with reference now to fig2 there is depicted a low inductance multiple resistor engineering change / rework capacitor pad arrangement 200 in accordance with the present invention . the drawings is not in scale and the written dimensions are all in mils ({ fraction ( 1 / 1000 )} inch ). however , it is acknowledged that these dimensions are only by way of example and may be varied in accordance to design constraints , such as the size of smt components . the pad arrangement 200 comprises a first signal pad 202 , a second signal pad 204 , a ground pad 206 and a voltage pad 208 . all pads 202 , 204 , 206 and 208 are made from conductive material . the area between the pads 202 , 204 , 206 and 208 is non conductive , so that the pads 202 , 204 , 206 and 208 are electrically separated from each other . the first signal pad 202 and the second signal pad 204 are both formed by a basically rectangularly shaped central portion 212 and 214 . both show a basically trapezoid extension 216 and 218 . in each of the basically trapezoid extensions 216 and 218 a via 220 and 222 is arranged connecting the first signal pad 202 to a respective pad ( not shown ) on the opposite surface of a pcb ( not shown ) and the second signal pad 204 to a respective pad ( not shown ) on the opposite surface of the pcb ( not shown ), whereby the vias 220 and 222 are formed basically on the edge of the respective pad 202 and 204 which is furthest away from the respective other of both pads 202 and 204 . the voltage pad 208 is formed by a basically square shaped main portion 230 with a basically square shaped extension 232 in one of its corners . in the basically square shaped extension 232 a via 234 is arranged connecting the voltage pad 208 to a supply voltage line ( not shown ) provided on the pcb . like the voltage pad 208 , the ground pad 206 includes as well a basically square shaped main portion 240 with a basically square shaped extension 242 in one of its corners . in the basically square shaped extension 242 a via 244 is arranged connecting the ground pad 206 to a ground line ( not shown ) provided on the pcb . however the ground voltage pad 208 further comprises four basically rectangularly shaped conductive pads 246 , 248 , 250 and 252 which are electrically connected to one another by intermediate conductive portions 254 , 256 , 258 and 260 . both the conductive pads 246 , 248 , 250 and 252 together with the intermediate conductive portions 254 , 256 , 258 and 260 form a integral area of conductive material running from close to the voltage pad 206 around the neighboring second signal pad 204 and basically half way around the first signal pad 202 . one more via 262 is provided in the intermediate portion 258 . now with reference to fig3 there is shown a usecase for employing the pad arrangement of fig2 on a printed circuit board ( pcb ). a pcb 300 comprises a first surface 302 and a second surface 304 . on the first surface 302 there is mounted an integrated circuit 306 having a plurality of pins 308 extending through respective openings 310 provided in the pcb 300 . the integrated circuit 306 is abuts on a support device 312 sitting on to of the first surface 302 of the pcb 300 . on the second surface 304 the tips of the pins 308 extending through the openings 310 provided in the pcb are covered by a housing 314 . further along the pcb on its second surface 304 another electronic device 316 is provided having four pins 318 extending through respective holes 320 formed in the printed circuit board 300 . a first pad arrangement 330 in accordance to the present invention is placed on the first surface 302 of the pcb 300 basically in the middle of the integrated circuit 306 and the pins 318 of the electronic device 316 extending through the pcb . a second pad arrangement 332 is placed inside the housing 314 on the second surface 304 of the pcb 300 . since the pad arrangements 330 and 332 are shown in a cross section according to the line iii - iii of fig2 only two portions of the ground pad 334 and 336 and one signal pad 338 and 349 can be seen from each pad arrangement 330 and 332 . the signal pads 338 and 340 from both pad arrangements 330 and 332 are electrically connected to each other by an embedded wire 342 . the ground pad , however , is connected to a respective ground line ( not shown ) provided on the pcb . as an example of an engineering change or rework a first coaxial cable 344 and a second coaxial cable 346 are employed . both coaxial cables 344 and 346 have a solid central conductor 348 and 350 surrounded by an insulator , in turn surrounded by a cylindrical shield 352 and 354 woven from fine wires . the cylindrical shield 352 of the first coaxial cable 344 is on one side electrically connected to one of the pins 318 of the electronic device 316 . the other side of the cylindrical shield 352 of the first coaxial cable 344 is electrically connected to a portion of the ground pad 334 of the first pad arrangement 330 . the central conductor 348 of the first coaxial cable 344 is on one side electrically connected to another of the pins 318 of the electronic device 316 . the other side of the central conductor 348 of the first coaxial cable 344 is electrically connected to a portion of the signal pad 338 of the first