eurovoc_concepts:
abolition of customs duties
information industry
information technology
trade agreement

text: COMMISSION DES COMMUNAUTES EUROPEENNES Ba. xelles, le 05. 03. 1997 COM(97)96 final 97/0082 (ACC) 97/0083 (ACC) Proposition de DECISION DU CCNSEEL concernant l'élimination des droits de douane sur les produits des technologies de l'information Proposition de DECISION DU CONSEIL concernant l'élimination des droits de douane sur certaines boissons spiritueuses (présentées par la Commission) EXPOSE DES MOTIFS Lors de sa réunion spéciale à Singapour le 13 décembre 1996, le Conseil (1) a approuvé une déclaration ministérielle sur le commerce des produits des technologies de l'information et (2) a accueilli favorablement l'accord bilatéral conclu ad referendum avec les Etats-Unis sur l'accélération de la mise en place des droits nuls prévue dans le Cycle de l'Uruguay sur les alcools "bruns" et les autres boissons spiritueuses. En ce qui concerne l'accord sur les technologies de l'information, le Conseil rappelle que le 3 décembre 1995, dans le contexte du sommet UE/EU à Madrid, PUE et les EU ont instauré un nouvel agenda transatlantique qui stipule, entre autres, qu"'eu égard à l'importance de la société de l'information, nous entamons actuellement des travaux pour tenter de conclure un accord sur les technologies de l'information". Le forum industriel parallèle, le dialogue commercial transatlantique, a ajouté du poids à cet engagement politique en déclarant que "la grande majorité estime que l'accord sur les technologies de l'information doit comprendre un engagement à éliminer tous les tarifs douaniers d'ici janvier 2000 au plus tard". Le 22 octobre 1996, à la suite de consultations exploratoires avec un certain nombre de pays tiers et de discussions avec le comité spécial prévu à l'article 113 du traité, la Commission a proposé au Conseil d'adopter une décision relative à l'ouverture de négociations avec les pays tiers en vue de conclure un accord sur les technologies de l'information. Le Conseil a adopté cette décision le 15 novembre 1996. Des négociations plurilaterals ont abouti à une déclaration des ministres de 15 Etats membres de l'OMC ou candidats à l'adhésion (Australie, Canada, Taïwan, UE, Hong Kong, Islande, Indonésie, Japon, Corée, Liechtenstein, Norvège, Singapour, Suisse, Turquie, Etats-Unis) réunis à Singapour le 13 décembre 1996. Cette déclaration définit l'objectif de l'éliminationljes tarifs douaniers d'ici l'an 2000 (et prescrit les réductions en quatre tranches égales) pour les produits des technologies de l'information énumérés en détail dans les annexes. Le paragraphe 4 des modalités de la déclaration mérite une attention particulière: "Les participants se réuniront le plus tôt possible et en tout état de cause le 1er avril 1997 au plus tard pour examiner la situation des acceptations reçues et évaluer les conclusions qui en seront tirées. Les participants mettront en oeuvre les mesures prévues dans la Déclaration à condition que des participants représentant environ 90 pour cent du commerce mondial1 des produits des technologies de l'information aient alors notifié leur acceptation, et à condition que l'échelonnement ait été convenu à la satisfaction des participants. Lorsqu'ils évalueront s'il y a lieu de mettre en oeuvre les mesures prévues dans la Déclaration, au cas où le pourcentage du commerce mondial représenté par les participants serait légèrement inférieur à 90 pour cent du commerce mondial des produits des technologies de l'information, les participants pourront tenir compte du niveau de participation des Etats ou territoires douaniers distincts représentant pour eux Pessenfiel de leur propre commerce de ces produits. A cette réunion,-les participants détermineront s'il a été satisfait à ces critères. " 1 Ce pourcentage sera calculé par le Secrétariat de l'OMC sur la base des données les plus récentes disponibles au moment de la réunion. 1 Les discussions techniques plurilaterals demandées dans la déclaration ministérielle ont pris fin le 31 janvier 1997. La liste des produits visés a été passée en revue, mais l'annexe originale à la déclaration ministérielle n'a pas été modifiée. Il a été décidé que le premier train de consultations sur la liste élargie de produits commencera le 1er octobre 1997 et un accord a été conclu ad referendum sur les demandes d'"échelonnement prolongé" de certains des premiers signataires, notamment l'Indonésie, la Corée et Taïwan. La Nouvelle-Zélande, sans demander d'"échelonnement supplémentaire", et le Costa Rica, après accord des autres participants sur sa demande d'"échelonnement supplémentaire", sont également participants. Le Conseil a décidé lors d'une réunion spéciale tenue à Singapour le 13 décembre 1996, qu'une nouvelle décision du Conseil était nécessaire, avant la révision qui doit avoir lieu avant le 1er avril 1997, pour approuver définitivement l'accord. Cette décision serait nécessaire pour lier la Communauté en ce qui concerne ses engagements. Toutefois, une telle décision dépend des dispositions relatives au volume des échanges à couvrir et de l'accord sur l'"échelonnement". Pour préparer le terrain, le projet de décision joint a été élaboré en supposant que ces deux critères sont satisfaits. Si, vers la fin du mois de mars, ces critères ne sont pas satisfaits, la question devra être réexaminée. En ce qui concerne les boissons spiritueuse*, la Commission considère que l'accord conclu avec 'es Etats-Uni*, SCJS forme d'un mémorandum d'entente améliorera considérablement le potentiel d'exportation de l'Union européenne. La Commission poursuivra ses efforts pour faire participer d'autres parties à l'accord. En conséquence, la Commission soumet au Conseil les deux propositions ci-jointes de décision du Conseil. 6) Proposition de décision du Conseil concernant l'élimination des droits de douane sur les produits des technologies de l'information 97/0082 (ACC) LE CONSEIL DE L'UNION EUROPEENNE, vu le traité instituant la Communauté européenne, et notamment son article 13 3, en combinaison avec l'art'cle 228 paragraphe 2 première phrase, vu la proposition de la Commission, considérant qu'il a été décidé, dans le nouvel agenda transatlantique adopté lors du sommet UE-EU de Madrid le 13 novembre 199 >, de tenter de conclure un accord sur les technologies de l'information; considérant qu'à la suite des rapports de la Commission sur ses consultations exploratoires avec de> pays tie. s, le Conseil a déridé le 16 novembre 1996 d'entamer des négociations avec des pays tiers en vue de conclure un accord sur les technologies de l'information; considérant que le 13 décembre 1996 à Singapour, la Communauté européenne a approuvé la déclaration sur le commerce des produits des technologies ce l'information; que cette déclaration définit certaines conditions ^réalablf s pour la misa en oeuvre du l'élimination des tarifs douaniers pour les produits des tec hnologies de l'infoimation et que ces conditions préalables sont remplies, DECIDE: Article premier L'accord sous forme de déclaration du 13 décembre 1996 conclu par les ministres à Singapour sur le commerce des produits des technologies de l'information est approuvé au nom de la Communal té. Le texte de l'accord est joint à la présente décision. Article 2 Conformément aux dispositions du paragraphe 4 de l'annexe à la déclaration, le Conseii: 1. 2. note que les participants représentant environ 90 pour cent du commerce mondial des produits des technologies de l'information ont notifié leur acceptation; et approuve, au nom de la Communauté, les demandes d'échelonnement de certains participants à l'accord sur les technologies de l'information. Article 3 Le Conseil autorise la Commission à soumettre à l'Organisation mondiale du Commerce 'es modifications ci-jointes de la liste des engagements spécifiques de la Communauté européenne afin de consolider et d'éliminer les droits de douane conformément. à la déclaration. Article 4 Le président du Conseil est autorisé à désigner la personne habilitée à signer Y accord/le protocole à l'effet d'engager la Communauté. Fait à Bruxelles Par le Conseil Le président 4 ORGANISATION MONDIALE 13 décembre 1996 DU COMMERCE CONFERENCE MINISTERIELLE Singapour, 9-13 décembre 1996 DECLARATION MINISTERIELLE SUR LE COMMERCE DES PRODUITS DES TECHNOLOGIES DE L'INFORMATION SINGAPOUR, 13 DECEMBRE 1996 Les Ministres, Représentant les Membres ci-après de l'Organisation mondiale du commerce (l'MOMC"), et les Etats ou territoires douaniers distincts ci-après ayant engagé le processus d'accession à l'OMC, qui sesont mis d'accord à Singapour sur l'expansion du commerce mondial des produits des technologies de 1 ' information et qui représentent nettement plus de 80 pour cent du commerce mondial de ces produits (les "parties"), Australie Canada Communautés européennes Corée Etats-Unis Hong Kong Indonésie Islande Japon Norvège Singapour Suisse1 Territoire douanier distinct de Taiwan, Penghu, Kinmen et Matsu Turquie Considérant le rôle-clé joué par le commerce des produits des technologies de l'information dans le développement des industries de l'information et l'expansion dynamique de l'économie mondiale, Tenant compte des objectifs du relèvement des niveaux de vie et de l'accroissement de la production et du commerce de marchandises, Désireux d'arriver à une liberté maximale du commerce mondial des produits des technologies de l'information,. Désireux d'encourager la poursuite du développement technologique de l'industrie des technologies de l'information à l'échelle mondiale, Conscients de la contribution positive que les technologies de l'information apportent à la croissance économique et au bien-être mondiaux, Etant convenus de donner effet aux résultats de ces négociations qui englobent des concessions s'ajoutant à celles qui sont incluses dans les Listes annexées au Protocole de Marrakech annexé à l'Accord général sur les tarifs douaniers et le commerce de 1994, et 'Au nom de l'union douanière entre la Suisse ef le Liechtenstein. b Page 2 Reconnaissant que les résultats de ces négociations englobent aussi certaines concessions offertes dans les négociations aboutissant à l'établissement des Listes annexées au Protocole de Marrakech, Déclarent ce qui suit: Le régime commercial de chaque partie devrait évoluer de manière à améliorer les possibilités 1. d'accès aux marchés pour les produits des technologies de l'information. 2. Conformément aux modalités énoncées dans l'Annexe de la présente déclaration, chaque partie consolidera et éliminera les droits de douane et autres droits et impositions de toute nature, au sens de l'article II: 1 b) de l'Accord général sur les tarifs douaniers et le commerce de 1994, pour les produits ci-après: a) b) tous les produits classés (ou pouvant être classés) dans les positions du Système harmonisé de 1996 ("SH") dont la li: te figure dans l'Appendice A de l'Annexe de la présente déclaration; et tous les produits spécifiés dans l'Appendice B de l'Annexe de la présente déclaration, qu'ils soient ou non inclus dans l'Appendice A, par le jeu de réductions égales des taux des droits de douane qui commence! ont en 1997 et se termineront en 2000, en reconnaissrnt qu'un échelonnement des réductions sur une période plus longue et, avant la mise en oeuvre, un élargissement du champ des produits visés pourront être nécessaires dans des circonstances limitées. Les Ministres expriment leur satisfaction au sujet du large champ des produits visés repris dans 3. les Appendices de l'Annexe de la présente déclaration. Ils donnent pour instructions à leurs représentants respectifs de s'efforcer de bonne foi de mener à terme les discussions techniques plurilaterals à Genève sur la base de ces modalités, et leur donnent pour instructions d'achever ces travaux pour le 31 janvier 1997, de manière que la présente déclaration soit mise en oeuvre par le plus grand nombre de participants. Les Ministres invitent les Ministres des autres Membres de l'OMC, et des Etats ou territoires 4. douaniers distincts ayant engagé le processus d'accession à l'OMC, à donner des instructions similaires à leurs représentants respectifs, de manière qu'ils puissent participer aux discussions techniques mentionnées au paragraphe 3 ci-dessus et participer pleinement à l'expansion du commerce mondial des produits des technologies de l'information. Annexe: Modalités et produits vises Appendice A: liste des positions du SH Appendice B: liste des produits Page 3 ANNEXE Modalités et produits visés Tout Membre de l'Organisation mondiale du commerce, ou tout Etat ou territoire douanier distinct ayant engagé le processus d'accession à l'OMC, pourra participer à l'expansion du commerce mondial des produits des technologies de l'information conformément aux modalités ci-après: Chaque participant incorporera les mesures décrites au paragraphe 2 de la Déclaration dans 1. sa liste annexée à l'Accord général sur les tarifs douaniers et le commerce de 1994 et aussi, soit au niveau de la ligne tarifaire de son propre tarif soit au niveau à six chiffres du Système harmonisé de 1996 ("SH"), dans son tarif officiel ou dans toute autre version publiée du tarif douanier, selon ce qu'utilisent normalement les importateurs et les exportateurs. Chaque participant non Membre de l'OMC mettra en oeuvre ces mesures sur une base autonome en attendant d'avoir achevé son processus d'accession à l'OMC et les incorporera dans sa liste concernant l'accès au marché pour les marchandises établie dans le cadre de l'OMC. 2. A cette fin, le plus tôt possible et au plus tard le 1er mars 1997, chaque participant communiquera à tous les autres participants un document contenant a) une description détaillée de la manière dont le traitement tarifaire approprié sera prévu dans sa liste de concessions établie dans le cadre de l'OMC, et b) une liste des positions détaillées du SH visées pour les produits spécifiés dans l'Appendice B. Ces documents seront examinés et approuvés par consensus, et ce processus d'examen sera achevé au plus tard le 1er avril 1997. Dès que ce processus d'examen sera achevé pour tout document de cette nature, le document en question sera présenté en tant que modification de la Liste du participant concerné, conformément à la Décision du 26 mars 1980 intimlée "Procédures de modification et de rectification des Listes de concessions tarifaires" (IBDD, S27/26). a) Les concessions qui seront proposées par chaque participant en tant que modifications de sa Liste consolideront et élimineront tous les droits de douane et autres droits et impositions de toute nature sur les produits des technologies de l'information de la manière suivante: i) l'élimination de ces droits de douane se fera par le jeu de réductions des taux opérées par tranches égales, à moins qu'il n'en soit convenu autrement par les participants. A moins qu' il n'en soit convenu autrement par les participants, chaque participant consolidera tous les droits de douane sur les produits dont la liste figure dans les Appendices au plus tard le 1er juillet 1997, et donnera effet à la première de ces réductions de taux au plus tard le 1er juillet 1997, à la deuxième de ces réductions de taux au plus tard le 1er janvier 1998, et à la troisième de ces réductions de taux au plus tard le 1er janvier 1999, et l'élimination des droits de douane sera achevée au plus tard le 1er janvier 2000. Les participants conviennent d'encourager l'élimination autonome des droits de douane avant ces dates. Le taux réduit devrait à chaque étape être arrondi à la première décimale; et ii) l'élimination de ces autres droits et impositions de toute nature, au'sens de l'article 11:1 b) de l'Accord général, sera achevée pour le 1er juillet 1997, à moins que le document communiqué par le participant aux autres participants pour examen n'en dispose autrement. 7 Page 4 b) I-es modifications qu'un participant proposera d'apporter à sa Liste pour mettre en oeuvre la consolidation et l'élimination de ses droits de douane sur les produits des technologies de l'information arriveront à ce résultat: i) ii) dans le cas des positions du SH dont la liste figure dans l'Appendice A,par la création, le cas échéant, de subdivisions dans sa Liste au niveau de la ligne tarifaire du tarif national; et dans le cas des produits spécifiés dans l'Appendice B, par l'adjonction d'une annexe à sa Liste incluant tous les produits de l'Appendice B, qui devra spécifier les positions détaillées du SH pour ces produits, soit au niveau de la ligne tarifaire du tarif national, soit au niveau à six chiffres du SH. Chaque participant modifiera dans les moindres délais son tarif national pour tenir compte des modifications qu'il aura proposées, dès qu'elles seront entrées en vigueur. 3. Les participants se réuniront périodiquement sous les auspices du Conseil du commerce des marchandises pour examiner les produits visés spécifiés dans les Appendices, en vue de déterminer par consensus si, compte tenu des progrès technologiques, de l'expérience acquise dans l'application des concessions tarifaires ou des modifications apportées à la nomenclature du SH, il conviendrait de modifier les Appendices pour y incorporer des produits additionnels, et pour se consulter au sujet des obstacles non tarifaires au commerce des produits des technologies de l'information. Ces consultations seront sans préjudice des droits et obligations découlant de l'Accord sur l'OMC. Les participants se reuniront le plus tôt possible et en tout état de cause le 1er avril 1997 au 4. plus tard pour examiner la situation des acceptations reçues et évaluer les conclusions qui en seront tirées. Les participants mettront en oeuvre les mesures prévues dans la Déclaration à condition que des participants représentant environ 90 pour cent du commerce mondial2 des produits des technologies de l'information aient alors notifié leur acceptation, et à condition que l'échelonnement ait été convenu à la satisfaction des participants. Lorsqu'ils évalueront s'il y a lieu de mettre en oeuvre les mesures prévues dans la Déclaration, au cas où le pourcentage du commerce mondial représenté par les participants serait légèrement inférieur à 90 pour cent du commerce mondial des produits des technologies de l'information, les participants pourront tenir compte du niveau de participation des Etats ou territoires douaniers distincts représentant pour eux l'essentiel de leur propre commerce de ces produits. A cette réunion, les participants détermineront s'il a été satisfait à ces critères. Les participants se réuniront aussi souvent qu'il sera nécessaire et au plus tard le 5. 