[ 0026 ] fig1 is a top view of a voltage partitioned solder - bump package according to the present invention . integrated circuit device 100 includes an integrated circuit chip 105 mounted to a solder - bump package 110 . integrated circuit chip 105 includes a multiplicity of chip pads 115 arranged in a matrix . solder bump package 110 contains a multiplicity of pins 120 arranged in a matrix . pins 120 are used to supply power and signals to integrated circuit chip 105 . within integrated chip 105 is a chip voltage island ( s ) 125 . chip voltage island 125 is powered by both vdd and one or more additional power sources vddx . chip voltage island 125 is connected to a multiplicity of chip voltage island pads 115 a . chip voltage island pads 115 a are a subset of chip pads 115 that are physically located in the outline of the chip voltage island . the outline of a package voltage island 155 , at least a portion of which extends under chip voltage island 125 , is also illustrated in fig1 . [ 0027 ] fig2 is a sectional side view of the voltage partitioned solder - bump package illustrated in fig1 according to the present invention . in fig2 solder - bump package 110 includes a multiplicity of package pads 130 arranged in a matrix on a top surface 135 of the package . pins 120 are arranged in a matrix and protrude from a bottom surface 140 of solder - bump package 110 . solder - bump package 110 contains a multiplicity of signal planes 145 that carry i / o signals between package pads 130 and pins 120 . solder - bump package 110 also contains a multiplicity of power planes 150 that carry vdd , vddx and gnd between package pads 130 and pins 120 . at least a portion of package voltage island 155 extends under and is approximately aligned to chip voltage island 125 . package voltage island 155 is a region of solder - bump package 110 containing package voltage island pins 120 a ( which are a subset of pins 130 ), package voltage island pads 130 a ( which are a subset of package pads 130 ) and wherein package voltage island signal planes 145 a and package voltage island power planes 150 a are dedicated to carry signals and vdd / vddx / gnd respectively only to chip voltage island 125 . it is possible to have non - voltage island pins within the outline of package voltage island 155 . pins 120 are connected to package pads 130 by channels . for example , one package voltage island pin 120 a is electrically connected to one package voltage island pad 130 a by a channel 127 . only one channel is illustrated in fig2 but generally , there is one channel for each package pin 120 and corresponding package pad 130 . package pads 130 are electrically connected to chip pads 115 by solder bumps 160 . in the present example , each signal path includes a pin , a package channel , a package pad , a solder bump and a chip pad . vertical signal and power connections are made by vias ( not illustrated ) extending between signal and power planes through openings in power planes 145 . the solder bump package illustrated in fig2 is a pin grid array ( pga ) package . the present invention may be applied to other package types . examples of other package types include , but are not limited to , ball grid array ( bga ) packages and column grid array ( cga ) packages . obviously , solder - bump package 110 is also a multi - layer package , examples of which include multi - layer ceramic ( mlc ) packages . [ 0030 ] fig3 is a flow diagram describing the method of designing a voltage partitioned solder - bump package according to the present invention . in step 165 , chip voltage island 125 is designed . the method of designing chip voltage island 125 includes determining the current related parameters of the voltage island , the area of the voltage island , assigning chip voltage island pads 115 a to the chip voltage island and creating a model of the chip voltage island . step 165 is illustrated in fig4 and described in more detail below . in step 170 , package voltage island 155 is designed . the method of designing package voltage island 155 includes defining the area of the region of solder - bump package 110 assigned to the package voltage island , defining the shape of the package voltage island and creating a package voltage island inductance model . step 170 is illustrated in fig8 and described in more detail below . in step 175 , the chip voltage island model is combined with the package voltage island inductance model , a noise analysis ( analysis of other electrical attributes such as power supply impedance analysis , power supply resonance analysis , signal integrity analysis and signal jitter analysis may also be done ) is performed and corrective changes to the design of package voltage island 155 are made if necessary . step 175 is illustrated in fig1 , and described in more detail below . [ 0033 ] fig4 is a flow diagram describing in detail step 165 of the flowchart illustrated in fig3 according to the present invention . in step 185 , chip voltage island 125 is defined based on circuit requirements . the voltage supply and power bus distribution of voltage island 125 is separated from the non - voltage island region of chip 105 . the area of chip voltage island 125 is also defined . in step 190 , the number of chip voltage island