a circuit board according to the invention is made from two or more laminates each made of a fusible dielectric material , which laminates are bonded to each other along respective inner faces thereof . each such laminate is preferably a pre - preg sheet containing both a heat - fusible resin and a reinforcing fiber filler to provide the desired stiffness and strength . a number of first electrical contacts are exposed on an outer face of the first laminate , and second electrical contacts are exposed on an outer face of the second laminate . the circuit board further includes a plurality of electrical conductors each running from a first contact to a second contact , the conductors including elongated conductive lines extending along one of the first or second laminates , and vias extending through the first and second laminates which have been filled with an electrically conductive via filler .