a semiconductor component includes a substrate , bonding pads on the substrate , and terminal contacts bonded to the bonding pads . exemplary components include semiconductor packages , semiconductor wafers and semiconductor dice . exemplary terminal contacts include contact balls , contact bumps and contact columns . in each case , the terminal contacts can be arranged in a dense array , such as a ball grid array , or fine ball grid array . the component also includes patterns of primary conductors on the substrate in electrical communication with the bonding pads and with the terminal contacts . selected terminal contacts , particularly those most likely to experience fatigue failure due to thermal loads , are in electrical communication with the primary conductors and also with one or more secondary conductors . the secondary conductors are configured to provide alternate electrical paths for the selected terminal contacts should damage occur to the primary conductors . in addition , the secondary conductors are configured to rigidify the bonding pads and terminal contacts so that separation from the substrate is less likely to occur .