a wafer attracting apparatus includes a substrate made of a ceramic material and adapted to attract and hold a wafer onto an attracting surface thereof , wherein the attracting surface is constituted by a ductile worked surface , the ductile worked surface has concave portions , a diameter of each of the concave portions is 0 . 1 μm or less , and when the wafer is attracted onto the attracting surface of the substrate and released therefrom , the number of particles attaching to that wafer is 9 . 3 or less per 1 cm 2 .