a polishing pad for polishing semiconductors and other planar substrates in the presence of a slurry comprising abrasive particles and a dispersive agent is disclosed . the polishing pad includes a soluble component within a polymer matrix component . the soluble component includes particles soluble in the slurry sufficiently to provide a void structure in the polishing surface of the pad . the void structure enhances the polishing rate and uniformity by increasing the mobility of the abrasive particles while reducing scratching of the polished surface . additives that further enhance polishing and / or assist in the removal of residues generated during polishing , such as surfactants and removers , are optionally incorporated in the soluble particles or topographically coated on the soluble particles .