동일한 두께인 웨이퍼 workpiece들을 비교해보면, 절단 속도는 S3~S5로 갈수 록 감소하고 저항은 정확히 그 반대이다.
Comparing wafer workpieces of the same thickness, the cutting speed decreases as it goes from S3 to S5, and the resistance is exactly the opposite.