printed circuit boards are disclosed comprising a support which on a major side carries circuit components in a desired design and on a second major side carries the soldered wires corresponding to said circuit components . manufacturing of the pcbs is carried out by producing respective designs of the component and soldering sides as labile electrostatic images on which conductive metallic powder is applied . the so obtained images are printed on respective insulating sheets , one with the component side design , and another with the solder side design . the thus printed sheets are fixed on the pcb support , and the conductive designs are treated to increase the thickness of the design .