there is provided a bump printing apparatus that can improve the printability of solder bumps printed on a board . the bump printing apparatus may include a printing table onto which a board is mounted ; a mask making close contact with the board and printing solder bumps on the board by separating the mask from the board after a printing operation ; and mask tables extending from the printing table to edges of the mask and sucking the edges of the mask to bring the edges of the mask into close contact with the board under vacuum .