an adhesive resin application system which requires no external heating apparatus , and which is operative in the absence of a reactive atmosphere , is disclosed . the system provides its own heat by employing an adhesive material containing reactants which react exothermally when electrically ignited . after ignition of the reactants , sufficient heat energy is liberated by the exothermic reaction either to plasticize a thermoplastic resin or to cure a thermosetting resin and therby bond together two closely spaced objects . this application is a continuation - in - part of application ser . no . 489 , 006 , filed apr . 27 , 1983 , which is a continuation - in - part of application , ser . no . 929 , 120 , filed july 28 , 1978 , both now abandoned .