a method of forming a semiconductor package is provided . the method includes forming a leadframe wherein the conductors or leads of the leadframe extend from a first end to a second end such that a portion of each lead exhibits a generally arcuate shape . the first end may be coupled with a printed circuit board and the second end may be coupled with a semiconductor die . the generally arcuately shaped portion of the leads may include a portion which exhibits a constant radius . the generally arcuately shaped portion may also be formed from a plurality of conductor segments including , for example , at least one generally arcuately shaped segment . the semiconductor die and at least a portion of the leads may be encapsulated with an insulating material .