in the following detailed description , reference is made to the accompanying drawings which form a part hereof , and in which is shown , by way of illustration , specific embodiments in which the invention may be practiced . these embodiments are described in sufficient detail to enable those skilled in the art to practice the invention , and it is to be understood that other embodiments may be utilized and that structural changes may be made without departing from the spirit and scope of the present invention . therefore , the following detailed description is not to be taken in a limiting sense , and the scope of the present invention is defined by the appended claims . a portion of a leadframe 200 is illustrated in fig2 . the leadframe 200 has first and second sets of leads 210 , 215 . although leads are discussed , other conductors can be used , such as lead fingers , and are considered within the scope of the invention . the first set of leads 210 extends from a first end 220 to a second end 230 , and the second set of leads 215 extends from the first end 220 to a third end 225 . for the first set of leads 210 , the first end 220 is substantially perpendicular to the second end 230 . for the first and second set of leads 210 , 215 , the first end 220 is for electrically coupling with an electronic system , such as a printed circuit board . the first end 220 can be coupled using reflow solder and other methods as known by those skilled in the art . the second end 230 of the first set of leads 210 and the third end 225 of the second set of leads 215 are adapted for coupling with a semiconductor die , as will be discussed further below . in one embodiment , a portion of each lead of the first set of leads 210 has a generally arcuate shape , as the lead 210 extends radially from the first end 220 to the second end 230 . for some of the first set of leads 210 , a substantial portion of the lead has a generally arcuate shape . the arcuate shape of each lead of the first set of leads 210 has a different arc length than the other leads of the first set of leads 210 . in another embodiment , each lead of the first set of leads 210 is spaced and sized such that the line spacing between at least one lead , or alternatively each lead , remains constant from the first end 220 to the second end 230 . each lead of the second set of leads 215 extends substantially straight from the first end 220 to the third end 225 . another embodiment is illustrated in fig3 . a leadframe 300 has first and second sets of leads 310 , 315 . the first set of leads 310 extends from a first end 320 to a second end 330 , and the second set of leads 315 extends from the first end 320 to a third end 325 . in one embodiment , the first end 320 of each lead of the first set of leads 310 is substantially perpendicular to the second end 330 . for both the first and second sets of leads 310 , 315 , the first end 320 of each lead is for electrically coupling with a printed circuit board . the second end 330 of the first set of leads 310 and the third end 325 of the second set of leads 315 are adapted for coupling with a semiconductor die , as will be discussed further below . in one embodiment , each lead of the first set of leads 310 has at least three segments 340 . the segments 340 are disposed such that a portion of each lead of the first set of leads 310 has a generally arcuate shape between the first end 320 and the second end 330 . the arcuate shape of each lead of the first set of leads 310 has a different arc length than the other leads of the first set of leads 310 . the segments 340 are substantially straight , and are each substantially the same length and substantially the same width . in one embodiment , at least one of the segments 340 is substantially straight and has a different length . in another embodiment , at least one of the segments 340 ′ has an arcuate shape as shown in fig5 . each lead of the second set of leads 315 extends substantially straight from the first end 320 to the third end 325 . the segmented leads provide a significant advantage since they are stamped , which is easier and less expensive to manufacture . the leadframe 200 of fig2 and the leadframe 300 of fig3 are formed from a single sheet of material or thin strip which is etched or stamped into a predetermined shape for connection with a selected chip design . the leads of the die are substantially flat . however , the leads or sections of the leadframe that extend over the die may need to be upset or downset , depending upon where the parting line of the mold is formed . after encapsulation in plastic , portions of the leadframe extend out of the respective chip packages . in one embodiment , the leadframe extends out of the sides , of the packages at a selected elevation which is determined in advance . these outwardly extending portions include the ends of the leads of a package . these leads may be ultimately bent for insertion into a suitable connector device . as shown in fig4 , a leadframe 400 is assembled into an integrated circuit package 405 . a semiconductor die 460 comprises circuitry ( not shown ) formed centrally on the die 460 and a plurality of bond pads 465 formed around the periphery of the die 460 . the semiconductor die 460 is mounted using loc technology with additional support from the leadframe at the edge of the die opposite the bond pad ( not shown ). electrically conductive wire bonding 480 is used to connect selected bond pads 465 on the die 460 to selected leads of the leadframe 400 . a portion of each lead of the first set of leads 410 of the leadframe 400 is formed in a generally arcuate shape . in one embodiment , a portion of the first set of leads 410 extends radially from a first end 420 to a second end 430 . alternatively , the first set of leads 410 includes a plurality of segments for forming the arcuate shape . in one embodiment , the leadframe 400 , semiconductor die 460 and wire bonding 480 are enclosed in protective , electrically insulative material such that ends of the leads are exposed to allow connection to be made to other electrical components . in another embodiment , leadframe 400 , semiconductor die 460 and wire bonding 480 are encapsulated in plastic , thereby forming the integrated circuit package 405 . an integrated circuit package including the leadframe according to the invention has reduced effective inductance and cross - talk relative to existing integrated circuit packages . below are simulated inductances and resistances for the tightly radiused leads of the conventional right angle leadframe shown in fig1 and the leads of the arcuate leadframe shown in fig2 . the lead number refers to leads shown in fig1 and 2 . like numbers in the figures indicate leads connecting between same locations on the die and same exterior connections . the results in table 1 reveal the decreased inductance for the present invention . the inductance and resistance of each lead is less for the arcuate leadframe and the segmented leadframe than in the tightly radiused leadframe . in particular , the longer leads experience the greatest improvement in using the arcuate leadframe and the segmented leadframe versus the tightly radiused leadframe . advantageously , the radiused leadframe provides for lower inductance , resistance , and capacitance of leads in a leadframe , as opposed to leads with tightly radiused corners . the factors are important when the leads are carrying high - frequency signals , or signal having high - frequency harmonics , such as sub - nanosecond rise times . the continuous arcuate shape of the leads and the constant width of the leads maintain line spacing between the leads . this consistency maximizes layout space of the leadframe without increasing cross - talk . in addition , a single leadframe strip or assembly can comprise leadframes for any number of a predetermined number of chips . it is to be understood that the above description is intended to be illustrative , and not restrictive . many other embodiments will be apparent to those of skill in the art upon reviewing the above description . the scope of the invention should , therefore , be determined with reference to the appended claims , along with the full scope of equivalents to which such claims are entitled .