a solder coating apparatus for coating lead sections of a lead frame , including a liquid solder bath and a coating block having a first slit - like passage therethrough for permitting a lead frame to pass through the block and a second passage of enlarged cross section communicating with and extending along the first passage for permitting the lead frame package to pass through the block . a pair of liquid solder supply slits are formed in the block and communicates with the first passage along the length thereof and on opposite sides of the second passage . a pump at least partially immersed in the liquid solder bath provides for positive supply of liquid solder to and through the slits into the first passage to coat the lead sections . a conduit connects between the delivery side of the pump and the liquid solder supply slits .