fundamental interconnect systems for connecting high - speed electronics elements are provided . the interconnect systems consists of signal line , dielectric system with open trench or slot filled up with air or lower dielectric loss material , and the ground plane . the signal line could be for example , microstripline , strip line , coplanar line , single line or differential pairs . the interconnect system can be used for on - chip interconnects or can also be used for off - chip interconnects . the fundamental techniques provided in this invention can also be used for high - speed connectors and high - speed cables .