a method for enhancing the solderability of a metallic surface is disclosed where the metallic surface is plated with an immersion silver plate prior to soldering , which immersion silver plate is treated with an additive selected from the group consisting of fatty amines , fatty amides , quaternary salts , amphateric salts , resinous amines , resinous amides , fatty acids , resinous acids , ethoxylated derivatives of any of the foregoing , and mixtures of any of the foregoing . the immersion silver deposits created are resistant electromigration .