a two - stage packaging method of image sensors is disclosed . the packaging method includes the following steps : providing a substrate , fixing an image sensor chip on the substrate , fixing a transparent board on the image sensor chip , electrically connecting the image sensor chip and the substrate , forming a first encapsulant lay , and forming a second encapsulant layer . the two - stage packaging method prevents excessive pressure from being generated by formation of the encapsulant layers during the image sensor packaging process . such excessive pressure , if generated , may result in position shift of the image sensor chip or damage of the bonding wires . the two - stage packaging method can increase the yield of the image sensor packaging process as well as the sensitivity of image sensors , thereby improving the quality and production of image sensor packaging while lowering the manufacturing costs .