electrodes and lead - out terminals of semiconductor devices employ fine wire interconnections which require forming into a predetermined configuration . the method of the present invention provides several novel steps in a sequence of steps which causes the interconnection wire to be shaped in an extremely desirable configuration free of slack . the method is characterized by first preforming a portion of the wire in a direction opposite the direction of the desired interconnection and subsequently reforming the preformed portion of wire while the remainder of the interconnection wire is being formed in tension .