the particular values and configurations discussed in these non - limiting examples can be varied and are cited merely to illustrate at least one embodiment of the present invention and are not intended to limit the scope of the invention . fig1 illustrates a block diagram of a system 100 that includes a plastic molding operation and a reel 120 of a reel - to - reel mechanism , which can be implemented in accordance with a preferred embodiment of the present invention . note that fig1 to 8 depicted and described herein represent a preferred embodiment , while fig9 to 18 represent an alternative embodiment . in fig1 to 8 , identical or similar parts are generally indicated by identical reference numerals . fig1 to 8 represent sequential manufacturing operations , beginning with the operations of system 100 and continuing to the operations of system 200 of fig2 , and so forth . note that in general , fig1 - 8 represent a photo plating process of producing a circuit utilizing a reel to reel system , while fig9 - 18 utilize the mid or two mold method with the reel to reel process . fig2 illustrates a block diagram of a system 200 illustrative of plating and photo circuit layout operations in association with reel 120 of a reel - to - reel mechanism , in accordance with a preferred embodiment of the present invention . system 200 can be implemented partially within an area 206 , which can constitute a proprietary portion of the manufacturing process . system 100 includes a wire 102 ( i . e ., wire a ) and a wire 104 ( i . e ., wire b ) which are associated respectively with carriers 106 and 108 , which may be formed from wire extending from wires 102 and 104 . it can be appreciated that although in this context , wire is discussed with respect to a preferred embodiment , carriers can also be formed from other materials , such as mylar , stamping , plastic links , and so forth . for illustrative purposes , however , wire is discussed herein . carriers 106 and 108 are linked to a plastic molding module 110 , which can be fed plastic material 116 provided by a plastic manufacturer 118 . plastic molding module 110 implements a plastic molding operation . following processing of the plastic molding operation via module 110 , plastic parts 112 and 114 are generated and as output and carried upon carriers 106 and 108 . parts 112 and 114 can then be spooled on reel 120 . note that spooling via reel 120 is an optional operation and can be used to permit linkage to the next process , which is depicted in process 200 of fig2 . the process depicted in fig1 continues in fig2 , as indicated by continuation block 122 . note that the term “ module ” as utilized herein can refer both to a physical module ( e . g ., hardware or manufacturing components ) and / or a software or process module that performs a particular task based upon a set of particular instructions stored in a memory of a data - processing system , such as a computer , and processible via a processor , such as , for example , a microprocessor or central processing unit ( cpu ). thus , the term “ module ” can refer to a collection of routines and data structures that can implement a particular task or abstract data types , and can also be referred to as a “ software module ”. software modules can be composed of two parts . first , a software module may list the constants , data types , variable , routines and the like that that can be accessed by other modules or routines . second , a software module can be configured as an implementation , which can be private ( i . e ., accessible perhaps only to the module ), and that contains the source code that actually implements the routines or subroutines upon which the module is based . thus , for example , the term module , as utilized herein can refer to software modules or implementations thereof . such modules can be utilized separately or together to form a program product that can be implemented through signal - bearing media , including transmission media and recordable media . the term “ module ” can also refer , however , to a self - contained hardware component that provides a complete function into a system and be interchanged with and / or function in association with other modules that provide other functions . such modules can be referred to also as “ hardware modules ”. the term “ module ” as utilized herein can thus refer to both hardware or software modules and / or a combination thereof . an un - reel operation can be implemented via reel 120 and the bare parts 112 and 114 are carried along the carriers , as indicated at time t 2 . parts 112 and 114 can be subject to a plating operation via a plating module 204 . in the example of fig2 , copper can be plated for a base . note that copper is referenced only as an example with respect to particular embodiments of the prevent invention . other materials may be plated in place of copper . the plating operation implemented via plating module 204 can be based on a reel - to - reel or batch manufacturing operation . as indicated at time t 3 , parts 112 and 114 are now plated and can thereafter , as depicted at time t 4 , be spooled on reel 120 . reeling via reel 120 is an optional operation and may be utilized to permit linkage to the next processes , which are indicated at times t 5 and t 6 . the plated parts can be unreeled ( i . e ., if required ) utilizing reel 120 , as indicated at time t 5 and thereafter subject to a photo - circuit layout operation via a photo - circuit layout module 212 . the photo process can be created utilizing a cad file . masking patterns can be accomplished with one or multiple reel processing , depending upon design choices . as indicated at time t 6 , parts 112 and 114 can be subject to a pattern created thereon in the form of a mask , which may be a positive or a negative mask . note that a stripping module can be optionally implemented for stripping parts 112 and 114 to reveal a circuit pattern thereof , as also indicated at time t 6 . thereafter , as indicated at time t 7 , parts 112 and 114 can be subject to a reeling operation via reel 120 ( i . e ., again , if required ). the process then continues , as indicated at continuation block 216 , which is also depicted in fig3 . fig3 generally illustrates a block diagram illustrative of a process 300 that includes stripping and build - up operations in association with a reel - to - reel mechanism , in accordance with a preferred embodiment of the present invention . thus , the process continues , as indicated at continuation block 216 . reel 120 can be utilized to un - reel parts 112 and 114 as indicated at time t 8 . parts 112 and 114 can then be subject to plating via plating module 204 . the parts are then indicated following the plating operation via plating module 204 , as indicated at time t 9 . next , as indicated at time t 10 , a build - up process can be implemented via a build - up module 307 . after the base plating occurs , a build - up operation can be implemented to create a final usable circuit upon parts 112 and 114 via a build - up module 307 . in the example depicted in fig3 , nickel and gold are added . such a build - up operation may permit a continuous reel to attain the final plated configuration . alternatively , multiple unreeling / reeling operations can be implemented utilizing reel 120 . plating may occur via bulk or reel - to - reel processing , depending upon desired embodiments . all plating processes such as etching , cleaning , rinsing , and plating can be included as part of the plastic metallization processes depicted in fig1 - 8 . following a reeling operation via reel 120 ( i . e ., if required ), the process continues , as indicated at continuation block 310 . fig4 illustrates a block diagram illustrative of process 400 that includes a component placement operation in association with a reel - to - reel mechanism , in accordance with a preferred embodiment of the present invention . in fig4 , an un - reeling operation may be implemented ( i . e ., if required ) via reel 120 . as indicated at time tar , parts 112 and 114 can continue to be carried toward the next processing step , which involves component placement , via a component placement module 404 . components can be attached to the plastic lead frame structure of parts 112 and / or 114 by a variety of possible techniques to establish electrical connections thereof . recall that parts 112 and 114 can be configured as plastic lead frames . such techniques can include , for example , soldering , conductive adhesive techniques , ultrasonic welding , and / or pressure contacts . the components are indicated thereafter integrated with and / or connected to parts 112 and 114 at time t 12 , immediately prior to reeling ( i . e ., if required ) via a reel 120 . the process then continues , as indicated at continuation block 408 . fig5 illustrates a block diagram illustrative of a system 500 involving a testing operation in association with a reel - to - reel mechanism , in accordance with a preferred embodiment of the present invention . an un - reeling operation can be implemented via reel 1202 ( i . e ., if required ). parts 112 and 114 are shown in fig5 at time t 13 , prior to implementation of an optional testing operation via a testing module 504 . tests performed via testing module 504 can include , for example , function and continuity testing . parts 112 and 114 are thereafter shown in fig5 at time t 14 , prior to reeling via a reel 120 ( i . e ., if required ). the process then continues , as indicated at block 508 . fig6 illustrates a block diagram illustrative of a system 600 that includes a packaging operation in association with a reel - to - reel mechanism , in accordance with a preferred embodiment of the present invention . an un - reeling