a system to package high performance microelectronic devices , such as processors , responds to component transients . in one embodiment , the system includes a decoupling capacitor that is disposed between a vcc electrical bump and a vss electrical bump . the decoupling capacitor has vcc and vss terminals . the vcc and vss terminals share electrical pads with the vcc electrical bump and the vss electrical bump . a simple current loop is created that improves the power delivery for the system .