in an encapsulated semiconductor module in which a semiconductor chip , having a major surface with terminals thereon , is deposed within the encapsulating material , a plurality of self - supporting , unitary , discrete , and continuous lead frame conductors formed of metal sheet stock are positioned at various locations around the chip and cantilevered out of the encapsulating material , so that discrete wires can be used to connect respective ones of said conductors to respective ones of said terminals . in the present invention excessively long bonding wires are avoided by connecting a selected one of said lead frame conductors to a parallel conductor by a jumper wire and connecting the parallel conductor to the desired terminal with a short wire .