an apparatus which reduces the surface area with which a carrier film adheres to a die , including a plate member including laterally - spaced supports . preferably , the apparatus also includes a vacuum source operatively connected to the plate member . upon placement of a carrier film having an array of semiconductor dice adhered thereto onto the plate member , the dice are proximate the supports . the vacuum pulls air from the spaces between the supports , which partially releases the carrier film from the bottom surface of at least some of the dice . the apparatus may also include a die removal mechanism such as a vacuum collet type die pickup mechanism , an extendable member die plunge - up mechanism , or a combination thereof . the present invention also includes a method for reducing the surface area with which a carrier film adheres to a die to facilitate removal thereof .