CVE:CVE-2021-30283
CNNVD:CNNVD-202112-252
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。
多款 Qualcomm 产品中存在代码问题漏洞，该漏洞源于产品调试寄存器中的trap处理不当。攻击者可通过该漏洞导致拒绝服务。 由于用户应用程序调试寄存器trap处理不当可能导致拒绝服务。受影响的产品和版本有:QCA6391、QCM6490、QCS6490、QRB5165、QRB5165N、SD778G、SD888 5G、SM7325P、WCD9370、WCD9375、WCD9380、WCD9385、WCN6750、WCN6850、WCN6851、WCN6855、WCN6856、WSA8830、WSA8835
solution:Upgrade qualcomm qca6391_firmware to a higher version than -; Upgrade qualcomm qcm6490_firmware to a higher version than -; Upgrade qualcomm qcs6490_firmware to a higher version than -; Upgrade qualcomm qrb5165_firmware to a higher version than -; Upgrade qualcomm qrb5165n_firmware to a higher version than -; Upgrade qualcomm sd778g_firmware to a higher version than -; Upgrade qualcomm sd888_5g_firmware to a higher version than -; Upgrade qualcomm sm7325p_firmware to a higher version than -; Upgrade qualcomm wcd9370_firmware to a higher version than -; Upgrade qualcomm wcd9375_firmware to a higher version than -; Upgrade qualcomm wcd9380_firmware to a higher version than -; Upgrade qualcomm wcd9385_firmware to a higher version than -; Upgrade qualcomm wcn6750_firmware to a higher version than -; Upgrade qualcomm wcn6850_firmware to a higher version than -; Upgrade qualcomm wcn6851_firmware to a higher version than -; Upgrade qualcomm wcn6855_firmware to a higher version than -; Upgrade qualcomm wcn6856_firmware to a higher version than -; Upgrade qualcomm wsa8830_firmware to a higher version than -; Upgrade qualcomm wsa8835_firmware to a higher version than -