a high density integrated test probe and method of fabrication is described . a group of wires are ball bonded to contact locations on the surface of a fan out substrate . the wires are sheared off leaving a stub , the end of which is flattened by an anvil . before flattening a sheet of material having a group of holes is arranged for alignment with the group of stubs is disposed over the stubs . the sheet of material supports the enlarged tip . the substrate with stubs form a probe which is moved into engagement with contact locations on a work piece such as a drip or packaging substrate .