fig1 is a top view of one embodiment of the printed wiring board of the present invention . the printed wiring board 10 has a first side 12 and a second side 14 . each side 12 and 14 includes a substrate having printed interconnections 16 and 18 , respectively . the printed wiring board 10 also defines openings 20a - 20g each having a sufficient size to receive an electrical component such as a semiconductor chip or a resistor . for discussion purposes , the openings 20a - 20g will be collectively referred to as an opening 20 . fig2 is an enlarged view of the opening 20f of the printed wiring board of the present invention , taken along lines 2 -- 2 . as shown in the figure , each opening 20 , such as the opening 20f , has rounded edges 30a - 30d which are tooled to provide a secure fitting for the electrical component 32 . in particular , each of the corners 32a - 32d of the electrical component 32 fit securely into the edges 30a - 30d . fig3 is a side view of the printed wiring board 10 of fig1 taken along lines 3 -- 3 . as shown in fig3 the printed wiring board 10 also has a plurality of via connections or through holes 40a and 40b ( collectively referred to as through - holes 40 ). once the component 32 has been securely fitted in the opening 20 , its leads 34a and 34b are soldered to the appropriate printed interconnections 16 and / or 18 ( fig1 ) at the appropriate through holes . to ensure a secure connection , and to facilitate interconnections on either side of the printed wiring board 10 , solder is permitted to flow into each through hole 40 . the component 32 is then epoxy coated . in one embodiment , the opening 20 which receives the component 32 is also filled with epoxy . examples of the epoxy used include that manufactured by itw devcon under the tradename fr4 or &# 34 ; 5 - minute epoxy resin &# 34 ; and that manufactured by al technology under the part designation e67655 - 5 - sm21 . fig4 is a side view of a second embodiment of the printed wiring board 100 of the present invention . as shown in fig4 the printed wiring board 100 has a first side 112 and a second side 114 . each side 112 and 114 is laminated with a metal 112a and 114a respectively , such as copper foil . the printed wiring board 100 also defines a plurality of openings ( only one opening 120 is shown ), each having a sufficient size to receive an electrical component 132 such as a semiconductor chip or a resistor . the opening 120 is out such that the metal laminate on the second side 114 is left in tact . the printed wiring board 100 also has a plurality of via connections or through holes 140a and 140b ( collectively referred to as through holes 140 ). once the component 132 has been securely fitted into the opening 120 , its leads 134a and 134b are soldered to the appropriate printed interconnections 16 and / or 18 ( fig1 ) at the appropriate through holes . to ensure a secure connection , and to facilitate interconnections on either side of the printed wiring board 100 , solder is permitted to flow into each through hole 140 . the component 132 is then epoxy coated . another aspect of the present invention involves the manufacture and assembly of printed wiring boards , as shown in fig5 a - 5d . in particular , fig5 a illustrates a printed wiring board 300 , which is divided into a plurality of smaller board sections 300a , 300b and 300c , for example , along lines 322a and 322b . alternatively , the smaller board sections 300a , 300b and 300c may be predesigned and / or manufactured so as to fit together . in this case , cutting of the board 300 into smaller pieces is not required . the printed wiring board 300 may be manufactured in the same manner as printed wiring board 10 or 100 as discussed above . for example , openings 320a , 320b and 320c ( collectively referred to as &# 34 ; openings 320 &# 34 ;) may be cut in each of the board sections 300a , 300b and 300c respectively . in addition , components ( not shown ) may be fitted into the openings 320 as discussed above . next , the printed wiring board 300 is cut along lines 322a and 322b , as shown in fig5 b . solder bump interconnections 330 are provided to facilitate electrical connections between adjacent board sections 300a , 300b and 300b , 300c ( fig5 d ), before the printed wiring board sections 300a , 300b and 300c are stacked together , as shown in fig5 c . it is apparent to one of ordinary skill in the art that a plurality of printed wiring boards 10 and / or 100 may be interconnected using the solder bump interconnection technique as shown in fig5 d . in a preferred embodiment , the board sections are coated with a non - conductive material so that each board section 300a , 300b or 300c is insulated from the other board sections except at the interconnections 330 . in one embodiment , the interconnections 330 are coated with a substance that negates the non - conductive coating . an example of such a coating is that manufactured by dupont under the tradename teflon . in addition , solder - filled vias such as via 332 may be used to facilitate interconnection between non - adjacent boards . it should be noted that , although some components , such as large capacitors , will not fit within an opening in a single board , additional boards that are stacked above the first board may be conformed and / or cut to fit around the large components . for example , corresponding openings may be cut in the additional boards so that a large component that is mounted in an opening of a first board may also be accommodated in corresponding openings in the other stacked boards . as a result , a very high density solution may be provided . such a manufacturing and assembly process is advantageous because 2 - dimensional layout tools may be used to make 3 - dimensional boards . in addition , vertical interconnects may be easily provided . most importantly , such a manufacturing and assembly process ( which facilitates stacking of the resulting board section ) is possible because of the flatness of the resulting component mounted boards . a further aspect of the present invention involves the use of a thermocooling layer to provide cooling for a plurality of stacked printed wiring boards 10 , 100 and / or 300a , 300b , 300c . as shown in fig6 a plurality of printed wiring boards 10 , may include a thermocooling layer 350 . examples of the thermocooling layer 350 include that manufactured by rmt limited of moscow , russia , under the part designation 1ms 03 - 030 - l and that manufactured by alpha and omega computer incorporated of anaheim , calif ., under the tradename &# 34 ; peltier junction active cooler &# 34 ;. the use of such a thermocooling layer 350 will facilitate the dissipation of heat from high power processors . in one embodiment , the thermocooling layer 