The use of various strain engineering techniques has been reported by many prominent microprocessor manufacturers, including AMD, IBM, and Intel, primarily with regards to sub-130 nm technologies. One key consideration in using strain engineering in CMOS technologies is that PMOS and NMOS respond differently to different types of strain.
Several prominent chipmakers, such as AMD, IBM, and Intel, have reported the use of strain engineering techniques for sub-130 nm technologies. When using strain engineering in CMOS devices, it's essential to consider how PMOS and NMOS respond to different strains.