after the resist is removed with an alkaline solution , a noncorrosive rinse solution is applied to the substrate which is composed of a water - soluble monovalent lower alcohol and an organic or inorganic acid , or a water - soluble monovalent lower alcohol , an organic or inorganic acid and water or an organic or inorganic acid . this rinse solution prevents corrosion completely when a resist is removed from al - si - cu wiring : material , which is widely used as the wiring material for high - density integrated circuits .