a light - emitting semiconductor component having : a semiconductor element containing an active layer , electrical contacts for impressing a current into the active layer , and a carrier with a large thermal capacity for absorbing the heat generated during operation . the rear side of the semiconductor element is electrically and thermally connected to the carrier by a conductive adhesive . recesses , which accommodate a part of the conductive adhesive when the semiconductor element is connected to the carrier , are provided in the rear side of the semiconductor element .