soldering fluxes and methods of using same for soldering metals with solders which are molten below 400 ° c . wherein the flux functions efficiently but with an absence or minimum of spattering of particulate solder or reaction products between the solder and flux . soldering fluxes according to this invention can be utilized in any soldering application and by any method of soldering where it is desirable to eliminate or reduce spattering . a few examples of common soldering compositions in this category are tin , tin and antimony , tin and lead . one example of the use of such fluxes is in the soldering of tinplate can bodies whereby it is possible to minimize or substantially eliminate the contamination of the can body by the lead component of the solder when lead bearing solders are used . when soldering printed circuit boards for the production of electronic and electrical equipments using the soldering flux of this invention , the minimal or absence of spattering can significantly reduce residual electrical conductivity between circuits .