Advanced silicon etching (ASE) is a deep reactive-ion etching (DRIE) technique to etch deep and high aspect ratio structures in silicon. ASE was created by Surface Technology Systems Plc (STS) in 1994 in the UK. STS has continued to develop this process with faster etch rates.
Advanced silicon etching (ASE), a deep reactive-ion etching (DRIE) technique, is used to create deep and high aspect ratio structures in silicon. This method was developed by Surface Technology Systems Plc (STS) in the UK in 1994. STS has been continuously improving this process with faster etching rates.