a semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades . the wafer saw , because of its variable indexing capabilities , can dice wafers having a plurality of differently sized semiconductor devices thereon into their respective discrete components . in addition , the wafer saw with its multiple blades , some of which may be independently laterally or vertically movable relative to other blades , can more efficiently dice silicon wafers into individual semiconductor devices .