30 septembre 1997 pour examiner toute divergence existant entre eux dans la façon de classer les produits des technologies de l'information, en commençant par les produits spécifiés dans l'Appendice B. Les participants conviennent que leur objectif commun est d'arnver, dans les cas où cela sera approprié, à une classification commune de ces produits dans le cadre de la nomenclature existante du SH, en prenant en compte les interprétations et décisions du Conseil de coopération douanière (également connu sous le nom d'Organisation mondiale des douanes ou "OMD"). Au cas où une divergence subsisterait dans la classification, les participants étudieront si une suggestion conjointe pourrait être faite à l'OMD en ce qui concerne l'actualisation de la nomenclature existante du SH ou l'élimination de la divergence d'interprétation au sujet de la nomenclature du SH. 2Ce pourcentage sera calculé par le Secrétariat de l'OMC sur la base des données les plus récentes disponibles au moment de la réunion. 8 Page 5 6. Il est entendu pour les participants que l'article XXIII de l'Accord général sera applicable en cas d'annulation ou de réduction d'avantages résultant directement ou indirectement de la mise en oeuvre de la Déclaration pour un Membre de l'OMC participant du fait de l'application par un autre Membre de l'OMC participant d'une mesure, contraire ou non aux dispositions de l'Accord général. Chaque participant examinera avec compréhension toute demande de consultations de tout autre 7. participant concernant les engagements énoncés ci-dessus. Ces consultations seront sans préjudice des droits et obligations découlant de l'Accord sur l'OMC. Les participants agissant sous les auspices du Conseil du commerce des marchandises informeront 8. les autres Membres de l'OMC et les Etats ou territoires douaniers distincts ayant engagé le processus d'accession à l'OMC des présentes modalités et engageront des consultations en vue de faciliter leur participation à l'expansion du commerce des produits des technologies de l'information sur la base de la Déclaration. 9. Tel qu'il est utilisé dans les présentes modalités, le terme "participant" désignera les Membres de l'OMC, ou les Etats ou territoires douaniers distincts ayant engagé le processus d'accession à l'OMC, qui communiquent le document décrit au paragraphe 2 au plus tard le 1er mars 1997. 10. La présente annexe sera ouverte à l'acceptation de tous les Membres de l'OMC et de tout Etat ou de tout territoire douanier distinct ayant engagé le processus d'accession à l'OMC. Les acceptations seront notifiées par écrit au Directeur général qui les communiquera à tous les participants. Page 6 There arc two attachments to the Annex. Attachment A lists the HS headings or parts thereof to be covered. Attachment B lists specific products to be covered by an ITA wherever they are classified in the HS HS96 3818 8469 8470 Attachment A, Section 1 HS description Chemical elements doped for use in electronics, in form of discs, wafers or similar forms; chemical compounds doped for use in electronics 11 Word processing machines Calculating machines and pocket-size data recording, reproducing and displaying machines with a calculating function; accounting machines, postage franking machines, ticket-issuing machines and similar machines, incorporating a calculating devices; cash registers: 8470 10 Electronic calculators capable of operating without an external source of electric power and pocket size data recording, reproducing and displaying machines with calculating functions 21 29 30 40 50 90 8470 8470 8470 8470 8470 8470 8471 8471 8471 10 30 8471 41 84 7; 8471 8471 8471 49 50 60 70 Other electronic calculating machines incorporating a printing device Other \ Other calculating machines Accounting machines Cash registers Other Automatic data processing machines and units thereof; magnetic or optical readers, machines for processing such data, not elsewhere specified or included: transcribing data onto data media form and machines in coded for Analogue or hybrid automatic data processing machines Portable digital automatic data processing machines, weighing no more than 10 kg. consisting of at least a central processing unit, a keyboard and a display Other digital automatic data processing machines comprising in the same housing at least a central processing unit and an input and output unit, whether or not combined Other digital automatic data processing machines presented in the form of systems Digital processing units other than those of subheading 8471 41 and 8471 49, whether or not in the same housing one or two of the following types of units : storage units, input units, output units Input or output units, whether or not containing storage units in the same housing Storage units, including central storage units, optical disk storage units, hard disk drives and magnetic tape storage units 8471 80 Other units of automatic data processing machines 84 71 <>0 Other ex 8472 8473 90 21. Automatic teller machines Parts and accessories of the machines of heading No 8470 of the electronic calculating machines of subheading 8470 10, 8470 21 and 8470 29 8473 29 Parts and accessories of the machines of heading No 8470 other than the electronic calculating machines of subheading 8470 10, 8470 21 and 8470 29 8473 30 Parts and accessories of the machines of heading No 8471 1 (1 Page 7 8473 50 Parts and accessories equally suitable for use with machines of two oi more of the headings Nos. 8469 to 8472 ex 8504 40 Static converters for automatic data processing machines and units thereof, and telecommunication apparatus ex 8504 50 Other inductors for power supplies for automatic data processing machines and units thereof, and telecommunication apparatus 8517 8517 8517 8517 8517 8517 8517 8517 8517 8518 8518 8518 8520 8523 8523 8523 8523 8523 8524 8524 8524 8524 ex ex ex ex ex 8424 11 19 21 22 30 50 80 90 10 30 29 20 II 12 13 20 90 31 39 40 91 99 ex ex ex ex 8525 8525 8525 8527 8529 10 20 40 90 10 Electrical apparatus for line telephony or line telegraphy, including line telephone sets line with cordless handsets and systems or for digital line systems; videophones: telecommunication apparatus for carrier-current Line telephone sets with cordless handsets Other telephone sets and videophones Facsimile machines Teleprinters Telephonic or telegraphic switching apparatus Other apparatus, for earner-current line systems or for digital line systems Other apparatus including entry-phone systems Parts ot apparatus ol heading 8517 Microphones having a frequency range of 300 Hz to 3,4 KHz with a diameter of not exceeding 10 mm and a height not exceeding 3 mm, for telecommunication use Line telephone handsets Loudspeakers, without housing, having a frequency range of 300 Hz to 3,4 KHz with a diameter of not exceeding 50 mm, for telecommunication use Telephone answering machines Magnetic tapes of a width not exceeding 4 mm Magnetic tapes of a width exceeding 4 mm but not exceeding 6,5 mm Magnetic tapes of a width exceeding 6,5 mm Magnetic discs Other Discs for laser reading systems for reproducing phenomena other than sound or image Other : - for reproducing representations of instructions, data, sound, and image, recorded in a machine readable binary form, and capable of being manipulated or providing interactivity to a user, by means of an automatic data processing machine Magnetic tapes for reproducing phenomena other than sound or image Media for reproducing phenomena other than sound or image Other : - for reproducing representations of instructions, data, sound, and image, recorded in a machine readable binary form, and capable of being manipulated or providing interactivity to a user, by means of an automatic data processing machine Transmission apparatus other than apparatus for radio-broadcasting or television Transmission apparatus incorporating reception apparatus Digital still image video cameras Portable receivers for calling, alerting or paging Aerials or antennae of a kind used with apparatus for radio-telephony and radio-telegraphy Page 8 "el [8529 Ï9Ô Parts of: — transmission apparatus other than apparatu* for radio-broadcasting or television transmission apparatus incorporating reception apparatus digital still image video cameras, portable receivers for calling, alerting or paging 8531 20 Indicator panels incorporating liquid crystal devices (LCD) or light emitting diodes (LED) ex ex ex ex ex ex 8531 8532 8532 8532 8532 "853T 8532 8532 8532 "853T 8532 8533 8533 8533 153T 8533 90 10 21 22 73 24 25 29 30 90 21 "2T Parts of apparatus of subheading 8531 20 Electrical capacitors, fixed, variable or adjustable (pre-set): Fixed capacitors designed for use in 50/60 Hz circuits and having a reactive power handling capacity of not less than 0,5 kvar (power capacitors) Tantalum fixed capacitors Aluminium electrolytic fixed capacitors Ceramic dielectric, single layer fixed capacitors Ceramic dielectric, multilayer fixed capacitors Dielectric fixed capacitOiS of paper or plastics Other fixed capacitors Variable or adjustable (pre-set) capacitors Parts resistors Electrical resistors: Fixed carbon resistors, composition or film types (including rheostats and potentiometers), other than heating Other fixed resistors for a power handling capacity not exceeding 20 W Other fixed resistors for a power handling capacity of 20 W or more 31 Wirewound variable resistors, including rheostats and potentiometers, for a power handling capacity not exceeding 20 W 8533 39 Wirewound variable resistors, including rheostats and potentiometers, for a power handling 8533 8533 8534 1536" 40 90 50 153T 50 50 "69" 90 "853T 1536" 8536 "854T 854 854 "85T 21 29 capacity of 20 W or more Other variable resistors, including rheostats and potentiometers Parts Printed circuits Electronic AC switches consisting of optically coupled input and output circuits (Insulated thyristor AC switches) Electronic switches, including temperature protected electronic switches, consisting of a transistor and a logic chip (chip-on-chip technology) for a voltage not exceeding i000 volts Electromechanical snap-action switches for a current not exceeding 11 amps Plugs and sockets for co-axial cables and printed circuits Connection and contact elements for wires and cables Diodes, transistors and similar semiconductor devices; photosensitive semiconductor devices, including photovoltaic cells whether or not assembled in modules or made up into panels; light-emitting diodes; mounted piezo-electric crystals: Diodes, other than photosensitive or light-emitting diodes Transistors, other than photosensitive transistors, with a dissipation rate of less than 1 W Transistors, other than photosensitive transistors, with a dissipation rate of 1 W or more 9 8541 8541 8541 8541 8541 8542 8542 8542 8542 8542 8542 8542 8542 8542 8543 8543 8544 30 40 50 60 90 12 13 14 19 30 40 50 90 81 89 41 ex ex ex 8544 49 ex 8544 51 8544 9009 9009 9009 9026 9026 9026 9026 9026 9027 9027 70 11 21 90 10 20 80 90 20 30 9027 50 9027 80 ex 9027 90 Page 9 Thyristors, diacs and triacs, other than photosensitive devices Photosensitive semiconductor devices, including photovoltaic cells whether or not assembled in modules or made up into panels; light emitting diodes Other semiconductor devices Mounted piezo-electric crystals Pans Electronic integrated circuits and microassemblies Cards incorporating an electron. c integrated circuit ('smart1 cards) Metal oxide semiconductors (MOS technology) Circuits obtained by bipolar technology Other monolithic digital integrated circuits, including circuits obtained by a combination of bipolar and MOS technologies (BIMOS technology) Other monolithic integrated circuits Hybrid integrated circuits Electronic microassemblies Part Proximity cards and tags Electrical machines with translation or dictionary functions Other electric conductors, for a voltage not exceeding 80 V, fitted with connectors, of a kind used for telecommunications Other electric conductors, for a voltage not exceeding 80 V, not fitted with connectors, of a kind used for telecommunications Other electric conductors, for a voltage exceeding 80 V but not exceeding 1000 V, fitted with connectors, of a kind used for telecommunications Optical fibre cables Electrostatic photocopying apparatus, operating by reproducing the original image directly onto the copy (direct process)] Other photocopying apparatus, incorporating an optical system Parts and accessories Instruments and apparatus for measuring or checking the flow, level, pressure or other variables of liquids or gases (for example, flow meters, level gauges, manometers, heat meters), excluding instruments and apparatus of heading No 9014, 9015, 9028 or 9032: Instruments for measuring or checking the flow or level of liquids Instruments and apparatus for measuring or checking pressure Other instruments and apparatus for measuring or checking of heading 9026 Pans and accessories of instruments and apparatus of heading 9026 t Chromatographs and electrophoresis instruments Spectrometers, spectrophotometers and spectrographs using optical radiations (UV, visible, 1R) Other instruments and apparatus using optical radiations (UV, visible, 1R) of heading No 9027 Other instruments and apparatus of heading No 9027 (other than those of heading No 9027 10) Parts and accessories of products of heading 9027, other than for gas or smoke analysis apparatus and microtomes 13 Page 10 9030 40 Instruments and apparatus for measuring and checking, specially designed for telecommunications (for example, cross-talk meters, gain measuring instruments, distorsion factor meters, psophometers) 14 Page 11 Attachment A, Section 2 Semiconductor manufacturing and testing equipment and parts thereof HS Code Description ex 7017 10 Quanz reactor tubes and holders desi3ned for insertion into diffusion and oxidation furnaces for production of semiconductor wafers 8419 89 8419 90 Chemical vapor deposition apparatus for semiconductor production Pans of chemical vapor deposition apparatus for semiconductor production 8421 19 Spin dryers for semiconductor wafer processing 8421 91 Pans ot spin dryers tor semiconductor wafer processing Comments For Attachment B For Attachment B For Attachment B 8424 89 8424 89 8424 90 8456 10 8456 91 8456 91 8456 99 8456 99 8464 10 8464'20 Deflash machines for cleaning and removing contaminants from metal leads of semiconductor packages prior to the electroplating process the Spraying appliances tor etching, stripping or cleaning semiconductor wafers Pans ol spraying appliances tor etching, stripping or cleaning semiconductor wafers Machines tor working "*ny material by removal of material, by laser or other light or photo beam in the production of semiconductor wafers Apparatus tor stripping or cleaning semiconductor wafers For Attachment B Machines tor dry-etching patterns on semiconductor materials Focused ion beam milling machines to produce or repair ma^ks and reticles for patterns on semiconductor devices Lasercutters for cutting contacting tracks in semiconductor production by laser beam For Attachment B Machines for sawing monocristal ser;. (Conductor boules into slices, or wafers into chips For Attachment B Grind'ng, polisnmg and lapping machines for processing of semiconductor wafers 8464 90 Dicing machines for scribing or scoring semiconductor wafers 8466 91 8466 91 8466 91 8466 93 8466 93 8466 93 8456 93 8466 93 8477 10 8477 90 Pans for machines for sawing monocrystal semiconductor boules into slices, or wafers into chips • For Attachment B Pans of dicing machines for scribing or scoring semiconductor wafers For Attachment B Pans of grinding, polishing and lapping machines for processing of semiconductor wafers Pans of focused ion beam milling machines to produce or repair masks and reticles for Datterns on semiconductor devices Pans of las rcutters for cutting contacting tracks in semiconductor production by laser beam Pans of machines for working any material by removal of material, by laser or other light or photo beam in the production of semiconductor wafers For Attachment B Pans of apparatUj for stripping or cleaning semiconductor wafers For Attachment B Pans of machines tor dry-etching patterns on semiconductor materials Encapsulation equipment for assembly of semiconductors Pans of encapsulation equipment For Attachment B For Attachment B. f> ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex Page 12 ex 8479 50 ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex ex 8479 89 8479 89 8479 89 8479 89 8479 89 8479 89 8479 89 8479 89 8479 89 8479 90 8479 90 8479 90 8479 90 8479 90 8479 90 8479 90 8479 90 8479 90 8479 90 8480 7 8514 10 8514 20 8514 30 8514 30 8514 90 8514 90 8536 90 8543 8543 30 Automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other material for semiconductor devices Apparatus for growing or pulling monocrystal semiconductor boules For Attachment B~ Apparatus for physical deposition by sputtering on semiconductor wafers Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays Die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors Encapsulation equipment for assembly of semiconductors Epitaxial deposition machines for semiconductor wafers Machines for bending, folding and straightening semiconductor leads Physical deposition apparatus for for semiconductor production Spinners for coating photographic emulsions on semiconductor wafers Part of apparatus for physical deposition by sputtering on semiconductor wafers Pans for die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors Pans for spinners for coating photographic emulsions on semiconductor wafers Pans of apparatus for growing or pulling monocrystal semiconductor boules Pans of apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and fiat pane! displays Pans of automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other material for semiconductor devices Pan; of encapsulation equipment for assembly of