a sputtering device according to this invention can sputter a plurality of substrates and can vary an angle of incidence of sputtering particles to each substrate , and comprises at least a substrate holder provided in a vacuum chamber rotatably ; a plurality of substrates installed on said substrate holder ; a target for forming a thin film on said substrates ; and a rotatable sputtering cathode installing said target ; wherein a center axis of said target is eccentric to a rotation shaft of said sputtering cathode in order to gain a desired film forming distribution .