a means to utilize conduction - cooled vme electronics modules in an air cooled system is provided . such means comprises a modified convection - cooled vme compatible chassis that includes a convection bridge thermally interfaced with a vme electronics module just as a conduction chassis would . the convection bridge is clamped between the vme electronics module and the modified chassis , requiring no modifications to the vme electronics module . for enhanced performance , additional features may include having any individual or combination of fin orientation on the convection bridge , interstitial material such as grease or indium foil can be inserted between the convection bridge and the vme electronics module , and compatible air - moving appliances such as a fan as part of the modified vme chassis .