semiconductors Pans of epitaxial deposition machines for semiconductor wafers Pans of machines for bending, folding and straightening semiconductor leads Pans of physical deposition apparatus for for semiconductor production Injection and compression moulds for the manufacture of semiconductor devices Resistance heated furnace. , and ovens for the manufacture of semiconductor devices on semiconductor wafers Inductance or dielectric furnaces and ovens for the manufacture of semiconductor devices on semiconductors wafers Apparatus for rapid heating of semiconductor wafers Pans of resistance heated furnaces and ovens for the manufacture of semiconductor devices on semiconductor wafers Pans of apparatus for rapid heating of wafers Pans of furnaces and ovens of Headings No 8514 10 to No 8514 30 Wafer probers Ion implanters for doping semiconductor materials Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B 18 Page 13 8543 90 8543 90 Parts of apparatus for -vet etching, developing, stripping or. cleaning semiconductor wafers and fat panel displays Parts of ion implanters for doping semiconductor materials 9010 41 to 9010 49 9010 90 Apparatus for projection, drawing or plating circuit patterns on sensitized semiconductor materials and flat panel displays Parts and accessories of the apparatus of Headings No 9010 41 to 9010 49 Optical stereoscopic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles Photomicrographic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles Parts and accessories of optical stereoscopic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles Parts and accessories of photomicrographic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles Electron beam microscopes fined with equipment specifically designed for the handling and transport of semiconductor wafers or reticles Pans and accessories of electron beam microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles Partem generating apparatus of a kind used for producing masks or reticles from photoresist coated substrates Pans and accessories for pattern generating apparatus of a kind used for producing masks or reticles from photoresist coated substrates Pans of such partem generating apparatus Instruments and apparatus for measuring or checking semiconductor wafers or devices Pans'and accessories of instruments and apparatus for measuring or checking semiconductor wafers or devices Pans of instruments and appliances for measuring or checking semiconductor wafers or devices Optical instruments and appliances for or devices or for inspecting masks, photomasks or reticles used in manufacturing semiconductor devices Optical instruments and appliances for measuring surface paniculate contamination on semiconductor wafers Pans and accessories of optical instn. ments and appliances for inspecting semiconductor wafers or devices or for inspecting masks, photomasks or reticles used in manufacturing semiconductor devices Pans and accessories of optical instruments and appliances for measuring surface paniculate contamination on semiconductor wafers inspecting semiconductor wafers ex ex ex ex 9011 10 ex 901 1 20 9011 90 ex 9011 90 ex ex ex 9012 10 9012 90 9017 20 9017 90 9017 90 9030 82 ex 9030 90 9030 90 9031 4 1 ex ex 9031 49 9031 90 ex 9031 90 For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B For Attachment B 17 Page 14 Attachment B Positive list of specific products to be covered by this agreement wherever they are classified in the HS. Where parts are specified, they are to be covered in accordance with HS Notes 2(b) to Section XVI and Chapter 90, respectively. Computers: automatic data processing machines capable of 1) storing the processing program or programs and at least the data immediately necessary for the execution of the program; 2) being freely programmed in accordance with the requirements of the user; 3) performing arithmetical cor putations specified by the user; and 4) executing without human intervention, a processing program which requires them to modify their execution, by logical decision during the processing run. The agreement covers such automatic data processing machines whether or not they a. e able to receive and process with the assistance of central processing unit telephony rignals, television signals, or other analogue or digitally processed audio or video signals. Machines performing a specific function other than data processing, or incorporating or working in conjunction with an automatic data pnoessing na. hin , and not otherwise specified under Attachment A or B, are not covered by this agreement. Electric amplifiers when used as repeaters in line telephony products falling within this agreement, and parts thereof Flat panel displays (including LCD, Electro Luminescence, Plasma and other technologies) for products falling within this agreement, and pans thereof. Network equipment: Local Area Network (LAN) and Wide Area Network (WAN) apparatus, including those products dedicated for use solely or principally to permit the interconnection of automatic data processing machines and units thereof for a network that is used primarily for the sharing of resources such as central processor units, data storage devices and input or output units - including adapters, hubs, in-line repeaters, converters, concentrators, bridges and routers, and printed circuit assemblies for physical incorporation into automatic data processing machines and units thereof. Monitors : display units of automatic data processing machines with a cathode ray tube with a dot screen pitch smaller than 0,4 mm not capable of receiving and processing television signals or other analogue or digitally processed audio or video signals without assistance of a central processing unit of a computer as defined in this agreement. The agreement does not, therefore, cover televisions, including high definition televisions. Optical disc storage units, for automatic data processing machines (including CD drives and DVD-drives), whether or not having the capability of writing/recording as well as reading, whether or not in their own housings. Paging alert devices, and parts thereof Plotters whether input or output units of HS heading No 8471 or drawing or drafting machines of HS heading No 9017. Printed Circuit Assemblies for products falling within this agreement, including such assemblies for external connections such as cards that conform to the PCMCIA standard. Such printed circuit assemblies consist of one or more printed circuits of heading 8534 with one or more active elements assembled thereon, with or without passive elements "Active elements" means diodes, transistor and similar semiconductor devices, whether or not photosensitive, of heading 8541, and integrated circuits and micro assemblies of heading 8542. Projection type Hat panel display units used with automatic data processing machines which can display digital information generated by the central processing unit. 3 Participants will conduct a review of this product description in January 1999 imdcr the consultation provisions of paragraph 3 cf ;. h^ Declaration 1 H ( Page 15 Proprietary format storage devices including media therefor for automatic data processing machines, with or without removable media and whether magnetic, optical or other technology, including Bernoulli Box, Syquest, or Zipdrive cartridge storage units. Multimedia upgrade kits for automatic data processing machines, and units thereof, put up for retail sale, consisting of, at least, speakers and/or microphones as well as a printed circuit assembly that enables the ADP machines and units thereof to process audio signals (sound cards). Set top boxes which have a communication function: a microprocessor-based device incorporating a modem for gaining access to the Internet, and having a function of interactive information exchange 11) Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 6 9 6 9 free free free 5. 2 5. 2 3. 0 3. 5 3. 5 2. 0 1. 7 1. 7 free free free EC - ITA - Schedule CXL C N 97 Label 3X18 00 Chemical elements doped loi use m electronics, in the form ol discs, waters or similar lorms. chemical compounds doped lor 3X18 00 10 3X18 00 90 7020 00 702O 00 05 7020 00 10 7020 00. 10 7020 00 80 8419 use in eleclronics I )oped silicon O'. her ( )thcr articles ol glass Ouartz reactor tubes ,md holders designed lor insertion into d i f l u s mn and oxidation lurnaces lor production ol semiconductor waters Ol fused quart/ or other fused silica Ofglass basing a linear coefficient of expansion not exceeding 5 x 10-6 per KeUin within a temperature range off) "(,' to 300 °C Other M a c h i n e r ), plant or laboratory equipment, whether or not electrically heated, for the treatment of materials by a process involving a change cf température such as heating, cooking, roasting, distilling, rejlifying. sterilizing, pasteurizing, steaming. drying, evaporating. vipourizing. condensing or cooling, other than machinery or plant of a kind used for domestic purposes; instantaneous or storage water healers, non-electric : 8419 89 - Other 8419 89 10 — Cooling towers and similar plant for direct cooling (without a separating wall) by means of recirculated water 8419 89 15 --- Apparatus for rapid heating of semiconductor wafers 8419 89 20 — Apparatus for chemical vapour deposition on semiconductor free free wafers 8419 89 25 — Apparatus for physical vapour deposition by electronic beam or 8419 89 30 --- Vacuum-vapour plant for the deposition of metal evaporation on semiconductor wafers 8419 89 95 — 8419 90 8419 90 10 8419 90 20 - - - Other Parts Of heat exchange units, for use in civil aircraft Of subheading 84 19 20 00 free free free free free free free free free free free free free free <\* vendredi, 28. février 1997 European C o m m i s s i on Delegation in Geneva - aj Page 1 of 33 CN97 Label B a se R a te F i n al B o u nd R a te Implementation J u l. 1 9 97 Jan. 1998 Jan. 1999 Jan. 2000 8-119 90 30 8-119 90 80 8-121 8421 19 8-121 19 10 I or apparatus of subheading 8 119 89 |S to XI 1989 25 2. 7 free 2. 0 1. 4 0. ™ ~ free Other Ceu'rifugcs including ccntrilugal divers, filtering or p u r i f \ i ng machiner) and apparatus, lor liquids or gases ( (llicr I or use m c i\ il aircraft ( )ther free free free free 0. 8 free 0. 4 free free Of centrifuges, including centrifugal dr>ers l or apparatus of subheading 8421 19 93 and 84 21 19 95 2 S free i. 9 1. 3 0. 6 free 8421 19 91 ( entnluges ol a kind used m laboratories Centrifuges ol a kind used in the inaniiLn. luring ol semiconductors waters 8-121 19 93 Spinners lor coating phoiogiapluc emulsions on semiconductor waters Other Other Parts 8421 19 95 8421 19 97 8421 91 10 8421 91 90 8421 99 00 8424 8424 89 8424 89 20 ( )t'her Other Mechanical appliances (whether or not hand-operated) for projecting, dispersing or spraying liquids or powders; fire extinguishers, whether or not charged; spray guns and similar appliances; steam or sand blasting machines and similar jet projecting machines : Other Spraying appliances for etching, stripping or cleaning semiconductor wafers 8424 89 30 Deflash machines for cleaning and r e m o v i ng contaminants from the metal leads of semiconductor packages prior to the electroplating process 8424 89 80 8424 90 8424 90 10 8424 90 90 842. 8 Other Parts Of apparatus of heading 8424 f,9 20 Other Other l i f t i n g, handling, loading or unloading machiner» (for example, lifts, escalators, convenors, leleleries) : free 2. 8 free free free 2. 1 free 1. 4 free 0. 7 free free 2. 8 free 2. 1 1. 4 0. 7 free ^ v o n d r o d i, 2 8. f é v r i er 1 9 97 European C o m m i s s i on Delegation in Geneva - aj P a ge 2 of 33 CN 97 Label Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 SI28 39 SI28. V) 10 8128 39 91 8428 39 93 8428 39 98 8431 8431 39 Other I or use m ». i\ il. nu i. ili Other Roller linn c) or-. Automated malciial handling machines lor transport, handling and storage ol semiconductor waters, water cassettes, wafer boxes and other materia) lor scmu ondui lor do K es Other Parts suitable tor use soleK or pniuip. illv with the niachmcrv of heading Nos X-i2<, to XI !n Other 8431 39 II) Of rolling-mill machmcrv ol subheading 8428 90 30 I rev free free free free 8431 39 20 XIM 39X0 X456 X456 10 8456 10 10 8456 10 90 8456 91 00 8456 99 8456 99 10 8456 99 30 8456 99 90 8462 846; Of machiner» ol heading 8428 39 93 Other Machine-tools for working an\ material bv removal of material. h\ laser or other light or photon beam, uhrasonic. electro- discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes : Operated bv laser or other light or photon beam processes 1. 2 0. 8 free free Of a kind used in the manufacturing of semiconductor wafers or 4. 7 free devices Other For dry-etching patterns on semiconductor materials Other Focused ion beam miling machines for producing or repairing masks and reticles for patterns on semiconductor devices Apparatus for stripping or cleaning semiconductor wafers free free free free free 3. 5 free free free 2. 4 free fre. - frce 1. 2 free free free free free free free Other Machine-tools (including presses) for working metal by forging, hammering or die-stamping; machine-tools (including presses) lor working metal by bending, folding, straightening, shearing, punching or notching; presses for working metal or metal carbides, not specified above : flattening, Bending, folding, straightening or flattening machines (including presses) Numerical I v controlled l\D vendredi, 28. février 1997 European C o m m i s s i on Delegation in Geneva - aj Page 3 of 33 CN97 Label Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 8462 2 I 05 ol a k i nd used in manufacturing semiconductors leads 3. 2 free 2. 4 I 6 0. 8 Jan. 1999 olT""" Jan. 2000 free 0. 4 free For w o r k i ng flat products Other Other For bending, folding aiul straightening semiconductor leads 1. 7 free I. 3 For w o r k i ng flat products - Other I lydraulic Other Machine-tools for w o r k i ng sione. ceramics, concrete, asbcslos- cement or like mineral materials or lor cold w o r k i ng glass Saw ing machines For sawing m o n o c r i s t al semiconductor boules into slices, or free free free free free free wafers into chips Other ('•rinding or polishing machines For w o r k i ng semiconductor wafers For w o r k i ng glass Optical glass Other Other Other free free free free For scribing or scoring semiconductor wafers free free free free free free Other Parts and accessories suitable for use solely or principally w i th the machines of heading Nos 8456 to 8465. including work or tool holders, self-opening dieheads. d i v i d i ng heads and other special attachments for machine-tools; tool holders for any type of tool for w o r k i ng in the hand ; Other For machines of heading No 8464 For machines of subheadings 8464 10 10, 8464 20 05 or 8464 90 10 Of cast iron or cast steel Other free 1. 4 0. 9 0. 5 free 8462 21 10 8462 21 80 8462 29 8462 29 05 8462 29 10 8462 29 91 8462 29 99 8464 8461 10 8464 10 10 8464 10 90 8464 20 8464 20 05 8464 20 ! I 8464 20 19 8464 20 80 8464 90 8464 90 10 8464 90 90 8466 8466 91 8466 91 15 8466 91 20 8466 91 95 v e n d r e d i, 2 8. f é v r i er 1 9 97 European Commission Delegation in Geneva - aj Page 4 of 33 CN 97 Label Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 84d6 93 8466 91 15 -- --- For machines ol heading Nos X456 to K16I I or machines and apparatus nl siihheadmgs XJ5(> K) 10. 8-156 91 19 free 1. 4 0. 9 0. 5 free 0 0. 8 I 5d WW | t) oi S l. sfi '>') 111 84 (>6 93 20 — ( )l cast iron or cast steel 84d6 93 95 — Other 84(i6 91 -- I or machines ol heading \ 'o X W>2 or X 1M 8 W ) 6 9 J K) — I or machines ol 'subheading 8 l o2 21 05 or 8152 29 05 I 9 free 1. 4 0. 9 0. 5 free 8-l()6 94 90 — Other. Automatic typewriters and word-processing machines X4fi9 I I 00 - Word-processing machines 3. 2 free 2. 4 1. 6 0. 8 free 847(1 Calculating machines and pocket-size data recording, reproducing and displav mg machines w nh calculating functions; accounting machines, postage-franking machines, ticket- issuing machines and similar machines, incorporating a calculating device; cash registers : 8470 10 - F. lectronic calculators capable of operation without an external source of electric power and pocket-size data recording. reproducing and displaying machines w i th calculating functions 8470 10 10 - FIcclronic calculators capable of operation without an external source of electric power 8470 10 90 — Pocket-size data recording, reproducing and displav ing machines 8. 4 5. 0 8. 4 8. 4 2. 8 2. 8 2. 8 2. 8 free free free free free free free free w i th calculating functions Other electronic calculating machines Incorporating a printing device Other Other calculating machines A c c o u n t i ng machines Cash registers Other 8470 2 1 00 8470 29 00 8470 30 00 8470 40 00 8470 50 00 8470 90 00 8471 - -- - - - - 8471 10 8471 10 10 847i 10 90 - - - A u t o m a t ic data-processing machines and units thereof; magnetic or optical readers, machine:; for transcribing data onto data media in coded form and machines for processing such data, not elsewhere specified or included : A n a l o g ue or hybrid automatic data-processing machines For use in c i v il aircraft Other free 3. 5 free free )*&* vendredi, 28. février 1997 European C o m m i s s i on Delegation in Geneva - aj 6. 3 3. 8 6. 3 6. 3 2. 1 2. 1 2. 1 2. 1 free 2. 6 4. 2 2. 5 4. 2 4. 2 1. 4 1. 4 1. 4 1. 4 free 1. 8 2. 1 1. 3 2. 1 2. 1 0. 7 0. 7 0. 7 0. 7 free free free free free free free free free 0 9 ' free free Page 5 of 33 CN97 Label 8471. 10 00 - Portable digital automatic data-processing machines, weighing not more than 10 kg. consisting ol at least a central processing unit, a kev board and a displav ( )ther digital automatic data-processing machines 847 I II -- Comprising in the same housing at least a central processing unit and an input and output unit, whether or not combined 847141 10 --- I or use in civ il aircraft 8471 41 90 — Other 8471 49 -- Other, presented in the form ol s\ stems 8-171 49 10 — For use in civ il aircraft 8471 49 90 — Other 8471 50 - Digital processing unils mher than those ol subheadings No 847 1 4 1 and 84 71 49. whether or not containing in the same housing one or two of the follow ing tv pes of unit: storage units, input units, output units 847150 10 -- For use in civil aircraft 8471 50 90 8471 60 - - Other Input or output units, whether or not containing storage units in 8471 60 10 - For use in civil aircraft the same housing Other 8471 60 40 — Printers 847160 50 — Keyboards 8471 60 90 — Other 8471 70 847170 10 - - Storage unils For use in civil aircraft 847170 40 — Central storage unils Other Other — Disk storage unils 8471 70 51 Optical, including magneto-optical 8471 70 53 8471 70 59 Other I lard disk drives Other 8471 70 60 — Magnetic tape storage units Base Rate Final Bound Rate Implementation J u l. 1997 Jan. 1998 Jan. 1999 Jan. 2000 3 5 free 2. 