referring initially to fig1 , a die stacking scheme according to one embodiment of the present invention is illustrated . fig1 illustrates a printed circuit board assembly 10 . the printed circuit board assembly 10 includes a multiple die semiconductor assembly 15 and a printed circuit board 70 . the multiple die semiconductor assembly 15 comprises a substrate 20 , a first semiconductor die 30 , a second semiconductor die 40 , a decoupling capacitor 50 , conductive lines 60 , a plurality of topographic contacts 80 , and an encapsulant 90 . it is noted that the encapsulant 90 and the semiconductor dies 30 , 40 are not illustrated in cross section in fig1 and 2 to preserve clarity . the substrate 20 includes a first surface 22 and a second surface 24 . conductive contacts 82 are included on the first surface 22 and the second surface 24 . the topographic contacts 80 extend from the conductive contacts 82 on the first and second surfaces 22 , 24 of the substrate 20 . for the purposes of defining and describing the present invention , it is noted that a topographic contact comprises any conductive contact that extends between and defines a spacing between an active surface of a substrate or die and an active surface of another substrate or die . examples include solder balls , conductive polymers , or other types of topographic electrical connections . a pin grid array , where pin recesses are provided in the opposing surface , present a suitable alternative to topographic contacts , where it is not necessary to create a spacing between two surfaces for accommodating structure there between . the first semiconductor die 30 also includes a pair of major surfaces one of which defines a first active surface 32 . the remaining major surface of the first die 30 defines a first stacking surface 34 . the first active surface 32 includes a plurality of conductive bond pads 84 . the first stacking surface 34 is devoid of conductive bond pads and is secured to the first surface 22 of the substrate 20 between the conductive contacts 82 included on the first surface 22 of the substrate 20 . the first semiconductor die 30 may be secured to the substrate 20 via a layer of die attach adhesive interposed between the substrate 20 and the first semiconductor die 30 . for the purposes of defining and describing the present invention , a stacking surface comprises a major surface of a substrate or die that is arranged to be secured to a substrate or other generally planar assembly component . for example , a semiconductor die may be secured to a surface of a substrate by interposing a layer of die attach adhesive between the stacking surface of the die and the surface of the substrate . for the purposes of describing and defining the present invention , it is noted that a conductive bond pad comprises a conductive surface area defined on or extending from a surface of a semiconductor die . a conductive contact comprises a conductive surface area defined on or extending from a substrate . an active surface comprises a surface of a die or substrate that contains conductive contacts or conductive bond pads . the second semiconductor die 40 also includes a pair of major surfaces , one of which defines a second active surface 42 . the remaining major surface of the second die 40 defines a second stacking surface 44 . the second active surface 42 includes a plurality of conductive bond pads 84 . the first semiconductor die 30 is electrically coupled to the second semiconductor die 40 by the topographic contacts 80 , which extend from respective conductive bond pads 84 on the second active surface 42 to a corresponding conductive bond pad 84 on the first active surface 32 . the decoupling capacitor 50 is secured to the second stacking surface 44 . each of the pair of conductive lines 60 illustrated in fig1 electrically connect a terminal 52 of the decoupling capacitor 50 , a bond pad 84 on the first active surface 32 , and a conductive contact 82 on the first surface 22 of the substrate 20 . the bond pad 84 on the first active surface 32 is electrically coupled to the second semiconductor die 40 via a conductive line ( not shown ) and one of the topographic contacts 80 extending from a conductive bond pads 84 on the second active surface 42 to a corresponding conductive bond pad 84 on the first active surface 32 . in this manner , the pair of conductive lines 60 are arranged such that the decoupling capacitor may be connected across v ss and v cc pins or terminals ( i . e ., the high and low voltage inputs ) of the first and second semiconductor dies 30 , 40 . it is noted that a conductive line may comprise an electrically conductive lead , trace , bond wire , etc . in this manner , the decoupling capacitors decouple the low voltage input from the high voltage input and serves as a power source filter or surge / spike suppressor . as will be appreciated by those practicing the present invention , the conductive contacts , which may embody printed conductive lines , wires , traces , and combinations thereof , electrically couple the various components of the printed circuit board assembly to the printed circuit board and to each other . for the purposes of defining and describing the present invention when reference is made herein to electrical coupling to a substrate or other structure , it is understood that the electrical coupling includes electrical coupling to a contact on a surface of the substrate or other structure . it is also noted that electrical coupling need not be direct and may include coupling through one or more circuitry components . the printed circuit board 70 is positioned such that a first surface 72 of the printed circuit board 70 faces the substrate 20 . a plurality of topographic contacts 80 extend from the second surface 24 of the substrate 20 to the first surface 72 of the printed circuit board 70 to electrically couple the multiple die semiconductor assembly 15 to the printed circuit board 70 . for the purposes of describing and defining the present invention , it is noted that a printed circuit board comprises a substrate upon which a circuit , network , or plurality of electrically conductive areas are formed . typically , the multiple die semiconductor assembly 15 is packaged with an encapsulant 90 . portions of the assembly may be provided with underfill material and other packaging materials , according to conventional die packaging methodology . as will be appreciated by those familiar with semiconductor fabrication , underfill materials are generally disposed between a die and the printed circuit board or substrate to which it is mounted for environmental protection and to enhance the attachment of the die to the printed circuit board or substrate . a die attach adhesive may be positioned to secure a die to a surface of an adjacent object and to secure an object to a surface of a die . in the embodiment of the present invention illustrated in fig2 , where like structure is indicated with like reference numerals , the first active surface 32 is electrically coupled to the substrate 20 by a plurality of topographic contacts 80 extending from respective conductive bond pads 84 on the first active surface 32 to corresponding conductive contacts 82 on the first surface 22 of the substrate 20 . the first stacking surface 34 is devoid of conductive bond pads 84 and is secured to the second stacking surface 44 with a die attach adhesive 36 . the decoupling capacitor 50 is secured to the second active surface 42 with , for example , a die attach adhesive ( not shown ). as is noted above with reference to the embodiment of fig1 , the pair of conductive lines 60 are arranged such that the decoupling capacitor is connected across v ss and v cc pins or terminals ( i . e ., the high and low voltage inputs ) of the first and second semiconductor dies . the embodiment of fig3 differs from that illustrated in fig1 because both surfaces of the second semiconductor die 40 comprise active surfaces 42 and include conductive bond pads 84 . conventional stacking , soldering , bonding , under filling , encapsulating , curing , and other semiconductor processing techniques may be modified and arranged to yield the various stacked structures of the present invention . the particular fabrication steps for assembling the various embodiments of the present invention may be gleaned from conventional semiconductor die stacking and packaging technology and the detailed description of the illustrated embodiments herein . for the purposes of defining the assembly scheme of the present invention it is noted that any claims to a method of assembling a structure are not intended to be limited by the order in which specific process steps are recited in a claim . as will be appreciated by those practicing the present invention , the printed circuit board assembly of the present invention is typically provided as part of a computer system . in specific applications of the present invention , the semiconductor dies may form an integrated memory unit but may embody a variety of alternative integrated circuit functions . having described the invention in detail and by reference to preferred embodiments thereof , it will be apparent that modifications and variations are possible without departing from the scope of the invention defined in the appended claims . more specifically , although some aspects of the present invention are identified herein as preferred or particularly advantageous , it is contemplated that the present invention is not necessarily limited to these preferred aspects of the invention .