in fig1 is shown a schematic representation of a system 10 , which includes a monolithic device 12 . the device 12 includes an integrated array with a plurality of leds . at this point , it is sufficient to note the general spatial arrangement of the leds . discrete regions of the array constitute pixels of the array . each array pixel includes two leds 18a and two leds 18b . for each array pixel , the leds 18a are connected to a single lead 29a and the leds 18b are connected to a separate lead 29b . in system 10 there are two separately adjustable power supplies va and vb for each array pixel . the power supply va is adapted to be connected to leds 18a , and the power supply vb is adapted to be connected to leds 18b . each power supply is coupled through a switch s and a voltage - to - current converting amplifier 24 to its corresponding leds . when its switch s is closed , each amplifier 24 provides a forward current to its respective leds which emits output light at a selected intensity from the device 12 . the output light intensity of the leds 18a , can be changed by adjusting power supply va , and the output light intensity of leds 18b can be changed by adjusting power supply vb . each switch s is separately addressable ( closed ) by a microprocessor ( μp ) 26 . turning now to fig2 discrete regions of the array constitute a plurality of array pixels . only three array pixels are shown in fig2 . each array pixel includes four electrically isolated but identical linear leds . with reference to array pixel &# 34 ; 1 &# 34 ;, leds 18a and leds 18b are selectively addressed to provide three different light images at a pixel of an image zone such as shown in fig4 a , 4b and 4c . the array actually illuminates a line image at the image zone . each line image has a plurality of image zone pixels . each image zone pixel corresponds to an array pixel and is adapted to receive light from its corresponding array pixel leds . a single pixel of an image zone is shown in fig4 a , 4b and 4c with different gray scale light images . as shown in fig4 a , the leds 18a and 18b of a corresponding array pixel are not activated . in fig4 b , the energized leds 18a of an array pixel form light images 18a &# 39 ; shown in black at the imate zone pixel . in fig4 c , all the leds of an array pixel 18a and 18b are activated to produce the maximum number of light images 18a &# 39 ; and 18b &# 39 ; at their corresponding image zone pixel . each array pixel has two spaced leds 18a connected to the common lead 29a . this lead 29a when addressed , is connected to a voltage supply va through a particular amplifier 24 . two leds 18b of an array pixel are connected to a common lead 29b and when addressed , driven by another voltage supply vb through another amplifier 24 . as best shown in fig2 one of an array pixel leds 18b is interleaved between the pixel &# 39 ; s leds 18a and one of the pixel &# 39 ; s leds 18a is interleaved between its leds 18b . the leads 29a and 29b of each array pixel are separately addressable by the microprocessor 26 . thus for a common - cathode led array , which provides at least three brightness levels of light images at each pixel of an image zone , at least two anode leads per array pixel plus one common cathode lead are required . by passing current through both anode leads 29a and 29b , a light image ( see fig4 c ) is formed at the corresponding pixel of the image zone which would produce a d max exposure of a portion of a photosensitive medium at the image zone . by passing current only to anode lead 29a or only to electrode 29b of an array pixel , a light image such as shown in fig4 b is produced at the corresponding image zone pixel . if leds 18a of an array pixel are designed to provide a different light exposure than leds 18b of the array pixel , by being driven by a different voltage or by having a different light emitting area , then there would , of course , be four different levels of brightness of images produced at an image zone pixel . interleaving of the leds on an array is advantageous since light from the adjacent leds of the array pixel overlaps to prevent bands from forming in the light image at the image zone . turning now to fig3 where a cross - section of the device 12 is shown . layer 39 is a semiconductor crystal of n - type gallium arsenide of a thickness from about 250 μm to 400 μm . a layer 42 of n - type , graded - composition , gallium arsenide phosphide is grown epitaxially on the surface of the semiconductor crystal 39 . the amount of phosphorus in the layer 42 is gradually increased as it is grown such that its composition varies from gaas at the beginning of growth to gaas o . 