an exposure method comprises the steps of : providing a resist - coated substrate ; providing a first mask including first and second regions having respective patterns formed therein ; conducting a first exposure process in which the patterns in the first and second regions of the first mask are projected onto the substrate so as to expose first and second regions of the substrate which correspond to the patterns , respectively ; and conducting a second exposure process after completion of said first exposure process so as to make an additional exposure of the second region of the substrate . by virtue of the incorporation of the second exposure process so as to make an additional exposure of the second region of the substrate , the resist linewidth which would be otherwise produced in the second region of the substrate by the first exposure process can be compensated through the second exposure process .