the circuit arrangement has at least one electrically , cut conductor track on at least one surface of a support film , the support film being free of deformations and fluctuations in the thickness , both in the region of the conductor track covering it and outside this region . the edges of the conductor track have a projection in the form of a stamping burr . a negative circuit is applied to a stamping substrate or embossed in the latter by means of embossing dies or punching tools constituting a block ; the conductor track representing the remaining positive circuit is transferred to the support film .