The use of various strain engineering techniques has been reported by many prominent microprocessor manufacturers, including AMD, IBM, and Intel, primarily with regards to sub-130 nm technologies. One key consideration in using strain engineering in CMOS technologies is that PMOS and NMOS respond differently to different types of strain.
The application of various strain modification methods has been observed by several prominent semiconductor manufacturers, including AMD, IBM, and Intel, primarily with respect to sub-130 nm technologies. A key aspect of using strain engineering in CMOS devices is the differing responses of PMOS and NMOS to different strains.