a method is provided for contactless testing of an integrated circuit by fabricating , integrally with the integrated circuit , at least one and preferably a plurality of conductive semiconductor elements that are electrically connected between power and / or signal sources and inputs to the integrated circuit , and that are adapted to electrically conduct when exposed to a radiation beam . the conductive elements are selectively exposed by at least one radiation beam , such as an electron or light beam , to cause the conductive elements to electrically conduct and supply desired electrical inputs at the connected inputs of the integrated circuits ; and the electrical responses of at least a segment of the integrated circuit to said electrical input are measured to determine whether said circuit segment possesses specified electrical characteristics . the integrated circuit can thus be selectively and sequentially tested by segments and modules . after testing , the conductive semiconductor elements are preferably disconnected from the integrated circuit , and the integrated circuit selectively connected electrically while accommodating and passivating defective components and modules of the circuit .