in a method of manufacturing a circuit board having a lateral conductive pattern and shield regions , a first laminate of a substrate , covered on one side by a copper foil , is contour cut whereafter a second entirely covering copper foil is laminated to the second side of the substrate , and a conductive pattern of signal conductors and ground conductors is etched in the second copper foil . the second substrate is also contour cut and is laminated to a copper foil , whereafter a window is etched in the copper foil , corresponding to a window cut in the substrate . the second laminate thus formed is adjusted in regard of the pattern to the first laminate and is adhesively secured thereto , the side of the second laminate covered by the copper foil turned away from the wide of the first laminate provided with the conductive pattern . a metal layer is thereafter applied to the surface of the first laminate facing away from the side having the conductive pattern and the lateral edges to electrically connect the surface , the ground conductors of the conductive pattern and the foil on the second substrate , whereafter components are mounted in the windows in the second laminate to the conductive pattern .