a subpad support for use in a web format or belt format polishing apparatus for polishing one or more layers of semiconductor device structures . the subpad support includes a subpad retention element for nonadhesively securing the subpad thereto . the subpad support may also include one or more lips protruding therefrom so as to at least substantially inhibit lateral movement of the subpad relative to the subpad support . polishing apparatus including the subpad support are also disclosed . the polishing pads of such polishing apparatus may be at least partially moved away from the subpad or subpad support so as to facilitate assembly of a subpad with the subpad support or removal of the subpad from the subpad support without damaging the polishing pad . methods of removably securing a subpad to the subpad support , removing the subpad from the subpad support , and replacing another subpad on the subpad support , as well as polishing methods , are also disclosed .