a manufacturing method for a semiconductor device which is capable of manufacturing the semiconductor device with a high quality in high yields while reducing variations in electric characteristic is disclosed . the manufacturing method according to the present invention includes a main body wafer manufacturing process for manufacturing a wafer on which a semiconductor device to be completed as a product is formed and a monitor wafer manufacturing process for manufacturing a wafer on which a monitor element is formed , the processes sharing a monitoring step alone , the main body wafer manufacturing process including a variation reduction step , the monitor wafer manufacturing process including , a quality check step and a condition setting step .