Aftermarket exhaust parts and the engine. However, the pipes do "ring" with the exhaust pulses and increase underhood noise. Headers can be ceramic coated to reduce the heat radiated in the engine compartment, and to increase the temperature of the pipes which increases the velocity of the exhaust gases. Terminology: Catalytic converters are necessary to reduce emissions but create back pressure due to the exhaust gases being forced through a catalyst, and therefore decrease high-end engine power. Many modern catalytic converters only produce 1-3 psi of back pressure, though this restriction worsens further with use. Hi-flow catalytic converters can replace the standard units
Semiconductor device fabrication materials are used in the fabrication process. These include: It is vital that workers should not be directly exposed to these dangerous substances. The high degree of automation common in the IC fabrication industry helps to reduce the risks of exposure. Most fabrication facilities employ exhaust management systems, such as wet scrubbers, combustors, heated absorber cartridges, etc., to control the risk to workers and to the environment. Semiconductor device fabrication Semiconductor device fabrication is the process used to create the integrated circuits that are present in everyday electrical and electronic devices. It is a multiple-step sequence of photolithographic and chemical