a method of forming a connection is comprised of the steps of depositing a lower conductor . a dielectric layer is deposited on the lower conductor , with the dielectric layer having a lower surface adjacent to the lower conductor , and having an upper surface . an opening extending between the upper surface and the lower surface of the dielectric layer is formed . a conductive plug is deposited within the opening , with the plug having an upper surface proximate the upper surface of the dielectric layer . the upper surface has an edge where the upper surface of the plug is adjacent to the dielectric layer . a recess is formed proximate to the edge of the upper surface of the plug , the recess extending into both the plug and the dielectric layer . finally , an upper conductor is deposited on the upper surface of the dielectric layer and the upper surface of the plug . a connection thus formed is also disclosed .