operation can be implemented via reel 120 . parts 112 and 114 are shown in fig6 at time t 15 , prior to implementation of a packaging operation via a packaging module 604 . packaging can take into account a variety of operation forms , including , for example , sealing , thermal packaging , structure built - in seals , and / or vibration isolation . packaging module 604 can implement more than one packaging operational step and may require that reel 120 be spooled and re - spooled . parts 112 and 114 are thereafter depicted in fig6 at time t 16 prior to optional reeling via reel 120 . the process can then continue , as indicated at continuation block 608 . fig7 illustrates a block diagram illustrative of a system 700 that includes a final testing operation in association with a reel - to - reel mechanism , in accordance with a preferred embodiment of the present invention . reel 120 can be utilized to implement an un - reeling operation ( i . e ., if required ). parts 112 and 1 14 are depicted in fig7 at time t 17 prior to subjugation to a final testing operation , which can be implemented via a testing module 704 . a number of tests are required prior to shipment . such a testing operation can , however , be optionally performed following a singulation operation , which is depicted subsequently in fig8 . parts 112 and 114 are shown in fig . at time t 18 following testing module 704 and prior to reeling via reel 120 . note that reeled parts can be shipped to a customer interface with the customer &# 39 ; s automated equipment . the process then continues , as indicated at block 708 . fig8 illustrates a block diagram illustrative of a system 800 that includes packing and shipping operations , in accordance with a preferred embodiment of the present invention . parts 112 and 114 are shown in fig8 at time tag , prior to implementation of a singulation operation via a singulating module 802 . note that an optional “ or ” block 801 is also indicated in fig8 , which indicates that the implementation of singulation module 802 is optional . the parts ( e . g ., part 112 depicted at time t 20 ) can simply be directly subject to a packaging operation via packaging module 804 following by shipping via a shipping module 808 . note that in fig1 to 8 , systems 100 - 800 illustrated therein can constitute an overall system in which parts are reeled / un - reeled , coiled / uncoiled , spooled / unspoiled in and out of various processes implemented respectively via various modules . the desire of the embodiment of fig1 to 8 is to accomplish - an entire manufacturing process with the fewest reel - handling operations as possible . the reels depicted in fig1 to 8 can be implemented as multiple reels , a single reel , or only two reels , depending upon design constraints and goals . for example , instead of utilizing a single reel 120 , one or more reels may also be utilized to accomplish both reeling and unreeling operations . the use of a single or multiple reel configurations again depends on the goals of the manufacturing operation . fig9 illustrates a block diagram illustrative of a system 900 that includes a plastic molding operation in association with a reel - to - reel mechanism , in accordance with an alternative embodiment of the present invention . in fig9 to 18 , identical or similar parts are generally indicated by identical reference numerals . fig9 to 18 represent sequential manufacturing operations , beginning with the operations of system 900 and continuing to the operations of system 1000 of fig1 , and so forth . system 900 includes a wire 902 ( i . e ., wire a ) and a wire 904 ( i . e ., wire b ) which are associated respectively with carriers 903 and 905 , which may be formed from wire extending from wires 902 and 904 . it can be appreciated that although in this context , wire is discussed with respect to a preferred embodiment , carriers can also be formed from other materials , such as mylar , stamping , plastic links , and so forth . for illustrative purposes , however , wire is discussed herein . carriers 903 and 905 are linked to a plate - able plastic molding module 906 , which can be fed plastic material 911 provided by a plastic manufacturer 908 . plastic material 911 is provided as raw material , which may be in the form of thermoplastic or thermo set material . plastic molding module 906 generally implements a plastic molding operation . following processing of the plastic molding operation via module 906 , plastic parts 1112 and 1114 are generated as output and carried upon carriers 903 and 905 as indicated at time t 1 of fig9 parts 1112 and 1114 can then be spooled utilizing reel 910 . note that spooling via reel 910 is an optional operation and can be used to permit linkage to the next process , which is depicted in system 1000 of fig1 . the process depicted in fig9 continues in fig1 , as indicated by continuation block 912 . fig1 