6 1. 8 0. 9 free Iree 3. 5 free 3. 5 Iree 3 5 free 2 2 2 free 2 free free free free free free- free free free free free free free- free free free free 2. 6 free 2. 6 free 2. 6 free 1. 5 1. 5 1. 5 free 1. 5 1. 5 1. 2 1. 5 1. 5 free 1. 8 free 1. 8 free 1. 8 free I. O l. O I. O free I. O l. O 0. 8 l. O l. O free 0. 9 free 0. 9 free 0. 9 free free free free free free free free free free free free free free free free free free free free free free free free free free. ^ vendredi, 28. février 1997 European C o m m i s s i on Delegation in Geneva - aj Page 6 of 33 CM 97 Label 8471 70 90 8171 80 8171 80 10 8471 80 90 8471 90 00 K-172 8472 90 8472 90 10 8472 90 30 8472 90 80 8473 8473 10 8473 21 8473 21 10 8473 21 90 8473 29 8473 29 10 8473 29 90 8473 30 8473 30 10 8473 30 90 8473 50 8473 50 10 8473 50 90 8477 )lher ( Mher units ol automatic data-processing machines Peripheral units Other Other (Mher o I lice mac It mes t lor example, hectogiaph or stencil duplicating machines, addressing machines, automatic banknote dispensers, coin-sorting machines, coin- counting or wrapping machines, pencil-sharpening machines, pcrlorating or stapling machines) Other Coin-sorting, coin-counting or coin-wrapping machines. Automatic teller machines Other Parts and accessories (other than covers, earn ing cases and the like) suitable for use solely or principalis with machines of heading Nos 8469 to 84 72 : Parts and accessories of the machines of heading No 84 70 Of the electronic calculating machines of subheading 8470 10. 8470 21 or 84 70 29 FIccironic assemblies Other Other Flectronic assemblies Other Parts and accessories of the machines of heading No 8471 FJectronic assemblies Other Parts and accessories equally suitable for use with machines of iwo or more of the headings Nos 8469 to 8472 Flectronic assemblies Other Machinerv for working rubber or plastics or for the manufacture of products from these materials, not specified or included elsewhere in this chapter : Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 J a n. 2 0 00 free free free free 1. 5 F5 1. 5 1. 5 l. O l. O l. O l. O free free free free free free free free 3. 1 free- 2. 3 0. 8 free 4. 3 2. 5 3. 4 1. 6 3. 3 1. 6 3. 4 1. 6 free free free free free free free free 3. 2 1. 9 2. 5 1. 2 2. 5 1. 2 2. 5 1. 2 2. 1 1. 3 1. 7 0. 8 1. 6 0. 8 1. 7 0. 8 I. I free 0. 8 free 0. 8 free 0. 8 free free free free free free free free free 8477 10 Injection-mouldinu machines f\£ C5 vendredi, 28. février 1997 European C o m m i s s i on Delegation in Geneva - aj Page 7 of 33 CN97 Label Base Rate Final Bound Rate Implementation H477 10 10 8477 10 90 K477 59 8477 59 05 8477 59 10 8177 59 90 8477 90 8477 90 04 8477 90 10 8477 90 80 8479 84 79 89 8479 89 10 I ncapsulation equipment for assemblv ol semiconductors 2 X free- Other Other I ncapsulation equipment lor assemblv ol semiconductors 2 X free J u l. 1 9 97 Jan. 1998 Jan. 1999 Jan. 2000 2. 1 2. 1 1. 4 1. 4 0. 7 0. 7 free free Presses Other Parts For machines of subheadings X I7"1 |i) |n ,,nd X 177 59 05 2. 8 free- 2. 1 1. 4 0. 7 free ( )l cast iron or cast steel Other Machines and mechanical appliances hav tug iiuliv ulual functions, not specified or included elsewhere in this chapter : Other I he f o l l o w i ng goods, for use in c i v il aircral : I lv dropneumalie batteries; Mechanical actuators for thrust reversers; Toilet units specially designed. A ir humidifiers and d e h u m i d i l i e r s; Servo- mechanisms, non-electric; Non-cleclric starter motors; Pneumatic starters for turbo-jets, turbo-jets, turbo-propellers and other gas turbines; Windscreen wipers, non-electric; Propeller regulators, non-electric Other 8479 89 30 8479 89 60 8479 89 65 8479 89 70 8479 89 75 M o b i le hydraulic powered mine roof supports Central greasing systems Apparatus for g r o w i ng or p u l l i ng monocrystal semiconductor boules Apparatus for epitaxial deposition on semiconductor wafers Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers 8479 89 76 Apparatus for wet etching, developing, stripping or cleaning liquid cryial display substrates 8479 89 77 Die attach apparatus and tape automated bonders for the assemblv 8479 89 79 8479 89 95 8479 90 8479 90 10 of semiconductors Fncapsulation equipment for assembly of semiconductors Other Parts For use in civ il aircraft free free free free free free free free 2. 8 2. 8 2. 8 free free free 2. 1 2. 1 2. 1 free free free 1. 4 1. 4 1. 4 v e n d r e d i, 2 8. f é v r i er 1 9 97 European C o m m i s s i on Delegation in Geneva - aj free free free 0. 7 0. 7 0. 7 free free free free free free Page 8 of 33 CN 97 Label < Mher X479 90 50 — ( II inachines ol subheadings X T ') X-> r>\ X I"1) X') ""o. X I " ') X9 " \\ 84 79 X*> " d. X I "9 X<> ~" or X 1"') X9 "9 8 4 7 9 9 0 92 — Ol cast , nm or cast steel 8479 90 98 — Other 84X0 M o u l d i ng boxes lor metal loundrv. m o u ld bases, m o u l d i ng patterns, moulds lor metal I oilier than ingot moulds), ruelal carbides, glass, mineral materials, rubber m pl. isiics Base Rate Final Bound Rate Implementation J u l. 1 9 97 Jan. 1998 Jan. 1999 Jan. 2000 2. 1 1. 4 0. 7 free 8480 71 8480 71 10 -- --- M o u l ds for rubber or plastics Injection or compression t\ pes ol a kind used m the m. i u u t. K l i n i ng »'t semiconductor dev ices free- 1. 3 0. 6 free 8480 71 90 — (Mher 8504 I lecttical translormers. static converters (for examp. le. recliliers) 8504 40 8504 40 10 - -- and inductors ; Static converters t o. use in c i v il aircraft Other Of a k i nd used with telecommunication apparatus and automatic data-processing machines and units t h e r e o f: 8504 40 30 — Povser suppiv units of a kind used w i th automatic data-processing 8504 40 35 —- Other machines 8504 40 50 — Pol\-crystalline semiconductors 8504 40 93 — A c c u m u l a t or chargers Other 8504 40 94 8504 40 96 8504 40 97 8504 40 99 8504 50 8504 50 10 Other Rectifiers Inverters I laving a power handling capacity not exceeding 7. 5 k VA I laving a power handling capacity exceeding 7. 5 k VA - - Other Other inductors For use in c i v il aircraft Other free free 4. 6 1. 5 3. 4 l. O 2. 3 free l. l free free v e n d r e d i, 2 8. f é v r i er 1 9 97 European C o m m i s s i on Delegation in Geneva - aj Page 9 of 3 3 CN97 Label Base Rate Final Bound Rate Implementation 8504 50 30 (M'a kind used for telecommunication apparatus and power 4. 8 supplies for automatic data processing machines and units thereof Jul. 1997 Jan. 1998 free- 3. 6 2. 4 Jan. 1999 Jan. 2000 Î. 2 "*""" "•"••*""• "'J£"c * 8504 50 80 8514 8:14 10 8514 10 05 8514 10 10 8514 10 90 851-1 20 8514 20 05 85 L4 20 10 8514 20 90 8514 30 Other Industrial or laboratory electric ( i n c l u d i ng induction or dielectric) furnaces and ovens, other industrial or laboratory induction or dielectric heating equipment Resistance heated furnaces and ovens For the manufacture of semiconductor dev ices on semiconductors 3 free 2. 3 1. 5 0. 8 free wafers Other Bakery and biscuit ovens (Mher Induction or dielectric furnaces and ovens For the manufacture of semiconductor devices on semiconductors 3 2. 3 0. 8 free wafers Other Induction furnaces and ovens Dielectric furnaces and ovens Other furnaces and ovens Infra-red radiation ovens 851430 II For the manufacture of semiconductor dev ices on semiconductor free- free free free free free 8514 30 19 85143091 8514 30 99 8514 90 8514 90 10 8514 90 90 8515 wafers Other Other For the manufacture of semiconductor devices on semiconductor free free free free free wafers Other Parts Of apparatus of subheading 8514 10 0 5. 8 5 14 2 0 0 5. 8514 30 3 free 2. 3 1. 5 0. 8 free 1 I or 85 14 30 91 Other Flectric ( i n c l u d i ng electrically healed gas), laser or other light or photon beam, ultrasonic, electron beam, magnetic pulse or plasma arc soldering, brazing or w e l d i ng machines and apparatus, whether or not capable of cutting: electric machines and apparatus for hot sprav ing of metals or cermets v e n d r e d i, 2 8. fôvrior 1 9 97 European C o m m i s s i on Delegation in Geneva - aj P a ge 10 of 33 CN97 Label Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 Brazing or soldering machines and apparatus 8515 11 oo 8515 19 oo Soldering iions an»l guns < Mher Machines and appaiatus lor resistance welding ol metal 8515 21 00 I ullv or partly automatic 8515 29 8515 29 10 8515 29 90 ( Mher For butt welding Other Machines and apparatus for arc I IIK hiding plasma arc) w elding of metals Fully or partly automatic Other For manual welding with coaled electrodes, complete with welding or cutting devices, and consigned with 1 ransformcrs (icneralors or rotary converters or static converters, recliliers or rectifying apparatus Other Other machines and apparatus Wire bonders of a kind used for manufacturing wafers or devices Other For treating mêlais For welding Other Other For resistance welding of plastics Other Parts For machines of subheading 85 1 5 80 05 Other I'lectrical apparatus for line telephony or line telegraphy. including line telephone sets with cordless handsels and telecommunication apparatus for carrier -current line systems or for digital line systems: videophones : Telephone sets; videophones 8515 31 00 85 I 5 39 8515 39 13 8515 39 18 8515 39 90 8515 80 8515 80 05 8515 80 11 8515 80 19 85158091 8515 80 99 8515 90 8515 90 10 851 5 90 90 8517 cc 37 1. 9 0. 9 free 3. 7 free 2. 8 1. 9 0. 9 free vendredi, 28. février 1997 European Commission Delegation in Geneva - aj Page 11 of 33 CN 97 Label Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 8517 II 00 8517 19 85 17 19 10 8517 19 90 8517 21 00 8517 22 00 8517 30 00 8517 50 8517 50 10 8517 50 90 8517 80 8517 80 10 8517 80 90 8517 90 8517 90 I 1 851790 19 8517 90 82 8517 90 88 8518 8518 10 8518 10 10 8518 10 20 8518 10 80 8518 29 8518 29 10 CO Fine telephone sels with cordless handsels Other Videophones Other Facsimile machines and teleprinters Facsimile machines Teleprinters Telephonic or telegraphic switching apparatus Other apparatus, lor carrier-current line systems or for digital line sv stems for carrier-current line sv stems (Mher ( Mher apparatus F. ntrv -phone s\ stems Other Parts Of apparatus for carrier-ciirrenl line systems of subheading 8517 50 10 Flectronic assembli'-. ; Other Other Flectronic assemblies Other Microphones and stands therefor: loudspeakers, whether or not mounted in their enclosures: headphones, earphones and combined microphone/speaker sets; audio- frequency electric amplifiers; electric sound amplifier sets : Microphones and stands therefor For use in civil aircraft Other 14 7. 5 7. 5 7. 5 7. 5 4. 6 7. 5 7. 5 7. 5 3. 6 3. 6 4. 8 4. 8 free free free free free free free free free free- free free free free 5. 6 I0. 5 5. 6 5. 6 5. 6 5. 6 3. 4 5. 6 5. 6 5. 6 2. 7 2. 7 3. 6 3. 6 3. 8 \. f 7. 0 3. 8 3. 8 3. 8 3. 8 2. 3 3. 8 3. 8 3. 8 1. 8 2. 4 2. 4 3. 5 1. 9 1. 9 1. 9 1. 9 I. I 1. 9 1. 9 1. 9 0. 9 0. 9 1. 2 1. 2 free free free free free free free free free free free free free free Microphones having a frequency range of 300 I Iz. to 3. 4 Kl Iz. 3. 5 free 2. 6 1. 8 0. 9 free with a diameter not exceeding 3 mm. for telecommunications use Other Other For use in civil aircraft vondrodj. 28. fôvrior 1997 European Commission Delegation in Geneva - aj Page 12 of 33 CN97 Label Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 85IX 29 20 I oudspcakcis h. i\ ing a Ircqucucy ol 'Oil 11/ to \ \ Kl Iz w uh a 3 8 free 2. 8 1. 9 0. 9 free 8518 29 80 8518 30 8518 30 10 8518 30 20 8518 30 80 8520 8520 20 00 8521 8521 10 8521 10 10 8521 10 30 8521 10 80 8521 90 8521 90 10 8521 90 90 8523 8523 11 00 8523 12 00 8523 13 00 8523 20 8523 20 1 I 8523 20 19 8523 20 90 8523 90 00 diameter ol not exceeding lo mm. nul a height not exceeding 3 m m. loi telecommunications use (Mher I leadphones. earphones and c oinbuied iniciophone speaker sets I or use in civ d aircrali l i ne telephone handsets Other Magnetic tape recorders and other sound recording apparatus. whether or nol incorporating a sound reproducing device telephone answer ing machines V i d eo recording or reproducing apparatus, whether or nol incorporating a v idcvi tuner Magnetic tape-tv pe For use in civ il aircraft Other Of a w i d th not exceeding 1. 3 cm and a l l o w i ng recording or reproduction at a tape speed not exceeding 50 mm per second Other Other Apparatus as defined in Note 5 F to Chapter 84 Other Prepared unrecorded media for sound recording or similar recording of other phenomena, other than products of Chapter 37 Magnetic tapes Of a w i d th not exceeding 4 mm Of a w i d th exceeding 4 mm but nol exceeding 6. 5 mm Of a w i d th exceeding 6. 5 mm Magnetic discs Rigid W i th a thin film metallic coaling, having a coercivitv exceeding 600 Oersted and an external diameter nol exceeding 231 mm Other Other Other free 3. 0 2. 0 l. O free free 3. 9 2. 6 I. 3 free 14 free 10. 5 7. 0 3. 5 free 3. 2 4. 1 4. 1 4. 1 4. 1 4. 1 free free free free free free free 2. 4 3. 1 3. 1 1. 5 3. 1 3. 1 3. 1 1. 6 2. 0 2. 0 l. O 2. 0 2. 0 2. 0 0. 8 l. O l. O free l. O l. O l. O free free free free free free free vendredi, 28. février 1997 European Commission Delegation in Geneva - aj Page 13 of 33 CN97 Label Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 ,852-1 Records, lapes and oilier recorded media lor sound or other similarly recorded phenomena, I IK hiding matrices and masters I'm the production ol records, but excluding products of Chapter 37 Discs lor laser reading systems «524 3 I 00 8524 32 00 8524 39 8524 39 10 I or reproducing phenomena oilier than sound or image 1. 1 fre>. 3. ) For reproducing sound only Other for reproducing representations ol instructions, data, sound and -I I free 3. 1 image recorded in a machine ie. ul. ihlc binary l o r m. and capable of being manipulated or p r o\ uling mter. uliv ity to the user, bv means of an automatic data processing machine 8524 39 90 Other 8524 40 Magnetic tapes for reproducing phenomena other than sound or image 8524 40 10 Bearing data or instructions ol a kind used in automatic data- 2 8524 40 91 8524 40 99 8524 91 8524 91 10 8524 91 90 8524 99 8524 99 10 8524 99 90 8525 processing machines Other Of a w i d th exceeding 4 nun but not exceeding 6. 5 mm Other Other For reproducing phenomena other than sound or image Bearing data or instructions of a k i nd used in automatic data- processing machines Other Other 3. 6 4. 1 2 4. 1 for reproducing representations of instructions, data, sound and 4. 1 image recorded in a machine readable binary f o r m, and capable of being manipulated or p r o v i d i ng interactivity to the user, by means of an automatic data processing machine Other Transmission apparatus for radio-telephony, radio-telegraph). radio-broadcasting or television, whether or n ol incorporating reception apparatus or sound recording or reproducing apparatus; television cameras: still image video cameras and other video free- free free- free free free 1. 5 2. 7 3. 1 I. 5 3. 1 3. 1 2. 0 2. 0 1. 8 2. 0 l. O 2. 0 2. 0 l. O l. O 0. 9 l. O free l. O l. O free free free free free free free free 8525 10 Transmission apparatus camera recorders : Radio-telegraphic or radio-telephonic apparatus: CO vendredi, 28. février 1997 European Commission Delegation in Geneva - aj Page 14 of 33 CN97 Label 8525 lo It) lor use in c i v il aire rait ( Mher Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 Radio-telegraphic or i. ulio-telcphonie apparatus II free 3. 1 ( Mher I ransinission apparatus incorporating reception apparatus Radio-lclegraphic or ra»ho-telcphonic apparatus, for use in c i v il lice free- free 8525 10 50 8525 10 80 8525 20 8525 20 10 X525 20 91 8525 20 99 8525 40 aircraft Other f or cellular net w oik s (mobile telephones) ( Mher Siil) image v uleo cameras arid other \ ideo camera recorders Slill image video cameras 8525 40 1 I 8525 40 19 D i g i t al Oiher 8525 40 91 Only able to record sound and images taken h\ the television ( Mher v ideo camera recorders free free- 6. 5 6. 5 4. 9 4. 9 4. 9 3. 7 2. 0 free 3. 3 3. 3 2. 5 l. O free 1. 6 1. 6 1. 2 free free free free free 8525 40 99 8527 8527 90 8527 90 10 8527 90 92 8527 90 98 8528 camera Other Reception apparatus for radio-telephony, radio-telegraphy or radio-broadcasting, whether or not combined, in the same housing, with sound recording or reproducing apparatus or a clock : Other apparatus For radio-telephony or radio-telegraphy, for use in c i v il aircraft Other Portable receivers for calling, alerting or paging 9. 6 free 7. 2 4. 8 2. 4 free Other Reception apparatus for television, whether or not incorporating radio-broadcast receivers or sound or video recording or reproducing apparatus; video monitors and video projectors : Reception apparatus for television, whether or not incorporating radio-broadcast receivers or sound or video recording or 8528 12 8528 12 10 reproducing apparatus Colour Apparatus as defined in Note 5 F to Chapter 84 Other 14 free I0. 5 7. 0 3. 5 free * • •• v e n d r e d i, 2 8. f é v r i er 1 9 97 European C o m m i s s i on Delegation in Geneva - aj Page 15 of 33 CN 97 Label Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 — l e l e v i s i on projection equipment 8528 12 14 W i th scanning parameters nol exceeding 625 lines 8528 12 16 8528 12 18 V»'ilh scanning parameters exceeding 625 lines W i th a vertical resolution ol less ihari 7()() lines W i th a vertical resolution ol 700 hues or more —. Apparatus incorporating a video recorder or reproducer 8528 I2 22 8528 12 28 W i th a screen w i d th height ratio less than Other l> Other W i l li integral lube W i th a screen w ullh height ratio less than 1. 