a process for forming a releasable metal film includes depositing a metal onto a polymeric sheet such that the metal layer provides a low adhesive interface and exhibits relatively low stress . a barrier layer is then deposited onto the surface of the low adhesion interface . a thin film of a stress relief layer of silicon dioxide , aluminum oxide , copper or aluminum is then deposited followed by addition of a second barrier layer onto the stress relief layer . the stress relief layer provides compressive relief to balance the tensile stress of the so - stacked metal films . an additional solderable layer maybe added for soldering applications . to fabricate the working device with sputtering tools , an extremely high gas pressure is used to achieve low adhesion force between the wettable metallic layer and the polymeric carrier film .