a method of fabricating a mems device includes forming a magnetic sensor over a soi wafer which may include an epoxy layer ; forming a pair of mems flux concentrators sandwiching the magnetic sensor ; connecting an electrostatic comb drive to each of the flux concentrators ; connecting a spring to the flux concentrators and the comb drive ; performing a plurality of drie processes on the soi wafer ; and releasing the flux concentrators , the comb drive , and the spring from the soi wafer . another embodiment includes forming adhesive bumps and a magnetic sensor on a first wafer ; forming a second wafer ; forming a pair of mems flux concentrators , a pair of electrostatic comb drives , and at least one spring on the second wafer ; bonding the second wafer to the adhesive bumps ; and compressing the adhesive bumps using non - thermal means such as pressure only .