the invention relates generally to a system and method for improved cleaning of workpieces and workpiece cleaning tools . more specifically , the invention provides systems and methods for cleaning workpieces and sponges by manipulating the surface charge of one or more sponges by exposing them to various cleaning fluids . in one embodiment , sponges such as pva sponges , having either positive , negative or neutral charges , are used to clean surfaces of workpieces such as semiconductor wafers . while cleaning a workpiece , a sponge may be exposed to a workpiece cleaning fluid , which may or may not alter the surface charge of the sponge . after cleaning the workpiece , the sponge may be exposed to a sponge cleaning fluid , which may or may not alter the surface charge of the sponge . manipulating the surface charge of a sponge during and / or after cleaning of a workpiece may enhance cleaning of the workpiece , by attracting oppositely charged particles and / or repelling similarly charged particles from the workpiece surface . manipulating the surface charge of a sponge may also enhance cleaning of the sponge , by reducing or eliminating the attractive forces between the surface of the sponge and the charged particles attached to it .