a template wafer fabrication process is disclosed for high density indium bumping of microchips by using an innovative template wafer upon which the bumps are initially fabricated . once fabricated , these bumps are transferred to the microchip , after which can be hybridized to another microchip . such a template wafer is reusable , and thus provides an economical way to fabricate indium bumps . reusability also eliminates nonuniformities in bump shape and size in serial processing of separate microchips , which is not the case for other indium bump fabrication processes . such a fabrication process provides a way to form relatively tall indium bumps and accomplishes this without the standard thick photoresist liftoff process . the described process can be suitable for bump pitches under 10 microns , and is only limited by the resolution of the photolithography equipment used .