5. w ith a diagonal measurement ol the screen Not exceeding 42 cm F. xceeding 4 2 cm but nol exceeding 52 cm F. xceeding 52 cm but not exceeding 72 cm Fxcccdmg 72 cm Other W i l li scanning parameters not exceeding 625 lines, w i th a diagonal measurement of the screen Not exceeding 75 cm Fxcccding 75 cm W i l li scanning parameters not exceeding 625 lines W i th a vertical resolution of less than 700 lines W i th a vertical resolution of 700 lines or more Other W i th screen W i th a screen width/height ratio less than 1. 5 Other Without screen Video tuners Other 8528 12 52 8528 12 54 X528 12 56 8528 12 58 8528 12 62 8528 12 66 8528 12 72 8528 12 76 8528 12 81 8528 12 89 8528 12 91 8528 12 98 8528 13 -- Black and white or other monochrome 8528 13 10 — Apparatus as defined in Note 5 I- to Chapter 84 6. 8 tree 5. 1 3. 4 1. 7 fr ce 8528 13 90 — Other 8528 30 - Video projectors US T^ ^ vendredi, 28. février 1997 European C o m m i s s i on Delegation in Geneva - aj Page 16 of 33 CN 97 L a b el Base Rate Final B o u nd Rate Implementation J u l. 1997 Jan. 1998 J a n. 1999 J a n. 2000 8528 30 05 ol a kind used w uh an automatic «lata processing machines II free 10. 5 7. 0 3. 5 free S528 30 20 8528 30 90 8529 ( Mher Colour Black and white 01 other monochrome Parts suitable lor use solelv or principally w i th the appaiatus of heading Nos 8525 to S52X 8529 10 Aerials and aerial rcllcctms ol all kinds, parts suitable lor use 8529 10 10 For use in c i v il aircraft therew iih Other Aerials 8529 10 15 Aerials of a kind used w ith apparatus for radio-telephony and free 3. 8 2. 5 I. 3 free radio-telegraphic 8529 10 20 Telescopic and u h i p - t v pc aerials for portable apparatus or for apparatus lor l i l t i ng in motor vehicles Outside aerials for radio or telev ision broadcast receivers 8529 10 31 For reception via satellite- 8529 10 39 Other 8529 10 40 Inside aerials for radio or television broadcast receivers, including 8529 10 50 8529 10 70 8529 10 80 8529 90 8529 90 10 built-in ty pes Other Aerial filters and separators Other Other Assemblies and sub-assemblies consisting of Uvo or more parts or pieces fastened or j o i n ed together, for apparatus f a l l i ng w i t h in subheadings 8526 10 10. 8 5 26 91 I I. - 8 5 2 6 - 91 I 9 arid 8526 92 10. for use in c i v il aircraft Other 8529 90 40 Parts ol'apparalusfalling w i t h in subheadings 8525 10 50. 8525 20 4. 7 3. 5 2. 4 1. 2 free 99. 8525 40 3 1. 8525 90 91 or 8527 90 91 8529 90 51 8529 90 59 8529 90 70 Cabinets and eases Of w o od Of other materials Flectronic assemblies Other vendredi, 28. février 1997 E u r o p e an C o m m i s s i on D e l e g a t i on in G e n e va - aj Page 17 of 33 CN 97 Label Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 8529 90 81 f or tclev isimi cameras of subheading 8525 30 and apparatus of 8529 90 89 853 I heading Nos 8. 527 and 8528 Other I Icclric sound or v isu. il signalling apparatus ( for example, bells. sirens, indicator panels, burglar or lire alarms), other than those of heading No X M2 or 8530 X53I 20 Indicator panels incorporating l i q u id crv si,d dev ices (I C D) or 8531 20 10 For use in civ il aircraft light emitting diodes (I I I )| Other 8531 20 30 Incorporating light c u n n i ng diodes ( I I D) 4. 2 free 3. 2 31 20 51 3 I 20 59 31 20 SO 31 80 531 80 10 Incorporating liquid cry si a I dev ices (I. CD) Incorporating acliv e matrix l i q u id cry stal dev ices ( L C D) Colour Black and w h i le or other monochrome Other Other apparatus For use in c i v il aircraft Other 8531 80 30 Flat panel devices of a kind used in automatic data processing machines and telecommunications apparatus Other Paris Of apparatus of subheading 853 1 20 Of apparatus of subheading 853 I 80 30 Other I rce free- free free 4. 2 I. ? 3:1 4. 2 4. 2 Flectrical capacitors, fixed, variable or adjustable (pre-set) : Fixed capacitors designed for use in 50/60 I Iz. circuits and hav ing a reactive power handling capacity of nol less than 0,5 kvar 3. 6 free (power capacitors) Other fixed capacitors Tantalum Aluminium electrolytic Ceramic dielectric, single laver Ceramic dielectric, mullilaver D 5 3. 6 3. 6 free- free free free 8531 80 80 8531 90 S531 90 10 8531 90 30 8531 90 80 8532 8532 10 00 8532 2! 00 8532 22 00 8532 23 00 8532 24 00 3. 2 3. 2 3 2 2. 3 3. 2 3. 2 2. 7 3. 8 3. 8 2. 7 2. 7 2. 1 2. 1 2. 1 2. 1 I. I free 1. 1 I. I free free free. 6 0. 8 free 2. 1 2. 1 2. 5 2. 5 1. 8 1. 8 1. 1 0. 9 1. 3 1. 3 0. 9 0. 9 free free free free free free free <* J* (endredi, 28. février 1997 European C o m m i s s i on Delegation in Geneva - aj Page 18 of 33 CN 97 Label 8552 25 00 8532 29 00 S 5 52 30 00 8 5 32 90 00 -- -- - - Dielectric ol paper or pi. isius other V a r i a b le or a i l | i i s |. i h lc ( p r c - s cl I c a p. u Mois P a ns 8 5 33 I I c c l n c al r e s i s i o rs ( uic h i d i ng r h c o s i a ls a nd p o t e n t i o m e t e r s ) ;, o t h er t h an h e a t i ng r e s i s i o rs Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 w> V r, s 17 free free f r ee free 2. 7 2. 7 3. 8 3. 5 1. 8 1. 8 2. 5 2. 4 0. 9 0. 9 13 1. 2 " f r ee free free f r ee 8 5 33 10 00 - F i x ed c a r b on r e s i s t o r s, c o m p o s i t i on or film tv p es 3. 7 f r ee 2. 8 1. 9 0 9 f r ee ( )ther f i x ed r c s i s t o is 8 5 53 2 1 00 -- F or a p o w er h a n d l i ng capac uy n ot e x c e e d i ng 2o \\ 3 7 f r ee 8533 29 1)1) - Other 3. 7 free 2. 8 2. 8 1. 9 1. 9 0. 9 0. 9 f r ee free 8533 31 00 8533 39 00- 8533 40 8533 4 0 )0 8533 40 90 5533 90 00 8534 00 -- -- - -- -- - \\ i r c w o u ud v a r i a b le r e s i s i o r s, i n c l u d i ng r h e o s t a ts a nd p o t e n t i o m e t e rs For a power handling capacity not exceeding 20 W Other Other variable resisiors. including rheostats and potentiometers For a power handling capacity not exceeding 20 W Other Parts Printed circuits Consisting only of conductor elements and contacts 5534 00 1 1 - M u l t i p le circuits 8534 00 19 8534 00 90 - - Other W i th other passive elements 8536 Flecirieal apparatus for switching or protecting electrical circuits, 3. 7 3. 7 3. 7 3. 7 3. 7 5. 2 5. 2 5. 2 free free free free free free free free 2. 8 2. 8 2. 8 2. 8 2. 8 3. 9 3. 9 3. 9 1. 9 1. 9 1. 9 1. 9 1. 9 2. 6 2. 6 2. 6 0. 9 0. 9 0. 9 0. 9 0. 9 1. 3 1. 3 1. 3 free free free free free free free free 8536 50 8536 50 03 - -- or for m a k i ng connections to or in electrical circuits ( f or example, switches, relays, fuses, surge suppressors, plugs, sockets, lamp- holders, junction boxes), for a voltage not exceeding ! 0 00 V : Other switches Flectronic AC switches consisting of optically coupled input and 3. 2 free output circuits (Insulated thy ristor AC switchs) 8536 50 05 - Flectronic switches, including temperature protected electronic switches, consisting of a transistor and a logic chip (chip-on-chip 3. 2 free technology) for a voltage nol exceding 1000 volts 2. 4 2. 4 1. 6 1. 6 0. 8 0. 8 free free 8536 50 07 - P'lcciromcchanical snap-acion switches for a current not 3. 2 free 2. 4 1. 6 0. 8 free exceeding 1 1 amps Other r* t •> ^^ s^C v e n d r e d i, 28. f é v r i er 1 9 97 European Commission in G e n e va - aj D e l e g a t i on P a ge 19 of 33 CN 97 Label 8536 50 I I —- Push-button switches For a voltage not exceeding 60 V Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 8536 50 15 8536 50 19 8536 50 90 8536 69 8536 69 05 ---- -—. - --- Kotarv switches (Mher o i l i er Other Plugs and sockets for co-axial cables and printed circuits 3. 2 free 2. 4 1. 6 0. 8 free ( Mher 8536 69 l() — l;o r c » - ; i \ i ; ri cables 8536 69 30. f or printed circuits 8536 69 90 — Other 8536 90 8536 90 01 8536 90 10 8536 90 20 8536 90 85 8541 - -- -- - -- 8541 10 8 5 4 1 10 10 - -- Other apparatus Prefabricated elements for electrical circuits Connections and contact elements for wire and cables Wafer probers (Mher Diodes, transistors and similar semiconductor devices; photosensitive semi- con- duclor devices, including photovoltaic cells whether or nol assembled in modules or made up into panels; l i g h l - e m i t t i ng diodes; mounted piezo-eleclric c n s l a ls : Diodes, other than photosensitive or l i g h t - e m i t t i ng diodes Wafers nol yet cul into chips Other 8541 10 91 — Power rectifier diodes 8541 10 99 — Other Transistors, other than photosensitive transistors 8541 21 - W i th a dissipation rate of less than I W 8 5 4 1 2 1 10 — Wafers nol yet cut into chips 8 5 4 1 2 1 90 8541 29. - Other Other 8 5 4 1 29 10 — Wafers not \ el cut into chips 8 5 4 1 29 20 — P o w e r M OS field effective transistors 8 5 4 1 29 30 — Insulated gale bipolar transistors ( K i B T s) 8 5 4 1 29 80 — Other 854 1 30 - Thvristors. diacs and triacs. oilier than photosensitive dev ices CO vendrodi. 28 fôvrior 1997 European C o m m i s s i on D e l e g a t i on in G e n e va - aj 3 2 free free free 2. 4 free 1. 6 free 0. 8 free free free 7 7 7 7 7 7 7 7 7 free free free free free free free free free 3. 5 3. 5 3. 5 3. 5 3. 5 3. 5 3. 5 3. 5 3. 5 1. 8 1. 8 1. 8 1. 8 1. 8 1. 8 1. 8 1. 8 1. 8 free free free free free free free free free free free free free free free free free free Page 20 of 33 CN97 Label Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 X 5 4 I 3 0 IO X 5 II 30 90 X5-1I 40 -- - - Wafers not vet cut into chips (Mher Phoioseiisiiiv e semiconductor dev ices, including pholov oliaic cells whether or not assembled in modules m made up into panels. light-emitting diodes I i g h l - e m i l l i ng diodes K. vll 40 II — I aser diodes 8541 40 11). o i l i er ( Mher 8541 40 9|. -- Solar cells whether or not assembled in modules m made up m io 8541 40 93 --- PholodiiHtes. |ihololiaiis|viois. photothy risiors or photocouples panels 8511 40 99 — Other 854150 - Other semiconductor dev ices 8541 50 10 -- Wafers not yet cut into chips 8541 50 90 854160 00 8541 90 00 - - - Olher Mounted piezo-eleclric cry stals Parts 7 7 7 7 3. 2 I. 8 l 8 7 7 5. 6 4. 1 free free free free- free free- free free- free free free 8542 Flectronic integrated circuits and microassemblies : Monolithic digital integrated circuits 8542 12 00 -- Cards incorporating an electronic integrated circuit («smart» 14 free cards) 8542 13 - Metal oxide semiconductors (MOS technology) 8542 13 01 — Wafers nol yet cut into chips 8542 13 05 — Chips Other — Memories 8542 13 11 8542 13 13 Dynamic random-access memories (D-KAMs) With a storage capacity not exceeding 4 Mbits Willi a storage capacilv exceeding 4 Mbits but not exceeding 16 Mbits 8542 13 15 With a storage capacitN exceeding 16 Mbits but not exceeding 64 8542 13 17 With a storage capacit. v exceeding 64 Mbits Mbits 7 7 7 7 7 7 free free free free- free 3. 5 3. 5 3. 5 3. 5 1. 6 0. 9 0. 9 3. 5 3. 5 2. 8 2. 0 7. 0 3. 5 3. 5 3. 5 3. 5 3. 5 3. 5 1. 8 1. 8 I. 8 1. 8 0. 8 0. 5 0. 5 1. 8 1. 8 1. 4 l. O 3. 5 1. 8 1. 8 1. 8 1. 8 I. 8 I. 8 free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free O vendredi, 28. février 1997 European Commission Delegation in Geneva - aj Page 21 of 33 CN 97 Label Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 8542 13 22 8542 13 25 Sialic random-access memories ( S - K A N F l. including cache random-access memories l e a c h e - K A M s) W i th a storage capacity not exceeding 256 Kbits W i l li a storage capacity exceeding 256 Kbits bul not exceeding I M b it 8542 13 27 W i th a storage capacity exceeding I M b it 8542 13 32 8542 13 35 I IV erasable, programmable, read only memories ( F P R O M s) W i l li a storage capacilv not exceeding I M b it W i l li a storage capacilv exceeding I M b it but nol exceeding 4 M b i ts 8542 13 37 W i l li a storage cap. u ily exceeding 1 Mbits I leclrically erasable, p r o g r a m m a b le read only memories 8542 13 41 8542 13 43 ( F T R O M s ). including F L A SK F ' P K O Ms F L A SH F ' P R O Ms W i th a storage capacity not exceeding I M b il W i th a storage capacity exceeding I M b it but not exceeding 4 M b i ts 8542 13 45 W i th a storage capacilv exceeding 4 M b i ts but not exceeding 16 8542 13 47 8542 13 49 8542 13 51 M b i ts W i th a storage capacilv exceeding 16 M b i ts Other Read only memories, non-programmable ( R O M s ); content addressable memories ( C A M s ); first-in/first-out read/write memories ( F I F O s ); last-in/lirsl-oul read/write memories ( F I F O s ); ferroelectric memories 8542 13 53 Other memories 8542 13 55 -— Microprocessors 8542 1. 3 61 8542 13 63 — M i c r o c o n t r o l l e rs and microcomputers W i th a processing capacity not exceeding 4 hits W i l li a processing capacity exceeding 4 bits but nol exceeding 8 bits 8542 13 65 W i th a processing capacity exceeding 8 bits but not exceeding 16 bits 8542 13 67 W i th a processing capacilv exceeding 16 bits but nol exceeding 8542 13 69 W i th a processing capacilv exceeding 32 bits 32 bits free free- free free free free- free free free- free free free 7 free 5. 6 7 7 7 7 free free free free- free free free free free free free free free free free free- free free- free free free free free free free free free free free free free 3. 5 free 2. 8 3. 5 3. 5 3. 5 3. 5 free free free free free free free free free free free free 1. 8 free 1. 4 1. 8 1. 8 1. 8 1. 8 free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free /»oa* v e n d r e d i, 2 8. f é v r i er 1 9 97 European Commission < Delegation in Geneva - aj Page 22 of 33 CN97 Label 8542 13 70 Micropeiipherals Olhcr 8542 13 72 8542 13 74 8512 13 76 8542 13 82 8542 13 81 8542 13 91 Olhcr I till custom logic circuits d a le arravs Standard cells Programmable logic circuits Standard logic circuits Other C o n t r ol circuits, interlace circuits, mtei lace circuits capable of p e r f o r m i ng control l i m i t i o ns 8542 13 99 Other 8542 14 8542 14 01 -- --- Circuits obtained b> bipolar technology Wafers not vet cut into chips 8542 14 05 — Chips Other — Memories 8542 14 10 8542 14 15 8542 14 20 8542 14 22 8542 14 29 Dynamic random-access memories (D-RAMs) Static random-access memories (S-RAMs), including cache random-access memories (cache-RAMs); read only jiicmories. non-programmable (ROMs): content addressable memories (CAMs); first-in/first-out read/write memories (FIFOs): last- in/llrst-out read/write memories (FIF'Os); ferroelectric memories Electrically erasable programmable, read only memories (PPROMs). including FLASH l/PROMs UV erasable, programmable, read onlv memories (FPROMs) Other memories 8542 14 30 — Microprocessors — Microcontrollers and microcomputers 8542 14 42 8542 14 44 With a processing capacity not exceeding 4 bits Wilh a processing capacity exceeding 4 bils 8542 14 50 Micro-peripherals Other Other 8542 14 60 Full custom logic circuits Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 5. 6 7 7 7 5. 6 5. 6 7 7 7 7 7 free free free 7 free 5. 6 7 5. 6 7 free free free free free free- free free free- free free free free free free free free free free fr. -c 2. 8 3. 5 3. 5 3. 5 2. 8 2. 8 3. 5 3. 5 3. 5 3. 5 3. 5 free free free 3. 5 free 2. 8 3. 5 2. 8 3. 5 1. 4 I. 8 I. 8 1. 8 1. 4 1. 4 1. 8 I. 8 1. 8 1. 8 I. 8 free free free 1. 8 free 1. 4 i. 8 1. 4 I. 8 free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free Iree free free free free free free free free free vendredi, 28. février 1997 E u r o p e an C o m m i s s i on Delegation in Geneva - aj Page 23 of 33 CN 97 L a b el B a se R a te F i n al B o u nd I m p l e m e n t a t i on 8542 14 65 8542 14 70 8542 14 75 8542 14 80 d a te arrays Standard cells Programmable logic circuits Standard logic circuits Other 8542 14 91 Control circuits; interlace circuits, interface circuits capable of 8542 14 99 Other p e r f o r m i ng control functions 8542 19 — Other, includ. ing circuits obtained by a combination ol bipolar and M OS technologies | B I \ |( )S technology ) 8542 1901 — Wafers not vel cut into chips 8542 19 05 — Chips Other — Memories 8542 19 15 Dy namic random-access memories ( D - R. A M s) 8542 19 22 8542 19 25 8542 19 27 8542 19 31 8542 19 35 —- 8542 19 41 Static random-access memories (S-R. AMs). including cache random-access memories ( c a c h e - R A M s) W i l li a storage capacity not exceeding 256 Kbits W i th a storage capacity exceeding 256 Kbits but nol exceeding I Mbil W i th a storage capacity exceeding 1 M b it UV erasable programmable, read only memories ( F P R O M s) Electrically erasable programmable, read o n ly memories ( EJP R O M s ), including i ' F A SH F / P R O Ms Read only memories, non-programmable ( R O M s ); content addressable memories ( C A M s ); first-in/first-out read/write memories (FIFOs); last-in/firsl-out read/write memories ( F I F O s ); ferroelectric memorie:; 8542 19 49 Other memories 8542 19 55 — Microprocessors 8542 19 62 8542 19 68 — Microcontrollers and microcomputers Wilh a processing capacilv not exceeding 4 bits W i th a processing capacity exceeding 4 bits R a te free free- free free free free free free free- free free free free free free free free free free 7 7 5 6 5 6 7 7 free free free free free free 7 free 5. 6 7 5. 6 J u l. 1 9 97 J a n. 1 9 98 J a n. 1 9 99 J a n. 2 0 00 3. 5 3. 5 2. 8 2. 8 3. 5 3. 5 3. 5 3. 5 3. 5 free free free free free free 3. 5 free 2. 8 3. 5 1. 8 1. 8 1. 4 1. 4 1. 8 free free free free free free 1. 8 free 1. 4 1. 4 free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free 8542 19 71 Microperipherals Other Other ww v e n d r e d i, 2 8. f é v r i er 1 9 97 European Commission Delegation in Geneva - aj P a ge 24 of 33 CN 97 Label 8542 19 72 8512 19 71 8542 19 76 8542 19 82 8542 19 84 I nil custom logic eneuiis (ialc arrays Standard cells Programmable logic c i u u i ts Standard logic circuits Other Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 7 7 7 5. 6 S. 6 free free free free free 3. 5 3. 5 3. 5 2. 8 2. 8 8542 1992 Control circuits; interlace circuits, interlace circuits capable of 7 free 3. 5 performing control lunctioiis 8542 19 98 Other 8542 30 8542 30 10 8542 30 20 - -- - Oilier monolithic mlegialcd circuits Wafers not yet cut inio chips Chips Olhcr 8542 30 30 — A m p l i f i e rs 8542 30 50 — Voltage and current regulators 8542 30 61 — Smartpower circuits Control circuits 8542 30 65 8542 30 69 Other M i x ed analogue-digital circuits Other 8542 30 70 — Interface circuits; interface circuits capable of p e r f o r m i ng control functions Other 8542 30 91 — 8542 30 95 8542 30 99 Smartpower circuits Other Mixed analogue-digital circuits Other 8542 40 - I l y b r id integrated circuits 8542 40 10 — Microprocessors, microcontrollers and microcomputers 8542 40 30 8542 40 50 8542 40 90 8542 50 00 8542 90 00 - - -- - - Converters A m p l i f i e rs Other Electronic microassemblies Parts 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 7 4. 