[ 0033 ] fig1 shows a partial view of an integrated circuit ( ic ) 11 having a void 12 formed between adjacent wiring lines 14 , 16 . the wiring lines 14 , 16 are conductively coupled to respective portions of a semiconductor substrate 18 . the substrate 18 includes various n - type and p - type doped regions interconnected by wiring lines , such as lines 14 , 16 . the interconnected substrate regions define desired semiconductor devices . the wiring lines are formed by one or more layers , including a barrier layer and a metal conductive layer . the barrier layer serves to prevent metal penetration into the substrate 18 during the formation processes . the conductive layer couples a local area of the substrate ( e . g ., doped or not doped area ) to another area ( not shown ) or another layer 20 . the spacing between adjacent wiring lines is occupied by fill material 22 , 24 or is a void 12 . [ 0034 ] fig2 shows a partial view of an integrated circuit ( ic ) 30 having a void 32 formed between adjacent wiring lines 34 , 36 according to an alternative embodiment of this invention . the wiring lines 34 , 36 are conductively coupled to respective portions of a semiconductor substrate 38 . the substrate 38 , like substrate 18 , includes various n - type and p - type doped regions interconnected by wiring lines . the interconnected substrate regions define desired semiconductor devices . the wiring lines couple a local area of the substrate ( e . g ., doped or not doped area ) to another area ( not shown ) or layer 40 . the spacing between adjacent wiring lines are occupied by fill material 42 and the void 32 . in the embodiment shown , vias 44 are formed through the fill material 42 and filled with conductive material to respectively couple the wiring lines 34 , 36 to an adjacent layer 40 . for the various ic embodiments , a void 12 / 32 in the spacing between adjacent wiring lines serves to reduce rc coupling of the lines . rc coupling is reduced by reducing the dielectric constant in the spacing . specifically , because the dielectric constant of the void ( e . g ., approximately 1 . 0 ) is less than the dielectric constant of conventional fill materials ( e . g ., approximately 3 . 0 ), the dielectric constant in the spacing between lines is reduced . following are descriptions of alternative methods for controllably - defining the voids 12 , 32 . referring to fig3 an integrated circuit 10 having integral devices ( not shown ) and wiring lines 14 , 16 formed by known processes receives hollow spheres 50 . as seen in fig4 the spheres 50 have an inner diameter 52 , outer diameter 54 and wall thickness 56 of known dimensions . in a preferred embodiment , the sphere walls 58 are formed of silica . for a given embodiment , each sphere 50 has the same dimensions . preferably , the line height and the line spacing is a multiple of the sphere outer diameter . alternatively , the sphere outer diameter is slightly less than a value which makes the spacing or height a multiple of the outer diameter . although the outer diameter of each sphere 50 is substantially the same for a given embodiment , the outer diameter varies for different embodiments . the outer diameter varies among different embodiments from a value greater 1 . 0 microns to a value less than 0 . 5 microns . spheres as small as 0 . 1 microns in outer diameter are achievable . the spheres 50 are of sufficient rigidity to withstand the mechanical stresses occurring in fabricating an integrated circuit . in one embodiment , the ratio of outer diameter to wall thickness is approximately 10 : 1 , although greater or lesser ratios are used in other embodiments . at one step , the spheres 50 , together with a binder material and / or dispersion chemical , are applied to the substrate 18 using a spinning process or a monolayer formation process . an exemplary binder material is methyl isobutyl ketone (“ mibk ”). the function of the binder is to hold the spheres in place relative to the wiring lines 14 , 16 and substrate 18 . exemplary dispersion chemicals include polyethylene oxide or a silanol compound . the function of the dispersion chemicals is to disperse the spheres into the line spacings and over the wiring lines and substrate . a film 60 , formed by the spheres 50 , binder material and / or dispersion chemical accumulates on the substrate 18 and wiring lines 14 , 16 as shown in fig5 . at another step , the substrate is planarized . a chemical - mechanical polishing (“ cmp ”) or other planarizing device 59 removes the film 60 from the tops of the wiring lines 14 , 16 as shown in fig6 . in one embodiment , the wiring lines 14 , 16 have a height relative to the substrate 18 surface which is a multiple of the sphere 50 outer diameter 54 . for minor variations of height to outer diameter , the wiring lines 14 , 16 are planed back to be a multiple of sphere 50 outer diameter 54 . for areas 62 not to be filled with the film 60 , an etching process is used to remove the film 60 ( see fig6 ). [ 0042 ] fig6 shows two preferred relations between wiring line 14 , 16 height and wiring line spacing . in one region 64 , the wiring line height equals the wiring line spacing . in another region 66 , the wiring line spacing is a multiple ( e . g ., 2 ) of the wiring line height . preferably , the ratio of the longer of the height and spacing to the shorter of height and spacing is an integer , ( i . e ., either the spacing is a multiple of the height or the height is a multiple of the spacing ). fig7 shows the height being a multiple of the spacing . for the best mode of the invention , spheres are applied which have an outer diameter substantially equal to ( or slightly smaller than ) either one or both of the line height or the line spacing . in other embodiments , either one or both of the height and spacing are multiples of the sphere outer diameter . preferably , both the line height and line spacing are not a multiple greater than 1 relative to the sphere outer diameter . in alternative embodiments , either a dielectric or a plasma oxide layer is applied over the wiring lines 14 , 16 and spheres 50 . for dielectric layer 68 , low temperature dielectric reflow is deposited on the wiring lines 14 , 16 and spheres 50 . reflow improves filling of high aspect - ratio contacts and via openings . preferably , the deposition process occurs at a temperature high enough to bake off the binder