as illustrated with approximately 3000 × magnification in fig1 and other relevant drawing figures , a single inkjet nozzle device is shown as a portion of a chip that is fabricated by integrating mems and cmos technologies . the complete nozzle device includes a support structure having a silicon substrate 20 , a metal oxide semiconductor layer 21 , a passivation layer 22 , and a non - corrosive dielectric coating / chamber - defining layer 23 . the nozzle device incorporates an ink chamber 24 which is connected to a source ( not shown ) of ink and , located above the chamber , a nozzle chamber 25 . a nozzle opening 26 is provided in the chamber - defining layer 23 to permit displacement of ink droplets toward paper or other medium ( not shown ) onto which ink is to be deposited . a paddle 27 is located between the two chambers 24 and 25 and , when in its quiescent position , as indicated in fig1 and 7 , the paddle 27 effectively divides the two chambers 24 and 25 . the paddle 27 is coupled to an actuating arm 28 by a paddle extension 29 and a bridging portion 30 of the dielectric coating 23 . the actuating arm 28 is formed ( i . e . deposited during fabrication of the device ) to be pivotable with respect to the support structure or substrate 20 . that is , the actuating arm has a first end that is coupled to the support structure and a second end 38 that is movable outwardly with respect to the support structure . the actuating arm 28 comprises outer and inner arm portions 31 and 32 . the outer arm portion 31 is illustrated in detail and in isolation from other components of the nozzle device in the perspective view shown in fig3 . the inner arm portion 32 is illustrated in a similar way in fig4 . the complete actuating arm 28 is illustrated in perspective in fig5 , as well as in fig1 , 8 , 9 and 10 . the inner portion 32 of the actuating arm 28 is formed from a titanium - aluminium - nitride ( tial ) n deposit during formation of the nozzle device and it is connected electrically to a current source 33 , as illustrated schematically in fig1 , within the cmos structure . the electrical connection is made to end terminals 34 and 35 , and application of a pulsed excitation ( drive ) voltage to the terminals results in pulsed current flow through the inner portion only of the actuating arm 28 . the current flow causes rapid resistance heating within the inner portion 32 of the actuating arm and consequential momentary elongation of that portion of the arm . the outer arm portion 31 of the actuating arm 28 is mechanically coupled to but electrically isolated from the inner arm portion 32 by posts 36 . no current - induced heating occurs within the outer arm portion 31 and , as a consequence , voltage induced current flow through the inner arm portion 32 causes momentary bending of the complete actuating arm 28 in the manner indicated in fig8 and 10 of the drawings . this bending of the actuating arm 28 is equivalent to pivotal movement of the arm with respect to the substrate 20 and it results in displacement of the paddle 27 within the chambers 24 and 25 . an integrated movement sensor is provided within the device in order to determine the degree or rate of pivotal movement of the actuating arm 28 and in order to permit fault detection in the device . the movement sensor comprises a moving contact element 37 that is formed integrally with the inner portion 32 of the actuating arm 28 and which is electrically active when current is passing through the inner portion of the actuating arm . the moving contact element 37 is positioned adjacent the second end 38 of the actuating arm and , thus , with a voltage v applied to the end terminals 34 and 35 , the moving contact element will be at a potential of approximately v / 2 . the movement sensor also comprises a fixed contact element 39 which is formed integrally with the cmos layer 22 and which is positioned to be contacted by the moving contact element 37 when the actuating arm 28 pivots upwardly to a predetermined extent . the fixed contact element is connected electrically to amplifier elements 40 and to a microprocessor arrangement 41 , both of which are shown in fig1 and the component elements of which are embodied within the cmos layer 22 of the device . when the actuator arm 28 and , hence , the paddle 27 are in the quiescent position , as shown in fig1 and 7 , no contact is made between the moving and fixed contact elements 37 and 39 . at the other extreme , when excess movement of the actuator arm and the paddle occurs , as indicated in fig8 and 9 , contact is made between the moving and fixed contact elements 37 and 39 . when the actuator arm 28 and the paddle 27 are actuated to a normal extent sufficient to expel ink from the nozzle , no contact is made between the moving and fixed contact elements . that is , with normal ejection of the ink from the chamber 25 , the actuator arm 28 and the paddle 27 are moved to a position partway between the positions that are illustrated in fig7 and 8 . this ( intermediate ) position is indicated in fig1 , although as a consequence of a blocked nozzle rather than during normal ejection of ink from the nozzle . fig1 shows an excitation - time diagram that is applicable to effecting actuation of the actuator arm 28 and the paddle 27 from a quiescent to a lower - than - normal ink ejecting position . the displacement of the paddle 27 resulting from the excitation of fig1 is indicated by the lower graph 42 in fig1 , and it can be seen that the maximum extent of displacement is less than the optimum level that is shown by the displacement line 43 . fig1 shows an expanded excitation - time diagram that is applicable to effecting actuation of the actuator arm 28 and the paddle 27 to an excessive extent , such as is indicated in fig8 and 9 . the displacement of the paddle 27 resulting from the excitation of fig1 is indicated by the upper graph 44 in fig1 , from which it can be seen that the maximum displacement level is greater than the optimum level indicated by the displacement line 43 . fig1 , 16 and 17 shows plots of excitation voltage , actuator arm temperature and paddle deflection against time for successively increasing durations of excitation applied to the actuating arm 28 . the device can be calibrated to determine an optimal level of displacement of the actuator arm by applying a series of current pulses of increasing duration as shown in fig1 . from these current pulses , the relationship between the current pulse width and displacement can be determined , which relationship can also determine the minimum current pulse to achieve correct operation , as indicated by the test level line in fig1 . by correctly calibrating the device , minimum energy can be applied to the device while still achieving correct operation . the plots shown in fig1 , 16 and 17 also have relevance to fault detection in the nozzle device . when detecting for a fault condition in the nozzle device or in each device in an array of the nozzle devices , a series of current pulses of successively increasing duration t p are induced to flow that the actuating arm 28 over a time period t . the duration t p is controlled to increase in the manner indicated graphically in fig1 . each current pulse induces momentary heating in the actuating arm and a consequential temperature rise , followed by a temperature drop on expiration of the pulse duration . as indicated in fig1 , the temperature rises to successively higher levels with the increasing pulse durations as shown in fig1 . as a result , as indicated in fig1 , under normal circumstances the actuator arm 28 will move ( i . e . pivot ) to successively increasing degrees , some of which will be below that required to cause contact to be made between the moving and fixed contact elements 37 and 39 and others of which will be above that required to cause contact to be made between the moving and fixed contact elements . this is indicated by the “ test level ” line shown in fig1 . however , if a blockage occurs in a nozzle device , as indicated in fig1 , the paddle 27 and , as a consequence , the actuator arm 28 will be restrained from moving to the normal full extent that would be required to eject ink from the nozzle . as a consequence , the normal full actuator arm movement will not occur and contact will not be made between the moving and fixed contact elements 37 and 39 . if such contact is not made with passage of current pulses of the predetermined duration t p through the actuating arm , it might be concluded that a blockage has occurred within the nozzle device . this might then be remedied by passing a further current pulse through the actuating arm 28 , with the further pulse having an energy level significantly greater than that which would normally be passed through the actuating arm . if this serves to remove the blockage ink ejection as indicated in fig9 will occur . as an alternative , simpler , procedure toward fault detection , a single current pulse as indicated in fig1 may be induced to flow through the actuator arm and detection be made simply for sufficient movement of the actuating arm to cause contact to be made between the fixed and moving contact elements . variations and modifications may be made in respect of the device as described above as a preferred embodiment of the invention without departing from the scope of the appended claims .