an optoelectronic package or system and method for fabrication is disclosed which includes a silicon layer with wiring . the silicon layer has an optical via for allowing light to pass therethrough . an optical coupling layer is bonded to the silicon layer , and the optical coupling layer includes a plurality of microlenses for focusing and or collimating the light through the optical via . a plurality of oe elements are coupled to the silicon layer and electrically communicating with the wiring . at least one of the oe elements positioned in optical alignment with the optical via for receiving the light . a carrier is interposed between electrical interconnect elements . the carrier is positioned between the wiring of the silicon layer and a circuit board and the carrier is electrically connecting first interconnect elements connected to the wiring of the silicon layer and second interconnect elements connected to the circuit board .