a processes for manufacturing actuating assembly for tuning a circuit by forming a carrier substrate containing a membrane , a conductive layer , and piezoelectric actuators are disclosed . the process includes the steps of : providing a substrate having a bottom protective layer on a bottom side and etched trenches on a top side ; depositing a top protective layer on the top side of the substrate ; depositing a first conductive layer on the top protective layer ; patterning the first conductive layer ; patterning the bottom protective layer to form an etch mask aligned with the patterned first conductive layer ; forming a piezoelectric structure on the top side of the substrate ; depositing a membrane layer along the top side of the substrate and above the piezoelectric structure ; curing the membrane layer ; depositing a second conductive layer on the cured membrane layer ; depositing a protective photoresist layer on the second conductive layer ; patterning and hard - baking the photoresist layer ; removing a portion of the substrate from the bottom side of the substrate , forming an etched opening in the substrate ; removing a portion of the top protective layer ; removing a portion of the second conductive layer to form a patterned second conductive layer ; and removing the patterned photoresist layer . changes in shape of the resulting piezoelectric arrangement allow a deflection of the membrane and a corresponding controllable upward or downward movement of the conductive element .