a sputtering apparatus includes a first cover surrounding a periphery of a target , having a first opening through which sputtered particles from the target are emitted , and being made of a conductive material ; a second cover having a second opening through which the sputtered particles from the target are adhered onto a substrate , the second cover being made of a conductive material ; an o - ring placed between the first cover and the second cover to allow the first opening and the second opening to communicate with each other via a hollow center portionof the o - ring , the o - ring being made of an insulating material ; and a third cover placed via an insulating material over a face of at least one of the first cover and the second cover facing the o - ring , the third cover being made of a conductive material .