pads 115 a and their assignments for vdd , vddx , gnd and i / o signals are made . layout of voltage island 125 is also determined . fig5 a and 5b illustrate two example voltage island layouts and pad assignments . in step 195 , based on the circuit requirements for voltage island 125 the average current ( iavg ), the peak current ( ipeak ) and current slew rate ( dl / dt ) can be determined from either the specification of the voltage island or from a circuit model of the voltage island . a typical plot of current vs . time for a voltage island is illustrated in fig6 and described below . next , in step 200 , a chip voltage island model is created . the current requirements determined in step 195 are used as input data to the chip voltage island model . a diagram of a chip voltage island model is illustrated in fig7 and described below . in one example , the chip voltage island model is created from design specifications and inputted to a spice ( simulation program for integrated circuits emphasis ) based software package . spice is a circuit simulator that was originally developed at the electronics research laboratory of the university of california , berkeley ( 1975 ) and many well - known commercial software packages are available . in a spice simulator , the user inputs circuit models in a spice netlist format . the simulator may calculate and plot nodal voltages and currents in both time and frequency domains . [ 0036 ] fig5 a and 5b are diagrams illustrating exemplary layouts of a chip voltage island according to the present invention . in fig5 a , a voltage island 125 a is designed as a rectangle and chip pads have been assigned as signal i / o pads 205 , vdd pads 210 , vddx pads 215 and gnd pads 220 . in fig5 b , a voltage island 125 b is designed in an irregular shape and chip pads have been assigned as signal i / o pads 205 , vdd pads 210 , vddx pads 215 and gnd pads 220 . [ 0037 ] fig6 is a plot of current vs . time illustrating current flow in a voltage island according to the present invention . in fig6 ipeak is the maximum current voltage island 125 draws . generally , voltage island 125 is drawing ipeak for only a short time , but the power buses must be able to supply ipeak without exceeding ir and l dl / dt drop limits . iavg is the time averaged current voltage island 125 is drawing . dl / dt is the rate of rise or fall of current in voltage island 125 . the power buses must be able to supply quick rises and falls in current without exceeding ir and l dl / dt drop limits . [ 0038 ] fig7 is a diagram of an equivalent circuit model of a chip voltage island according to the present invention . in fig7 a chip power bus 225 is modeled as a vddx bus 230 between nodes “ a 1 ” and “ a 2 ” having a series resistance and inductance and parallel capacitance rlc 1 , a gnd bus 235 between nodes “ b 1 ” and “ b 2 ” having a series resistance and inductance and parallel capacitance rlc 2 and a vdd bus 240 between nodes “ c 1 ” and “ c 2 ” having a series resistance and inductance and parallel capacitance rlc 3 . for a simple model , at low frequency , only resistance need be modeled . at edge rate knee frequencies approaching 1 ghz , resistance , capacitance and inductance should be modeled for accuracy . at 10 ghz and higher , resistance , capacitance and inductance almost certainly should be modeled . the load on power bus 225 is modeled as a first load 245 across nodes “ a 1 ” and “ b 1 ,” a second load 250 across nodes “ a 2 ” and “ b 2 ,” a third load 255 across nodes “ c 1 ” and “ b 1 ” and a fourth load 260 across nodes “ c 2 ” and “ b 2 .” first load 245 is modeled as a current source 11 and a resistance , capacitance and inductance rlc 4 . second load 250 is modeled as a current source 12 and a resistance , capacitance and inductance rlc 5 . third load 255 is modeled as a current source 13 and a resistance , capacitance and inductance rlc 6 . fourth load 260 is modeled as a current source 14 and a resistance , capacitance and inductance rlc 7 . first and second loads 245 and 250 are powered by vddx while third and fourth loads 255 and 260 are powered by vdd . while four loads are illustrated in fig7 generally there is a multiplicity of loads vddx is supplied to vddx bus 230 from a vddx chip pad 265 . gnd is supplied to gnd bus 235 from a gnd chip pad 270 . vdd is supplied to vdd bus 240 from a vdd chip pad 275 . there may be multiple vddx , vdd and gnd chip pads . while only one vddx , vdd and gnd chip pads are illustrated in fig7 generally there is a multiplicity of vddx , vdd and gnd pads for each voltage island . fig7 is an example of how the circuits and package may be modeled . the actual model used will depend upon the chip power bus design and types of circuits utilized . voltage drops are calculated at nodes a 1 and a 2 , b 1 and b 2 and c 1 and c 2 . [ 0043 ] fig8 is a flow diagram describing in detail step 170 of the flowchart illustrated in fig3 according to the present invention . in step 280 , package voltage island 155 is defined . package voltage island 155 is defined in the first pass based on the number of signal i / o &# 39 ; s required and the vdd , vddx current requirements of chip voltage island 125 . in step 285 , package voltage island 155 is designed . because of the need to reduce