CVE:CVE-2022-33221
CNNVD:CNNVD-202302-858
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。
Qualcomm 芯片存在安全漏洞，该漏洞源于由于在处理元数据验证请求时缓冲区过度读取，可信执行环境中的信息泄露。
solution:Upgrade qualcomm sd_8_gen1_5g_firmware to a higher version than -; Upgrade qualcomm ssg2115p_firmware to a higher version than -; Upgrade qualcomm ssg2125p_firmware to a higher version than -; Upgrade qualcomm sxr1230p_firmware to a higher version than -; Upgrade qualcomm sxr2230p_firmware to a higher version than -; Upgrade qualcomm wcd9380_firmware to a higher version than -; Upgrade qualcomm wcd9385_firmware to a higher version than -; Upgrade qualcomm wcn6855_firmware to a higher version than -; Upgrade qualcomm wcn6856_firmware to a higher version than -; Upgrade qualcomm wcn7850_firmware to a higher version than -; Upgrade qualcomm wcn7851_firmware to a higher version than -; Upgrade qualcomm wsa8830_firmware to a higher version than -; Upgrade qualcomm wsa8832_firmware to a higher version than -; Upgrade qualcomm wsa8835_firmware to a higher version than -