a method for manufacturing open cavity integrated circuit packages , the method comprising : placing a wire - bound integrated circuit in a mold ; forcing a pin to contact a die of the wire - bound integrated circuit by applying a force between the pin and the mold ; injecting plastic into the mold ; allowing the plastic to set around the integrated circuit to form a package having an open cavity defined by the pin ; and removing the open cavity integrated circuit package from the mold . a mold for forming a package for an integrated circuit sensor device , comprising : a bottom part for supporting an integrated circuit die ; a top part that is operable to be placed on top of said bottom part to form a cavity into which a plastic material can be injected to form the package , wherein the top part of the mold comprises a spring - loaded pin arrangement comprising a cover that covers a sensor area on the integrated circuit die and provides for an opening when the plastic material is injected .