although the discussion below with respect to embodiments of the present invention is directed to leds for convenience , it should be understood that the invention relates to the use of any light emitting semiconductor . with reference to fig1 , a conventional led assembly is shown generally at 10 . the led assembly includes an led chip 12 mounted on a bottom surface 14 of the led assembly . the led chip 12 emits radiation ( typically uv or blue light in a white light led ). a lens 18 made from a transparent material surrounds the chip 12 and bottom surface 14 . two lead wires 20 connect the chip 12 to a source of power . filling the space 22 between the lens and the chip 12 is typically an epoxy or other transparent material ( not shown ). intimately dispersed within the epoxy are phosphor particles ( not shown ) that absorb at least a portion of the light emitted by the chip 12 and converting it to a different wavelength . while the performance of such leds can be adequate for some applications , they suffer from many of the drawbacks discussed above . thus , the embodiments disclosed below seek to overcome some of the limitations of the conventional leds . with reference to fig2 , a cross - sectional view of one embodiment of the invention is shown . in this embodiment , an led package is provided generally at 110 and includes an led chip 112 mounted on a submount 114 , which in turn is mounted on a reflector 116 . as used herein , “ reflector ” is meant to include not only any surface on the bottom of the led package , but also any other structures meant to support the led chip , e . g . a heat sink , etc . a lens 118 made from a transparent material surrounds the chip 112 and submount 114 and reflector 116 . optionally filling space 122 between the lens and the chip 112 is typically an epoxy or other transparent material . a phosphor layer 124 comprising phosphor particles is applied on an inside or outside surface of the lens 118 . the coating is preferably coated on an inside surface of the lens to prevent the phosphor coating from being displace by handling , etc . the thickness of the phosphor coating should be sufficient to convert at least a portion of the radiation emitted by the led chip to a different wavelength . this may typically be between 6 - 200 μm , with a preferred thickness being between 20 - 30 μm . the led chip 112 can be any conventional uv or blue light led . such leds are known and typically consist of ingan or algan layers epitaxially grown on a sapphire , alumina or single crystal sic substrate . a preferred led chip may have a primary emission in the range of 200 - 480 nm . likewise , the phosphor layer 124 may include one or more suitable fluorescent phosphors capable of absorbing the uv or blue radiation and in turn of producing , either alone or in combination with the radiation emitted by the led chip , a visible white or near - white light for illumination . suitable phosphors for use in the present invention include , but are not limited to , y 3 al 5 o 2 : ce ( yag : ce ), tb 3 al 4 . 9 o 12 : ce ( tag : ce ), and sr 4 al 14 o 25 : eu ( sae ). other white light producing phosphors are also suitable . the size of the phosphor particles is not critical , and may be , by way of example , about 3 - 30 μm in diameter . the lens 118 may be made from any material that is substantially transparent to the radiation emitted by the phosphor and the led chip . thus , depending on the wavelength of the emitted radiation , the lens may comprise various materials including , but not limited to , glass , epoxy , plastic , thermoset or thermoplastic resins , or any other type of led encapsulating material known in the art . the providing of the phosphor coating 124 on an inside surface of the lens 118 rather than dispersed in the epoxy or other fill material provides a more uniform and efficient conversion of the led emission . one advantage is that a uniform coating of controlled thickness may be applied . one benefit of this is that coating thickness can be accurately controlled for optimum conversion efficiency and uv bleed through ( if a uv emitting chip is used ) control using a minimum amount of phosphor . this helps to achieve uniform light emission without incidence of color rings resulting from non - uniform dispersion of the phosphor in prior art devices . another benefit is that the phosphor is remote from the heat generated by the led , further increasing the conversion efficiency . of course , the phosphor layer may be positioned inside the lens material or have a coating of another material positioned over it , and such an arrangement is contemplated by the invention . although not intended to be limiting , the phosphor coating may be applied by , for example , spray coating , roller coating , meniscus or dip coating , stamping , screening , dispensing , rolling , brushing or spraying or any other method that can provide a coating of even thickness . a preferred method for applying the phosphor is by spray coating . in an exemplary technique for coating the lens and reflector parts of the led housing , the phosphor powder is first stirred into a slurry , along with a binder and a solvent . suitable binders include , but are not limited to , silicone , epoxies , thermoplastics , acrylics , polyimides , and mixtures thereof . suitable solvents include , but are not limited to , low boiling point solvents such as toluene , methyl ethyl ketone ( mek ), methylene chloride , and acetone . the amount of each component in the slurry is not critical , but should be chosen so as to produce a slurry that is easily applied to the lens while also containing a sufficient concentration of phosphor particles for efficient conversion of the led radiation . an exemplary slurry can be made using about 2 parts by weight of a 6 μm phosphor , 1 . 