detection of bumps &# 39 ; contact is enabled correctly , and the trouble of crushing a bump too much by an overshoot and connecting with an adjacent bump is abolished . the manufacturing apparatus of a semiconductor device and the manufacturing method of a semiconductor device which make it possible to perform stable flip chip bonding by an easy mechanism . the manufacturing apparatus of the semiconductor device concerning the present invention has a stage where a substrate is arranged , a movable member formed made it possible to advance or retreat towards the stage , an elastic member formed in the movable member , a chip adsorption means which can adsorb the chip supported by the elastic member made it possible to advance or retreat towards a stage , a press means which can be pressed towards a stage about a chip adsorption means , a stopper which is formed in a movable member and can specify displacement of the direction close to a stage of a chip adsorption means by contacting a chip adsorption means from the stage side , a driving means which a movable member drives , and a control unit which controls operation of a driving means .