before describing in detail the particular method and apparatus related to a saw device for determining strain experienced by an object , it should be observed that the present invention resides primarily in a novel and non - obvious combination of elements and process steps . so as not to obscure the disclosure with details that will be readily apparent to those skilled in the art , certain conventional elements and steps have been presented with lesser detail , while the drawings and the specification describe in greater detail other elements and steps pertinent to understanding the invention . the following embodiments are not intended to define limits of the structure or method of the invention , but only to provide exemplary constructions . the embodiments are permissive rather than mandatory and illustrative rather than exhaustive . a system of the invention comprises k saw devices or saw sensors with one of the k devices illustrated in fig2 . each k th device further comprises , an idt 60 , and in one embodiment , five reflectors designated 65 , 66 , 67 , 68 and 69 . each i th gap of the k th saw device between two adjacent reflector electrodes is designated d k , i . note that there is no d k , 5 gap . each of the k saw sensors creates a reflected saw or echo at the same time and collectively the k saw sensors provide an indication of strain deformations in multiple directions . if strain deformation in only one direction is sought then a single saw sensor to measure that strain in that direction may suffice . preferably the temperature of the object experiencing the strain must be determined as deformation due to an applied force and deformation due to a temperature change cannot be distinguished . a technique for resolving this issue is described below . for each of the k devices , a first reflector 65 is located at a distance p k ( also referred to as a delay line distance ) from the idt 60 . each subsequent reflector of the reflector array effectively carries a + 1 or − 1 code that is related to a phase shift imposed on the echo signal at each reflector that is due to changes in the spacing d k , i between successive reflectors . the echo from the first reflector 65 is always defined as + 1 code that serves as a phase reference to allow defining the phase of the other reflector echos relative to the first reflector 65 . for instance the code shown in fig2 is + 1 , − 1 , − 1 , + 1 , + 1 due to the gap distance d k , i between each reflector pair . the change in gap distances between each reflector electrode is slight and may not be easily observed in fig2 . but generally , beginning with the reflector electrode 65 , the gap lengths are qualitatively considered as narrow , medium , wide , and medium . depending on the application , this approach can be referred to as code division multiple access , or cdma , since the coding is important for correlation properties , or it can be referred to as time division multiple access , or tdma , since the k devices occupy different time slots ( i . e . p k is selected such that if all k devices were visually overlapped none of the reflectors in any of the k devices would touch ). dimensions in such devices are typically referred to in saw wavelengths . for example , at 915 mhz for yz lithium niobate a saw wavelength is 3 . 8 micrometers . spacing between each of the reflector electrodes 65 - 69 varies by ± ¼ wavelength to achieve the + 1 , − 1 , − 1 , + 1 , + 1 code referred to above . the period of the electrode pair comprising the idt 60 is one wavelength . the impulse response length for each k th device is approximately 350 nanoseconds where the impulse length is from the leading edge of the echo from the first reflector electrode to the end of the response from the last reflector electrode . this length is the same for each k th sensor only the p k length changes for each k th sensor . to increase sensitivity to strain deformation this length can be increased by either adding additional reflectors in an array , adding additional reflector arrays or by increasing the separation between the five illustrated reflectors 65 , 66 , 67 , 68 , and 69 . although the saw sensor can be bonded to any surface of the object to determine strain , it has been found that to improve the predictability of the relationship between surface strain on the object and surface strain on the component - bearing side of the saw substrate , each of the k saw devices are disposed in a well , depression or cavity defined in a surface of the object . the saw substrate is affixed to the surfaces of said well using a stiff adhesive or solder , i . e ., a bonding material that will efficiently transfer deformations in the object to the saw substrate . disposing the substrate in the well allows for bonding of its bottom surface , side surfaces ( e . g ., the longer of the four surfaces that form the perimeter of the substrate ) and end surfaces ( e . g ., the shorter of the four surfaces that form the perimeter of the substrate ) to adjacent surfaces of the well . by comparison , when the bottom surface of the saw sensor is bonded to an upper surface of the object , the four sides of the substrate are not bonded or attached to anything and therefore all the strain in the object has to propagate up through the substrate to have any effect on the top surface and the propagation of the surface acoustic wave on that surface . this approach of bonding the saw sensor in a well is considered superior to bonding only the bottom surface of the sensor to the substrate as it provides more accurate strain measurements . fig3 illustrates one of the k saw devices mounted within a well 83 formed in an object 84 that experiences strain deformation . a top surface 88 a of a substrate 88 that carries the idt 60 and the reflector electrodes 65 - 69 ( shown collectively as a simple block in fig3 ) faces away from the object 84 and a bottom surface 88 b of the substrate 88 is bonded securely to a bottom surface 90 a of a well 90 using an adhesive 92 , such as solder or another adhesive that stiffens after curing . end and side surfaces of the substrate are also bonded to adjacent surfaces of the well 83 using the adhesive 92 . in lieu of the using the adhesive to bond the side and end surfaces to proximate surfaces of the well , a clip is disposed between the side and end surfaces and the well surfaces . fig3 also illustrates a cover 104 for the saw sensor . the cover 104 is attached to the object 84 with a soft and yielding adhesive 105 . an adhesive with these properties is desired to permit the object 84 to freely deform in response to applied forces , without being constrained by the cover 