a system , apparatus , and method for removing pressure adhesive indicia , such as labels or stamps , from their backing and affixing the same to a target substrate is provided . the automated process affixes stamps , for example , to the target substrate with both speed and precision of placement . desired stamps can be selectively removed from a backing , for example , can be placed on variable locations upon the target substrate , and can be affixed in the desired orientation with precise spacing between stamps . the precision of affixation afforded by this system is commensurate with philatelic standards and is suitable for all pressure adhesive indicia where rapid and precise placement is desired for aesthetic or other reasons .