1 free free free free free free free free free free free free free free free free free 3. 5 3. 5 3. 5 3. 5 3. 5 3. 5 3. 5 3. 5 3. 5 3. 5 3. 5 3. 5 3. 5 3. 5 3. 5 3. 5 2. 0 1. 8 1. 8 1. 4 1. 4 1. 8 1. 8 1. 8 I. 8 1. 8 I. 8 1. 8 1. 8 1. 8 1. 8 1. 8 1. 8 1. 8 I. 8 l. O free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free free vendredi, 28. février 1997 European C o m m i s s i on Delegation in Geneva - aj Page 25 of 33 C N 97 Label Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 8543 8543 I I 00 8543 30 I lectrical machines and apparatus, having individual functions. not spciilicd or IIK ludcd cEcu hcic m this ( hapier Particle accclcialors Ion implanters lor doping semiconductor materials Machines and apparatus for electroplating, eleclroly sis or electrophoresis 8543 30 10 Apparatus for wet etching, developing, shipping or cleaning free semiconductor w a I era 85-13 30 20. Apparatus lor wet etching, developing shipping or cleaning liquid crystal diplay suhsUaics 85-13 30 90 ( Mher 8543 81 00 85-13 89 85-13 89 10 85-13 89 I 5 8543 89 17 8543 89 20 8543 89 51 8543 89 55 8543 89 59 8543 89 70 8543 89 72 8543 89 73 854 3 89 77 8543 89 79 ( Mher machines and apparatus Proximity cards and tags ( Mher flight recorders, lor use in civil aircraft Electrical machines with translation or dictionary functions Apparatus as defined in nol 5 I lo Chapter 84 Aerial amplifiers Sunbeds. sunlamps and similar suntanuing equipment For fluorescent lubes using ultraviolet A rays With a maximum tube length of 100 cm Other Other Apparatus for physical deposition on semiconductors wafers. by sputtering on semiconductor wafers Other Encapsulation equipment for assembly of semiconductors Set top boxes, having a communication function, microprocessor based device inorporaling a modem for gaining access lo the Internet, and having a functioi of interactive information exchange Multimedia upgrade kits, for automatic data processing machines and units thereof, put up for retail sale consisting of. at least. speakers and/or microphones. and a printed circuit assembly that enables the automatic data processing and units thereof lo process audio signals (sound cards) free 5 5 5 free free free free- free free free free free free I ra Iree free 3. 8 3. 8 free 3. 8 3. 8 3. 8 free Iree free 2. 5 2. 5 2. 5 free 2. 5 2. 5 2. 5 free free free free 1. 3 1. 3 1. 3 free free free free free free free free free free free 3. 8 2. 5 1. 3 free r» vendredi, 28. février 1997 E u r o p e an C o m m i s s i on D e l e g a t i on in G e n e va - aj Page 26 of 33 C N 97 Label 854 3 89 90 854 3 90 Other Paris 8543 90 11) Assemblies and sub-assemblies consisting ol two or more parts or pieces Listened or loined together, lor (light recorders, lor use in c i v il aircrall 854 3 90 20 Ol apparatus ol suhe. idings XM1 II on. Xs It to | o. s54 3 89 70 8543 90 30 8543 90 90 8544 8544 41 8544 41 10 8544 41 90 8544 49 8544 49 20 8544 49 80 8544 51 8544 51 10 8544 51 90 8544 70 00 9006 9006 10 9006 10 10 or 85 It to III Of apparatus ol subheading X^M X'> "2 and X< It X9 71 Other Insulated (including enamelled or aiiodised) w ire. cable ( i n c l u d i ng coaxial cable I aiul other insulated elccific conductors. w helher or not lined \\ ith cornice tors, optical libre cables, made up of mdiv iduallv shcalhcd fibres, vvhelher or nol assembled with electric conductors or lilted w i th connectors : (Mher electric conductors, for a voltage not exceeding 80 V Filled w ith connectors Of a kind used for telecommunications 4. 6 Other Other Of a kind used for telecommunications 4. 8 free- Other Olher electric conductors, for a voltage exceeding 80 volts bul not exceeding 1 000 volts Fitted w i th connectors Of a kind used for telecommunications Other Optical fibre cables Photographic (other than cinematographic) cameras; photographic flashlight apparatus and llashhulhs other than discharge lamps of heading No 8539 : Cameras of a kind used for preparing printing plates or cylinders 4. 6 6. 3 free free B3se Rate Final BounB Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 free free 3. 8 3. 8 2. 5 2. 5 1. 3 I. 3 free free 3. 4 3. 6 3. 4 4. 7 2. 3 2. 4 2. 3 3. 1 El 1. 2 El 1. 6 free free free free Pattern generating apparatus of a kind used for producing masks free free free free free free or reticles from photoresist coated substrates 9006 10 90 Other ^ 9006 91 00 For cameras Paris and accessories: vendredi, 28. février 1997 European C o m m i s s i on Delegation in Geneva - aj Page 27 of 33 CN97 Label 9006 99 10 9006 99 90 9009 Other of apparatus of subheading 9()()(i |0 |0 Other Pholocopv ing apparatus incorporating an optical sy stem or of the contact t \ pe and iherino-copv ing apparatus: Electrostatic pholocopv ing apparatus 9009 1 1 00 Operating bv reproducing the original image directly onto the 9009 21 00 9009 90 9009 90 10 9009 90 90 9010 9010 41 00 9010 42 00 9010 49 00 9010 90 9010 90 10 9010 90 90 9011 9011 10 9011 10 10 9011 10 90 9011 20 copy (direct process) ( Mher pholocopv ing apparatus Incorporating an optical system Pans and accessories ( )f electrostatic photocopy ing apparatus or other pholocopv ing apparatus incorporating an optical system Other Apparatus and equipment for photographic ( i n c l u d i ng cinematographic) laboratories (including apparatus for the projection ol circuit patterns on sensilived semi-conductor material), nol specified or included elsewhere in this chapter. negatoscopes, projection screens Apparatus for the projection or drawing of circuit patterns on sensiti/ed semiconductor materials: Direct write-on-wafer apparatus Step and repeat aligners Other Parts and accessories Of the apparatus of subheadings N° 9010 41 00. 9010 42 00 and 9010 49 00 Other C o m p o u nd optical microscopes, including those for photomicrography, cine-photomicrography or m i c r o p r o j e c l i on Stereoscopic microscopes fitted w i th equipment specifically designed for the h a n d l i ng and transport of semiconductor wafers or reticles Other Other microscopes, for p h o t o m i c r o g r a p h }, cine-photomicrography or micro-projection Base Rate F i n al B o u nd R a te Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 free 3. 0 2. 0 l. O free 6. 5 6. 5 6. 5 3. 8 Iree free- free 3. 6 free- free free free- free free 4. 9 4. 9 4. 9 2. 8 free free free 2. 7 3. 3 3. 3 3. 3 1. 9 free free free 1. 8 free free free free free free free free E6 1. 6 0. 9 free free free 0. 9 6. 0 4. 0 2. 0 free « V7 v e n d r e d i, 2 8. f é v r i er 1 9 97 European C o m m i s s i on Delegation in Geneva - aj Page 28 of 33 CN97 Label Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 9111 I 20 10 l i n ed w i th equipment specific all) designed for the handling and transport o! semiconductor wafers or reticles 91)1 I 20 90 ( Mher 6. 0 4. 0 2. 0 91)1 1 90 91)1 1 90 10 91)1 1 90 90 9012 Paris and aceessones ( )l apparatus ol subheadings \ 9 ( l| 1 10 |0 or 901 I 20 10 free 6. 0 4. 0 2. 0 Other Microscopes other than optical microscopes, d i l l r a c t io microscopes free free 9012 10 Microscopes other than optical microscopes and d i f f r a c t i on apparatus 9012 10 10 Electron beam microscopes lined with equipment specilicall} 4 5 designed for the handling and transport of semiconductor wafers 3. 4 2. 3 I. I free 9012 10 90 Other or reticles 9012 90 901 2 90 10 9012 90 90 9013 Parts and accessories Of apparatus of subheading N° 90 12 10 00 Olhcr L i q u id crystal devices not consisluting articles provided for more specifically in other headings: lasers, other than laser diodes; other optical appliances and instruments, nol specified or included elsewhere in this Chapter 9013 80 Other devices, appliances and instruments 9013 80 II 9013 80 19 9013 80 30 9013 80 90 9013 90 9013 90 10 9013 90 90 L i q u id crystal dev ices A c t i ve matrix liquid crystal devices Colour Black and white or other monochrome Olhcr Other Parts and accessories Other For liquid crystal devices ( L C D) Olhcr 4. 5 free- 3. 4 2. 3 free 6. 5 6. 5 6. 5 free free free 4. 9 4. 9 4. 9 3. 3 3. 3 3. 3 E6 1. 6 1. 6 free free free 6. 5 free 4. 9 3. 3 1. 6 free v e n d r e d i, 2 8. f é v r i er 1 9 97 European C o m m i s s i on Delegation in Geneva - aj Page 29 of 33 CN97 Label Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 901 7 D r a w i n g, marking-out or malheinalic. il calculating instruments ( for e x a m p le d i a l l i ng machines, pantographs, protraclors. drawing sels, slide rules, disc calculators), instruments for measuring length, for use in the hand ( for example, measuring rods and tapes, inieroinelcrs. callipers), not specified or included else- where in this chapter Drafting tables and machines, whether or not automatic Plotters Other ( Mher draw ing. marking-out or malheuialic. il calculating instruments D r a w i ng instruments Plotters D r a w i ng sets ( Mher M a rk ing-out instruments Pattern generating apparatus of a kind used for producing masks or reticles from photoresist coaled substrates Other Mathematical calculating instruments ( i n c l u d i ng slide rules, disc calculators and the like) Parts and accessories For apparatus of subheading 9017 20 3 1 Other Instruments and apparatus for measuring or checking the How, level, pressure or other variables of liquids or gases (for example, Row meters, level gauges, mano- meters, heal meters), excluding instruments and apparatus of heading No 9014, 9015, 9028 or 9032 : For measuring or checking (he How or level of liquids For use in c i v il aircraft Other Electronic Flow meters Other Other 9017 10 9017 10 10 9017 10 90 9017 20 9017 20 05 9017 20 II 9017 20 19 9017 2031 9017 20 39 9017 20 90 9017 90 9017 90 10 9017 90 90 9026 9026 10 9026 10 10 9026 10 51 9026 10 59 3. 7 free 2. 8 1. 9 0. 9 free 3. 7 free 2. 8 1. 9 0. 9 free free free free 3. 7 free 2. 8 E9 0. 9 free free 4. 8 4. 8 free free free free free free 3. 6 3. 6 2. 4 2. 4 1. 2 1. 2 free free free vendredi, 28. février 1997 European C o m m i s s i on Delegation in Geneva - aj Page 30 of 33 C N 97 Label 9026 10 91 9026 10 99 9026 20 9026 20 10 9026 20 31) F l ow m e t e rs O t h er I or m e a s u r i ng or c h e c k i ng p r e s s u re F or use in civ il a r r c r a lt ( Mher Electronic Other 9026 20 51. Appliances lor measuring and non-autoinatieallv regulating Ivre Spiral or metal diaphragm type pressure gauges 9026 20 59 9026 20 90 9026 X0 9026 XO 10 9026 80 91 9026 80 99 9026 90 9026 90 10 9026 90 90 9027 9027 20 9027 20 10 9027 20 90 9027 30 00 pressure Other Other ( Mher instruments or apparatus For use in civ il aircraft Other Electronic Other Parts and accessories For use in civil aircraft Other Instruments and apparatus for physical or chemical analysis (for example, polarimelcrs. refraetometers. spectrometers, gas or smoke analvsis apparatus): instruments and apparatus for measuring or checking viscosity, porosity, expansion, surface tension or the like; instruments and apparatus for measuring or checking quantities of heat, sound or light (including exposure meters); microtomes : Chromatographs and electrophoresis instruments Chromalographs Electrophoresis instruments Spectrometers, spectrophotometers and spectrographs using optical radiations (UV. visible. IR) 9027 50 00 Other instruments and apparatus using optical radiations (UV. 9027 80 Other instruments and apparatus visible IR) Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 J a n. 2000 3 6 3 6 free 4. 8 3 3 3. 3 3. 3 4. 8 3 6 free 3. 3 3. 5 4. 4 3. 5 4. 4 free Iree free free- free free free free free free free free free free free 2. 7 2. 7 free 3. 6 2. 5 2. 5 2. 5 free 3. 6 2. 7 free 2. 5 2. 6 3. 3 2. 6 3. 3 1. 8 I. 8 free 2. 4 I. 6 E6 1. 6 free 2. 4 E8 free E6 2. 2 1. 8 2. 2 0. 9 0. 9 free I. 2 0. 8 0. 8 0. 8 free E2 0. 9 free 0. 8 0. 9 El 0. 9 El free free free free free free free free free free free free free free free free Electronic CJf svondrodi, 28. février 1997 European C o m m i s s i on Delegation in Geneva - aj Page 31 of 33 CN97 Label Base Rate F i n a. B o u nd R a te I m p l e m e n t a t i on J u l. 1 9 97 J a n. 1 9 98 J a n. 1 9 99 J a n. 2 0 00 9027 80 1 I pi I meters, rl I meters and other apparatus lor measuring conducliv it} 9027 X0 15 Apparatus lor p e r l o i n u ng measurements ol the phv sical properlies ol semiconductor materials oi associated insulating and conducting la} ers during lhe semiconductor wafer production process 9027 X0 IX 9027 80 91 9027 XO 95 9027 XO 98 9027 90 9027 90 10 9027 90 50 Other Other Viscometers, porosimctcrs and expansion meters Apparatus for p c i t o r m i ng measurements ol the physical properties ol s e m i i o n d u i t oi materials or associated insulating and conducting layers during the semiconductor wafer production process Other Microtomes; parts and accessories Microtomes 4 1 free 4 1 4 free Iree free 4 free 3. 3 free 3. 3 3. 0 free 3. 0 3. 3 i':'. rt and accessories of apparatus of heading N' 9027 20 to 9027 4. 4 free 80 9027 90 80 Parts and accessories of microtomes or of gas or smake analysis apparatus 9030 Oscilloscopes, spectrum analysers and other instruments and apparatus for measuring or checking electrical quantifies, excluding meters of heading No 9028: instruments and apoaralus for measuring or detecting alpha, beta, gamma. X-ray, cosmic or other ionizing radiations : 9030 40 Other instruments and apparatus, specially designed for telecommunications (for example, cross-talk meters, gain measuring instruments, distortion factor meters, psophometers) 9030 40 10 9o30 40 90 9030 82 00 9030 90 9030 90 10 9030 90 20 9030 90 80 C7 For use in c i v il aircraft Other Other instruments and apparatus free 5. 5 For measuring or checking semiconductor wafers or devices free- free free- free free 4. 1 free Parts and accessories For use in c i v il aircraft For apparalu- of subheading N° 9030 82 00 4 4 free 3. 3 Other v o n d r o d i, 2 8. f é v r i er 1 9 97 European C o m m i s s i on Delegation in Geneva - aj 2. 2 free 2. 2 2. 0 free 2. 0 2. 2 free 2. 8 free 1 1 1. 1 free 1. 0 free free free iree free 1. 0 free El free free 1. 4 free free free free II free P a ge 32 of 33 C N 97 Label Base Rate Final Bound Rate Implementation Jul. 1997 Jan. 1998 Jan. 1999 Jan. 2000 9<|1| Measuring m checkme iiistiuuients. appliances and machines, nol spec ilied or I IK hided eEew here in this chapter profile protectors ( Mher optical inshumcuts and appliances 9031 4 1 00 I or inspecting sciuicoihluc tor w alers or »lev ices or for inspecting photomasks oi icliclc's used m m. IIIIII. U luring semieoiidiictor I rev free- free free free free 9031 19 9031 49 10 9031 49 90 9031 90 9031 90 10 9031 90 20 9031 90 90 dev lie's Olhcr I oi measuring surl. uc particulate contammalion on free free- free free free senneonductor w alers Other Paris ,md accessories ( )l iiisirumenls. appliances ,\\\i. \ machines ol subheading 9(>3 I XO. for use in civ il aircraft I or apparatus of subheadings N ' 9 0 31 4 1 00 and 90. 3 I 49 10 4. 6 free 3. 4 2. 3 El free Other vendredi, 28. février 1997 European Commission Delegation in Geneva - aj Page 33 of 33 EC - ITA - Schedule CXL - Attachment A, Section 2 Description HS 97 Headings Quartz reactor tubes and holders designed for insertion into diffusion and oxidaUon furnaces for production of semiconductor wafers 70200005 Chemical vapor deposition apparatus for semiconductor production E4193920 Parts of chemical vapor deposition apparatus for semiconductor production Spin dryers for semiconductor wafer processing Parts of spin dryers for semiconductor wafer processing Deflash machines for cleaning and removing contaminants from the metal leads of semiconductor packages prior to the electroplating process Spraying appliances for etching, stripping or cleaning semiconductor wafers Parts of spraying appliances for etch. ng, stripping or cleaning semiconductor wafers Machines fo. working any material by removal of material, by laser or ciîïe"r light or photo beam in the production of semiconductor wafers Apparatus for stripping or cleaning semiconductor wafers Machines for dry-etching patterns on serr iconductor materials Focused ion beam milling machines to produce or repair masks and reticles for patterns on semiconductor devices 84199030 84211995 84219110 84248930 84248920 84249010 84561010 84569930 84569100 84569910 Lasercutters for cutting contacting tracks in semiconductor production by laser beam 84561010 Machines for sawing monocrystal semiconductor boules into slices, or wafers into chips 84641010 Grinding, oolishing and lapping machines for processing of semiconductor wafers Dicing machines for scribing or scoring semiconductor wafers Parts for machines for sawing monocrystal semicond:;ctor boules into slices, or wafers into chips 84642005 84649010 84669115 Parts of dicing machines for scribing or scoring semiconductor wafers 84669115 ^arts of grinding, polishing and lapping machines for processing of semiconductor wafers 84669115 Parts of focused ion beam milling machines to produce or repair masks and reticles for patterns on semiconductor devices 84669315 Parts of lasercutters for cutting contacting tracks in semiconductor production by laser beam Parts of machines for working any material by removal of material, by laser or other light or photo beam in the production of semiconductor wafers Parts of apparatus for stripping or cleaning semiconductor wafers Parts of machines for dry-etching patterns on semiconductor materials 84669315 84669. 315 84669315 84669315 Encapsulation equipment for assembly of semiconductors 84771010, 84775905 Parts of encapsulation equipment 84779004 vendredi, 28. février 1997 Page I of3 53 Description Automated machines for transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other material for semiconductor devices HS 97 Headings 84283993 Apparatus for growing or pulling monocrystal semiconductor boules 84798965 Apparatus for physical deposition by sputtering On semiconductor wafers 84198925, 85438970 Apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays 84798975, 84798976 Die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors 84798977. 