package inductance , package voltage island is placed at least partially under and may extend outward of the outline of chip voltage island 125 . generally package voltage island is one contiguous region that mimics the geometry of chip voltage island 125 with a one to one mapping of chip signal i / o pads to package signal i / o pins , but not necessarily a one to one mapping of vdd , vddx and gnd voltage island chip pads to package voltage island vdd , vddx and gnd pins . an example of mapping a chip voltage island to a package voltage island is illustrated in fig9 and described below . in step 290 , a package voltage island inductance model is created using an electromagnetic field solver . an electromagnetic field solver is a software tool that reads in the geometry ( length and cross - section ) of conductor structures , and given the dielectric constant of the medium , generates the electrical equivalent r ( resistor ), c ( capacitor ) and l ( inductor ) circuit representation at the circuit operating frequency . an example of an electromagnetic field solver software tool is hfss by the ansoft corporation ( pittsburgh , pa .) an example of an a package voltage island inductance model is illustrated in fig1 and described below . [ 0046 ] fig9 is a exemplary diagram illustrating initial definition of the layout of a package voltage island according to the present invention . in fig9 a chip voltage island 125 c on an integrated circuit chip 105 c includes two vdd pads 210 , two vddx pads 215 , four gnd pads 220 and four signal i / o pads 205 a through 205 d . a package voltage island 155 c on an solder - bump package 110 c includes one vdd pin 295 c , one vddx pin 300 c , four gnd pins 305 c and four signal i / o pins 310 a through 310 d . in the completed package design , package voltage island signal i / o pads corresponding to chip voltage island signal i / o pads are wired through channels in the solder - bump package so , after reflow of the solder bumps ( also called c4 solder balls ), signal i / o pad 205 a is electrically connected to signal i / o pin 310 a , signal i / o pad 205 b is electrically connected to signal i / o pin 310 b , signal i / o pad 205 c is electrically connected to signal i / o pin 310 c and signal i / o pad 205 d is electrically connected to signal i / o pin 310 d . package voltage island vdd pads corresponding to chip voltage island vdd pads are wired through power planes in the solder - bump package so , after reflow of the solder bumps vdd pads 210 are electrically connected to vdd pin 295 c . package voltage island vddx pads corresponding to chip voltage island vddx pads are wired through power planes in the solder - bump package so , after reflow of the solder bumps vddx pads 215 are electrically connected to vddx pin 300 c . package voltage island gnd pads corresponding to chip voltage island gnd pads are wired through power planes in the solder - bump package so , after reflow of the solder bumps gnd pads 220 are electrically connected to gnd pins 305 c . while signal i / os are mapped one for one , vdd , vddx and gnd do not need to be mapped one for one . additionally , while voltage island i / o signal wiring and pins as well as voltage island vdd wiring and pins and voltage island vddx wiring and pins must remain within the package voltage island outline . [ 0052 ] fig1 is an equivalent circuit model diagram of a package voltage island according to the present invention . in fig1 , a wiring channel 315 has a first end 320 coupled to a package voltage island pad 130 a and a second end 325 coupled to a package voltage island pin 120 a . a frequency dependent resistor rf 1 is modeled between package voltage island pad 130 a and first end 320 . the field solver represents the inductance of channel 315 on package voltage island power planes 150 a as a network of inductors l 1 through l 1 + n , each inductor coupled to ground through a capacitor c 1 to c 1 + n . [ 0053 ] fig1 is a flow diagram describing in detail steps 175 and 180 of the flowchart illustrated in fig3 according to the present invention . in step 330 , the chip voltage island model is combined with the package voltage island inductance model and inputted to a simulator such as spice . in step 335 , the combined chip voltage island / package voltage island model is analyzed for noise , again using a simulator such as spice . in the present example , the analysis is limited to noise , but other analysis such as power supply impedance analysis , power supply resonance analysis , signal integrity analysis and signal jitter analysis may also be done using similar techniques as used for noise analysis . noise is a voltage spike ( î ″ i ) induced in a quiet channel by an active channel when the active channel is switching . an example of noise induced in a quiet channel by an active channel is illustrated in fig1 and described below . in step 340 , a determination is made if the noise level of the combined chip voltage island / package voltage island model is acceptable ( within specification .) if in step 340 , the noise level is acceptable then the method proceeds to step 345 . in step 345 , a package design specification is generated and the method terminates . a package design specification is illustrated in fig1 and