in one embodiment a micro - electro - mechanical system microphone package includes a multiple layer substrate , an upper acoustic port formed through a plurality of upper layers of the multiple layer substrate and exposing an upper surface of a membrane portion , a lower acoustic port formed through a plurality of lower layers of the multiple layer substrate and exposing a lower surface of the membrane portion , a ring trench formed through at least one of the plurality of upper layers and exposing a metal ring , a mems die located above the ring trench , a copper pillar ring extending between the metal ring and the mems die , and a solder pillar ring positioned on a first surface of the copper pillar ring , the copper pillar ring and solder pillar ring attaching the mems die to the metal ring .