this invention is directed to a polymer thick film transparent conductive composition with haptic response capability that may be used in applications where thermoforming of the base substrate occurs , e . g ., as in capacitive switches . polycarbonate substrates are often used as the substrate and the polymer thick film conductive composition may be used without any barrier layer . depending on the specific design , the thermoformable transparent conductor may be below or on top of a thermoformable silver conductor . thermoformable electric circuits benefit from the presence of an encapsulant layer over the dried polymer thick film conductive composition . the electrical circuit is subsequently subjected to an injection molding process .