embodiments of the present invention relates generally to the manufacture of printed circuit boards or printed wiring boards , and particularly to methods for treating smooth copper surfaces to increase the adhesion between a copper surface and an organic substrate . more particularly , embodiments of the present invention related to methods of achieving improved bonding strength of pcbs without roughening the topography of the copper surface . the bonding interface between the treated copper and the resin layer of the pcb exhibits excellent resistance to heat , moisture , and chemicals involved in post - lamination process steps .