a method for fabricating a semiconductor package is provided , which includes the steps of : providing a first substrate having a plurality of first conductive posts on a surface thereof and providing a second substrate having a third surface having a chip disposed thereon and a fourth surface opposite to the third surface ; disposing the first substrate on the third surface of the second substrate through the first conductive posts ; forming an encapsulant between the first substrate and the second substrate , wherein the encapsulant has a first surface adjacent to the first substrate and a second surface opposite to the first surface ; and removing the first substrate , thereby effectively preventing solder bridging from occurring .