a method of manufacturing a substrate with through electrodes of the present invention , includes the steps of forming a metal post over a temporal substrate in a state that the metal post is peelable from the temporal substrate , placing a normal substrate in which a through hole is provided in a position corresponding to the metal post over the temporal substrate , whereby inserting the metal post on the temporal substrate into the through hole in the normal substrate , and obtaining a through electrode that is formed of the metal post passing through the normal substrate by peeling the temporal substrate from the metal post .