fig1 and 2 schematically illustrate a wave soldering apparatus preferably used in practising the inventions set forth herein . basically , the apparatus 10 comprises an inclined conveyor 11 for moving a pallet 12 of elongate frames of electronic packages or other electronic parts to receive a coating of solder . the package or parts , first pass above a first station comprising a flux container 14 which includes top baffles and a pump ( not shown ) to form a fluxing zone 15 above the level of flux in the container . the package leads or parts are thus coated with a flux . the packages or parts continue up the incline of the conveyor through a second station comprising a radiant preheater 16 forming a heating zone 20 to preheat the packages , or parts , and leads to avoid subsequent thermal shock from the application of molten solder . solder coating occurs at a third station comprising a molten solder container 17 having a solder wave - producing series of baffles and pump 18 , as is known in the art , to form a wave 19 of molten solder with intermixed oil above the solder level in the container 17 . the packages and leads or other parts pass through the wave . a speed controller on a panel board controls the conveyor speed . the wave is contained by baffles 21 which give the wave a rectangular shape . in practice , packages or parts are loaded onto a pallet or other fixture holding the parts to the conveyor for transport through the above - described apparatus . an activated water soluble flux ( blackstone 1452 ) is applied to the package leads in zone 15 using foam fluxer ( or wave fluxer ) and any excess flux removed by an air knife ( not shown ). the parts are heated in the preheater zone to evaporate water moisture from the flux solution , afford the flux an opportunity to remove oxides from the surface of the electrical leads and to raise the temperature of the package and leads to minimize thermal shock when they pass through the solder wave . the wave is generated by pumping liquid solder ( nominally 60 % sn and 40 % pb ) up between baffles 21 to form a wave zone 19 . heretofore , the packages or parts were passed in a leads - down orientation in a serial - in - line progression along the incline of the conveyor through the wave so that basically only the depending leads were below the wave top . immersion time has generally been from two seconds to three seconds . the fixture holding the series of integrated circuit packages may be dipped in the &# 34 ; leads - down &# 34 ; orientation in the industry accepted prior art wave soldering process to reflow the deposited solder on the leads . this reflow technique is detailed in assembly engineering , june 1977 , in an article by t . thompson . a model il - 6 apparatus sold by htc inc ., concord , ma , may be employed for performing the reflow step . fig3 illustrates a typical quad - type integrated circuit package 22 having a flat surface 23 surrounded by castellated peripheral edge portion 23a between which j - leads 25 are bent and form the j - lead crests 25c . the overall package 22 is subsequently surface - mounted to printed circuit board traces at the crests 25c . other types of electronic packages such as the &# 34 ; pocket &# 34 ; type where the free end of each lead is bent into a rectangular or other shaped depression or pocket in and around the periphery of package surface 23 may be processed with this invention . fig4 illustrates the difficulties which were encountered in the prior art solder coating of the package of fig3 when the solder coating was performed in a hollis wave soldering machine ( astra 16 ) with the j - leads facing downwardly during and immediately after the solder dip operation . the proximal inner ends 25a of the leads 25 are attached to metallization on a chip lead frame 27 which is wire bonded to the contact pads of an integrated circuit chip 28 inside the package 22 . package 22 is molded or encapsulated with an epoxy resin with lead portion 25a extending from the side edges of the package at the periphery 26c of the package . a downward lead portion 25b is essentially vertical with respect to the horizontal package . the bottom curved portion of the j - lead forms a bottom crest portion 25c , the outer surface of which is eventually to be surface - mounted to a pcb trace and a distal end 25d which abuts or is in a pocket in the package surface 23 between castellations 23a . the crests 25c extend between and exterior of the top of the castellations 23a . upon &# 34 ; leads down &# 34 ; solder coating , the j - leads crests are coated with a relative wide variance of solder thicknesses . for example , some leads are coated thickly as at 25e , while other leads are much thinner as at 25f . since it is desired that the coated crests have the exterior surfaces all in the same plane , i . e . planar , it is