the figure illustrates a block diagram illustration of a layout of components on a wafer or a corresponding hall sensor configured in such a way that a metering current may be applied to check individual components , and especially the components of a signal pathway with respect to their electrical resistance r . from the electrical resistance the quality of the investigated segment can be determined , without having to apply an external magnetic field . one application which is advantageous is integrated hall sensors with evaluation circuits . a portion of a wafer 10 is shown for configuring an integrated circuit sensor . a reference current from a bias generator is input to a hall current generator 14 . thus , the currents are generated in the bias generator , which provides reference currents and reference voltages for practically all the analog circuits on the sensor . the hall current generator 14 outputs a hall current as a metering current ihall on a line 16 to a matrix switch 18 . the hall current generator 14 outputs via a preferably independent output an additional current ihall / 10 on a line 20 to a metering current tap ithall . the current switched in this way to the outside is a copy of the testing or metering currents ihall on the line 16 used internally , to avoid interference coupled in from the outside . the matrix switch 18 may be connected by a plurality of lines 22 to a hall plate 24 , and the terminals on the hall plate 24 preferably lie at its corners . with this matrix switch 18 , a hall plate current itmagn 1 produced by the hall current ihall on the line 16 can be switched in to enable a current flow in the 0 ° direction or 90 ° direction through the hall plate 24 . the matrix switch 18 may be used to switch the taps for picking off a hall voltage . preferably , switching in the 0 ° direction , 90 ° direction , 1800 direction and 270 ° direction relative to the applied hall plate current itmagn 1 , itmagn 2 or the picked - off hall voltage is made possible by the matrix switch 18 , to avoid a magnetic offset caused by mechanical stresses or non - ideal features of the hall plates . preferably , from each of the lines between the matrix switch 18 and the hall plate 24 a line branches off to a corresponding tap 28 ( e . g ., a four - pole tap ). these four taps allow for the provision of corresponding signals 0 to 3 , which are used to determine hall plate resistance r . depending on the settings of the matrix switch 18 ( i . e ., which two lines apply the hall plate current itmagn 1 , 2 to the hall plate 24 ) two of the four measuring taps 28 pick off the resulting generated hall plate voltage vtmagn 1 - vtmagn 2 . from the hall current ithall and the hall plate voltage vtmagn 1 - vtmagn 2 , one can now determine the hall plate resistance . advantageously , such a layout allows one to measure the hall plate 24 with two independent measurements in the vertical and horizontal direction relative to its resistance . the circuit layout may also have an analog - digital converter ( adc ) 30 , being connected to the matrix switch 18 , to convert the hall voltage into a proportional current . such an adc input offers advantages , but it is not necessary to realize the inventive technique of the present invention . during an additional test measurement , the impressed metering current itmagn 1 , 2 produces , on account of the resistance of the hall plate 24 , a voltage equivalent to the hall voltage , which through the adc 30 may stimulate the entire signal processing chain . in the case of disruptive magnetic fields present in the surroundings of the measurement layout , one may use differential measurements with different metering currents to calculate the impact of such existing magnetic fields . depending on the strength of the imposed or measured currents , it may be desirable to amplify or attenuate such currents for measurement purposes . determination of the resistance r is preferably performed by bringing to the outside a possibly scaled copy of the hall plate current itmagn 1 , 2 and the voltage drop vtmagn 1 , 2 across the hall plate 24 , this being configured , depending on the design , as a parallel measuring tap or serially across an individual connection pin as the measuring terminal . due to the resistance determined in one or more directions , one can determine the geometry of the hall plate 24 , as well as the resulting dopant concentration or , through this , the hall sensitivity of the hall plate 24 . fluctuations and errors in the geometry of the hall plate 24 , as well as fluctuations in the dopant concentration of the hall plate 24 , can therefore be detected by deviations of the resistance . the foregoing describes , in particular , the inspection of the hall plate 24 by determining its resistance . however , one may determine not just the electrical resistance of the hall plate 24 or , in a hierarchical arrangement with several hall plates 24 , the electrical resistance of a plurality of hall plates . it is especially advantageous to determine the electrical resistance not only of the hall plate 24 , but also the entire signal pathway , including the hall plates 24 and the matrix switch 18 , for which one uses , when determining the resistance , also and in particular the metering current ithall that can be picked off from the metering current tap . since test signals and the metering current ithall are also routed through the matrix switch 18 , this also is checked as part of the signal pathway . thus , a complete signal pathway ( e . g ., a hall sensor with evaluation circuit ) can be checked in its entirety by an electrical stimulation . the evaluation circuit in this case includes the structural elements on the wafer 10 , especially those downstream from the hall plate 24 . although the present invention has been illustrated and described with respect to several preferred embodiments thereof , various changes , omissions and additions to the form and detail thereof , may be made therein , without departing from the spirit and scope of the invention .