an apparatus including a die including a device side and an opposite backside , first contacts on the backside and a through vias from the device side to the first contacts and second contacts on the backside of the die or on at least two opposing sidewalls of the die ; a secondary die coupled to the first plurality of contacts ; and a carrier including carrier contact points operable for mounting the carrier to a substrate . a method including forming a first portion of a carrier adjacent a device side of a die and including carrier contact points operable for mounting the carrier to a substrate ; and forming a second portion including second carrier contact points connected to contacts on the backside of the die or on at least two opposing sidewalls of the die ; and coupling a secondary die to the second carrier contact points .