2 parts silicone , and 1 part mek . a suitable silicone is ge xe5844 . the slurry is subsequently applied to the surface of the lens . the coated lens may then be baked , heated or otherwise treated to remove the solvent and cure the binder . as used herein , the term “ cure ” is meant to encompass not only actual curing or crosslinking of the binder , but also more generally to indicate any chemical and / or physical change in the binder to a where the phosphor particles become relatively stationary in the binder , typically due to a solidifying or hardening of the binder . as noted above , the slurry can be applied to the lens via any suitable method . in a preferred method , the slurry is applied by spray coating . in this method , the slurry is used to fill the reservoir of a suitable air brush . the slurry is then sprayed using a pressurized spray gun onto the lens , which is preheated and kept on a hot plate at an elevated temperature preferably above the boiling temperature of the solvent , for example at about 110 ° c . the part is sprayed by making successive passes , which may be done at about ½ second per pass . the slurry dries on contact and a uniform coating is achieved . a coating approximately 4 layers thick ( about 20 - 30 μm using 6 μm size phosphor particles ) is achieved on the lens with 35 - 40 passes . the lens is then baked to cure the binder . it is planned that this approach to coating led &# 39 ; s would be used for any led &# 39 ; s for general illumination . if desired , a second coating of a transparent material may be added over the phosphor layer to protect the phosphor or to provide an overcoating to help light extraction . a significant improvement in light output has been achieved using blue led &# 39 ; s with the yag phosphor over the conventional coating method wherein the phosphor is embedded in the slurry and uniformly applied around the chip . clearly there are many other ways to remotely the lens surrounding an led chip . these would be considered within the scope of this invention ; in one preferred embodiment , the lens preferably has a radius that is at least about 2 - 3 times the length (“ l ”) of one side of the chip . this arrangement increases the likelihood that radiation generated or reflected off a coating applied to such a lens is more likely to strike other parts of the coating , where it will be retransmitted , rather than the chip or other non - coated area , where it will be absorbed and lost . in a second embodiment , illustrated in fig3 , an led package is again provided at 210 and includes an led chip 212 mounted on a submount 214 , which in turn is mounted on a reflector 216 . a lens 218 surrounds the chip 212 and submount 214 and reflector 216 . optionally filling space 222 between the lens and the chip 212 is typically an epoxy or other transparent material . to further improve efficiency , a phosphor coating 224 comprising phosphor particles is applied on an inside surface 226 of the lens 218 and on the top surface of the reflector 216 . the top surface of the reflector , which may be thought of as the bottom of the package , is preferably first coated with a reflective layer 240 , such as a high dielectric powder , such as , alumina , titania , etc . a preferred reflective material is al 2 o 3 . the phosphor layer 224 is then placed over the reflective layer 240 on top of the reflector . the use of the reflective layer 240 serves to reflect any radiation 242 that penetrates the phosphor layer 224 on this surface . alternately , instead of coating the transparent lens 118 with a separate phosphor layer 224 , the phosphor may instead be intimately dispersed within the material comprising the transparent hemisphere . the phosphor layer 224 over the reflective layer 240 on the reflector 216 is preferably relatively thick , i . e . & gt ; 5 layers of powder , while the phosphor layer on the curved top of the hemisphere may be adjusted to achieve a desired color and to absorb all radiation incident on it . in general the phosphor layer on the top of the hemisphere will range between 1 - 4 layers thick in the case of blue emitting chips in order that some of the blue radiation be emitted . in the case of uv chips the layer of phosphor coating on the hemisphere should be 4 - 8 layers thick in order to absorb at least most of the uv radiation emitted by the chip . as shown in fig3 , radiation from the chip 242 is prevented from leaving the structure without first striking the phosphor coated surface of the hemisphere . further , the total phosphor coated surface area is much greater than the surface area of the emitting chip , preferably at least 10 times the exposed surface area of the absorbing parts of the led chip . as used herein , the exposed surface area of the absorbing parts of the led include the exposed surface are of the led chip as well as any exposed surface of the submount not covered with a reflective layer and / or a phosphor layer . in such an arrangement , although there may be a significant amount of blue or uv radiation scattered back into the hemisphere , nearly all this radiation , which is diffusely scattered , strikes other parts of the phosphor coating rather than the chip or submount . most of the visible light generated by the phosphor coating also is directed back into the hemisphere . also there is no metallic reflector and no exposed lead structure . the important feature of this geometry is that everything except the led chip 212 is phosphor covered and the phosphor surface