apparent that the illustrated fig4 package the solder coating would be out - of - specification . as will be shown , the coated crests formed in a &# 34 ; leads down configuration &# 34 ; also have been found to vary extensively in solder composition . fig5 illustrates the affect of overly thick crest coatings or of icicles or solder balls on the lead crests for the end user . a pair of adjacent j - leads 25 ( rotated 90 ° from their usual orientation with the edge of a package 22 ) are shown with their crests 25c in a plane parallel to a metal path or traces 32a and 32b on a surface 31 of a printed circuit board 30 to which the leads ( and package ) are to be surface - mounted . a coating of flux 33 is present over the traces to aid in forming a proper solder connection between lead crest 25c and traces 32a and 32b when the leads are placed in position over the traces for connection . overthick solder coated crest 25e on the right - hand crest 25c makes first contact with the trace 32b and prevents the adjacent left hand lead crest with its thinner solder coat ( and other adjacent lead crests ) from making proper contact with the trace 32a . the distance d 2 between the bottom of the solder coat on the left lead and the surface 31 is thus greater than the distance d 1 between the bottom of the solder coat on the right lead and the surface 31 and a gap 34 is formed between the left - hand crest coated surface and trace 32a . when the leads 25 , solder coat 36 , adjacent flux 33 and traces 32a and 32b are heated to soldering temperature , the solder 36 on the leads flows downwardly to form a solder miniscus 37 shown by the dotted outline . due to the noncontacting of the left - hand lead 25 , more particularly its coated crest 25c , with trace 32a , an imperfect joint is made therebetween with a high possibility of air and bubble inclusions . fig6 and 7 illustrate the desired orientation of multiple plastic chip carrier and integrated circuit packages 22 when the package leads are to be solder coated by passing a strip of packages through a soldering wave . each package is attached to an elongated frame or strip 40 having lateral edges 41 with indexing perforations 42 therein for automatic machine handling . as seen in fig8 a pallet mounts the strips and includes a series of short pins 55 extending upwardly from surfaces 56 onto which a strip of packages having side apertures 46 is placed so that the apertures 46 are aligned with and inserted over pins 55 on adjacent bars 53 . each package is held at its corners by connection links or tie - bars 45 extending between the edges 41 and an integral portion of the lead frame strip within the package . after wave soldering the links or tie - bars are severed so that the five packages can be removed from the frame . cutouts or openings 41a and 41b are provided in the frame . a feature of this invention is that a group of five or more packages 22 , are advanced at one time across a solder wave at a right angle to strip 40 as shown by arrow 44 in fig7 . each of the leads 25 of packages 22 are in a &# 34 ; crests up &# 34 ; orientation . such orientation when the packages are passed through the wave soldering apparatus ( fig1 and 2 ) results in even ( within specification ) coating of the lead crests with a resultant narrow range of solder composition at the lead crest critical area . each of five packages contact the solder wave simultaneously and creates a minimum change in temperature of the solder across the wave . if the strip 40 is put into the wave lengthwise , each individual package lowers the wave temperature and gives a different coating thickness on different packages . fig8 illustrates a production pallet which is the preferred best mode of placing and holding the strips 40 for conveyance through the wave soldering machine . the pallet 50 is preferably made from titanium for its lightness , strength and corrosion - resistant properties . pallet 50 comprises two lengthwise elongate support members or bars 51a and 51b having a top surface 52 and a series of spaced support crossbars 53 between bars 51a and 51b . each crossbar includes pins 55 as discussed above for holding the apertured adjacent edges of the elongate frames to which the packages ( fig6 and 7 ) are attached in a &# 34 ; leads up &# 34 ; orientation . the pallet rigidly clamps the frames , allows for simultaneous plating of multiple packages and allows a large number of frames to be supported in a single structure . as seen in fig8 package support bars 60 ( one shown without a strip underneath ) extend parallel to and between each of two adjacent crossbars of the pallet and are connected to the bars 51a and 51b of the pallet by suitable fasteners 63 extending through apertures 64 and 64a in the lengthwise bars and support bars , respectively . each support bar 60 ( fig9 and 10b ) has