metallization patterns are provided to reduce the probability of chip fracture in semiconductor lasers . according to one embodiment disclosed herein , the pad edges of a metallization pattern extend across a plurality of crystallographic planes in the laser substrate . in this manner , cracks initiated at any given stress concentration would need to propagate across many crystallographic planes in the substrate to reach a significant size . additional embodiments of the present disclosure relate to the respective geometries and orientations of adjacent pairs of contact pads . still further embodiments are disclosed and claimed .