details of present invention will now be described , including exemplary aspects and embodiments thereof . referring to the drawings and the following description , like reference numbers are used to identify like or functionally similar elements , and are intended to illustrate major features of exemplary embodiments in a highly simplified diagrammatic manner . moreover , the drawings are not intended to depict every feature of actual embodiments or the relative dimensions of the depicted elements , and are not drawn to scale . with this in mind , fig1 shows a coaxially cooled laser module 10 under illustrated embodiments of the invention . the coaxial cooled laser module 10 shown in fig1 consists of a to - can and a fiber pigtail module 12 which functions to align an axis of light transmission between the to - can and the optical fiber . the embodiments described herein are associated with the to - can design . therefore , the discussion provided herein is focused primarily on the to - can and similar packaging . the to - can package shown in fig2 typically consists of a to header subassembly 14 shown in fig2 ( a ) and a sealing cap 16 with a flat window 18 shown in fig2 ( b ). the to header subassembly 14 may include a to header 20 with a number of electrical conductor pins 22 extending through the to header 20 . the to header subassembly 14 may also include a thermo - electric cooler ( tec ) 24 and a carrier module 26 that supports active and passive optical components , i . e ., ld , mpd , optical lens and isolator ( the lens and isolator combo ). the to header 20 may be made of a number of different materials , like cold roll steel , kovar or other alloys . the diameter of the header should be large enough to accommodate a selected tec 24 . one example may be a to header 24 that is 9 mm in diameter . the header pins 20 may be of an inline layout or alternatively of a circular layout as shown in fig3 and 4 . in order to get better rf performance at high frequency ranges , the rf pin 300 may be designed to have good impedance match . under illustrated embodiments , a coaxial pin configuration is used as shown in fig3 and 4 . the coaxial pin consists of metal tubing and a glass filler . the diameters of the tubing and pin are determined by the matching impedance and dielectric constant of the glass filler . the metal tubing is brazed on the header . the tec 24 may be any commercial available miniature cooler that consists of a hot , a cold plate and thermal electric semiconductor elements as shown in fig5 . the thermal electric semiconductor elements are placed in couples . the thermal capacity of the tec should be chosen so that it has a sufficient number of thermal couples that are able to keep the cost low and yet are still adequate to dissipate both the active heat load generated by ld and the passive heat load leaked into the package from the surrounding environment . one example is the tec with footprint of approx . 5 × 4 mm . there may be two wirebond pads 500 , 502 located in opposite ends of the tec 24 . other configurations of the wirebond pads are possible . the tec may be soldered to the center of the to header . the wirebond pads 500 , 502 may be connected to pins 22 via a pair of wirebonds 32 . the carrier module 26 is mounted onto the cold plate 504 of the tec and is populated with a ld 600 , a mpd 604 , a reflection mirror 602 and the lens and isolator combo ( fig7 and 8 ). the ld 600 may be mounted on a ld submount 606 that is made of a material with good thermal conductivity . one example is aluminum nitride ( ain ). there may be several au metalized pads on the ld submount ( not shown in the figure ) to allow soldering of the leads of the ld and other possible components to an intermediate connection point and then on to the leads 22 . the ld 600 may be an edge emitting laser and may be soldered vertically on the submount . alternatively , a surface emitting laser is also suitable for this application with slight modification of the ld submount 606 . the edge emitting laser emits laser light in two directions , one is in a forward direction from a front facet and the other is backward from a rear facet . in a traditional uncooled to laser package where the edge - emitting laser is used , the mpd is mounted beneath the ld to catch the laser light from the rear facet of the ld for purposes of monitoring laser performance . this configuration has a drawback , i . e ., it raises the profile of the components on the cold plate of the tec , resulting in poor mechanical and thermal stability . under illustrated embodiments , a compact ld - mpd configuration is provided as shown in fig6 . a wedge shaped mirror reflector 602 is used to reflect the laser light and to redirect it to the mpd 604 that is mounted in front of the ld . in this way , the profile of the components is lower significantly . the wedge shaped mirror is made of metal , ceramic or silicon with au plated on the reflective surface . the surface quality is