a series of sets of at least two downwardly extending pins which , when the support bars are assembled over the strips 40 , abut each of the topsides of the packages 22 inward of the leads 25 at at least two spaced points 65 and 66 to support each package in the row of the packages 22 . the packages and frames are suspended transversely of bars 51a and 51b and extend parallel between crossbars 53 . support bars 60 support each frame and each package so that the frame and package does not bulge upwardly and flex when they and the pallet are passed through the solder wave . in solder coating operations using the preferred astra 16 machine , the operator first assures that the preheater temperatures are at the desired level . after conveyor start - up , the temperature of the upwardly facing surface of the package is checked . care must be taken to have the specific gravity of the flux in the flux container kept within the manufacturer &# 39 ; s specifications . the following operating parameters of the astra 16 machine have been found to be optimum : __________________________________________________________________________ operatingparameter standard range check__________________________________________________________________________ flux specific gravity 1 . 129 ± 0 . 010 every 4 hrs . flux air pressure - foam 1 . 0 ± 0 . 1 psi flux air pressure - spray 1 . 5 ± 0 . 1 psi air knife pressure 2 . 0 ± 0 . 2 psi temperature @ preheater 120 ° c . ± 5 ° c . package body temperature 180 ° c . ± 5 ° c . @ solder wave solder temperature 255 ° c . ± 5 ° c . solder wave height 0 . 4 inch ± 0 . 5 solder wave width 1 . 7 inch ± 0 . 310 . conveyor speed 2 . 5 ft / min ± 0 . 5 ft / min . conveyor angle 6 . 3 ° ± 0 . 3 input d . i . water flow rate 2 . 5 gpm ± 1 / 2 gpm rinse water temperature 58 ° c . ± 2 ° c . water pump pressure 28 psi ± 1 psi conveyor speed ( cleaner ) 2 . 5 ft / min . ± 0 . 5 ft / min . __________________________________________________________________________ a wave length of about 16 inches best accommodates the pallet 50 which has a width of 9 . 85 inches and a length of 15 . 73 inches . the conveyor speed has been lessened from about 4 ft / min . to about 2 . 5 ft / min . to lessen the chance of having shorts between leads . this also affords optimum temperature of the solder for proper and optimum solder coating of the lead . process development was verified by conducting tests on integrated circuit packages held in a test fixture and passed through a solder wave produced in an astra 16 wave soldering machine with the j - leads in a &# 34 ; leads down &# 34 ; orientation and a &# 34 ; leads up &# 34 ; orientation . 84 - lead quad packages were utilized with data taken on up to 10 leads , i . e . every other , of the 21 leads on each side of the square 84 - lead quad package , i . e . a total of 40 leads . forty tests were run on one package at the end of the elongate frame of packages and on the middle package of the elongate frame of packages so as to be representative of solder coating conditions across the wave which the elongate frame of packages simultaneously traverse . for example , in test lot no . 1 - 1 - 1 on the center package # 3 with the leads facing downwardly on an astra 16 apparatus , the lead crest thicknesses , as measured by x - ray fluorescent techniques , of measured leads varied from 591 . 9 microinches to over 1000 microinches , at the 1000 microinch point an alarm indicated a gross deviation from a 500 microinches nominal desired thickness for 17 out of the 40 leads measured . the mean thickness of leads actually measured ( those under 1000 microinches ) was 820 . 8 microinches . by x - ray fluorescent techniques , it was found that the sn constituent of the desired 60 % sn and 40 % pb solder varied from 56 . 6 % to 100 % sn . it was clear that the solder coating was not within specifications for thickness , i . e . a range of thickness about 200 to 950 microinches and for composition , i . e . 58 - 70 % sn . lot no . 2 - 1 - 1 were processed in the astra 16 machine but processed in the &# 34 ; leads up &# 34 ; orientation as shown in fig6 and 9 . the solder coating on the middle package of the group of five packages in an elongate frame in all cases was below 1000 microinches in thickness with a mean thickness for all 40 leads tested of 480 . 9 , very close to the nominal mean of 500 microinches desired . the mean of sn composition at the crest of all 40 leads was 63 . 0 % sn with a minimum of 58 . 5 % sn and a maximum of 69 . 9 % sn , again within the specifications given above . all of the above percents are in weight percent . the above description of the preferred embodiment of this invention is intended to be illustrative and not limiting . other embodiments of this invention will be obvious to those skilled in the art in view of the above disclosure .