a high density connector for electrically interconnecting conductive paths on close centers between circuit boards such as those of a backpanel and daughter cards , includes a clamping mechanism bolted first to a daughter card and then to a backpanel to compress springs held by the mechanism driving flat flexible circuits having contacts on close centers to engage board circuit paths , where the mechanism is rigid and includes spring driven clamps to straighten the daughter card and strain relief the interconnection area . the flexible circuit contacts are offset relative to the springs bearing area to provide a contact wipe of the contact path interconnection .