a system for clamping a heat sink that prevents excessive clamping force is provided . the system may include a heat sink , a semiconductor device , a printed circuit board , and a cover . the semiconductor device may be mounted onto the circuit board and attached to the cover . the heat sink may be designed to interface with the semiconductor device to transfer heat away from the semiconductor device and dissipate the heat into the environment . accordingly , the heat sink may be clamped into a tight mechanical connection with the semiconductor device to minimize thermal resistance between the semiconductor device and the heat sink . to prevent excessive clamping force from damaging the semiconductor device , loading columns may extend between the cover and the heat sink .