hereinafter , the alkali - soluble resins of synthesis examples a - 1 to a - 14 were prepared according to table 1 . a 1000 ml four - necked conical flask equipped with a nitrogen inlet , a stirrer , a heater , a condenser and a thermometer was purged with nitrogen . then , 45 parts by weight of 2 - methacryloyethoxy succinate monoester ( hereinafter as homs ), 1 part by weight of 3 - methacryloxypropyltrimethoxysilane ( hereinafter as mptms ), 3 parts by weight of 3 -( methacryloyl methoxy ) oxetane ( hereinafter as oxma ), 11 parts by weight of dicyclopentenyl acrylate ( hereinafter as fa - 511a ), 20 parts by weight of styrene monomer ( hereinafter as sm ), 5 parts by weight of benzyl methacrylate ( hereinafter as bzma ) and 15 parts by weight of methyl methacrylate ( hereinafter as mma ) were dissolved in 200 parts by weight of ethyl 3 - ethoxypropionate ( hereinafter as eep ), and the aforementioned monomers were fed continuously . after mixed uniformly , the temperature of the oil bath was elevated to 100 ° c . then , 4 parts by weight of 2 , 2 ′- azobis - 2 - methyl butyronitrile ( ambn ) was dissolved in ethyl 3 - ethoxypropionate ( eep ), and the solution containing ambn was separated to five equal parts . one of the five parts was added into the four - necked conical flask every one hour . the reaction temperature of the polymerization process was kept 100 ° c ., and the polymerization time was continued for 6 hrs . after the polymerization process , the polymerized product was obtained from the four - necked conical flask and the solvent was devolatilized so as to produce the alkali - soluble resin ( a - 1 ). synthesis examples a - 2 to a - 14 were synthesized with the same method as in synthesis example a - 1 by using various kinds , amounts of the reactants or the conditions of polymerization for the alkali - soluble resin ( a ). the formulations of synthesis examples a - 2 to a - 14 were listed in table 1 rather than focusing or mentioning them in details . the photosensitive resin compositions of examples 1 to 12 and comparative examples 1 to 8 were prepared according to table 2 and table 3 as follows . 100 parts by weight of the alkali - soluble resin ( a - 1 ), 20 parts by weight of the first compound modified by the alkoxy group ( in which n is 6 and hereinafter as b - 1 - 1 ), 10 parts by weight of dipentaerythritol hexaacrylate ( hereinafter as b - 3 - 1 ), 3 parts by weight of 2 - methyl - 1 -( 4 - methylthio phenyl )- 2 - morpholino - 1 - propanone ( hereinafter as c - 1 ), 3 parts by weight of 2 , 2 ′- bis ( 2 , 4 - dichlorophenyl )- 4 , 4 ′, 5 , 5 ′- tetraphenyl - biimidazole ( hereinafter as c - 2 ), 4 parts by weight of 4 , 4 ′- bis ( diethylamine ) benzophenone ( hereinafter as c - 3 ), 60 parts by weight of c . i . pigment r254 / c . i . pigment y139 = 80 / 20 ( hereinafter as e - 1 ), and 0 . 1 parts by weight of 2 , 2 - thio bis ( 4 - methyl - 6 - tertbutylphenol ) ( hereinafter as f - 2 ) were added into 500 parts by weight of ethyl 3 - ethoxypropionate ( hereinafter as d - 1 ). the aforementioned components were mixed in a shaking type stirrer uniformly , so as to produce the photosensitive resin composition of the example 1 . the resulted photosensitive resin composition was evaluated according to the following evaluation methods , and the result thereof was listed as table 2 . the evaluation methods of the resistance to an alkaline solution and the linearity of the finer pattern were described as follows . examples 2 to 12 and comparative examples 1 to 8 were practiced with the same method as in example 1 by using various kinds or amounts of the components for the photosensitive resin composition . the formulations and evaluation results thereof were listed in table 2 and table 3 rather than focusing or mentioning them in details the photosensitive resin composition of the examples 1 to 12 and comparative examples 1 to 8 were coated on glass substrates , and the size of the glass substrate was 100 mm × 100 mm . next , a reduced - pressure drying was subjected to the glass substrate for 30 seconds under 100 mmhg . then , the aforementioned glass substrate was pre - baked for 2 minutes at 80 ° c . to form a pre - baked and coated film with 2 . 