fig3 shows an embodiment of an interface tower 300 as an example of a ta - interface according to the invention . the interface tower 300 is depicted in fig3 in the same way as the interface tower 50 in fig1 so that the shown upper side of the interface tower 300 is intended to be contacted with the dut board 30 , while the lower side is intended to be contacted with the probe card 20 . the interface tower 300 according to the invention can be provided fully compatible with the interface tower 50 as shown in fig1 so that the interface tower 300 can be applied in the same way as shown by and described for fig1 . the interface tower 300 comprises a frame 305 with a plurality of recesses 310 i ( with i = a , b , c , . . . ), each one adapted to receive a respective segment 320 i ( with i = a , b , c , . . .). in the - embodiment of fig3 the interface tower 300 comprises eight recesses 320 a . . . 320 h , each filled with a respective segment 320 a . . . 320 h . in the explosive view of fig3 the segments 320 a and 320 d are represented spaced off from - the interface tower 300 . as further apparent from fig3 segments 320 a , 320 b , 320 e and 320 f are embodied as blank or dummy segments bearing no electrical contacts , while segments 320 c , 320 d , 320 g and 320 h are embodied as segments with a plurality of electrical contacts for establishing an electrical contact between respective contacts of the dut board 30 and the probe card 20 . each segment 320 i can be fixed to the frame 305 of the interface tower 300 e . g . by means of screws 330 . for that purpose , each segment 320 i is provided on its upper side with a flange 340 i laterally extending over a body 350 i to be inserted into the respective recess 310 i . each flange 340 i comprises holes 360 . for fixing the segment 320 i to the frame 305 , the screws 330 are inserted into the holes 360 and screwed to the frame 305 . on its upper side , the interface tower 300 further comprises rods 370 for adjusting and fixing the interface tower 300 to the dut - boards 30 ( cf . fig1 ). the arrangement of the signal paths 120 and the ground contacts 130 in the segments 320 i is preferably provided in the same way as depicted in fig2 b . each ground contact 120 contacts directly with the solid core of the body 350 i . preferably , the body 350 i , at least for the segments 320 i with electrical contacts 120 and 130 , is provided by a solid aluminum core . in a preferred embodiment , each segment 320 i is electrically insulated from the frame 305 and / or other segments 320 i . for that purpose , an insulating layer 400 ( preferably an epoxy layer ) is arranged between the flanges 340 i of the segments 320 i and the upper side of the frame 305 . between side walls 410 i around each segment 320 i and inner walls 420 i of each recess 310 i , an insulation might be provided e . g . by a coating over the outside walls 410 i and / or the outside walls 420 i of the frame 305 . alternatively or in addition thereto , an air gap ( e . g . 0 . 5 mm ) might be provided between the outside walls 410 i and 420 i of the segments 320 i and the recesses 310 i . further insulation might be provided with respect of the mechanical fixing of the segments 320 i to the frame 305 . preferably the head of the screws 330 will only come in contact with an insulating layer 500 i ( preferably an epoxy layer ) provided on the top side of each segment 320 i ( cf . in particular fig2 b ), while the bodies of the screws 330 are spaced apart from the flange 340 i , so that no electrical contact will be provided by the screws 330 between the segments 320 i and the frame 305 . in the embodiment of fig3 all segments 320 i preferably have the same mechanical dimensions , but are capable of taking over different tasks . this allows configuring the interface tower 300 in accordance with the special applications . the interface tower 300 can e . g . be split into analog and digital areas comprised of one or more of the segments 320 i , whereby each area can have its own electrical ground condition . the segments 320 i can be designed for different pin - counts and different performance requirements . thus , the user of the test system will be able to upgrade the interface tower 300 when the pin count of the test system increases or if higher performance is required . mechanical and electrical contact between the interface tower 300 and the dut board 30 as well as between the interface tower 300 and the probe card 20 is generally provided by mechanically pressing the components against each other . contact might be provided manually e . g . using locking means such as screws , semi - automatically e . g . using bayonet slide locks or lever systems , or automatically e . g . using automatic loading mechanisms of the prober 10 and / or the tester 25 .