIDA) and Waste Electrical and Electronic Equipment Directive (WEEE). These initiatives resulted in tin-silver-copper alloys being considered and tested as lead-free solder ball alternatives for array product assemblies. In 2003, tin-silver-copper was being used as a lead-free solder. However, its performance was criticized because it left a dull, irregular finish and it was difficult to keep the copper content under control. In 2005, tin-silver-copper alloys constituted approximately 65% of lead-free alloys used in the industry and this percentage has