there is provided a semiconductor device manufacturing apparatus capable of recovering a damage of a low dielectric insulating film exposed to co 2 plasma to obtain the low dielectric insulating film in a good state , thus improving performance and reliability of a semiconductor device . the semiconductor device manufacturing apparatus includes : an etching processing mechanism for performing an etching process that etches a low dielectric insulating film formed on a substrate ; a co 2 plasma processing mechanism for performing a co 2 plasma process that exposes the substrate to co 2 plasma after the etching process ; a polarization reducing mechanism for performing a polarization reducing process that reduces polarization in the low dielectric insulating film after the co 2 plasma process ; and a transfer mechanism for transferring the substrate .