a stacked multichip package comprises a first chip having a first active surface and a first rear surface , a first chip carrier having a first opening and being configured to carrier the first active surface , a plurality of first conductive leads passing through the first opening and being configured to electrically connect the first active surface and the first chip carrier , a second chip having a second active surface and a second rear surface , an adhesive layer configured to enclose the first conductive leads and to electrically couple the first chip carrier to the second rear surface , a second chip carrier having a second opening and being electrically connected to the second active surface , and a plurality of conductive leads passing through the second opening and being configured to electrically connect the second active surface and the second chip carrier .