a semiconductor device package includes a carrier , an electronic component disposed over a top surface of the carrier , and a package body disposed over the top surface of the carrier and covering the electronic component . the semiconductor device package further includes a shield layer , which in turn includes a first electrically conductive layer , a first magnetically permeable layer , and a second electrically conductive layer , where the first magnetically permeable layer is interposed between and directly contacts the first electrically conductive layer and the second electrically conductive layer .