a power module with multiple equalized parallel power paths supporting multiple parallel bare die power devices constructed with low inductance equalized current paths for even current sharing and clean switching events . wide low profile power contacts provide low inductance , short current paths , and large conductor cross section area provides for massive current carrying . an internal gate & amp ; source kelvin interconnection substrate is provided with individual ballast resistors and simple bolted construction . gate drive connectors are provided on either left or right size of the module . the module is configurable as half bridge , full bridge , common source , and common drain topologies .