this invention discloses a integrated circuit chip having a plurality of modular cells , the chip comprises a first modular cell having a first metal layer , which contains at least two power lines independent of each other ; and a second modular cell , juxtaposed to the first modular cell , also having the first metal layer , which contains at least two power lines independent of each other , wherein all the power lines on the first metal layer serving the first modular cell do not extend into the second modular cell , and all the power lines on the first metal layer serving the second modular cell do not extend into the first modular cell .