85158005. 85159010 Encapsulation equipment for assembly of semiconductors 84798979, 85438973 Epitaxial deposition machines for semiconductor wafers 84798970 Machines for bending, folding and straightening semiconductor leads 84622105, 84622905 Physical deposition apparatus for semiconductor production 85438972 Spinners for coating photographic emulsions on semiconductor wafers 84211993 Part of apparatus for physical deposition by sputtering on semiconductor wafers Parts for die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors Parts for spinners f or c o a t i ng p h o t o g r a p h ic emulsions on s e m i c o n d u c t or wafers Parts of a p p a r a t us f or g r o w i ng or p u l l i ng m o n o c r y s t a' s e m i c o n d u c t or b o u l es 85439020 84799050 * 84219110 84799050 Parts of a p p a r a t us for wet e t c h i n g, d e v e l o p i n g, s t r i p p i ng or c l e a n i ng s e m i c o n d u c t or wafers a nd flat panel displays 84799050, 85439020 Parts cf a u t o m a t ed m a c h i n es f or transport, h a n d l i ng a nd s t o r a ge of s e m i c o n d u c t or w a f e r s, wafer cassettes, wafer b o x es a nd o t h er material f or s e m i c o n d u c t or devices 84313920 Parts of e n c a p s u l a t i on e q u i p m e nt f or assembly of s e m i c o n d u c t o rs 84799050, 85439C30 Parts of epitaxial d e p o s i t i on m a c h i n es for s e m i c o n d u c t or w a f e rs 84799050 Parts of m a c h i n es for b e n d i n g, f o l d i ng a nd s t r a i g h t e n i ng semf o n d u c t or leads 84669410 Parts of p h y s i c al d e p o s i t i on a p p a r a t us for s e m i c o n d u c t or p r o d u c t i on 84199030, 85439030 I n j e c t i on a nd c o m p r e s s i on m o u l ds for the m a n u f a c t u re of s e m i c o n d u c t or devices 84807110 Resistance heated furnaces a nd ovens for the m a n u f a c t u re of s e m i c o i. d u c t or devices on s e m i c o n d u c t or w a f e rs I n d u c t a n ce or dielectric f u r n a c es a nd ovens f or the m a n u f a c t u re of s e m i c o n d u c t or devices on s e m i c o n d u c t o rs wafers 85141005, 85143011, 85143091 85142005 A p p a r a t us for rapid heating of s e m i c o n d u c t or wafers 84198915, 85143091 Pa. ts of r e s i s t a n ce heated furnaces a nd o v e ns f or t he m a n u f a c t u re of s e m i c o n d u c t or devices on s e m i c o n d u c t or wafers 85149010 Parts of a p p a r a t us for rapid heatinn of w?fe s 84199030, 85149010 Parts of f u r n a c es a nd o v e ns of Headings Mo 8514 10 to No 8514 30 Wafer proffers Ion i m p l a n t e rs for d o p i ng s e m i c o n d u c t or materials 85149010 85369020 85431100 A p p a r a t us for w e: e t c h i n g, d e v e l o p i n g, s t r i p p i ng or c l e a n i ng s e m i c o n d u c t or wafers a nd flat panel d i s p l a ys 84798975, 84 798976, 85433010, 8L4330'^0 vendredi. 2H. février 1997 Page 2 of 3 iH Description Parts of apparatus for wet etching, developing, stripping or cleaning semiconductor wafers and flat panel displays HS 97 Headings 84799050, 85439020 Parts of ion implanters for doping semiconductor materials 85439020 - Apparatus for projection, drawing or plating circuit patterns on sensitized sem. condù»,îo. materials and flat panel displays 90104100, 90104200. 90104900 Parts and accessaries of the apparatus o. ' Headings No 9010 41 to 9010 49 90109010 Optical stereoscopic microscopes fin«*d with equipment specifically designed for the handling and transport of semiconductor wafers or reticles Photomicrographic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles Parts and accessories of optical stereoscopic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles Parts and accessories of photon. icrographic microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles 90111010 90112010 90119010 90119010 Electron beam microscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles 90121010 Parts and accessories of electron beam m-croscopes fitted with equipment specifically designed for the handling and transport of semiconductor wafers or reticles 90129010 Pattern generating apparatus of a kind used for producing masks or reticles from photoresist coated substrates 90061010, 90172n31 Parts and accessories for pattern generating apparatus of a kind used for producing masks or reticles from photoresist coated substrates 90069910, 90179010 Parts of such pattern generating apparatus Instruments and apparatus for measuring or checking semiconductor wafers or devices Parts and accessories of instruments and apparatus for measuring or checking semiconductor wafers or devices Parts of instruments and appliances for measuring or checking semiconductor wafers or devices Optical instruments and appliances for inspecting semiconductor wafers or devices or for inspecting masks, photomasks or reticles used in manufacturing semiconductor devices Optical instruments and appliances for measuring surface particulate contamination on semiconductor wafers Parts and accessories of optical instruments and appliances for inspecting semiconductor wafers or devices or ror inspecting masks, photomasks or retic'. as used in manufacturing semiconductor devices 90179010 90308200 90309020 90309020 90314100 90314910 90319020 Parts and accessories of optical instruments and appliances for measuring surface particulate contamination on semiconductor wafers 90319020 * * * * * * * * * * * * * * * * * * * * vendredi. 28. février 199 7 Page 3 of 3 i>5 EC - ITA - Schedule CXL - Attachment B HS 97 Headings 84711090. 84713000. 84714190,84714990," 84715090. 85219010. 85281210. 85281310. 85438917 Description Computers; automatic data processing machines capable of 1) storing the processing program or programs and at least the data immediately necessary for the execution of the program; 2) being freely programmed in accordance with the requirements of the user; 3) performing arithmetical computations specified by the user; 4) executing without human intervention, a processing program which requires them to modifiy teir execution, by logical decision during the processing run. The agreement covers automatic data processing machines whether or not they* are able to receive and process with assistance of central processing unit telephony signals, television signals, or other analogue or digitally processed audio or video signals. Machines performing a specific function other than data processing, or incorporating or working in conjunction with an automatic data processing machine, and not otherwise specified under Attachement A or B, are not covered by this agreement The agreement covers such automatic data processing machines whether or not they are able to receive and process with the assistance of the central processing unit telephony signal?, television signals, or other analogue or digitally processed auuio or video signals. However, machines performing a specific function other than data processing, or incorporating or working in conjunction with an automatic data processing machines, and not referred to under part A or B, are excluded from the product coverage of this agreement. Electric amplifiers when used as repeaters in line telephony products falling within this agreement, and parts thereof. 85175010, 85178090 Flat panel displays (including LCD, Electro Luminescence, Plasma and other technologies) for products falling within this agreement, and parts thereof. Network equipment: Locai Area Network (LAN) and Wide Area Network (WAN) apparatus, including those products dedicated for use solely or principally to permit the interconnection of automatic data processing machines and units thereof for =i network that is used primarily for the sharing of resources such as central processor units, data storage devices and input or output units - including adapters, hubs, in4ine repeaters, converters, concentrators, bridges and routers, and printed circuit assemblies for physical incorporation into automatic data processing machines and units thereof Monitors: display units of automatic data processing machines with a ca'thode ray tube with a dot screen pitch smaller than 0. 4 mm not capable of receiving and processing television signals or other analogue or digittally processed audio or video signals without assistance of a central processing unit of a computer as defined I this agreement. The agreement does not. therefore, cover télévisions, including high definition televisions(l). (1) Participants will conduct a review of this product description in January 1999 under the consultation of paragraph 3 of the Declaration. 85312030, 85312051, 85312059,85312080, 85318030, 85319010, 85319030,90138011, 90138019,90138030, 90139010 84715090, 84716090, 85175090 84716090 Optical disc storage units for automatic data processing machines (including CD drives and DVD-drives), whether or not having the capability of writing/recording as well as reading, whether or not in their own housings. 84717051 Paging alert devices and parts thereof. 85279092, 85299040 vendredi. 28. février 1997 Page 1 of 2 Ob Desrrifftion Plotters whether input or output units of HS heading No 8471 or drawing or drafting machines of HS heading No 9017. Printed Circuit Assemblies for products falling within this agreement, including such assemblies for external connections such as cards that conform to the PCMCIA standard. Such printed circuit assemblies consist of one or more printed circuits of heading 8534 with one or more active elements assembled thereon, with or without passive elements "Active elements" means diodes, transistors and similar semiconductor devices, whether or not photosensitive, of heading 8541, and integrated circuits and micro assemblies of heading 8542. Proprietary format storage devices including media therefor for automatic data processing machines, with or without removable media and whether magnetic, optical or other technology, including Bernoulli Box, Syquest, Zipdrive cartridge storage units. Multimedia upgrade kits for automatic data processing machines, and units thereof, put up for retail sale, consisting of, at least, speakers and/or microphones, as well as a printed circuit assembly that enables the ADP machine and units thereof to process audio signals (sound cards). Set top boxes which have communication function a microprocessor- based device incorporating a modem for gaining access to the Internet, and having a function of interactive information exchange. HS 97 Headings -. /. r t a. ^ « r «, a» - —. 84716090. 84718090. 90171010. 90172005 84732110. 8473/910. £4733010. 84735010. 85175090. 85179082. 85299040 84717051. 84717053. 84717059. 84717060. 84717090. 85232011, 85232019. 85232090. 85244091. 85244099. 85249190 85438979 85175090, 85438977 vendredi. 28. février 1997 Page 2 of 2 57 Proposition de décision du Conseil 97/0083 (ACC) concernant l'élimination des droits de douane sur certaines boissons spiritueuses LE CONSEIL DE L'UNION EUROPEENNE, vu le traité instituant la Communauté européenne, et notamment son article 113, en combinaison avec l'article 228 paragraphe 2 première phrase, vu la proposition de la Commission, considérant que l'élimination des tarifs douaniers par les Etats-Unis et la Communauté européenne est considérée comrr 2 globalement avantageuse, DECIDE: Article premier L'accord sous forme de mémorandum d'entente entre la Communauté économique européenne et les Etats-Ui?;s d'Amérique sur les boissons spiritueuses est approuvé au nom de la Communauté. Le texte de l'accord est joint à la présente décision. Article 2 Le Conseil autorise la Commission à soumettre à l'Organisation mondiale du Commerce la modification ci-jointe de la liste des engagements spécifiques de la Communauté européenne afin de consolider et d'éliminer les droits de douane pour les boissons spiritueuses concernées. Article 3 Le président du Conseil est autorisé à désigner la personne habilitée à signer Y accord/le protocole à l'effet d'engager la Communauté. Fait à Bruxelles Par le Conseil Le président 58 MEMORANDUM D'ENTENTE ex 2208 Eaux- de- vie, liqueurs et autres boissons spiritueuses Comme convenu à Singapour, nous avons entamé des négociations détaillées au sujet de l'éUmination des droits sur certaines boissons spiritueuses. Sous réserve de l'accomplissement de leurs procédures internes respectives et à l'exception du rhum (2208 40) auquel les dispositions spéciales énoncées en annexe s'appliquent, la Communauté européenne et les États-Unis élimineront les droits de douane en vigueur au 1er juillet 1997 pour les positions du SH de 1996 énumérées ci-dessous en quatre tranches égales dont la première débutera le 1er juillet 1997. Cette première phase sera suivie d'autres réductions des droits le 1er janvier 1998, le 1er janvier 1999 et le 1er janvier 2000. SH de 1996 2208 20 Eaux-de-vie de vin ou de marc de raisins 2208 30 Whiskies 2208 50 Gin et genièvre 2208. 60 Vodka 2208 70 Liqueurs ex 2208 90 Autres que l'alcool éthylique non dénaturé d'un titre alcoométrique volumique de moins de 80 % vol. (classés dans les positions 208 90 91 et 2208 90 99 par la Communauté européenne et 2208 90 80 par les États-Unis). ANNEXE Objet: 2208 40 - Rhum et tafia A. 1. Droits CE Les droits applicables au rhum ayant une teneur en substances volatiles autres que les alcools éthylique et méthylique égale ou supérieure à 225 grammes par hectolitre d'alcool pur, avec une tolérance de 10 %, sont réduits comme suit: En récipients d'une contenance n'excédant pas 2 1 En récipients d'une contenance excédant 2 1 Taux de base 0,8 Ecu/%vol/hl + 4,1 0,8 Ecu/ %vol/hl Ecu/hl 1er juillet 1997 0,8 Ecu/ %vol/hl + 4,1 Ecu/hl 0,8 Ecu/ %vo1/hl 1er juillet 1998 0,7 Ecu/%vol/hl+3,8 Ecu/hl 0,7 Ecu/ %vol/hl 1er juillet 1999 0,65 Ecu/ %vol/hl +3,5 Ecu/hl 0,65 Ecu/ %vol/hl 1er juillet 2000 0,6 Ecu %vol/hl + 3,2 Ecu/hl 0,6 Ecu/%vol/hl La Communauté applique, dans les limites des contingents tarifaires indiqués, les taux réduits de droit de douane suivants au rhum et au tafia, autres qae ceux qui sont spécifiés au paragraphe 1 ci-dessus et d'une valeur précisée dans le tableau ci- dessous, jusqu'à ce que le droit nul soit atteint le 1er janvier 2003. Les contingents tarifaires couvrent le rhum indépendamment de la taille du récipient. en En récipients d'une contenance n'excédant pas 21 D'une valeur supérieure à 7,9 Ecu/1 aie. 100 % 0,7 Ecu/ %vol/hi +3,5 Ecu/hl 0,6 Ecu/ %vol/hl + 2,9 Ecu/hl 0,5 Ecu/%vol/hl + 2,3 Ecu/hl 0,4 Ecu/ %vol/hl +1,8 Ecu/hl 0,3 Ecu/ %vol/hl +1,2 Ecu/hl 0,2 Ecu/ %vol/hl +0,6 Ecu/hl nul 1er juillet 1997 1er janvier 1998 1er janvier 1999 1er janvier 2000 1er janvier 2001 1er janvier 2002 A partir du 1er janvier 2003. Taux du droit En récipients d'une contenance excédant 21 D'une valeur supérieure à 2 Ecu/1 aie. 100 % 0,7 Ecu/%vol/hl Volume du contingent tarifaire Litres d'alcool 100 % 890 000 0,6 Ecu/%vol/hl 1950 000 0,5 Ecu/%vol/hl 0,4 Ecu/%vol/hl 2145 000 2359 500 0,3 Ecu/%vol/hl 2595450 0,2 Ecu/%vol/hl 2854 995 nul illimité Le rhum et le tafia d'un prix inférieur au seuil indiqué ci-dessus ainsi que le rhum et le tafia non couverts par les contingents tarifaires sont soumis aux droits indiqués au paragraphe 1 ci-dessus. immédiatement aux Etats-Unis La Communauté européenne notifie toute modification intervenant entre le 1er janvier 2000 et le 1er janvier 2003 du traitement préférentiel qu'eile accorde à ses importations de rhum. Sur demande, la Communauté européenne engage immédiatement des consultations avec les Etats-Unis au sujet de toute question relative aux exportations américaines de rhum vers la Communauté effectuées conformément au paragraphe 2 ci-dessus, en vue de trouver une solution commune aux problèmes soulevés. > ! B. 5. Droits US Les réductions de droit suivantes sont appliquées au rhum et au tafia Rhum et tafia Rhum et tafia en (a) récipients d'une (a) récipients d'une contenance n'excédant pas contenance n'excédant pas 4 1; d'une valeur supérieure 4 1; d'une valeur égale ou inférieure à 3 USD par Utre à 3 USD par litre d'esprit- d'esprit-preuve; et preuve; et en (b) en récipients d'une récipients d'une (b) en contenance excédant 4 1; contenance excédant 4 1, d'une valeur supérieure à 69 d'une égale ou inférieure à 69 cents par cents par litre d'esprit-preuve preuve litre d'esprit- valeur 1er juillet 1997 1er janvier 1998 1er janvier 1999 1er janvier 2000 26,1 preuve 21,7 preuve 17,4 preuve 13,0 preuve cents/litre d'esprit- 30,4 cents/litre d'esprit- preuve cents/litre d'esprit- 28,1 cents/litre d'esprit- preuve cents/litre d'esprit- 25,9 cents/litre d'esprit- preuve cents/litre d'esprit- 23,7 cents/litre d'esprit- preuve 1er janvier 2001 8,7 cents/litre d'esprit- 23,7 cents/litre d'esprit- preuve preuve 1er janvier 2002 4,3 cents/litre d'esprit- 23,7 cents/litre d'esprit- 1er janvier 2003 preuve 0 preuve 23,7 preuve cents/litre d'esprit- f> CN97 Label Base Rate Final Bound Rate Jul. 97 Jan. 93 Jan. 99 Jan. 2000 Implementation EC - SPIRITS - Schedule CXL 2208 Undenatured ethyl alcohol of an alcoholic strength by volume of less than 80 % vol; spirits, liqueurs and other spirituous beverages 2208 20 2208 20 12 Spirits obtained by distilling grape wine or grape marc - — In containers holding 2 litres or less -- Cognac 2208 20 14 Armagnac 2208 20 26 — Grappa 2208 20 27 Brandy de Jerez 2208 20 29 Other 2208 20 40 In containers holding more than 2 litres Raw distillate 2208 20 62 Other Cognac 2208 20 64 Armagnac 2208 20 86 Grappa 2208 20 87 Brandy de Jerez W-' «" lundi 17 février 1997 1. 12 Ecu/% vol/hl + 7 Ecu/hl 1. 12 Ecu/% vol/hl + 7 Ecu/hl 1. 12 Ecu/% vol/hl + 7 Ecu/hl 1. 12 Ecu/% vol/hl + 7 Ecu/hJ 1. 12 Ecu/% vol/hl + 7 Ecu/hl 1. 12 Ecu/% vol/hl 1. 12 Ecu/% vol/hl 1. 12 Ecu/% vol/hl 1. 12 Ecu/% vol/hl 12 Ecu/% vol/hl free free free free free free free free free free 0. 84 Ecu/% vol/hl + 5. 3 Ecu/hl 0. 84 Ecu/% vol/hl + 5. 3 Ecu/hl 0. 84 Ecu/% vol/hl + 5. 3 Ecu/hl 0. 84 Ecu/% vol/hl + 5. 3 Ecu/hl 0. 84 Ecu/% vol/hl' + 5. 3 Ecu/hl 0. 56 Ecu/% vol/hl + 3. 5 Ecu/hl 0. 56 Ecu/% vol/hl + 3. 5 Ecu/hl 0. 56 Ecu/% vol/hl + 3. 5 Ecu/hi 0. 56 Ecu/% vol/hl + 3. 5 Ecu/hl 0. 56 Ecu/% vol/hl + 3. 5 Ecu/hl 0. 28 Ecu/% vol/hl+1. 8 Ecu/hl 0. 28 Ecu/% vol/hl+1. 8 Ecu/hl 0. 28 Ecu/% vol/hl + 1. 8 Ecu/hl 0. 28 Ecu/% vol/hl + 1. 8 Ecu/hl 0. 28 Ecu/% vol/hl +1. 8 Ecu/hl 0. 