a semiconductor integrated circuit device includes a semiconductor element having pads , a lead frame stage on which the semiconductor element is mounted , and a plurality of terminal members mounted on the lead frame stage and located outside the semiconductor element , the terminal members respectively having electrically conductive patterns and being made of a material identical to a material of which the semiconductor element is made . the device includes inner leads spaced part from the lead frame stage , a first group of bonding members connecting the pads of the semiconductor element and the electrically conductive patterns of the terminal members to each other , and a second group of bonding members connecting the electrically conductive patterns of the terminal members and the inner leads to each other .