a light emitting device comprises a flip - chip light emitting diode die mounted on a submount . the top surface of the submount has a reflective layer . over the led die is molded a hemispherical first transparent layer . a low index of refraction layer is then provided over the first transparent layer to provide tir of phosphor light . a hemispherical phosphor layer is then provided over the low index layer . a lens is then molded over the phosphor layer . the reflection achieved by the reflective submount layer , combined with the tir at the interface of the high index phosphor layer and the underlying low index layer , greatly improves the efficiency of the lamp . other material may be used . the low index layer may be an air gap or a molded layer . instead of a low index layer , a distributed bragg reflector may be sputtered over the first transparent layer .