Tin be toxic. Tin in combination with other elements forms a wide variety of useful alloys. Tin is most commonly alloyed with copper. Pewter is 85–99% tin; bearing metal has a high percentage of tin as well. Bronze is mostly copper (12% tin), while addition of phosphorus gives phosphor bronze. Bell metal is also a copper–tin alloy, containing 22% tin. Tin has sometimes been used in coinage; for example, it once formed a single-digit percentage (usually five percent or less) of American and Canadian pennies. Because copper is often the major metal in such coins, sometimes including zinc, these could be
Printed circuit board coated with solder by hot air solder levelling (HASL). The HASL finish prevents oxidation from the underlying copper, thereby guaranteeing a solderable surface. This solder was a tin-lead alloy, however new solder compounds are now used to achieve compliance with the RoHS directive in the EU, which restricts the use of lead. One of these lead-free compounds is SN100CL, made up of 99.3% tin, 0.7% copper, 0.05% nickel, and a nominal of 60 ppm germanium. It is important to use solder compatible with both the PCB and the parts used. An example is ball grid array (BGA) using tin-lead solder