current protection in integrated circuit having multiple pads . different types of current protection structures may be associated with different pads . a common current discharge or charge path may be used to provide current to or draw current from various of these heterogenic current protection structures . since a common current discharge or charge path is used , the metallization used to formulate a discharge solution is significant simplified . additionally , the protection structures may be provided with selectively conductive regions that are approximately radially symmetrical around the circumference of the pad . accordingly , if the protection structures are slightly off center with respect to the bond pad , the error in the amount of active region around the circumference of the pad is at least partially averaged out .