described below . if in step 340 , the noise level is not acceptable then the method proceeds to step 350 . in step 350 , three possible actions may be taken to modify the package voltage island . the first possible action is to add more power pins to the package voltage island . this option is illustrated in fig1 and described below . the second possible action is to increase the area of the package voltage island region of the solder - bump package in order to increase the power pin count . the third possible action is to reassign chip voltage island ( also the corresponding package voltage island pads ) between vdd , vddx and gnd . after one of the actions is taken the method loops to step 280 of fig8 . assignment of another package voltage island pad to a package voltage island is illustrated in fig1 and described below . [ 0056 ] fig1 is a diagram of a noise analysis model of chip voltage island combined with a package voltage island according to the present invention . in fig1 a first driver 355 a on chip voltage island 125 is connected to a first channel 360 a on package voltage island 155 through a first solder - bump 160 . a second driver 355 b on chip voltage island 125 is connected to a second channel 360 b on package voltage island 155 through a second solder - bump 160 . first channel 360 a is designated active as the model simulates a signal to the first channel . second channel 360 b is designated quiet as the model determines what signal is induced in the second channel in responds to first channel 360 a being active . [ 0058 ] fig1 is a plot of voltage vs . time illustrating noise induced in a quiet channel by an active channel according to the present invention . in fig1 as active channel 360 a switches low to high a negative voltage spike 365 a , is induced in quiet channel 360 b . a positive voltage spike 365 b is induced in quiet channel 360 b when active channel 360 a switches from high to low . [ 0059 ] fig1 is partial top view illustrating initial package pins assigned to package voltage island and optionally added package voltage island vddx pin 300 d assigned after noise analysis . in the example of fig1 , package voltage island 155 d is identical to package voltage island 155 c illustrated in fig9 and described above except for the added package voltage island vddx pin 300 d . in other examples the added pin ( s ) may be a vdd or a gnd pin ( s ) [ 0060 ] fig1 is a table illustrating a package design specification according to the present invention . a package design specification includes at least a list of chip pads ids ( solder bump ids ), a list of the corresponding package pin ids and a list of corresponding functions for the chip pads . generally , the method described herein with respect to designing a voltage partitioned solder - bump package is practiced with a general - purpose computer and the method may be coded as a set of instructions on removable or hard media for use by the general - purpose computer . fig1 is a schematic block diagram of a general - purpose computer for practicing the present invention . in fig1 , computer system 400 has at least one microprocessor or central processing unit ( cpu ) 405 . cpu 405 is interconnected via a system bus 410 to a random access memory ( ram ) 415 , a read - only memory ( rom ) 420 , an input / output ( i / o ) adapter 425 for connecting a removable data and / or program storage device 430 and a mass data and / or program storage device 435 , a user interface adapter 440 for connecting a keyboard 445 and a mouse 450 , a port adapter 455 for connecting a data port 460 and a display adapter 465 for connecting a display device 470 . rom 420 contains the basic operating system for computer system 400 . examples of removable data and / or program storage device 430 include magnetic media such as floppy drives and tape drives and optical media such as cd rom drives . examples of mass data and / or program storage device 435 include hard disk drives and non - volatile memory such as flash memory . in addition to keyboard 445 and mouse 450 , other user input devices such as trackballs , writing tablets , pressure pads , microphones , light pens and position - sensing screen displays may be connected to user interface 440 . examples of display devices include cathode - ray tubes ( crt ) and liquid crystal displays ( lcd ). a computer program with an appropriate application interface may be created by one of skill in the art and stored on the system or a data and / or program storage device to simplify the practicing of this invention . in operation , information for or the computer program created to run the present invention is loaded on the appropriate removable data and / or program storage device 430 , fed through data port 460 or typed in using keyboard 445 . the description of the embodiments of the present invention is given above for the understanding of the present invention . it will be understood that the invention is not limited to the particular embodiments described herein , but is capable of various modifications , rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention . therefore , it is intended that the following claims cover all such modifications and changes as fall within the true spirit and scope of the invention .