the appended drawings will be used to clearly disclose the technical characteristics of the present invention . fig2 ( a ) is a lithographic apparatus according to an embodiment of the present invention . when an mpw reticle 201 is being fabricated , it is additionally provided with fine alignment marks for some projects on the reserved regions where a diamond blade will be applied , for example , fine alignment marks 203 m and 204 m on the reserved regions used for wafer sawing . the fine alignment marks are used to align the patterns to be exposed with the patterns already formed on the wafer , so as to achieve the fine alignment of the layout patterns to be fabricated . first , the layout patterns of the chips to be fabricated are selected with reference to the floorplan of the mpw reticle 201 . in the present embodiment , the chips 203 and 204 are selected to get exposure . the neighboring sides 203 h and 204 h of chips 203 and 204 have the same length and their bottom y coordinates are the same . moreover , the chips 203 and 204 share sawing lines 209 and 210 . a wafer lithographic shielding mask 202 for selecting the exposure regions of the mpw reticle 201 is disposed on the light transmission path from a lithographic light source 217 to a wafer 219 and is placed between the mpw reticle 201 and a lithographic light source 217 . when fabricating the wafer lithographic shielding mask 202 for selecting the exposure regions of the mpw reticle 201 , a transparent region 216 must at least allow the light beam from the lithographic light source 217 being irradiated over the chips 203 and 204 to perform exposure . the dashed lines on the surface of the reticle 201 are virtual sawing lines ( sawing lines 209 , 210 ), which indicate the possible sawing positions after wafers are fabricated . the transparent regions 214 and 215 are used for alignment such that the reticle alignment marks 211 and 212 on the mpw reticle can align with the stepper through the transparent regions 214 and 215 . then , the stepper moves a wafer 219 to a site yet to be exposed . when the aligning task is completed , the shutter ( not shown ) is opened such that the light beam from the lithographic light source 217 traveling through the wafer lithographic shielding mask 202 , the mpw reticle 201 , and a projection lens 218 is projected on the photoresist layer 220 of the wafer 219 . after a period of exposure , the shutter is closed and the wafer 219 is moved to the next site to be exposed . this process is repeated until all sites allowed to expose are exhausted . in fig2 ( a ), the stepping method on the wafer 219 is only one type of methods , which can be replaced by other stepping method , as long as the exposed regions can make the wafer produce more dice . the commonly used steppers are divided into two types , namely step - and - repeat aligners and step - and - scan systems . the former is taken as an example in the present embodiment , and the latter can also be used . if the latter is used , the scanning only needs to be performed over the area at least comprising the transparent region 216 on the wafer lithographic shielding mask 202 instead of the whole wafer lithographic shielding mask . moreover , the commonly used lithographic light source 217 is a mercury arc lamp for generating an exposure light beam such as a g - line with a wavelength of 436 nm , an h - line with a wavelength of 405 nm , and an i - line with a wavelength of 365 nm . also , the lithographic light source 217 can be an excimer laser such as a krf excimer laser with a wavelength of 248 nm , an arf excimer laser with a wavelength of 193 nm , and an f2 excimer laser with a wavelength of 157 nm . then , the exposed photoresist layer 220 of the wafer 219 is developed , and the photoresist at the exposed regions is removed . basically , the photoresist development uses a chemical developer solution to dissolve the photoresist at the exposed regions . the regions not covered by the photoresist layer 220 on the developed wafer 219 are etched in a manner of dry etching , wet etching , or both . finally , the photoresist layer 220 on the wafer 219 is removed , i . e ., the so - called photoresist removal step , so as to remove the photoresist layer which is now useless . photoresist removal methods are mainly divided into two types , namely wet stripping and dry stripping . the wet stripping uses organic solutions or inorganic solutions to destroy the structure of the photoresist . the dry stripping uses plasma to remove the photoresist . generally , the above two methods are used together to completely remove the photoresist layer and avoid leaving residual substances after the plasma etching . fig2 ( b ) is a device for lithographic process according to another embodiment of the present invention . when an mpw reticle 201 is being fabricated , it is additionally provided with fine alignment marks for some projects on the reserved regions where a diamond blade will be applied , for example , fine alignment marks 203 m and 205 m on the reserved regions used for wafer sawing . the 15 fine alignment marks are used to align the patterns to be exposed with the patterns already formed on the wafer , so as to achieve the fine alignment of the layout patterns to be fabricated . first , the layout patterns of the chips to be fabricated are selected with reference to the floorplan of the mpw reticle 201 in fig2 ( b ). in the present embodiment , the chips 203 and 205 are selected to get exposure . the chips 203 and 205 are disposed diagonally adjacent to each other . one side 203 w of the chip 203 has the same length as one side 205 w of the chip 205 , and both chips 203 and 205 share the sawing lines 209 and 210 . a wafer lithographic shielding mask 233 for selecting the exposure regions of the mpw reticle 201 is disposed on the light transmission path from a lithographic light source 217 to a wafer 219 and is placed between the mpw reticle 201 and the wafer 219 . when the wafer lithographic shielding mask 233 is fabricated , the transparent regions 221 and 222 must be at least capable of selecting the chips 203 and 205 on the mpw reticle 201 to get exposure . in the present embodiment , the shape and position of the wafer lithographic shielding mask 233 for selecting the exposure regions of the mpw reticle 201 do not affect the operation of the alignment system that uses the alignment marks on the mpw reticle 201 . then , the stepper moves a wafer 219 to a site yet to be exposed . when the aligning task is completed , the shutter ( not shown ) is opened such that the light beam from the lithographic light source 217 traveling through the mpw reticle 201 , wafer lithographic shielding mask 233 , and a projection lens 218 is projected on the photoresist layer 220 of the wafer 219 . after a period of exposure , the shutter is closed and the wafer 219 is moved to the next site to be exposed . this process is repeated until all sites allowed to expose are exhausted . similarly , the stepping method shown in fig2 ( b ) can be replaced by other stepping methods . for example , if a step - and - scan system is adopted , the scanning only needs to be performed over the area at least comprising the transparent regions 221 and 222 on the wafer lithographic shielding mask 233 instead of the whole wafer lithographic shielding mask . according to the above embodiments , after the fabrication of the wafer is complete , all the dice on the wafer can be completely sawed out without destroying a die . moreover , because only the desired chips are fabricated , the waste of the wafer is greatly reduced . the present invention can also select the chips 203 , 205 and 206 in fig2 ( b ) to be exposed at the same time . the sawing line along the right edge of the dice fabricated for the chip 206 may cause damage to the dice fabricated for the chip 203 in the same exposure region . similarly , the dice fabricated for the chip 206 may not be properly packaged when the dice fabricated for the chip 203 are selected to be sawed out . however , the dices fabricated for the chip 203 and the dice fabricated for the chip 206 in different exposure regions on the same wafer can be sawed out from the wafer . since only desirable chips are fabricated , the wafer production cost is reduced considerably . the above - described embodiments of the present invention are intended to be illustrative only . numerous alternative embodiments may be devised by those skilled in the art without departing from the scope of the following claims .