a method of fabricating a micro - array ic package is recited . a wafer has a b - stageable adhesive applied , and the wafer is diced . the individual dice are applied to a lead - frame via their adhesive , and wirebonded to associated leads . the lead - frame is then encapsulated , and solder connectors are applied . the lead - frame is then singulated to produce a plurality of lead - frame based micro - array packages . the process thus allows lead - frame based manufacturing methods to be employed in the production of bga - type packages , allowing such packages to be produced faster and more efficiently .