an improved semiconductor die stacking scheme is provided . in accordance with one embodiment of the present invention , a method of stacking a plurality of semiconductor die is provided . in accordance with another embodiment of the present invention a multiple die semiconductor assembly is provided . each embodiment relates generally to a stacked semiconductor die assembly including a substrate , first and second semiconductor dice including stacking surfaces and active surfaces , a decoupling capacitor , and one or more conductive lines connecting elements of the assembly .