a method of the present invention is used for the high - rate deposition of materials , such as carbon , silicon , metals , metal oxides , and the like , onto a metal substrate defined by a metal current collector . the particles of the material are mixed with fluid and are injected against the metal tape at high pressure and high velocity . the particles of the material form an active layer of the metal current collector . the metal current collector is used as a cathode or anode combined with a separator to form a cell of a secondary battery , metal - ceramic membranes , film composite metal - ceramic materials for electronic devices .