physics.ins-det hep-ex
Design, fabrication and initial test of a novel 3D-Trench sensor utilizing 8-inch CMOS compatible technology
Manwen Liu Huimin Ji Wenzheng Cheng Le Zhang Zheng Li Bo Tang Peng Zhang Wenjuan Xiong Trevor Vickey E. Giulio Villani Zhihua Li Dengfeng Zhang Jun Luo