an apparatus is described that includes a substrate and a mold compound disposed on the substrate . the semiconductor die is embedded within the mold compound and is electrically coupled to lands on the substrate . solder balls are disposed around the semiconductor die on the substrate . each of the solder balls have a solid coating thereon . the solid coating contains a cleaning agent to promote its solder ball &# 39 ; s coalescence with another solder ball . respective vias are formed in the mold compound that expose the solder balls and their respective solid coatings . in combined or alternate embodiments outer edges of the mold compound have smaller thickness than regions of the mold compound between the vias and the semiconductor die . in combined or alternate embodiments micro - channels exist between the solder balls and the mold compound .