according to the present invention a pad arrangement is provided for applying reworks or engineering changes to an electronic circuits to be formed on the circuit board , the pad arrangement comprising a first signal pad for being electrically connected to a first signal line , a second signal pad for being electrically connected to a second signal line , a ground pad being connected to a ground line provided on the circuit board , and a voltage pad being connected to a supply voltage line provided on the circuit board , whereby the pads are arranged in proximity to each other for facilitating a placement of electronic devices between at least two of the pads .