pad arrangement 330 . correspondingly , the cylindrical shield 354 of the second coaxial cable 346 is on one side electrically connected to one of the pins 308 of the integrated circuit 306 . the other side of the cylindrical shield 354 of the second coaxial cable 346 is electrically connected to a portion of the ground pad 336 of the second pad arrangement 332 . the central conductor 350 of the second coaxial cable 346 is on one side electrically connected to another of the pins 308 of the integrated circuit 306 . the other side of the central conductor 350 of the second coaxial cable 346 is electrically connected to a portion of the signal pad 340 of the second pad arrangement 332 . by means of the embedded wire 342 the central conductor 348 of the first coaxial cable 344 is electrically connected to the central conductor 350 of the second coaxial cable 346 , thus , providing a electrical connection from the first surface 302 of the pcb 300 to its second surface 304 . in addition to the first coaxial cable 344 a smt component 356 is electrically connected to the ground pad 334 and the signal pad 338 of the first pad arrangement 330 . [ 0041 ] fig4 shows a pad arrangement 400 . the pad arrangement 400 comprises a first signal pad 402 , a second signal pad 404 , a ground pad 406 and a voltage pad 408 as explained in greater detail with reference to fig2 . to the pad arrangement 400 an engineering change / rework has been applied comprising a first coaxial cable 410 and a second coaxial cable 412 as well as a low inductance bypass capacitor 414 . the low inductance bypass capacitor 414 is electrically connected between the voltage pad 408 and the ground pad 406 . both coaxial cables 410 and 412 have a solid central conductor 416 and 418 surrounded by an insulator , in turn surrounded by a cylindrical shield 420 and 422 woven from fine wires . the cylindrical shield 420 of the first coaxial cable 410 is electrically connected to a portion of the ground pad 406 . the central conductor 416 of the first coaxial cable 410 is electrically connected to the first signal pad 402 . the cylindrical shield 422 of the second coaxial cable 412 is as well electrically connected to a portion of the ground pad 406 . the central conductor 418 of the second coaxial cable 412 , however , is electrically connected to the second signal pad 404 . with reference to fig5 there is depicted the pad arrangement 500 comprises a first signal pad 502 , a second signal pad 504 , a ground pad 506 and a voltage pad 508 as explained in greater detail with reference to fig2 . to the pad arrangement 500 an engineering change / rework has been applied comprising a first coaxial cable 510 and a second coaxial cable 512 as well as a a tie up / tie down engineering change / rework circuitry consisting of a first resistor 514 and a second resistor 515 . the first resistor 514 is electrically connected between the voltage pad 508 and the first signal pad 502 , whereas the second resistor 515 is electrically connected between the ground pad 506 and the second signal pad 504 . both coaxial cables 510 and 512 have a solid central conductor 516 and 518 surrounded by an insulator , in turn surrounded by a cylindrical shield 520 and 522 woven from fine wires . the cylindrical shield 520 of the first coaxial cable 510 is electrically connected to a portion of the ground pad 506 . the central conductor 516 of the first coaxial cable 510 is electrically connected to the first signal pad 502 . the cylindrical shield 522 of the second coaxial cable 512 is as well electrically connected to a portion of the ground pad 506 . the central conductor 518 of the second coaxial cable 512 , however , is electrically connected to the second signal pad 504 . in fig6 a first example of placement overlapping of two pad arrangements as explained in further detail with reference to fig2 is shown in accordance with the present invention . there is depicted a complex pad arrangement 600 basically consisting of a first pad arrangement and a second pad arrangement that is basically a mirrored first pad arrangement . the complex pad arrangement 600 comprises a first signal pad 602 , a second signal pad 604 , a third signal pad 606 and a fourth signal pad 608 . furthermore it comprises a first voltage pad 610 and a second voltage pad 612 and a ground pad 614 . according to the embodiment shown in fig6 the portion of the ground pad running next to the first and second signal pad 602 and 604 is shared . finally with reference to fig7 there is depicted a second example of placement overlapping of two pad arrangements as explained in further detail with reference to fig2 is shown in accordance with the present invention . there is depicted a complex pad arrangement 700 basically consisting of a first pad arrangement and a second pad arrangement that is basically a mirrored first pad arrangement . the complex pad arrangement 700 comprises a first signal pad 702 , a second signal pad 704 , a third signal pad 706 and a fourth signal pad 708 . furthermore it comprises a first voltage pad 710 and a second voltage pad 712 and a ground pad 714 . according to the embodiment shown in fig7 the portion of the ground pad running between the second and the third signal pad 704 and 706 is shared .