The terms medial and lateral are evaluated along the coronal plane. When drawing an imaginary line to evaluate a structure's position in terms of medial and lateral, the line â¦ drawn is parallel to the sagittal plane.
Posted. Basically all metals can be soldered, but we are talking about a low melting point soft solder and a flux common to stained glass. With the soft solders and a zinc chloride flux (most common), these metals will bond very easily: copper, tin, and brass. These metals will NOT bond: Iron, stainless steel, steel, and aluminum.. Boris: I agree with most of your list (add some bronzes to the yes list), but steel CAN be soldered with soft solder.
Lead-tin solder layers on copper leads can form copper-tin intermetallic layers; the solder alloy is then locally depleted of tin and form a lead-rich layer. The Sn-Cu intermetallics then can get exposed to oxidation, resulting in impaired solderability.he widespread use of this popular lead-free solder alloy family is based on the reduced melting point of the Sn-Ag-Cu ternary eutectic behavior (217 ËC), which is below the Sn-3.5Ag (wt.%) eutectic of 221 Â°C and the Sn-0.7Cu eutectic of 227 Â°C (recently revised by P. Snugovsky to Sn-0.9Cu).