an electronic device packaging apparatus using molding techniques is provided . this packaging apparatus includes an upper die , a lower die , and a resin injection mechanism . the lower die is designed to mate with the upper die , and includes a cavity block which has an upper block surface and a lower block surface . the upper block surface has formed therein a mold cavity for packaging an electronic device placed between the upper and lower dies with a resin material . the lower block surface has formed therein a groove communicating with the mold cavity . the resin injection mechanism is operable to inject a melted resin material into the mold cavity of the cavity block through the groove formed in the lower block surface of the cavity block .