methods of applying film to substrates are provided wherein the film matingly conforms to the configuration of the substrate , including areas adjacent protrusions or depressions in the substrate . in certain embodiments , the film is punctured by a probe and a vacuum is applied to the probe in order to aspirate air and urge the film toward a position of compliance with the substrate . optionally , the film is softened by heat in order to facilitate conformance with the shape of the substrate .