a semiconductor package device , a semiconductor package structure , and fabrication methods thereof are provided , which mainly includes disposing a plurality of semiconductor chips on a wafer formed with tsvs and electrically connecting the semiconductor chips to the tsvs ; encapsulating the semiconductor chips with an encapsulant ; and disposing a hard component on the encapsulant . the hard component ensures flatness of the wafer during a solder bump process and provides support to the wafer during a singulation process such that the wafer can firmly lie on a singulation carrier , thereby overcoming the drawbacks of the prior art , namely difficulty in mounting of solder bumps , and difficulty in cutting of the wafer .