[ 0014 ] fig4 a - b provides an illustration describing the attachment of a magnetic head 402 to a suspension ( hga ) 404 with electrically conductive anisotropic conductive paste ( acp ) 401 under principles of the present invention . as is shown in fig4 a , in one embodiment a magnetic head 402 is secured to the suspension 404 by ultraviolet acp ( acp ) 401 . in an embodiment , a suspension barrier 409 is utilized to maintain proper directional orientation while the acp is curing . the barrier 409 prevents the head 402 from tilting , etc . in relation to the suspension 404 while the adhesive 410 is still soft . as is shown in fig4 b , in an embodiment the conductive particles 405 of the acp 406 are much larger than the silver particles . in one embodiment , the conductive particles 405 are made of a polymer coated in gold . in an alternative embodiment , the particles 405 are made of a metal , such as nickel , etc ., coated in gold . in one embodiment , the adhesive material in which the particles are suspended is acrylate . in an alternative embodiment , the adhesive material is epoxy resin . the conductive particles 405 are large enough for each particle 405 to touch the head 402 and the suspension 404 simultaneously . thus , the particles 405 must be at least as large in diameter as the depth of the tongue barrier 409 . ( see fig4 a ). because each conductive path through the acp 406 is just through a single particle 405 , resistance is greatly reduced . [ 0016 ] fig5 a - b illustrates acp attachment of magnetic head 502 to suspension 504 with and without a suspension barrier 504 under principles of the present invention . in an embodiment , acp 501 with large conductive particles 503 is utilized with a suspension barrier 509 . as stated , in an embodiment the conductive particles 503 are larger than the suspension barrier 509 in depth ( to enable particle 503 contact with head 502 and suspension 504 simultaneously ). as seen in fig5 b , in an alternative embodiment a suspension barrier 509 is not utilized . because a suspension barrier is 15 to 25 micrometers ( um ) in depth , without a suspension barrier , the conductive particles 513 can be smaller than this when a barrier is not utilized ( reduced bondline gap ). [ 0018 ] fig6 a - b illustrates the ‘ dual cure ’ process for acp 608 under principles of the present invention . as seen in fig6 a , in one embodiment , ultraviolet ( uv ) light 609 is directed upon the acp 608 to cure the exposed surface of the acp material 608 . this is done to provide a preliminary cure , affixing the head 602 to the suspension 604 , to maintain directional orientation of the head 602 . in an alternate embodiment , a ( non - conductive ) uv adhesive ( not shown ), such as uv acrylate or uv epoxy , is utilized additionally for pre - tacking ( to shorten the fixture time ). as seen in fig6 b , in an embodiment the uv process is followed by a thermal cure ( via a heater 611 ). in this , the acp is fully cured , bringing its bond to full strength . although several embodiments are specifically illustrated and described herein , it will be appreciated that modifications and variations of the present invention are covered by the above teachings and within the purview of the appended claims without departing from the spirit and intended scope of the invention .