104 . as illustrated in fig3 it is preferred that the idt 60 and the reflector array 65 - 69 are aligned with a top surface 84 a of the object 84 . this arrangement ensures that the top surface 88 a of the substrate 88 is subjected to approximately the same strain deformation as the object 84 , resulting in a more accurate strain measurement . compression and tension forces applied to the object 84 cause strain deformation of the object . the strain deformation is transferred to the bottom surface 88 b of the substrate 88 and through the substrate to the top surface 88 a where the saw waves travel . thus the top surface 88 a of the saw substrate 88 expands and contracts proportionately with the expansion and contraction of the object &# 39 ; s bottom surface 90 a due to the application of the compression or tension forces . a length of arrowheads 100 indicates a magnitude of strain compression of the object 84 as a result of compression forces exerted on the object . a length of arrowheads 102 indicates a magnitude of compression of the substrate 88 . as can be seen by comparing the arrowhead lengths , the compression of the substrate 88 is proportional to but less than the compression of the object 84 due to the transfer of the compression forces through the body 84 , the bonding material 90 , and the substrate 88 to the idt 60 and the reflector array 65 - 69 . as described elsewhere herein , when the body 84 is at rest , i . e ., no compression or tension forces applied to it , there is strain deformation . compression forces compress the body 84 , the bonding material 90 and the substrate 88 as described above . tension forces , not shown , expand the body 84 , the bonding material 90 and the substrate 88 . fig5 illustrates a top view of a saw - based system for determining tension strain deformation due to the application of tension forces , as depicted by arrowheads 120 , on the object 84 . a saw substrate 122 defines a zig - zag pattern in its side surfaces 122 a and 122 b . thus the saw substrate differs from the saw substrate 88 , which defines flat surfaces . the zig - zag pattern side surfaces are more effective when measuring tension deformation than a flat side surface . while there are many different types of strain deformations as caused by different force vectors , they must each create some physical change in the object 84 , the substrate 80 and the saw components disposed on the top surface of each of the k saw devices in order to measure the resulting strain . effectively , the components of the k saw devices expand or contract proportionally to the expansion or contraction of the object 84 as it responds to applied tension and compression forces . because each of the k saw devices physically expands or contracts in response to forces applied to it , the time domain response of each saw device also expands or contracts the echo signals . using digital signal processing techniques , this time domain change can be detected and recorded , if desired . a database of system time domain responses ( or responses in a different domain ) to known strains can be created for use in determining the magnitude and type of strain that is being experienced by an object . to create the data base , the object 84 is subjected to various forces that produce strain deformations . the strain deformations are determined by techniques known to those skilled in the art and correlated with each time domain response of the system of k saw devices . thus a database of known strain deformations and associated time domain responses can be created . each one of those responses is stored in a dsp engine as a matched filter . in lieu of subjecting the object 84 to real world forces to create the database , it can be created by simulating the application of forces to an object representing the object 84 . to then determine the strain deformation of the object 84 , for example when the object 84 is a component of an operating machine , a time domain response of the operating machine is determined . this response is compared with each one of the matched filter responses during each saw interrogation cycle and the matched filter yielding the best match is determined . the strain deformation associated with that matched filter represents the strain deformation experienced by the component during operation of the machine . because it is not possible to separate temperature effects from strain effects in a saw reflected signal , it is preferred to mount a temperature - measuring saw sensor on the same surface ( for example , a bottom surface of a well ) as the strain - measuring saw sensor ( s ). the former saw sensor is mounted using a soft and yielding but heat conductive adhesive , such as a silicone adhesive . this type of adhesive absorbs strain deformations and thereby minimizes the strain deformations imposed on the temperature - measuring saw sensor . by separately determining temperature - induced saw effects and deformation - induced saw effects a more accurate strain - related deformation can be obtained by removing the temperature - induced saw effects . fig5 illustrates a saw sensor 140 for determining temperature - induced strain effects ( attached to a well surface using a soft , yielding and heat - conducting adhesive 142 ) a saw sensor 144 for determining strain - induced saw effects ( attached to the well surface using the adhesive 92 ). the saw sensors 140 and 144 separately determine deformations of the object 84 so that the temperature - related effects can be removed from the strain determined by the saw sensor 144 . although the invention has been shown and described with respect to a certain preferred embodiment or embodiments , equivalent alterations and modifications may occur to others skilled in the art upon the reading and understanding of this specification and the annexed drawings . in particular regard to the various functions performed by the above described components ( assemblies , devices , circuits , etc . ), the terms used to describe such components are intended to correspond , unless otherwise indicated , to any component that performs the specified function of the described component ( i . e ., that is functionally equivalent ), even though not structurally equivalent to the disclosed structure , which performs the function in the illustrated exemplary embodiments of the invention . in addition , while a particular feature of the invention may have been disclosed with respect to only one of several embodiments , such feature may be combined with one or more other features of the other embodiments as may be desired and advantageous for any given or particular application .