an interlayer connector for preventing delamination of semiconductor layers , and methods of forming the connector are disclosed . the connector includes a first connector head in a first distal layer , a second connector head in a second distal layer and a connector body coupling the first and second connector heads . each connector head has a dimension greater is size than the connector body such that the layers are securely held together . the interlayer connector may be isolated from current - carrying wiring or provided in the form of a contact via . the interlayer connector provides a mechanical mechanism to prevent layers from delaminating regardless of the materials used . the invention also eliminates the need for white space fill above and below via fill by using the connectors coplanar with the on device wiring .