5 μm in thickness . next , the pre - baked and coated film was exposed to 100 mj / cm 2 uv light ( the trade name of the exposing device was canon pla - 501f ). then , the film was baked at 235 ° c . for 30 minutes , so as to form a photosensitive resin layer of 2 . 0 μm in thickness on the glass substrate . the chromaticity ( l * , a * , b *) of the photosensitive resin layer was measured by the chromaticity meter manufactured by otsuka electronics co . ltd . ( the trade name was mpcd ). thereafter , the film was immersed an alkaline solution ( potassium hydroxide , and the concentration is 0 . 5 wt . %) under 23 ° c . for 60 minutes , and the chromaticity was measured again . a chromaticity difference ( δeab *) was calculated according to the following formula ( x ), and an evaluation was made according to the following criterion . δ eab *=[( δ l ) 2 +( δ a ) 2 +( δ b ) 2 ] 1 / 2 ( x ) the photosensitive resin composition of the examples 1 to 12 and comparative examples 1 to 8 were coated on glass substrates , and the size of the glass substrate was 100 mm × 100 mm . next , a reduced - pressure drying is subjected to the glass substrate for 30 seconds under 100 mmhg . then , the aforementioned glass substrate was pre - baked for 2 minutes at 80 ° c . to form a pre - baked and coated film with 2 . 5 μm in thickness . next , the pre - baked and coated film was exposed to 100 mj / cm 2 uv light ( the trade name of the exposing device was canon pla - 501f ) through a mask with a strip - shaped pattern of 25 μm in width ( the pitch of 50 μm ). then , the pre - baked and coated film was immersed in a developing solution under 23 ° c . for 2 minutes and was washed by water . and then the pre - baked and coated film was post - baked under 200 ° c . for 80 minutes so as to form a photosensitive resin layer of 2 . 0 μm in thickness on the glass substrate . next , the strip - shaped pattern on the photosensitive resin layer was observed by an optical microscope . based on a total amount of the strip - shaped pattern was 100 %, a percentage ( p ) of the good linearity of the strip - shaped pattern was then calculated and evaluated according to the following criterion : according to the results of table 2 and table 3 , when the aforementioned alkali - soluble resin ( a ) included the structure of the vinyl unsaturated monomer having the silane group ( a2 ) listed as the formula ( i ), the produced photosensitive resin composition had good linearity of the finer pattern . moreover , when the alkali - soluble resin ( a ) included the structure of the vinyl unsaturated monomer having the oxetanyl group listed as the formula ( iv ), the produced photosensitive resin had good resistance to an alkaline solution . in addition , when the compound having the vinyl unsaturated group ( b ) included the first compound modified by the alkoxy group ( b - 1 ), the produced photosensitive resin composition had good resistance to an alkaline solution . when the compound having the vinyl unsaturated group ( b ) included the second compound modified by the caprolactone group , the produced photosensitive resin had good linearity of the finer pattern . it should be supplemented that , although specific compounds , components , specific reactive conditions , specific processes , specific evaluation methods or specific equipments are employed as exemplary embodiments of the present invention , for illustrating the photosensitive resin composition and the application of the same of the present invention . however , as is understood by a person skilled in the art instead of limiting to the aforementioned examples , the photosensitive resin composition and the application of the same of the present invention also can be manufactured by using other compounds , components , reactive conditions , processes , analysis methods and equipment without departing from the spirit and scope of the present invention . although the present invention has been described in considerable detail with reference to certain embodiments thereof , other embodiments are possible . therefore , the spirit and scope of the appended claims should not be limited to the description of the embodiments contained herein .