a technique for increasing the compliance of tin - indium solders is disclosed . in one particular exemplary embodiment , the technique may be realized as a lead free solder alloy comprising from about 58 . 0 % to about 99 . 998 % by weight tin , from about 0 . 001 % to about 40 . 0 % by weight indium , and from about 0 . 001 % to about 2 . 0 % by weight at least one rare earth element .