a single - chip magnetic field sensor bridge , comprising a substrate , a reference arm , a sensing arm , shielding structures , and wire bond pads is disclosed . the reference arm and the sense arm respectively comprise at least two rows / columns of reference element strings and sense element strings formed by electrically connecting one or more identical magnetoresistive sensing elements . the reference element strings and the sense element strings are alternately arranged . the magnetoresistive sensing elements are amr , gmr or tmr sensing elements . the reference element strings are provided with shielding structures thereon , and the sensing element strings are located in gaps between two adjacent shielding structures . the shielding structures are arrays of elongated strips composed of permalloy or another soft ferromagnetic material . the sensors can be implemented as one of three different bridge structures , called a quasi - bridge , a half - bridge , or a full - bridge . this single - chip magnetic field sensor bridge has the advantages of small size , low cost , high sensitivity , small offset , good linearity , and good temperature stability .