area of the hemisphere is much larger , preferably & gt ; 10 times , the surface area of any absorbing parts of the led . therefore , nearly all radiation going back into the hemisphere will strike other phosphor - coated areas and be either reflected or absorbed and retransmitted by the phosphor . the embodiments disclosed herein are calculated to have an efficiency greater than 70 %, and in most cases approaching 100 %. in table 1 the efficiency of this design is compared with several standard led package geometries . these comparisons were made using a computer simulation . the computer simulation is a flux model described below . it considers all the radiation fluxes and assumes that all are diffuse so that the amount of radiation incident on any given surface is proportional to its area . as shown in table 1 the geometry described above provides a package efficiency of essentially 100 %. fig4 shows a second embodiment operating under the same principle . here an led chip 312 is mounted on a pedestal 314 which also serves as the heat sink . however , the chip 312 is placed at the center of a molded sphere 318 . a phosphor layer ( not shown ) is then coated on the inside surface 320 of the sphere 318 or , alternately , intimately dispersed within the sphere . in this design the led will radiate uniformly in all directions . again , it is clear that both blue / uv radiation and visible radiation generated by the phosphor coating and scattered back into the sphere will be more likely to strike other phosphor coated surfaces in preference to striking either the chip 312 or the pedestal 314 . these light absorbing structures are small targets for the diffuse radiation . as seen in table 1 , the package efficiency is close to 100 % for this arrangement . the lower package efficiency for led structure on sic substrates are due to greater absorption of the led radiation by the sic substrate as compared to the al 2 o 3 substrate . from the previous embodiments , it is apparent that the specific shape of the phosphor coating is not important as long as it surrounds as completely as possible the led chip and is a distance sufficient from this chip ( e . g . a distance such that the phosphor coated surface has a surface area greater than about 10 times the exposed surface area of the chip ) such that radiation scattered from the coating is unlikely to strike the chip or chip structures . the invention is not limited to the embodiments described herein but intended to embrace all such coating shapes , and preferably wherein the phosphor covered surfaces has approximately 10 times the exposed area of the absorbing parts of the led or greater . thus , the lens on which the phosphor is coated is not limited to hemispherical or spherical , but can include any geometric shape , preferably with the phosphor coated surface area being about at least 10 times the exposed area of the absorbing parts of the led . the invention is also intended to cover geometries which are not so ideal and perhaps do not give the full advantage of 100 % package efficiency but nevertheless do utilize the principle of a remote phosphor coating designed so that the coated surface is at least 10 times the emitting area of the chip . for example fig5 shows a schematic of a conventional surface mount led . in this arrangement , the led chip 412 and submount 414 are mounted in a reflector cup 416 . unlike the conventional design ( described in the background above ), which has the phosphor embedded more or less randomly in an optical medium between reflector and the lens , the phosphor coating is applied as a layer on a transparent lens 418 . the phosphor coating is remote from the chip 412 and on a surface with about & gt ; 10 times the exposed area of the absorbing parts of the led . obviously , the surface of the lens 418 on which the phosphor coating is applied can have a surface area less than 10 times the surface area of the chip . however , the package efficiency of the assembly will be reduced accordingly , since more of the radiation will strike and be absorbed by the chip . again , a second lens 430 can be mounted over the phosphor coated lens for protection . most of the uv or blue radiation and visible radiation which is scattered back from the phosphor coating strikes either the reflector cup 416 or other phosphor surface . only a relatively small amount strikes the light absorbing chip and submount . in this design it is important that the reflector cup 416 be made of a very highly reflective material , for example a vapor deposited and protected silver coating with & gt ; 95 % reflectivity or an inorganic powder of high purity , such as finely divided alumina or titania . in addition the reflector cup 416 may or may not be coated with the phosphor . table 1 shows the simulated performance of a specific led with an area of 1 . 6 mm 2 on a submount in a silver reflector cup utilizing a phosphor coated lens of area of 27 mm 2 . as shown in fig6 and 7 , the present invention also discloses the concept of a remote phosphor coating as applied to systems containing multiple led chips . multiple blue or uv emitting led &# 39 ; s can be mounted on a single reflective electrical interconnect board or other structure . a phosphor coated surface then is used to surround not a single led but the entire set of led &# 39 ; s . the phosphor coated surface may be used alone or in combination with other highly reflecting surfaces to surround the set of led &# 39 ; s . two examples of such structures are shown in fig6 and 7 . one is a power module 500 which might be used as a downlight . the other is a panel lamp 600 with many led &# 39 ; s mounted behind a phosphor coated panel . it is clear that many such arrangements could be made provided that the phosphor surface area is the preferred 10 times the exposed area of the absorbing parts of the led . as detailed above , any of the embodiments may include an epoxy or other transparent filler between the led chip and the phosphor coated lens . more efficient extraction of light can be realized when the refractive index of the encapsulant or transparent filler is closely matching the geometric mean of the refractive indexes of the die and the lens , preferably within about 20 % of this value , and even more preferably within about 10 %. this reduces the amount of internal reflections in the lamp . thus , in the case of a gan led chip having a refractive index of about 2 . 