when a material of an organic substrate is glass epoxy and a material of a semiconductor chip is silicon or gallium arsenide , a substrate warp sometimes occurs because of a difference between thermal expansion coefficients of the materials . the shape of the antenna formed on the organic substrate due to such a substrate warp , so that the characteristics of the antenna are sometimes shifted from desired values . an antenna is provided on the substrate on which a semiconductor chip is mounted , and is covered with a resin . the resin has enough hardness to suppress the warp caused by joining the semiconductor chip and the substrate and a transformation of the antenna . by changing a connection relation of adjustment vias after the manufacture of the semiconductor device , the characteristic of the antenna can be changed .