a method and resultant product are disclosed wherein a metal film is deposited by sputtering a metal cathode target in an essentially nonreactive atmosphere comprising inert gas and a reactive gas , wherein the concentration of reactive gas is sufficiently low that the sputtering is accomplished in the metallic mode , i . e . the film is deposited as metal . the metal film of the present invention is harder than a metal film sputtered in an atmosphere consisting of only inert gas . the method and resultant product may further comprise thermal oxidation of the metal film , which proceeds more efficiently than oxidation of a metal film sputtered in an atmosphere consisting of only inert gas .