7 p 0 . 3 at the end of growth . layer 42 is from about 15 μm to 30 μm thick . an n - type layer 45 of constant composition gaas 0 . 7 p 0 . 3 is then grown on the graded composition layer 42 to a thickness of from about 15 μm to 30 μm . those skilled in the art will realize that the graded composition layer 42 reduces the effect of the strain induced on the devices fabricated in the constant composition layer 45 due to the lattice mismatch between the gaas layer 39 and the gaas 0 . 7 p 0 . 3 layer 45 . a film 41 of silicon nitride is grown by plasma deposition on the epitaxial layer 45 . windows are etched by a conventional photolithographic technique in the film 41 . the silicon nitride film 41 serves as a mask for the diffusion of p - type impurities ( for example , zinc ) into layer 45 . a film of zinc oxide is grown on the silicon nitride film 41 , and on the epitaxial layer 45 within the windows in the silicon nitride film , by chemical vapor deposition from dimethyl zinc and oxygen . a film of silicon dioxide is then grown on both sides of the device 12 by chemical vapor deposition from silane and oxygen to protect the device 12 from decomposition during the diffusion process . the device 12 is now placed in a furnace at an elevated temperature for a time interval sufficient for the zinc to diffuse into the n - type layer 45 to a depth of about 2 μm , forming the p - type regions of the leds 18a and 18b . the zinc oxide film serves as a source of zinc ; other methods can be used to diffuse zinc into layer 45 , e . g . vapor - phase transport from a zinc arsenide source , zinc - doped spin - on emulsions , and ion implantation . as viewed in fig2 each led of the array has a rectangular light emitting surface , with the short side of the rectangle being about 100 μm in length and the long side being about 400 μm . the silicon dioxide films and the zinc oxide film are now removed from the device 12 . metal anode leads 44 for contacting the p - type regions of the light emitting diodes are formed from evaporated aluminum using standard photolithographic and metal - liftoff techniques on the leds 18 . a film of silicon nitride 43 is then deposited on the silicon nitride layer 41 , and on the epitaxial layer 45 within the windows in the silicon nitride film , to an appropriate thickness to form an antireflection coating . the electrodes 44 are alloyed to layers 41 and 45 to improve the electrical contact between the electrodes 44 and the epitaxial layer 45 and to improve the mechanical adhesion of the electrodes 44 to the layers 41 and 45 . electrodes 29a and 29b are then formed on layer 43 and connected to their corresponding anode electrodes 44 in a similar manner to that described for electrodes 44 . a layer 36 formed of evaporated nickel , a layer 37 formed of evaporated gold germanium , and another layer 36 formed of evaporated nickel are deposited successively on the bottom side of the gallium arsenide crystal 39 . the metal layers 36 and 37 are then alloyed to the semiconductor 39 to improve the electrical contact . a layer 38 formed of evaporated gold is deposited on layer 36 . layer 38 provides a common cathode for all the array leds and is electrically connected to ground . layers 36 , 37 and 38 , as will be appreciated by those skilled in the art , make good ohmic electrical ground contact to the n - type gallium arsenide crystal 39 . as has been discussed above , optical radiation is produced at the p - n junction of each led upon the application of a forward current to its anode electrodes 44 . this current is selectively supplied by an amplifier 24 under the control of microprocessor 26 . the invention has been described in detail with particular reference to a preferred embodiment thereof , but it will be understood that variations and modifications can be effected within the spirit and scope of the invention . for example , the array leds could be staggered and the rectangular leds of one or more array pixels placed with their long dimension parallel to the axis of the array so as to provide continuous irradiance along the axis of the array . the leds 18a and 18b of an array pixel need not be symmetrical but could rather be chosen so that they would produce different exposures at their corresponding image zone pixel . if a plurality of m leds per array pixel were provided , with relative brightness weighted according to a binary number system , i . e ., 1 , 2 , 4 , . . . 2 exp ( m - 1 ), gray scale light images at the corresponding image zone pixel could be created with 2 exp ( m ) brightness levels ; mn + 1 electrodes would be required for an array with n array pixels .