a method for the manufacture of a package encasing a micro - electro - mechanical systems device provides a cover having a lid and sidewalls with a port extending through the lid . a first base component is bonded to the sidewalls defining an internal cavity . this first base component further includes an aperture extending therethrough . the mems device is inserted through the aperture and bonded to the lid with the mems device at least partially overlapping the port . assembly is completed by bonding a second base component to the first base component to seal the aperture . the package so formed has a cover with a lid , sidewalls and a port extending through the lid . a mems device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component . a second base component is bonded to the first base component spanning the aperture .