the conductor tracks 3 which in their totality represent the circuit are located on a support film 2 ( fig1 ). they have been cut out of a foil of conductive material , in general aluminum or copper . the thickness s of this metal foil and hence that of the conductor tracks 3 is , for example for resonance labels , 50 to 60 μm . the film 2 which carries the conductor tracks 3 and , depending on the intended use , may be a plastic film , for example coated with a heat - sealing coat , or an adhesive layer or a varnish layer alone , then has a thickness t of only 15 to 20 μm . fig1 a shows the detail i from fig1 where the embodiment of the conductor tracks 3 is shown on a magnified scale . since punching tools of a punching press are used for cutting out the conductor tracks 3 from the metal foil , as described in more detail below with reference to the process for the production of the circuit arrangement according to the invention , a projection , the so - called stamping burr 6 , is formed at the edge between the cut borders 4 of the conductor tracks 3 and their surface 5 . fig2 shows , in a schematic manner , the process for the production of a circuit arrangement 1 according to the invention . metal foil 9 and stamping substrate 10 are brought into contact with one another in the form of tapes by means of rolls 7 and 8 , respectively , via guide rolls 11 , and are passed through a punch 12 , the forward movement taking place stepwise in accordance with the operating cycle of the punch 12 and the register of the desired circuit arrangement . the stamping substrate 10 is coated with a heat - sealing coat 26 on its side facing the metal foil 9 ; it may consist of a very wide range of very economical materials , such as , for example , cheap packaging paper . it is also possible for the metal foil 9 to be coated with the heat - sealing coat ( not shown ). the punching tools 13 of the punch 12 are then pressed onto metal foil 9 and stamping substrate 10 . the projecting punching tools 13 , which have been heated to a temperature of about 120 to 160 ° c ., if necessary up to 250 ° c ., have an approximately concave cross - section . the surfaces facing the metal foil 9 are curved inwardly , away from the metal foil , and the tools further have substantially straight lateral surfaces , thereby defining sharp punching edges as shown in fig2 . the metal foil 9 can be coated with an antifriction coat on its side facing the punching tools 13 , in order thus to promote the cutting process . the metal foil 9 is cut through and is pressed into the stamping substrate 10 at the points determined by the shape of the punching tools 13 . as a result of the heating , the heat - sealing coat is activated ; the cut parts of the metal foil 9 which have been pressed into the stamping substrate 10 are thus firmly bonded to the stamping substrate 10 . the tool height h , i . e . the internal height of the voids 27 formed by the punching tools 13 , should be chosen so that it is greater than a value defined by the sum of the thickness s of the metal foil 9 and the indentation depth e ( fig2 a ) determined by the compressibility of the stamping substrate 10 . only then is it ensured that the metal foil parts 16 which represent the positive circuit and hence finally the conductor tracks 3 , and which are located between the cut , pressed - in metal foil parts 15 forming the negative circuits are satisfactorily separated from the metal foil parts 15 and do not adhere firmly to the stamping substrate 10 . the positive circuit 16 is subjected to a certain contact pressure only at the cut borders 4 and is thus also heated . thus , it will adhere only in these border regions to the stamping substrate 10 coated with heat - sealing coat but will only make light contact in the other regions . however , since this heat - sealing coat is applied , for example , in the form of a screen to the stamping substrate 10 or to the metal foil 9 , the positive circuit 16 will adhere to the stamping substrate 10 only at certain spots , which is sufficient to hold it firmly to the stamping substrate 10 for the further process steps . the transfer process is also simplified . the stamping burr 6 formed during the stamping process can also be seen in fig2 a . then a support film 2 supplied via a roll 18 is pressed , by means of guide rolls 17 and 25 , onto the stamping substrate 10 having the firmly pressed - in negative circuit parts 15 of the metal foil and having the positive circuit 16 on top . fig2 shows , only schematically , the stamping substrate 10 carrying the positive circuit 16 and having the pressed - in negative circuit 15 . fig2 a therefore shows a detail of this arrangement on a larger scale . this support film 2 is coated with an adhesive layer 28 , which may be , for example , a pressure - activatable adhesive . if a heat - sealing coat is used , the roll 17 guiding the support film 2a is preferably heated and activates the adhesive . thus , the positive circuit 16 , which adheres relatively weakly ( because it does so only in certain border regions ) to the stamping substrate 10 , is lifted off the latter and transferred to the support film 2 . a condition for this is that the adhesive force of the adhesive with which the support film 2 is coated is greater than that of the adhesive with which the stamping substrate 10 or the metal foil 9 is coated . since the metal foil parts 15 which constitute the negative circuit are embedded in the stamping substrate 10 , they cannot also be transferred to the support film 2 in this process . the stamping substrate 10 having the pressed - in negative circuit 15 can be fed via a roll 19 of a means for recovering the pressed - in metal foil parts . if the support film 2 is self - adhesive , it can be mounted on the roll 18 , advantageously with release paper 30 , which is then removed when the support film 2 is unrolled by means of a roll 29 . the support film 2 holding the positive circuit 16 can therefore be chosen completely at will , this applying both to its thickness and to its material , provided that the support film 2 can be rendered capable of adhesion . during the transfer process , it remains essentially flat and is not pressed , bent , warped or distorted , not even partially . instead of the stamping process described above , an analogous embossing process may be provided . in this case , instead of the punching tools , heatable embossing dies then constitute the block for the conductor tracks . punching tools or embossing dies may preferably also be arranged on cylinders ; in this case , the stamping process and the embossing process take place in rotation . fig3 shows schematically the individual layers from which a resonance label 20 produced by the process according to the invention is composed . for this purpose , at least one conductor coil and at least one capacitor plate should be provided in a layer 22 and at least one second capacitor plate in a layer 24 , a dielectric layer 23 being present between these two conducting layers 22 and 24 . the induction coil and capacitor together define the oscillating circuit . the special form produced by the shape of the punching tool together with the dielectric layer 23 , determines the electrical properties of the resonance label 20 . the label 21 is , for example , printable paper , with which any labels are provided . for reasons of deactivation , the dielectric layer 23 should be made as thin as possible in order to allow the energy required for reliable deactivation to be kept as small as possible . if , however , a resonance label 20 is produced by the process according to the invention , one or both conducting layers 22 , 24 can be transferred to the dielectric layer 23 in the manner described above , and this dielectric layer 23 may then preferably be in the form of an adhesive or varnish layer , for example covered on both sides with release paper and provided on a roll , which adhesive or varnish layer lifts the particular conductor tracks from correspondingly embossed stamping substrates in succession on its two sides . however , a layer 21 intended for covering , or for providing text on , the resonance label 20 may be used in an analogous manner as a support film , which may be , for example , paper or plastic , for a conducting layer 22 or 24 . the structure of the resonance label 20 then corresponds to the two circuit arrangements according to the invention , connected to one another .