in order to form a semiconductor integrated circuit capable of effectively using a chip area , there is provided a semiconductor integrated circuit including : a plurality of bonding pads formed along an edge of a semiconductor substrate ; a plurality of i / o cells arranged along the edge under the plurality of bonding pads ; an upper layer wire mesh including a plurality of upper layer wirings ; and a core region formed on the semiconductor substrate . in the semiconductor integrated circuit , the core region has an area larger than an area occupied by the upper layer wire mesh in a plane parallel to a surface of the semiconductor substrate .