illustrates a block diagram illustrative of a system 1000 that includes an over - mold operation in association with a reel - to - reel mechanism , in accordance with an alternative embodiment of the present invention . bare parts 1112 and 1114 are illustrated in fig1 at time t 2 , following un - reeling via reel 910 ( i . e ., if required ). parts 1112 and 1114 , which at this point in the process are configured as bare plastic lead frame structures can then be subject to an over - molding operation via a molding module 1004 , wherein the plastic of parts 1112 and 1114 is over - molded with non - plateable plastic . parts 1112 and 1114 are thereafter indicated at time t 3 with a second plastic over - mold . parts 1112 and 1114 can then be spooled on reel 910 . note that spooling via reel 1006 is an operation operational and may be used to permit linkage to the next process , which continues in fig1 , as indicated at continuation block 1008 of both fig1 and 11 . fig1 illustrates a block diagram illustrative of a system 1100 that includes a plating operation in association with a reel - to - reel mechanism , in accordance with an alternative embodiment of the present invention . parts 1112 and 1114 are depicted in fig1 at time t 4 , following an un - reeling operation implemented via reel 9102 ( i . e ., if required ). parts 1112 and 1114 can then be subject to a plating operation , which may be a reel - to - reel or batch plating operation implemented via a plating module 1104 . in the example of fig1 , copper may be plated . it can be appreciated , of course , that other metals can be plated in place of or in addition to copper . the plated circuitry is thereafter indicated on parts 1112 and 1114 at time t 5 . thereafter , if required , a reeling operation can be implemented via reel 910 . the process can then continue , as indicated at continuation block 1108 . fig1 illustrates a block diagram illustrative of a system 1200 that includes build - up operation in association with a reel - to - reel mechanism , in accordance with an alternative embodiment of the present invention . fig1 illustrates a block diagram illustrating a system 1300 that shows in greater detail the build - up operation depicted in fig1 , in accordance with an alternative embodiment of the present invention . reel 910 may be utilized to implement an un - reeling operation . fig1 depicts parts 1112 and 1114 at time t 6 , immediately prior to the implementation of a build - up operation or process via a build - up module 1204 . after base plating , a build - up operation may be implemented to create a final usable circuit upon parts 1112 and 1114 . the process continues from fig1 to fig1 , as indicated at continuation block 1206 . in the scenario of fig1 and 13 , the build - up process implemented via build - up module 1204 can result in the addition of nickel and gold , as respectively indicated at time t 7 and time t 8 . such a build - up may allow one continuous reel to attain the final plated configuration or multiple unreeling / reeling operations , depending upon design constraints . plating may be accomplished by bulk or reel - to - reel processing . all plating processes , such as etching , cleaning , rinsing and plating can be included in the plastic metallization operations of fig1 - 13 . a reeling operation can be implemented via reel 9102 ( i . e ., if required ). the process then continues to fig1 , as indicated at continuation block 1304 . fig1 illustrates a block diagram illustrative of a system 1400 that includes a component placement operation in association with a reel - to - reel mechanism , in accordance with an alternative embodiment of the present invention . parts 1112 and 1114 are depicted in fig1 at time t 9 , following implementation ( i . e ., if necessary ) of an un - reeling operation via reel 910 . parts 1112 and 1114 can then be subject to a component placement operation via a component placement module 1404 . components can be attached to the plastic lead frame structure of parts 1112 and 1114 by a variety of means to establish electrical connections thereof , including techniques such as soldering , conductive adhesion , ultrasonic welding , pressure contact and the like . parts 1112 and 1114 are next shown at time t 10 , prior to implementation of a reeling operation ( i . e ., if required ) via reel 1910 . the process can then continue to fig1 as indicated at continuation block 1408 . fig1 illustrates a block diagram illustrative of a system 1500 that includes a testing operation in association with a reel - to - reel mechanism , in accordance with an alternative embodiment of the present invention . parts 1112 and 1114 are depicted in fig1 at time t 11 , following a reeling operation ( i . e ., if required ) implemented via reel 1502 . parts 1112 and 1114 can then be subject to a testing operation via a testing module 1504 . testing