an electrostatic chuck comprises a ceramic body having a first surface and a second surface that is on an opposite side of the ceramic body to the first surface , the ceramic body comprising a through - hole between the first surface and the second surface . the electrostatic chuck further comprises a thermally conductive base that supports the ceramic body and comprises a second hole that lines up with the through - hole , wherein the second hole is to fluidly couple to a source of heat transfer gas . the electrostatic chuck further comprises a bonding layer between the ceramic body and the thermally conductive base , the bonding layer comprising a space between an opening of the through - hole on the second surface and the gas introduction path .