material , but low enough not to alter the structural integrity of the spheres 50 . more specifically , one does not want to collapse or puncture the spheres 50 during the dielectric reflow deposition step . in one embodiment , binder material capable of withstanding temperatures up to a desired temperature ( e . g ., 200 degrees c .) are used . above the desired temperature , the binder breaks down and flows out as a vapor , but leaving the spheres in place and intact . alternatively , for a plasma oxide layer 70 , plasma oxide is deposited over the wiring lines 14 , 16 and the spheres 50 . preferably , the process occurs at a temperature sufficient to bake off the binder material , while leaving the spheres in place and intact . further semiconductor processes then occur to fabricate another device level or area of the substrate 18 . void defined by controlled deposition referring to fig9 a semiconductor substrate 38 has integral devices ( not shown ) formed by known processes . metal stacks 72 , 73 are formed to define wiring lines 34 , 36 , 74 , 76 . according to alternative embodiments , the stack cross - section appears as a “ t ” ( e . g ., stack 72 ) or an “ i ” shape ( e . g ., stack 73 ). of significance is the “ t - top ” in each embodiment . by depositing a dielectric layer , the t - tops of adjacent wiring lines grow toward each other sealing off a void between adjacent wiring lines ( see fig2 ). referring to fig1 , each metal stack includes a barrier layer 78 , a conductive layer 80 and a top layer 82 . a common material for an exemplary barrier layer 78 is titanium , although other elements and alloys are used , ( e . g ., titanium nitride , titanium tungsten , tantalum nitride ). a common material for an exemplary middle layer 80 is aluminum , although other elements and alloys also can be used , ( e . g ., copper , gold ). a common material for an upper layer 82 is titanium nitride , although other materials and alloys are used , ( e . g ., titanium tungsten , titanium , titanium aluminide , tantalum nitride ). in one embodiment , the three layers are deposited , then etched , using a reactive ion etching ( rie ) process to achieve a straight metal stack . for an “ i ” stack 73 , the conductive middle layer 80 is etched using a wet dip process to achieve the “ i ” configuration . for a “ t ” stack 72 , both the conductive middle layer 80 and the barrier layer 78 are etched using a wet dip process to achieve the t - top configuration . alternatively , the barrier layer 78 and middle layer 80 are formed to desired shape by an rie process . an isotropic overetch then is performed to achieve the “ t - top ” for either the “ t ” stack 72 or “ i ” stack 73 . for each stack 72 , 73 configuration , the length of undercut 84 is prescribed based upon a desired line resistance , the desired line spacing between adjacent stacks 72 and / or 73 and the size of void desired between adjacent wiring lines 34 / 36 / 74 / 76 . with the stacks formed at desired locations with desired dimensions ( e . g ., line height , pitch , undercut ) and desired line spacings , dielectric material 86 is deposited using a cvd or other deposition process . exemplary dielectric materials include teos , polyamide , si 3 n 4 , sog , phosphosilicate glass , and boro - phosphosilicate glass . the dielectric material 86 accumulates on the wiring lines 34 , 36 , 74 , 76 and substrate 38 , as shown in fig1 . as the deposition process continues , the dielectric material accumulating at adjacent “ t - tops ” seals off an area between the adjacent lines . such sealed off area is the desired void 32 ( see fig2 and 12 ). the deposition process continues for a prescribed time or a prescribed thickness of dielectric material accumulates above the wiring lines 34 , 36 , 74 , 76 . thereafter , the substrate is subjected to a chemical - mechanical polishing process or other planarizing process to achieve a dielectric layer of desired thickness , ( see fig1 ). for embodiments in which vias 44 ( see fig2 ) are desired , a plasma enhanced chemical vapor deposition of a nitride compound is deposited ( e . g ., approximately 100 angstroms ) prior to dielectric deposition to serve as an etch - stop layer . as seen in fig1 and 13 , the formation of the voids 32 is controlled for a given line spacing by ( i ) appropriately defining the wiring line height 83 and under cut 84 and ( ii ) controlling the deposition process ( see fig1 ). as a result , the voids 32 occur with known size and shape . voids 32 formed between adjacent “ t ” stacks are generally uniform in size and shape . similarly , voids 32 formed between adjacent “ i ” stacks are generally uniform in size and shape . the length of each void 32 is determined by the wiring line length of adjacent wiring lines 34 , 36 , 74 , 76 . [ 0052 ] fig1 depicts a cross - sectional top view along line 90 in fig1 , illustrating that the length of each void 32 corresponds with the length of adjacent wiring lines 34 , 36 , 74 and 76 . the voids 32 have a dielectric constant of approximately 1 . 0 . the surrounding dielectric material 86 has a higher dielectric value ( e . g ., teos has a dielectric constant of 3 . 0 , high density plasma oxides have a dielectric constant of 2 . 4 - 2 . 7 ). the net effect of the void is to lower the dielectric constant across the line spacing and thereby reduce rc coupling between adjacent lines . further semiconductor processes also occur after void formation to fabricate additional devices , levels or other area of the substrate 38 . according to one advantage of the invention , the void in the spacing between adjacent wiring lines reduces rc coupling of the lines . rc coupling is reduced by reducing the dielectric constant in the spacing . specifically , because the dielectric constant of the void ( e . g ., approximately 1 . 0 ) is less than the dielectric constant of conventional fill materials ( e . g ., approximately 3 . 0 ), the dielectric constant in the spacing between lines is reduced . according to another advantage , the reduced dielectric is achieved for conventional or reduced line spacings . although a preferred embodiment of the invention has been illustrated and described , various alternatives , modifications and equivalents may be used . therefore , the foregoing description should not be taken as limiting the scope of the inventions which are defined by the appended claims .