referring to fig1 , there is shown a schematic view of the process flow of a smart automatic communication method according to the first embodiment of the present invention . as shown in fig1 , the smart automatic communication method are for use with a first electronic device and a second electronic device , wherein the first electronic device has a first near field communication chip and a first far field communication chip , whereas the second electronic device has a second near field communication chip and a second far field communication chip . the process flow of the smart automatic communication method starts with step s 11 which involves generating a communication packet by the first electronic device to package a communication setup file of the first far field communication chip . step s 12 involves moving the first electronic device toward the second electronic device to allow the first near field communication chip to trigger the second near field communication chip within a distance and create a first near field communication path between the first near field communication chip and the second near field communication chip . for example , the distance is shorter than 10 centimeters , wherein the first near field communication chip complies with a near field communication protocol . for example , the distance is shorter than 10 meters , wherein the first near field communication chip complies with a bluetooth communication protocol . step s 13 involves sending the communication packet to the second electronic device through the first near field communication path . step s 14 involves analyzing the communication packet with the second electronic device to obtain the communication setup file and then sending the communication setup file to the second far field communication chip . step s 15 involves creating a first far field communication path between the second far field communication chip and the first far field communication chip according to the communication setup file , thereby allowing the first electronic device and the second electronic device to switch from the near field communication to the far field communication . referring to fig2 , there is shown a schematic view of the process flow of the smart automatic communication method according to the second embodiment of the present invention . as shown in fig2 , the smart automatic communication method is for use with a first electronic device , a second electronic device and a third electronic device , wherein the first electronic device has a first near field communication chip and a first far field communication chip , whereas the second electronic device has a second near field communication chip and a second far field communication chip . the third electronic device has a third near field communication chip and a third far field communication chip . in the second embodiment , the smart automatic communication method not only comprises steps s 11 ˜ s 15 in fig1 but also comprises steps s 21 ˜ s 24 . step s 21 follows step s 13 and involves moving the second electronic device to the third electronic device and creating a second near field communication path by means of the second near field communication chip and the third near field communication chip of the third electronic device . step s 22 involves sending the communication packet to the third electronic device by the second near field communication path . step s 23 involves analyzing the communication packet by the third electronic device to fetch and send the communication setup file to the third far field communication chip . step s 24 involves creating a second far field communication path between the third far field communication chip and the first far field communication chip according to the communication setup file . for example , the second far field communication path is the internet . referring to fig3 , there is shown a schematic block diagram of a smart automatic communication system according to the first embodiment of the present invention . as shown in fig3 , a smart automatic communication system 10 comprises a first electronic device 12 and a second electronic device 14 . for example , the first electronic device 12 and the second electronic device 14 are exemplified by a smart mobile device , a tablet computer , or a notebook computer . the first electronic device 12 has a first processing unit 122 , a first near field communication chip 124 , and a first far field communication chip 126 . the first processing unit 122 connects the first near field communication chip 124 and the first far field communication chip 126 . the first processing unit 122 generates a communication packet cp . the communication packet cp is sent from the first near field communication chip 124 of the first electronic device 12 . a communication setup file csf of the first far field communication chip 126 is packaged in the communication packet cp . the second electronic device 14 has a second near field communication chip 142 , a second processing unit 144 , and a second far field communication chip 146 . if the distance between the first electronic device 12 and the second electronic device 14 does not exceed ( for example , when the distance is shorter than or equal to ) a distance d 1 ( for example , when the distance is shorter than 10 centimeters or shorter than 10 meters ), the first near field communication chip 124 will trigger the second near field communication chip 142 to create a first near field communication path fnfcp . the second processing unit 144 connects the second near field communication chip 142 and the second far field communication chip 146 . the second near field communication chip 142 enables the second electronic device 14 and the first electronic device 12 to connect with each other and thereby receive the communication packet cp . the second processing unit 144 analyzes the communication packet cp to obtain the communication setup file csf . the second far field communication chip 146 and the first far field communication chip 126 form a first far field communication path fffcp therebetween according to the communication setup file csf . the first near field communication chip 124 and the second near field communication chip 142 comply with a near field communication protocol or a bluetooth communication protocol . the first near field communication chip 124 and the second near field communication chip 142 perform near field communication under the same communication protocol . furthermore , the first far field communication chip 126 and the second far field communication chip 146 comply with at least one of a bluetooth communication protocol , a wi - fi communication protocol , and a wireless universal serial bus protocol . referring to fig4 , there is shown a schematic block diagram of the smart automatic communication system according to the second embodiment of the present invention . as shown in fig4 , a smart automatic communication system 10 ′ not only comprises the first electronic device 12 and the second electronic device 14 which are shown in fig3 , but also comprises a third electronic device 16 . the third electronic device 16 has a third processing unit 162 , a third near field communication chip 164 and a third far field communication chip 166 . if the distance between the second electronic device 14 and the third electronic device 16 does not exceed a distance d 2 ( for example , when the distance is shorter than 10 centimeters or 10 meters ), the second near field communication chip 142 will trigger the third near field communication chip 164 for creating a second near field communication path snfcp . the third processing unit 162 connects the third near field communication chip 164 and the third far field communication chip 166 . the third electronic device 16 is connected to the second electronic device 14 through the third near field communication chip 164 , so as to receive the communication packet cp received by the second processing unit 144 . furthermore , the third processing unit 162 analyzes the communication packet cp so as to obtain the communication setup file csf . a second far field communication path sffcp is formed between the third far field communication chip 162 and the first far field communication chip 126 according to the communication setup file csf . for example , the second far field communication path sffcp is the internet . referring to fig5 , there is shown a schematic block diagram of a smart automatic communication system according to the third embodiment of the present invention . as shown in fig5 , a smart automatic communication system 10 ″ comprises the first electronic device 12 and a second electronic device 14 ′. the first electronic device 12 shown in fig5 is identical to the first electronic device 12 depicted in fig3 and thus is not reiterated hereunder for the sake of brevity . the second electronic device 14 ′ has the second near field communication chip 142 , the second processing unit 144 , the second far field communication chip 146 , and a first image projecting unit 148 . the first image projecting unit 148 projects projected data pd , which is generated from the second processing unit 144 , to a carrier ( not shown ). data da related to the first electronic device 12 and fetched from the first far field communication path fffcp is converted into the projected data pd by the second processing unit 144 . referring to fig6 , there is shown a schematic block diagram of the smart automatic communication system according to the fourth embodiment of the present invention . as shown in fig6 , a smart automatic communication system 10 ″′ not only comprises the first electronic device 12 and the second electronic device 14 ′ in fig5 , but also comprises a third electronic device 16 of a second image projecting unit 168 . projected data pd generated from the third processing unit 162 is projected to a carrier by the second image projecting unit 168 . data da related to the first electronic device 12 and fetched from the second far field communication path sffcp is converted into the projected data pd by the third processing unit 162 . the present invention is disclosed above by preferred embodiments . however , persons skilled in the art should understand that the preferred embodiments are illustrative of the present invention only , but should not be interpreted as restrictive of the scope of the present invention . hence , all equivalent modifications and replacements made to the aforesaid embodiments should fall within the scope of the present invention . accordingly , the legal protection for the present invention should be defined by the appended claims .