operations implemented via testing module 1504 can include , for example , tests such as functionality and continuity tests . parts 1112 and 1114 are then depicted in fig1 at time t 12 , prior to implementation of an un - reeling operation via reel 910 . the process then continues to fig1 , as indicated at block 1508 . fig1 illustrates a block diagram illustrative of a system 1600 that includes a packaging operation in association with a reel - to - reel mechanism , in accordance with an alternative embodiment of the present invention . an un - reeling operation ( i . e ., if required ) can be implemented via reel 910 . thereafter , at time t 12 , parts 1112 and 1114 are depicted in fig1 prior to implementation of a packaging operation 1604 via a packaging module 1604 . packaging via packaging module 1604 can take into account a variety of packaging operations including , but not limited to thermal packaging , structure packaging , built - in seals , and vibration isolation . such an operational package may include more than one manufacturing step and can additionally require the reel at issue to be unspoiled and re - spooled . parts 1112 and 1114 are then depicted in fig1 at time t 14 , following completion of the packaging operation ( s ) via packaging module 1604 . reel 910 can be then be utilized ( i . e ., if required ) to implement a reeling operation . the process can then continue , as indicated at continuation block 1608 . fig1 illustrates a block diagram illustrative of a system 1700 that includes a final testing operation in association with a reel - to - reel mechanism , in accordance with an alternative embodiment of the present invention . parts 1112 and 1114 are depicted in fig1 at time t 15 , following a reeling operation ( i . e ., if required ) implemented via reel 910 . parts 1112 and 1114 can be subject to one or more testing operations implemented by a testing module 1704 . all final testing much be accomplished prior to shipment of the final product . the testing phase accomplished via testing module 1704 can be implemented following singulation . parts 1112 and 1114 are thereafter depicted in fig1 at time t 16 , prior to implementation of a reeling operation ( i . e ., if required ) via reel 910 . the process then continues to the process depicted in fig1 , as indicated at continuation block 1708 . fig1 illustrates a block diagram illustrative of a system 1800 that includes packing and shipping operations , in accordance with an alternative embodiment of the present invention . in fig1 , an optional “ or ” block 1801 is depicted to indicate that the process can continue to a singulation operation via a singulation module 1802 or directly toward packaging via a packaging module 1804 and a packaging module 1806 . note that in fig9 to 18 , systems 900 - 1800 illustrated therein can constitute an overall system in which parts are reeled / un - reeled , coiled / uncoiled , spooled / unspoiled in and out of various processes implemented respectively via various modules . the desire of the embodiment of fig9 to 18 is to accomplish an entire manufacturing process with the fewest reel - handling operations as possible . the reels depicted in fig9 to 18 can be implemented as multiple reels , a single reel , or only two reels , depending upon design constraints and goals . in the alternative embodiment of fig9 to 18 , a dual - plastic process has been substituted for the camera masking operations depicted in the preferred embodiment of fig1 to 9 . the embodiments and examples set forth herein are presented to best explain the present invention and its practical application and to thereby enable those skilled in the art to make and utilize the invention . those skilled in the art , however , will recognize that the foregoing description and examples have been presented for the purpose of illustration and example only . other variations and modifications of the present invention will be apparent to those of skill in the art , and it is the intent of the appended claims that such variations and modifications be covered . for example , as utilized herein , the terms sensor , sensing element , ic ( integrated circuit ), and die can be utilized to refer to silicon circuitry that permits measurement . it is understood that sensing elements other than silicon can also be implemented in accordance with the embodiments disclosed herein . the description as set forth is not intended to be exhaustive or to limit the scope of the invention . many modifications and variations are possible in light of the above teaching without departing from the scope of the following claims . it is contemplated that the use of the present invention can involve components having different characteristics . it is intended that the scope of the present invention be defined by the claims appended hereto , giving full cognizance to equivalents in all respects .