7 with a lens having a refractive index of about 1 . 5 , the filler will preferably have a refractive index of from about 2 . 1 . in the case of an led chip having two or more materials having different refractive indices , such as a gan semiconductor on a sapphire submount having a refractive index of about 1 . 7 , the refractive index of the encapsulant will preferably match the geometric mean of the lens and the higher of the two . better light extraction can thus be achieved with encapsulants having a higher index of refraction than epoxy , such as spin - on glass ( sog ) or other high refractive index materials . any of the above embodiments can also be equipped with one or more band pass filters to further improve the efficiency of the resulting led package . thus , in one embodiment , as shown in fig9 , a lens 718 for a blue led source is shown containing a first band pass filter 750 . the band pass filter is positioned between the phosphor layer 724 and the led ( not shown ). the band pass filter is selected such that the incident light from the blue led source 752 is allowed to pass while the light emitted from the phosphor layer 754 is reflected outward . in the embodiment shown in fig1 , two band pass filters are provided in a uv led source package . in this embodiment , a first band pass filter 850 is positioned between the phosphor layer 824 and the led source ( not shown ) adjacent a lens 818 . the first band pass filter acts to transmit the uv light 852 from the led while reflecting the light emitted from the phosphor layer 854 . a second band pass filter 856 reflects the uv light from the led 852 while allowing the light emitted from the phosphor layer 854 to pass . this arrangement prevents the transmission of potentially harmful uv radiation from the package while ensuring transmission of visible light . as seen in fig1 , an array of micro or macro lenses 960 may be formed on the outer surface of the lens 918 in any of the above embodiments to control the emission angle , direction or intensity of the emitted radiation 952 and 954 . the calculation results shown in table 1 are based on a linear flux model illustrated in the fig8 . the figure shows nine fluxes incident on four surfaces of the led package . these fluxes are described by the nine linear equations below , with each equation describing the flux with the corresponding number . the equations are : 1 . l 3 out = l 3 + ⁢ t 3 vis 2 . l 3 - = l 3 + ⁢ r 3 vis + i 3 + ⁢ a 3 uv ⁢ q ⁡ ( λ _ i / λ _ l ) ⁢ ( 1 2 ) 3 . l 3 + = l 2 - ⁢ p 23 + l 1 - ⁢ p 13 + l 0 - ⁢ p 03 + i 3 + ⁢ a 3 uv ⁢ q ⁡ ( λ _ i / λ _ l ) ⁢ 1 2 4 . l 2 + = l 3 - ⁢ p 32 + l 1 - ⁢ p 12 + l 0 - ⁢ p 02 + i 2 + ⁢ a 2 uv ⁢ q ⁡ ( λ _ i / λ _ l ) ⁢ 1 2 5 . l 2 - = l 2 + ⁢ r 2 vis 6 . l 1 + = l 3 - ⁢ p 31 + l 2 - ⁢ p 21 + l 0 - ⁢ p 01 7 . l 1 - = l 1 + ⁢ r 1 vis 8 . l 0 + = l 3 - ⁢ p 30 + l 2 - ⁢ p 20 + l 1 - ⁢ p 10 9 . l 0 - = l 0 + ⁢ r 0 vis there are nine other equations describing the blue or uv fluxes . the equations describing the blue or uv fluxes are not shown . they are coupled to the visible light equations through the quantum efficiency q and the stoke &# 39 ; s shift ( λi / λl ). the eighteen linear equations result in eighteen unknowns , i . e . the relative powers of radiation striking each surface , and are solved simultaneously . the p values are the probabilities that radiation from one surface will strike another . in the calculations shown in table i these were taken to be the ratios of surface areas . q is the quantum efficiency of the phosphor . a is the average wavelength of the blue or uv chip radiation or the average wavelength of the visible emission of the phosphor . the other parameters needed are the reflectivities and absorptivities of the different material surfaces . these were obtained either from handbook values or were measured directly using known methods . there are no values for the reflectivities of the chips and so these were calculated by assuming that each chip consisted of the semiconductor layers and substrate . all radiation incident on the chip was assumed to be normal and incident on the substrate in a flip - chip design and diffraction effects were ignored . up to second order the expression for the reflectivity of the chip is then : r = r sub +( 1 − r sub ) 2 exp (− 2 a sub t sub ) r act +( 1 − r sub ) 2 exp (− 2 a sub t sub )( 1 − r act ) 2 exp (− 2a act t act ) r mst . . . known or estimated values were used for the indices of refraction , the absorption coefficients and thicknesses . thus , r =(( n 1 − n 2 ) 2 + k 2 )/( n 1 + n 2 ) 2 + k 2 ), where k = λa / 2π . the invention has been described with reference to the preferred embodiments . obviously , modifications and alterations will occur to others upon reading and understanding the preceding detailed description . it is intended that the invention be construed as including all such modifications and alterations .