a method for measuring a height of a bump formed on a work of substrate , the method comprising : irradiating x - rays having a predetermined wavelength and an incident intensity toward a first work of substrate which is the same as the above - mentioned work of substrate , but no bump is formed thereon , and detecting a first x - ray transmitted intensity at a position on which the bump is to be formed ; irradiating x - rays having the same wavelength and incident intensity toward a material constituting the bumps and detecting a linear absorption coefficient of the x - rays ; memorizing the first x - ray transmitted intensity and the linear absorption coefficient as known data ; and irradiating x - rays having the same wavelength and the same incident intensity toward a second work of substrate which is the same as the above - mentioned work of substrate , but bump is formed thereon , and detecting a second x - ray transmitted intensity at a position on which the bump is formed ; and determining the height of the bump from the second x - ray transmitted intensity on the basis of the known data .