the present invention relates to a package structure , a packaging substrate and a chip . the package structure includes : a chip including a plurality of electrode pads on a surface thereof ; a packaging substrate including a plurality of first conductive pads on a surface thereof ; and a plurality of connecting units through which the electrode pads electrically communicate with the first conductive pads , in which the chip or the packaging substrate further includes a first surface finish layer over the electrode pads or the first conductive pads , and the first surface finish layer includes a ni — pd alloy layer . accordingly , the surface finish method applied in a package structure , a packaging substrate and a chip has advantages of simple manufacture , low cost and high reliability .