350 may be embedded into any one of the printed wiring boards 10 . an example of such an arrangement is shown fig7 where a thermocooling layer 422 is embedded in a printed wiring board 420 . yet another aspect of the present invention involves the use of flat batteries to provide the voltage and current requirements of a system which implements the use of printed wiring boards . such a system 400 comprises a plurality of layers 410 , 420 , 430 and 440 . in one embodiment , layers 410 and 430 are printed wiring boards such as the printed wiring board 10 , 100 , 300a , 300b or 300c . each board 410 and 430 has an opening in which a component 412 and 432 respectively , such as a chip , may be fitted and epoxied , as described above . the printed wiring board 410 may be electrically connected with the non - adjacent printed wiring board 430 by means of the solder bumps 424a , 424b and a via 426 . in one embodiment , layer 420 is printed wiring board 10 , 100 , 300a , 300b or 300c , in which a thermocooling layer 422 is embedded . the thermocooling layer 422 is identical to that shown in fig6 and described above . in another embodiment , the thermocooling layer 422 is located adjacent to a heat sink 424 , which facilitates the transfer of heat from one end of the layer 420 to the other end . in a further embodiment , layer 440 is a flat battery . examples of such a flat battery includes the flat lithium - ion battery manufactured by ultralife , inc . under the tradename &# 34 ; solid state system &# 34 ;. one embodiment of the process s100 for manufacturing the printed wiring board 10 of the present invention , as illustrated in fig8 will now be described . the board 10 is first laminated on a first side ( step s102 ) with a metal . in one embodiment , the metal is copper foil . a circuit pattern is then etched onto the first side of the board 10 ( step s104 ). the openings 20a - 20g are then cut from the board 10 ( step s106 ). the openings 20a - 20g are cut so that each opening has rounded edges 30a - d which are tooled to provide a secure fitting for a corresponding electrical component . at the same time , holes 40 for via connections are also drilled . next , the components 32 are fitted into their corresponding openings 20 and then soldered ( step s108 ). in particular , solder is permitted to flow into the through holes 40 to ensure a secure connection . once the components 32 are situated , they are coated with epoxy ( step 110 ). the openings in which the components 32 are located are also fitted with epoxy . the second side of the board 10 is then laminated with a metal . in one embodiment , the metal copper is foil . a circuit pattern is then etched onto the metal on the second side of the board 10 ( step s114 ). fig9 illustrates an alternate embodiment of the process s200 for manufacturing the printed wiring board 10 of the present invention . the board 10 is first laminated with a metal , patterned and etched on a first side ( step s202 ). in one embodiment , the metal is copper foil . next , the openings 20 are cut and the through holes are drilled ( step s204 ). a second side of the board 10 is then laminated with a metal , patterned and etched ( step s206 ) before the components 32 are fitted into the openings . in one embodiment , the metal is copper foil . next , the components 32 are fitted into their corresponding openings 20 and then soldered into place ( step s208 ). the components 32 are then epoxy - coated and the openings 20 are filled with epoxy ( step s210 ). fig1 illustrates a third embodiment of the manufacturing process s300 of the printed wiring board 100 of the present invention . the board 100 ( fig4 ) is first laminated with metal 112a and 114b on sides 112 and 114 of the board 100 ( step s302 ). in one embodiment , the metal is copper foil . next , holes 140 for via connections are drilled and plated with metal , such as copper foil ( step s304 ). the circuit pattern for the first side 112 of the board 100 is then etched ( step s306 ). next , the openings 120 are cut from the board 100 , such that the metal laminate 114b on the second side 114 of the board 100 is left intact ( step s308 ). the components 132 are then fitted into the corresponding opening 120 and the component leader 134a , 134b of each component 132 are soldered into place ( step s310 ). the components 132 are then coated with epoxy and the openings 120 ( with the components 132 in place ) epoxy and the opening 120 ( with the components 132 in place ) are also coated with epoxy ( step s312 ). the second side 114 of the board 100 are then patterned and etched ( step s314 ). the process s300 then laminates . it is apparent to one of ordinary skill in the art that in each of the processes described above , additional layers of routing can be added on one or both sides of the finished board where each layer is provided by plating the board with metal ( such as copper ), etching the metal and then depositing of an insulating layer on the metal . vias may be used to provide interconnection between the layers . the process of the present invention lends itself well to automation because component placement is accurately determined by the holes , which are easy to provide , with good alignment . the resulting board thickness is uniform and is determined by the largest electronic component used , which is typically 1 mm . as a result , the board is flush , and no components will be sticking out from the board . the board is further strengthened through the use of epoxy and can support a very high integrated density , with a component to wiring area ratio of 2 : 1 . the board can also be maintained at a reasonable cost . this is because the board is totally flat , with no exposed leads or pins , so that dirt , grime and metal particles will not be trapped on the board . as a result , shorts ( and thus unreliable operation ) are eliminated or greatly reduced . in the process of the present invention also facilitates connections to non - adjacent boards , and for providing circuit boards that may be integrated into a compact package , while providing sufficient cooling , through the use of special thermoelectric cooling . the present invention may be embodied in other specific forms without departing from its spirit or essential characteristics . the described embodiments are to be considered in all respects only as illustrative and not restrictive . for example , the electrical component may be an integrated chip or a discrete component such as a resistor , a capacitor or a transistor . the scope of the invention is , therefore , indicated by the appended claims rather than the foregoing description . all changes which come within the meaning and range of equivalency of the claims are to be embraced within their scope .