ionization of air without the use of corona discharge tips , thereby to avoid the generation of particulates from corrosion of the corona tips , is accomplished by use of a laser beam focussed to a small focal volume of intense electric field adjacent a semiconductor chip . the electric field is sufficiently intense to ionize air . in the manufacture of a semiconductor circuit chip , during those steps which are conducted in an air environment , opportunity exists to remove from a surface of a chip , or wafer , charge acquired during the manufacturing process . the ionized air is passed along the chip surface . ions in the air discharge local regions of the chip surface which have become charged by steps of a manufacturing process . by way of further embodiment of the invention , the ionization may be produced by injection of molecules of water into the air , which molecules are subsequently ionized by a laser beam and directed toward the chip via a light shield with the aid of a magnetic field .