84 Ecu/% vol/hl 0. 56 Ecu/% vol/hl 0. 28 Ecu/% vol/hl 0. 84 Ecu/% vol/hl 0. 56 Ecu/% vol/hl 0. 84 Ecu/% vol/hl 0. 56 Ecu/% vol/hl 0. 28 Ecu/% vol/hl 0. 28 Ecu/% vol/hl 0. 84 Ecu/% vol/hl 0. 56 Ecu/% vol/hl 0^28 Ecu/% vol/hl 0. 84 Ecu/% vol/hl 0. 56 Ecu/% vol/hl 0. 28 Ecu/%. vol/hl free free fre: free free free: free free free free European Commission Delegation in Geneva - aj Page 1 CN97 Label 2208 20 89 Other 2208 30 - Whiskies - Bourbon whiskey, in containers holding 2208 30 11 — 2 litres or less 2208 30 19 More than 2 litres Scotch whisky - — Malt whisky, in containers holding 2208 30 32 — 2 litres or less 2208 30 38 — More than 2 litres 2208 30 52 — Blended whisky, in containers holding — 2 litres or less 2208 30 58 — More than 2 litres 2208 30 72 --- Other, in containers holding — 2 litres or less 2208 30 78 — More than 2 litres C; Other, in contairers holding 2208 30 82 — 2 litres or less EC - SPIRITS - Schedule CXL Base Rate Final Bound Rate Jul. 97 Jan. 98» Jan. 99 Jan. 2000 Implementation 12 Ecu/% vol/hl 0. 2 Ecu/% vol/hl + 1. 5 Ecu/hl 0. 2 Ecu/% vol/hl 0. 28 Ecu/% vol/hl + 2. 1 Ecu/hl 0. 28 Ecu/% vol/hl 0. 28 Ecu/% vol/hl+ 2. 1 Ecu/hl 0. 28 Ecu/% vol/hl 0. 28 Ecu/% vol/hl + 2. 1 Ecu/hl 0. 28 Ecu/% vol/hl 0. 28 Ecu/% vol/hl+ 2. 1 free free free free free free free free free free 0. 84 Ecu/% vol/hl 0. 56 Ecu/% vol/hl 0. 28 Ecu/% vol/hl 0. 15 Ecu/% vol/hl+1. 13 Ecu/hl 0. 15 Ecu/% vol/hl 0. 1 Ecu/% vol/hl + 0. 8 Ecu/hl 0. 1 Ecu/% vol/hl 0. 05 Ecu/% vol/hl + 0. 8 Ecu/hl 0. 05 Ecu/% vol/hl 0. 21 Ecu/% vol/hl + 1. 6 Ecu/hl 0. 14 Ecu/% vol/hl+1. 1 Ecu/hl 0. 07 Ecu/% vol/hl + 0. 5 Ecu/hl 0. 21 Ecu/% vol/hl 0. 14 Ecu/% vol/hl 0. 07 Ecu/% vol/hl 0. 21 Ecu/% vol/hl + 1. 6 Ecu/hl 0. 14 Ecu/% vol/hl+1. 1 Ecu/hl 0. 07 Ecu/% vol/hl + 0. 5 Ecu/hl 0. 21 Ecu/%' vol/hl / 0. 14 Ecu/% vol/hl 0. 07 Ecu/% vol/hl 0. 21 Ecu/% vol/hl + 1. 6 Ecu/hl 0. 14 Ecu/% vol/hl+1. 1 Ecu/hl 0. 07 Ecu/% vol/hl + 0. 5 Ecu/hl •0. 21 Ecu/% vol/hl 0. 14 Ecu/% vol/hl 0. 07 Ecu/% vol/hl 0. 21 Ecu/% vol/hl + 1. 6 0. 14 Ecu/% vol/hl +1. 1 0. 07 Ecu/% vol/hl + 0. 5 free free free free free free free free free free lundi 17 février 1997 European Commission Delegation in Geneva - aj Page 2 C N 97 Label 220S 30 88 More than 2 litres EC - SPIRITS - Schedule CXL Base Rate Ecu/h! Final Bound Rate J u l. 97 Ecu/hl Implementation Jan. 98 Ecu/hl Jan. 99 Ecu/hl Jan. 2000 0. 28 Ecu/% vol/hl free 0. 21 Ecu/% vol/hl 0. 14Ecu/% vol/hl 0. 07 Ecu/% vol/hl free 2208 40 2208 40 10. Rum and taffia: - -- — Ex : Rum with a content of volatile substances other than ethyl In containers holding 2 litres or less and methyl alcohol equal to or exceeding 225 grams per hectolitre of pure alcohol with a 10% tolerance. Ex : Other 2208 40 90 In containers holding more than 2 litres Ex : Rum with a content of volatile substances other than ethyl and methyl alcohol equal to or exceeding 225 grams per hectolitre of pure alcohol with a 10% tolerance. Ex : Other 2208 50 Gin and geneva: 2208 50 Gin, in containers holding : 2 litres or less 2208 50 19 — More than 2 litres 2208 50 91 Geneva, in containers holding 2 litres or less 2208 50 99 More than 2 litres 0 8 lxii/% vol/hl +4. 1 Ecu/hl 0. 8 Ecu/% vol/hl + 4. 1 Ecu/h] 0. 8 ECU/% vol/hl 0. 8 Ecu/% vol/hl 0. 8 Ecu/% vol/hl +4. 1 Ecu/hl 0. 8 Ecu/% vol/hl 1 3 Kcu/% vol/hl + 8. 2 Ecu/lil. 3 Ecu/% vol/hl free free free free 0. 6 Ecu/% vol/hl + 3. 1 Ecu/hl 0. 4 Ecu/% vol/hl + 2. 1 Ecu/hl 0. 2 Ecu/% vol/hJ + 1. 0 Ecu/hl 0. 6 Ecu/% vol/hl 0. 4 Ecu/% vol/hl 0. 2 Ecu/% vol/hl 1. 0 Ecu/% vol/hl H 6. 2 Ecu/hl 0. 7 Ecu/% vol/hl +4. 1 Ecu/hl. 0 Ecu/% vol/hl 0. 7 Ecu/% vol/hl 0. 3 Ecu/% vol/hl +2. 1 Ecu/hl 0. 3 Ecu/% vol/hl free free free free 2208 60 ZJt 2208 60 11 • Vodka -- Of an alcoholic strength by volume of 45. 4% vol or les. s in containers holding: — 2 litres or less 1 I Ecu/% lundi 17 février 1997 European Commission Delegation In Geneva - aj free 0. 8 Ecu/% 0. 6 Ecu/% 0. 3 Ecu/% free Page 3 CN97 Label Base Rate Final Bound rale E C - S P I R I T S - Sc îcdule CXL Implementation - 7^v 2208 40 2208 40 10 - Rum and taffia In containers holding 2 litres or less — Ex. Rum with a content of volatile substances other than ethyl and methyl alcohol equal to or exceeding 225 grams per hectolitre of pure alcohol with a 10% tolerance July 1997 July 1998 July 1999 July 2000 0. 8 Ecu/%vol/hl + 4. 1 Ecu/hl 0. 6 Ecu/%vol/hl + 3. 2 Ecu/hl 08 Ecu/%vol/hl + 4. 1 Ecu/hl 0. 7 Ecu/%vol/hl + 3. 8 Ecu/hl 0. 65 Ecu/%vol/hl + 3. 5 Ecu/hl 0. 6 Ecu/%vol/hl + 3. 2 Ecu/hl — Ex Other: — Valued over Ecu 7. 9 per litre of 100% alcohol* 0. 8 Ecu/%vol/hl T 4. 1 Ecu/hl Free July 1997 0. 7 Ecu/%vol/hl + 3. 5 Ecu/hl* Jan 1998 0. 6 Ecu/%vol/hl +. 2. 9 Ecu/hl* Jan 1999 o. : Ecu/%vol/hl + 2. 3 Ecu/hl* Jan 2000 0. 4 Ecu/%vol/hl + 1. 8 Ecu/hl* Jan 2001 0. 3 Ecu/%vol/hl + 1. 2 Ecu/hl* Jan 2002 0. 2 Ecu/% vo l/hi + 0. 6 Ecu/hl* Jan 2003 Free 2208 40 90 —- Other In containers holding 2 li'res or less --- Ex: Rum with a content of volatile substances other than ethyl and methyl alcohol equal to or exceeding 225 grams per hectolitre of pure alcohol with a 10% tolerance 0. 8 Ecu/%vol/hl + 4. 1 Ecu/hl 0. 6 Ecu/%vol/hl + 3. 2 Ecu/hi July 1997 0. 8 Ecu/%vol/hl + 4. 1 Ecu/hl July 1997 July 1998 0. 7 Ecu/%vol/hl + 3. 8 Ecu/hl July 1998 July 1999 0. 65 Ecu/%vol/hl + 3. 5 Ecu/hl July 1999 July 2000 0. 6 Ecu/%vol/hl + 3. 2 Ecu/hl July2000 0. 8 Ecu/%vol/hl 0. 6 Ecu/%vol/hl 0. 8 Ecu/%vol/hl 0. 7 Ecu/%vol/hl* 0. 65 Ecu/%vol/hl 0. 6 Ecu/%vol/hl — Ex Other: — Valued over Ecu 2. 0 per litre 0. 8 Ecu/%vol/hl Free of I00%o alcohol* July 1997 0. 7 l-;cu/%. vol/hl* Jan 1998 0 6 Ecu/%vol/hl* Jan 1999 0. 5 Ecu/%vol/hl* Jan 2000 0. 4 Ecu/% vol/hl* Jan 2001 0. 3 Ecu/%vol/hl* Jan 2002 0. 2 Ecu/%vol/hl* Jan 2003 Free —- Other 0. 8 Ecu/%vol/hl 0. 6 Ecu/%vol/hl July 1997 0. 8 Ecu/%vol/hl July 1998 0. 7 Ecu/%vol/hl July 1999 0. 65 Ecu/%vol/hl July 2000 0. 6 Ecu/%vol/hl * Note: In the period 1 July 1997 to 31 December 2002 these concessions shall be limited by the tariff quota amounts indicated below within which rum and laffia in whatever size of container can be imported at the duty rates indicated. From 1 January 2003 there will be no tariff q"ota limitation: Tariff Quota Period Litres of 100% alcohol 2,145,000 2,359,500 Tariff Quota 1 Jan 2001 - 31 December 2001 1 Jan 2002 - 31 December 2002 Litres of 100%> alcohol 2,595,450 2,854,995 6 k>JS Litres of 100% alcohol 890,000 1,950,000 Tariff Quota 1 Jan 1999 - 31 December 1999 I Jan 2000 - 31 December 2000 1 July 1997-31 December 1997 J Jan 1998-31 December 1998 EC - SPIRITS - Schedule CXL CN97 Label 2208 60 19 More than 2 litres Base Rate vol/hl +4. 1 Ecu/hl 1 Ecu/% vol/hl 2208 60 91 Of an alcoholic strength by volume of more than 45. 4% vol in containers holding: 2 litres or less 1. 3 Ecu/% vol/hl +8. 2 Ecu/hl 2208 60 99 More than 2 litres 2208 70 2208/0 10 - Liqueurs and cordials in containers holding: - 2 litres or less 2208 70 90 - More than 2 litres 2208 90 2208 90 11 - Other - Arrack, in containers holding: - 2 litres or less 2208 90 19 More than 2 litres 2208 90 33 Plum, pear or cherry spirit (excluding liqueurs), in containers holding 2 litres or less 2208 90 38 More than 2 litres 1. 3 Ecu/% vol/hl 1. 3 Ecu/% vol/hl +8. 2 Ecu/hl 1. 3 Ecu/% vol/hl 0. 8 Ecu/% vol/hl +4. 1 Ecu/h! 0. 8 Ecu/% vol/hl 0. 91 Ecu/% vol/hl •- 3. 5 Ecu/ill 1 Eci'J% vol/hl Final Bound Rate free free free free free free free free free Implementation Jui. 97 vol/hl +3. 1 Ecu/hl Jan. 9g vol/hl +2. 1 Ecu/hl 0. 8 Ecu/% vol/hl 0. 6 Ecu/% vol/hl 1. 0 Ecu/% vol/hl +6. 2 Ecu/hl 0. 7 Ecu/% vol/hl +4. 1 Ecu/hl 1. 0 Ecu/% vol/hl 0. 7 Ecu/% vol/hl Jan. 99 vol/hl +1. 0 Ecu/hl 0. 3 Ecu/% vol/hl 0. 3 Ecu/% vol/hl +2. 1 Ecu/hl 0. 3 Ecu/% vol/hl 1. 0 Ecu/% vol/hl +6. 2 Ecu/hl 0. 7 Ecu/% vol/hl +4. 1 Ecu/hl 0. 3 Ecu/%. vol/hl +2. 1 Ecu/hl 1. 0 Ecu/% vol/hl 0. 7 Ecu/% vol/hl 0. 3 Ecu/% vol/hl 0. 6 Ecu/% v>l/hl +3. 1 Ecu/hl 0. 4 Ecu/% vol/hl +2. 1 Ecu/hl 0. 2 Ecu/% vol/hl +1. 0 Ecu/hl 0. 6 Ecu/"// vol/hl ' 0. 4 Ecu/% vol/hl 0. 2 Ecu/% vol/hl 0. 68 Ecu/% vol/hl + 2. 6 Ecu/hl 0. 46 Ecu/% vol/hl + 1. 8 Ecu/hl 0. 22 Em/% vol/hl + 0. 9 Ecu/hl 0. 8 Ecu/% vol/hl 0. 6 Ecu/% vol/hl 0. 3 Ecu/% vol/hl Oï - Other spirits, and other spirituous beverages, in containers holding — 2 litres or less lundi 17 février 1997 European Commission Delegation in Geneva - \\ Jan. 2000 free free free free free free free free free Page 4 CN 97 Label 2208 90 41 — Ouzo Other Spirits (excluding liqueurs) - Distilled from fruit — Calvados 2203 90 45 2208 90 48 Other 2208 90 52 Other Kom 2208 90 57 Other 2208 90 69 — Other spiritual beverages More than 2 litres Spirits (excluding liqueurs) • Distilled from fruit 2208 90 71 2208 90 74 Other 2208 90 78 — Oùher spiritual beverages EC - SPIRITS - Schedule CXL Final Bound Rate free Base Rate 1. 3 Ecu/% vol/hl +8 2 Ecu/hl Implementation Jul. 97 1. 0 Ecu/% vol/hl +6. 2 Ecu/hl Jan. 9fi 0. 7 Ecu/% vol/hl +4. 1 Ecu/hl Jan. 99 0. 3 Ecu/% vol/hl +2. 1 Ecu/hl Jan. 2000 free 1. 12 Ecu/% vol/hl + 7 Ecu/hl 1. 12 Ecu/% vol/hl + 7 Ecu/hl 1. 3 Ecu/% vol/hl +8. 2 Ecu/hl 1. 3 Ecu/% vol/hl +8. 2 Ecu/hl 1. 3 Ecu/%) vol/hl +8. 2 Ecu/hl 12 Ecu/% vol/hl. 3 Ecu/% vol/hl. 3 Ecu/% vol/hl free free free free free free free free 0. 84 Ecu/% vol/hl + 5. 3 Ecu/hl 0. 84 Ecu/% vol/hl + 5. 3 Ecu/hl 1. 0 Ecu/% vol/hl +6. 2 Ecu/hl 1. 0 Ecu/% vol/hl +6. 2 Ecu/hl 1. 0 Ecu/% vol/hl +6. 2 Ecu/hl 0,56 Ecu/%» vol/hl+ 3. 5 Ecu/hl 0. 56 Ecu/% vol/hl + 3. 5 E-u/hl 0. 7 Ecu/% vol/hl +4. 1 Ecu/hl 0. 7 Ecu/% vol/hl +4. 1 Ecu/hl 0. 7 Ecu/% vol/hl +4. 1 Ecu/hl 0. 28 Ecu/% vol/hl+1. 8 Ecu/hl 0. 28 Ecu/% vol/hl+1. 8 Ecu/hl 0. 3 Ecu/% vol/hl +2. 1 Ecu/hl 0. 3 Ecu/% vol/hl +2. 1 Ecu/hl 0. 3 Fcu/% vol/hl +2. 1 Ecu/hl 0. 84 Ecu/% vol/hl 0. 56 Ecu/% vol/hl 0. 28 Ecu/% vol/hl. 0 Ecu/% vol/hl 1. 0 Ecu/% vol/hl 0. 7 Ecu/% vol/hl 0. 7 Ecu/% vol/hl 0. 3 Ecu/%) vol/hl 0. 3 Ecu/% vol/hl free free free free free free free free lundi 17 février 1997 European Commission Delegation in Geneva - aj PageS 1. 2. 3. 4. 5. 6. FICHE FINANCIERE Proposition de décision du Conseil concernant l'élimination des droits de douane sur les produits des technologies de l'information et sur certaines boissons spiritueuses. Ligne budgétaire: chapitre 12/article 120 Base juridique: article 113 Description: la proposition mit suite à une décision du Conseil d'entamer des négociations avec des pays tiers en vue de conclure un accord sur les technologies de l'information ainsi qu'à l'engagement politique pris par les ministres à la conférence ministérielle de Singapour le L> décembre 1996. Elle concerne l'élimination de droits de douane sur les produits des technologies de l'information et sur certaines boissons spiritueuses d'ici l'an 2000 Type de recettes: perte de recettes découlant des droits payés sur les importations en provenance de pays tiers. Modification du niveau des recettes: L'éhmination des droits appliqués aux importations de produits des technologies de l'information s'échelonnera en quatre tranches annuelles égales entre le 1er juillet 1997 et le 1er janvier 2000. La perte de droits perçus est calculée comme étant la différence entre le taux de droit convenu dans le cadre du cycle de négociations de l'Uruguay (pour chaque année) et le taux convenu dans le cadre de l'ATI (pour la même année) pour un volume d'importation équivalent à celui de 1995 (voir l'annexe). La perte de recettes due à l'ATI équivaut donc simplement à la perte dt. , recettes supplémentaire. Elle s'élèvera au total à: 1. 7. 1997 1. 1. 1998 1. 1. 1989 1. 1. 2000 242,6 millions d'écus 643,3 millions d'écus 891,3 millions d'écus 1241,8 millions d'écus En ce qui concerne les boissons spiritueuses, sur la base des importations réalisées par l'Europe des Quinze en 1995 et d'équivalents ad valorem (ave) pour toutes les importations NPF de 1995, la perte de droits perçus s'élèvera à:. 1. 1997. 1. 1998. 1. 1999. 1. 2000. 1. 2001. 1. 2002. 1. 2003 0,5 millions d'écus 1,6 millions d'écus 2 millions d'écus 2,5 millions d'écus 1,9 millions d'écus 1,2 millions d'écus 0. 7 millions d'écus La moyenne annuelle est de 1625 kilo-écus (6,5 ans) et le total s'élève à 10, 5 millions d'écus. La diminution en termes de ressources propres traditionnelles sera financée par un recours supplémentaire aux ressources propres PNB. Ci* European Commission ITA DUTY LOSS 1997-2000 Directorate General External Relations HS-97 EU imports 95 (kecu) Total duty loss ITA Duty loss 97 4 steps Duty loss 98 4 steps Duty loss 99 4 steps Duty loss 00 4 steps 3818 00 Total 8469 11 Total 8470 10 Total 8470 21 Total 8470 29 Total 8470 30 Total 8470 40 Total 8470 50 Total 8470 90 Total 8471 10 Total 8471 30 Total 8471 41 Total 8471 49 Total 8471 50 Total 8471 60 Total 8471 70 Total 8471 80 Total 8471 90 Total 8472 90 Total 8473 21 Total 8473 29 Total 8473 30 Votai 8473 50 Total 8504 40 Total 8504 50 Total 8517 11 Total 8517 19 Total 8517 21 Total 8517 22Tota' 8517 3C Total 8517 50 Total 8517 80 Total 8517 90 Total 8518 ï0 Total 8518 29 Total 8518 30 Total 8520 20 Total 852J 11 Total 8523 12 Total 8523 13 Total 8523 20 Total 8523 90 Total 8524 31 Total 8524 32 Total 8524 39 Total 8524 40 Total 8524 91 T"tal 8524 99To'al 85/5 10 Te al 8525 20 Total 8525 40 Total 8527 90Totîl 8529 10 Tot il 8529 90 Total 8531 20TotJ 8531 90 Total 8532 10Totô! 8532 21 Total 8532 22 Total 8532 23Tota' 8532 24 Total 8532 25 Total 8532 29 Total 170 531 29 929 410719 59 114 11 975 2 786 11 834 166 942 32 651 83 905 2 956157 344 694 2 308 652 538 257 4 769150 5 495 373 538 415 287 733 22 038 4 654 33 008 3 352 385 3 632 303 250 682 10 903 375 826 1 058 18? 859 052 1 334 152 286 673 096 443 858 1 171 807 4^32 9 796 41 032 126 869 100 84b 62 554 437 681 239 018 80 320 89 984 89 984 80 986 145 407 989 1961 18f30 24 608 388 830 94 861 34 958 149 5"T9 817 7{'9 822 421 12 93< 0 131 340 251 381 50 047 222 137 24 091 21 420. 26 432 1 516 43 622 8 394 1 701 130 550 7 763 1 518 2317 175 892 20134 136 826 31 692 19 070 20 234 2154 1 151 1 140 101 644 159 348 182 332 1 003 949 1 879 228 762 71 731 111 12716 57 152 37 063 81 855 246 705 1 949 M 862 " "4 639 5 223 36 546 14 039 6 707 7514 7 514 6 762 3 878 5 603 1 556 2 129 53 145 11 146 ^572 12 639 57 245 79 301 f 248 0 11 492 21 996 3 253 j - -^ 1 566 1 392 1 535 120 3 304 650 132 10 41 584 114 175 13 303 1 523 10348 2 397 14 303 15611 1 615 863 88 19 87 12910 13 563 752 65 1 504 13445 5 584 9 990 4 138 2 885 6 781 19 49 226 825 403 344 2 407 1 128 442 495 495 445 541 3019 103 135 o 1 78 617 419 972" 4 907 4 5 19 71 85 4 1 634 250 M 10 120 _ _ _„ 5 628 359 9 495 1 833 371 28 118 1 669 327 506 38 430 4 399 29 895 6 924 4 767 4 623 538 288 243 23 125 34 748 37 785 251 207 376 48140 15 463 24 2 741 12 353 7 990 17 828 54 157 451 2 537 1 008 1 126 7 878 3 036 1 446 1 620 16201 1 458 851 1 341 336 468 12 339 2 372 1 398 2 692 12 266 17 257. 272 73 2 495 4 776 701 3 110 337 300 8 185 449 12 383 2 365 479 35 154 2 170 424 662 50 255 5 752 39 093 9 055 0 0 0 0 331 24 183 49 640 55 417 0 273 0 71 647 19 759 31 3 503 16 429 10 209 22 094 70 206 451 3 425 1 210 1 564 10 942 4 1 14 2 908 2 250 2 250 2 025 1 034 5', 8 466 640 18 322 3510 1 958 3 590 15 538 24 653 388 99 3 284 6 285 951 4 221 458 407 | 11 085 689 18440 3 547 719 56 237 3 339 653 974 73 904 8 4 60 57 490 13316 0 0 0 0 485 * 36 250 62 050 75 568 0 403 0 95 530 30 926 48 5 482 24 232 15 979 35 153 103 294 821 5 075 2 0 17 2 189 15319 5 760 2 811 3 149 3 149 2 834 __ _. ^ 725 C52 886 24 305 4 648 2 797 5 386 24 534 32 871 517 140 4 860 9 301 1 351 5 998 650 57 r, /u European Commission ITA DUTY LOSS 1997-2000 Directorate General External Relations HS-97 EU imports 95 (kecu) Total duty loss ITA Duty loss 97 4 steps Duty loss 98 4 steps Duty loss 99 4 s'eps Duty lot s 00 4 steps 8532 30 Total 8532 90 Total 8533 10 Total 8533 21 Total 8533 29 Total 8533 31 Total 8533 39 Total 8533 40 Total 8533 90 Total 8534 00 Total 8536 50 Total 8536 90 Total 8541 10 Total 8541 21 Total 8541 29 Total 8541 30To^l 85',î 40 Total 8541 50 Total 8541 60 Total 8541 90 Total 8542 12 Total 85^2 13 Total 8542 14 Total 8542 19 Total 8542 30 Total 8542 40 Total 8542 50Tohl 8542 90 Total 8543 81 Total 8543 89 Total 8544 41 Total 8544 49 Total 8544 51 Total 8544 70 Total 9001 10 Total 9C09 12 Total 9009 21 Total 9009 90 Total 9026 10 Total 9026 20 Total 9026 80 Total 9026 90 Total 9027 20 Total 9027 30 Total 9027 50 Total 9027 80 Total 9027 90 Total 90?C 40 Total Grand Total 22 797 6 070 50 255 158 855 26 522 18 333 8 032 101 626 17 264 593 219 31 476 527 614 214 276 1l7e)6'1 223 342 27 227 283 283 16154 32f 696 41 665 86 358 3 297 950 216715 3 518 982 896 423 150 154 174 530 88 672 269 728 13 486 57 694 47 339 7 101 44 147 53 088 399 100 169 827 933 748 74 446 106 025 75 851 106 653 62 103 170 639 159 177 324 106 2C5 974 82 925 50 430 563 1 995 504 3216 10 167 1 697 1 173 514 6504 1 105 62 584 1 700 28 491 35 734 19 683 37 298 4 547 21 013 2 698 30 569 2 854 28 714 191 806 25 841 218 368 149 704 25 076 29 147 6 074 23 601 1 180 4 442 4118 547 5 474 3610 56 872 24 200 131 854 4 006 6 314 4 284 4 940 3 485 9 300 9 391 16 654 12 152 8 362 3 018 930 148 36 251 794 133 92 40 508 86 3 856 126 2110 1 928 1 061 2010 245 1 495 145 2 30'. 229 1 511 13 183 1 640 14 862 8 068 1 350 1 571 488 1 753 88 346 284 43 353 319 3 392 1 444 7 877 344 532 369 449 313 768 955 1 659 1 236 580 242 676 433 115 704 2 224 371 257 112 1 <">23 242 13 051 373 6 331 7500 4126 7 817 953 4 456 565 6 574 625 6 045 39 569 5 361 45 080 31 374 5 255 6 109 1 330 5 125 256 923 899 114 1 192 796 11 973 5 095 27 773 869 1 378 930 1 098 608 1 365 2 069 3 663 2 678 1 904 6^3 351 | 570 158 905 2 859 477 330 145 1 830 311 18 983 473 7914 11 357 b?46 11 837 1 443 6 465 856 8 546 792 9 068 59 918 8119 68 266 47 510 7 958 9 250 1 685 6 743 337 1 269 1 183 156 1 633 956 17 560 7 472 40 692 1 072 1 692 1 146 1 297 1 012 2 901 2 388 4 290 3 090 2 401 891 396 844 225 1 357 4 289 716 495 217 2 744 466 26 695 724 12 135 15000 8 250 '5 633 1 J06 8 597 1 13' 13148 1 208 12 090 79 137 10 723 90161 62 750 10fc10 12 217 2 571 9 980 499 1 904 1 752 234 2 296 1 540 23 946 10 190 55 513 1 718 2715 1 838 2 096 1 552 4 266 3 979 7 043 5 149 3 477 1 241 843 0H1 i 1 ISSN 0254-1491 COM(97) 96 final DOCUMENTS FR 02 03 15 N° de catalogue : CB-CO-97-090-FR-C ISBN 92-78-16672-3 Office des publications officielles des Communautés européennes L-2985 Luxembourg