a bump forming method and apparatus by which no deformed bump having an abnormal shape is formed and no shape correcting process is necessary , the member for handling the bump materials can be easily changed , and the position of the member after the change of the member can be easily adjusted with a desired accuracy , thereby shortening the bump forming process and reducing the manufacturing cost . a positioning member is set above a heating device . bump materials are inserted into positioning holes of the positioning member and are made to partially protrude from the holes toward a side opposite to the heating device . a semiconductor substrate is positioned onto the positioning member so that the semiconductor substrate faces the protruding side of the bump materials . the bump materials are heated and pressed from the protruding side via the semiconductor substrate so as to form bumps having a specific shape .