BGA Assembly & Benefits
BGA assembly is a type of SMT process, which is used for Printed Circuit Boards. It allows the customer to have more room for the PCB layout. Ball Grid Array (BGA) packaging is a method
BGA Assembly & Benefits
BGA assembly is a type of SMT process, which is used for Printed Circuit Boards. It allows the customer to have more room for the PCB layout. Ball Grid Array (BGA) packaging is a method for reducing package size and integrating a greater number of functions on a single chip module.
Higher-density circuits: As through-hole circuits were more densely-populated, soldering them accurately without crossover or short-circuits became nearly impossible.
Heat conduction: BGA circuits allow heat to pass much more easily from the integrated circuit outwards, reducing overheating problems.
Lower inductance: Because each solder ball in a BGA circuit is generally only a handful of millimeters large, problems from interference within the circuit are greatly minimized.
Fewer damage leads:BGA leads are composed of solid solder balls that cannot take damage during the process of operation.
There are 3 BGA package types:
PBGA (plastic ball grid array)
In PGBA normally, resin/glass laminate to employed, solder balls are often classified into the lead and lead-free solders. No other soldering method is required to attach the solder balls with the packaging body.
CBGA (ceramic ball grid array)
CBGA has the longest history among the three sorts of BGAs. The fabric of the substrate is multi-layer ceramic. The metal cover is soldered onto the substrate by packaging solder to guard the chip, leads, and pad.
TBGA (tape ball grid array)
TBGA may be a structure with a cavity. There are two sorts of interconnections between chip and substrate:
1.Inv