a plasma etch system that processes one slice at a time is disclosed . the system is comprised of an entry loadlock , an exit loadlock , a main chamber , vacuum pumps , rf power supply , rf matching network , a heat exchanger , throttle valve and pressure control gas flow distribution and a microprocessor controller . a multiple slice cassette full of slices is housed in the entry load lock and after pumping to process pressure , a single slice at a time is moved by an articulated arm from the cassette through an isolation gate to the main process chamber . the slice is etched and removed from the main process chamber through a second isolation gate by a second articulated arm to a cassette in the exit loadlock . the process is repeated until all semiconductor wafers have been etched . the cassette loadlock system is able to evacuate a whole cassette of semiconductor wafers for processing which lowers the particulate environment for the slices and , provides a more stable environment for the slices by removal of moisture and preventing static discharges and additionally provides a safety feature that protects the operators from harsh or toxic gases that are traditionally used in semiconductor type plasma reactor .