not critical because it is for monitoring purpose only . the angle of the wedge varies depending on the position and height of the mpd ( e . g ., 30 - 60 degrees ). the mpd orientation may be slightly adjusted to avoid saturation and back reflection . referring now to fig7 and 8 , a projection and shoulder combination 702 on an upper surface of the optical lens and isolator combo 30 may engage the flat window ( aperture ) 18 of the sealing cap 16 . alternatively , the flat window 18 may be comprised of an optically transparent material disposed in the upper surface of the sealing cap 16 . where the flat window 18 is a transparent material , the optical lens and isolator combo 30 may be separated from the window by a short distance ( e . g ., less than 1 mm ). separation of the optical lens and isolator combo 30 allows the combo 30 to be thermally isolated from the sealing cap 16 , yet still allows the optical signal to be transmitted by the combo 30 through the window 16 into the optical fiber . the optical lens and isolator combo 30 may be fabricated by integrating an optical lens and an isolator in a housing to form a single compact component as shown in fig7 ( a ). the optical lens 700 may be a ball lens or aspheric lens depending on optic design and coupling efficiency . the surface of the lens may have an anti - reflective ( ar ) coating . the optical isolator 703 may be suspended by the lens 700 in free space with the only connection being made to the carrier . alternatively , a supporting stand 800 can be integrated into the combo component as shown in fig7 ( b ). the housing is made of kovar or other appropriate metals . in order to get good optical performance , the lens and isolator combo 30 may be cooled by the cold plate of the tec . therefore , it may be mounted on the carrier module 26 along with the ld and mpd . if there is no supporting stand on the combo component , a bonding ring 802 may be needed as shown in fig8 ( a ). the bonding ring is made of metal , like kovar or stainless steel . however , if the supporting stand is integrated into the combo component , the combo component can be directly mounted on the carrier as shown in fig8 ( b ). there may be two configurations of the carrier , one is extruded and the other is flat as shown in fig8 ( a ) and ( b ). the carrier can be made of kovar or stainless steel . two methods can be employed to bond the combo component on the carrier , one is laser welding and the other is epoxy bonding . the placement of the lens - isolator component should be done using either active or passive alignment depending on the manufacturing process and requirement of coupling efficiency . the novel features and characteristics of the invention are set forth in the appended claims . the invention itself , however , as well as other features and advantages thereof , will be best understood by reference to a detailed description of a specific embodiment , when read in conjunction with the accompanying drawings . compared with the to package currently reported , this coaxial package provides cooling for both active components and passive components on the cooled platform instead of active components only . the coaxial package ensures stable laser performance over a wide range of operation temperature . the coaxial package may include a commercially available to header and tec , so it is more economical and flexible in key components selection . compared with a traditional butterfly package , the coaxial package described herein consumes much less dc power than the butterfly package , for substantially the same laser output . typically only ½ of the dc consumed by the butterfly package is needed by the module described above . therefore , the package reliability is increased and thermal efficiency is also increased . the coaxial package simplifies the manufacturing processes and significantly reduces component and labor cost . material costs are significantly reduced by ⅓ to ½ . it will be understood that each of the elements described above , or two or more together , also may find a useful application in other types of constructions differing from the types described above . while the invention has been illustrated and described as embodied in a laser module or transceiver for an optical communications network , it is not intended to be limited to the details shown , since various modifications and structural changes may be made without departing in any way from the spirit of the present invention . without further analysis , the foregoing will so fully reveal the gist of the present invention that others can , by applying current knowledge , readily adapt it for various applications without omitting features that , from the standpoint of prior art , fairly constitute essential characteristics of the generic or specific aspects of this invention , and therefore , such adaptations should and are intended to be comprehended within the meaning and range of equivalence of the following claims .