a metal strip resistor is provided . the metal strip resistor includes a metal strip forming a resistive element and providing support for the metal strip resistor without use of a separate substrate . there are first and second opposite terminations overlaying the metal strip . there is plating on each of the first and second opposite terminations . there is also an insulating material overlaying the metal strip between the first and second opposite terminations . a method for forming a metal strip resistor wherein a metal strip provides support for the metal strip resistor without use of a separate substrate is provided . the method includes coating an insulative material to the metal strip , applying a lithographic process to form a conductive pattern overlaying the resistive material wherein the conductive pattern includes first and second opposite terminations , electroplating the conductive pattern , and adjusting resistance of the metal strip .