The panel is eventually broken apart into individual PCBs; this is called depaneling. Separating the individual PCBs is frequently aided by drilling or routing perforations along the boundaries of the individual circuits, much like a sheet of postage stamps. Another method, which takes less space, is to cut V-shaped grooves across the full dimension of the panel. The individual PCBs can then be broken apart along this line of weakness. Today depaneling is often done by <answer>lasers</answer> which cut the board with no contact. Laser panelization reduces stress on the fragile circuits.
What technology has made depaneling possible without needing to physically interact with the board?
lasers