the present invention is directed to a probe head having a probe contactor substrate with at least one slot that passes through the probe contactor substrate , at least one probe contactor adapted to test a device under test , with the probe contactor being coupled to the a top side of the probe contactor substrate and electrically connected to a terminal also disposed on top of the probe contactor substrate , and a space transformer having at least one bond pad coupled to a top side of the space transformer , and a bond interconnect which electrically couples the bond pad to the terminal through the slot in the probe contactor substrate .