referring now to fig2 there is shown the improved apparatus for slider growth of hg 1 - x cd x te . a quartz tube 10 , of which a partial section is shown , provides the conventional furnace enclosure within which the hg 1 - x cd x te is grown . a suitable source of heat , such as a heating coil 11 around the tube , provides the desired temperature for the liquid phase epitaxy growth of hg 1 - x cd x te . the graphite furnace boat comprises a slider or carrier section 12 , a base section 13 , and a cover section 14 . the slider section 12 has one or more wells 15 extending through the section , and has a more shallow well or depression 16 . the bottom surface of the slider section 12 has a continuous trough or groove 17 therein looping around the bottom near the perimeter . a channel extending in a vertical direction through the slider section connects the groove 17 to the top surface . the well 15 is adapted to contain a growth solution 20 of ( hg 1 - x cd x ) 1 - y te y . a plug 21 caps the well . the base section 13 of the boat has a recess 22 in the top surface thereof . the purpose of the recess is to receive a growth substrate , such as cdte , upon which the lpe layer of hg 1 - x cd x te is epitaxially grown . the cover section 14 of the boat has a shoulder 25 on its lower face and extending around its perimeter which is machined to fit closely to the upper surface of the slider section 12 . when growing hg 1 - x cd x te in the apparatus of the present invention , a growth substrate is placed in the recess 22 . a charge 20 of ( hg 1 - x cd x ) 1 - y te y is placed in the well 15 and the well capped with plug 21 . it is necessary to prevent loss of hg from the charge 20 during the growth procedure . a hg source wafer 26 of hgte plus te is placed in shallow well 16 . the cover 14 is placed over the slider 12 and the furnace boat is placed in the tube 10 , is purged , and is heated to 500 ° c . a source of h 2 gas is caused to flow in the quartz tube . when the equilibration is reached , the slider is moved with respect to the base to position the well 15 with ( hg 1 - x cd x ) 1 - y te y charge 20 over the substrate in recess 22 so that the epitaxial growth can commence . the purpose of the source wafer 26 is to give up hg thereby pressurizing the growth area , i . e ., the region 27 under the cover 14 , in the wells 15 of the slider and in the groove or moat 17 around the bottom of the slider . since this is a slider assembly , some hg vapor leaks and diffuses out of the boat through the cover fit or through the sliding fit between slider section 12 and base section 13 and into the h 2 gas stream contained in the quartz tube 10 . the hg which escapes is replaced by dissociation of the source wafer 26 to thereby maintain a constant hg pressure over the plug 21 , and around the growth solution 20 and growth substrate . since the partial pressure of hg from the source wafer 26 of hgte is the same as the partial pressure of hg from the charge 20 , i . e . about 0 . 1 atm , there is prevented any loss of hg from the charge 20 and the lpe grown layer of hg 1 - x cd x te on the substrate . referring now to fig4 there is shown a more preferred embodiment of the boat assembly comprising major components including a base or stator member 30 , a slider member 31 and a cover member 32 . the details of the base member 30 are shown in fig5 b and 5c which are the top , side and end views , respectively . the base member has a long flat bed 40 broken by a recessed rectangular area 41 into which a semiconductor substrate wafer is placed and on which the liquid phase epitaxy layer of hg 1 - x cd x te is grown . the base member has recessed channels 42 and 43 along each edge of the bed . in fig6 b , 6c and 6d , there is shown the detail construction of the graphite slider member 31 . from the top view , fig6 there is seen a flat top surface 50 extending the length of the slider and having raised parallel guides 51 and 52 along opposite edges for the purpose of properly positioning the cover member . two wells 53 and 54 are cut through from the top surface 50 to the bottom of the slider . the wells , as shown , are somewhat tapered , being of lesser diameter at the bottom . surrounding the wells 53 and 54 on the top surface 50 are grooves or moats 55 and 56 , respectively . groove 55 completely encompasses well 53 and likewise groove 56 encompasses well 54 . located in the top surface 50 generally between the two wells is a shallow well 57 which communicates with grooves 55 and 56 by means of a shallow channel 58 milled into the top surface . also , a hole 59 is drilled from the channel 58 through to a groove 60 cut into the lower face 61 of the slider member 31 . the lower face , best seen in fig6 c , is generally planar and mates with and is slideable along the flat bed 40 of the base member 30 . a pair of parallel guide members 62 and 63 ( fig6 d ) extend somewhat beyond the lower face 61 and are designed to fit in and slide along recessed channels 42 and 43 . fig6 d is a sectional view through the slider at the position of the well 53 . the groove or moat 60 in the lower face 61 completely surrounds the two wells 53 and 54 . in the area of the wells 53 and 54 and inside of the groove 60 , recessed rectangular areas 64 and 65 are cut . these recessed areas are preferably comparable in size with recessed area 41 in the base member 30 . the dimensions of the recessed areas 41 , 64 and 65 generally correspond to the size of the substrate upon which the hg 1 - x cd x te layer is to be grown . fig6 e and 6f show a top view and an edge view , respectively , of a plug 66 which fits into the top of well 53 . fig7 b and 7c are the top , side and end views of the graphite cover member 32 for covering the top surface of the slider member 31 . the bottom surface of the cover member is generally flat and designed to mate closely with the top surface 50 of the slider . when growing hg 1 - x cd x te in the embodiment shown in fig4 - 5 , a growth substrate is placed in the recess 41 and a charge of ( hg 1 - x cd x ) 1 - y te y is placed in the well 53 and the well capped with plug 66 . a hg source wafer of hgte is placed in shallow well 57 . the cover 32 is placed over slider 31 and the assembly is placed in the quartz tube 10 . before heating , the assembly is thoroughly purged with nitrogen . a source of h 2 is then caused to flow in the quartz tube , it is heated to 500 ° c . and when equilibration is reached , the slider 31 is adjusted longitudinally along base 30 to position the well 53 and recessed area 64 containing the melted charge of ( hg 1 - x cd x ) 1 - y te y over recess 41 containing the growth substrate so that epitaxial growth can commence . as an example , growth may continue about one half hour . as mentioned previously , the vapor pressure of the hg is about 0 . 1 atm and to prevent the hg from escaping from the ( hg 1 - x cd x ) 1 - y te y charge , a hg source wafer of hgte is also included in shallow well 57 . the hg vapor pressure of hgte is the same as that of ( hg 1 - x cd x ) 1 - y te y , i . e . 0 . 1 atm at 500 ° c ., so that grooves 55 , 56 and 60 are pressurized with hg to prevent the escape of hg from the charge . the temperature of 500 ° c . is used throughout as the growth temperature . obviously , growth must occur from a solution at a temperature below its liquidus temperature t l and the liquidus temperature depends on composition . for example , the table lists t l for 5 growth solutions of ( hg 1 - x cd x ) 1 - y te y which have been used to grow hg 1 - x cd x te . these compositions have been selected to be near 500 ° c . but other compositions can be selected to have t l at 450 ° c . for example . in all cases growth must be at a temperature less than t l . thus the temperature of the ( hg 1 - x cd x ) 1 - y te y charge is initially raised by the furnace to a temperature above t l and is then dropped below t l during growth . these growth conditions can be by step cooling in which the liquid ( hg 1 - x cd x ) 1 - y te y is supercooled by a predetermined number of degrees below t l before the slider 31 is adjusted to bring the liquid charge over the growth substrate , or by beginning with the ( hg 1 - x cd x ) 1 - y te y solution at the liquidus temperature and slowly cooling below t l after the molten charge is brought in contact with the growth substrate , or again by a combination of the two . table______________________________________tie line parameters . ( hg . sub . 1 - x cd . sub . x ). sub . 1 - y te . sub . y ) for solution , hg . sub . 1 - x cd . sub . x te for solidsource solution solid grown ratio , kx y t . sub . l x x . sub . s / x . sub . l______________________________________0 . 1 0 . 825 508 ° c . 0 . 40 4 . 000 . 095 0 . 82 508 ° c . 0 . 37 3 . 890 . 082 0 . 81 507 ° c . 0 . 29 3 . 540 . 06 0 . 80 510 ° c . 0 . 22 3 . 670 . 05 0 . 80 499 ° c . 0 . 195 3 . 90______________________________________ thus in summary we utilize the rather surprising fact that mercury vapor pressure over ( hg 1 - x cd x ) 1 - y te y at a given temperature is substantially independent of x and y for y values greater than 0 . 5 . obviously if x = 1 or y = 1 in the above formula then no mercury is present and the mercury pressure will drop . since the mercury pressure is independent of x and y over a large range , then hgte or hgte plus te can provide the hg vapor over a growth solution of ( hg 1 - x cd x ) 1 - y te y to prevent the loss of hg from it . as hg is lost from a hgte source , the source becomes richer in te , but the hg vapor pressure remains constant . thus it is not necessary to control the exact composition of the hg source . this phenomena of mercury pressure being independent of x and y holds true over a wide range of temperatures .