the invention is directed to a method of bonding a hermetically sealed electronics package to an electrode or a flexible circuit and the resulting electronics package that is suitable for implantation in living tissue , such as for a retinal or cortical electrode array to enable restoration of sight to certain non - sighted individuals . the hermetically sealed electronics package is directly bonded to the flex circuit or electrode by electroplating a biocompatible material , such as platinum or gold , effectively forming a plated rivet - shaped connection , which bonds the flex circuit to the electronics package . the resulting electronic device is biocompatible and is suitable for long - term implantation in living tissue .