Other types are the liquid photoimageable solder mask (LPSM or LPI) inks and dry-film photoimageable solder mask (DFSM). LPSM can be silkscreened or sprayed on the PCB, exposed to the pattern and developed to provide openings in the pattern for parts to be soldered to the copper pads.
Other types include liquid photoimageable solder mask (LPSM or LPI) inks and dry-film photoimageable solder mask (DFSM). LPSM can be applied through screen printing or spraying onto the PCB, exposed to the pattern, and developed to create openings for components to be attached to the copper pads.