a self - contained liquid cooled heat sink system disposed in a computer has a plurality of socket portions through which a cooling liquid is pumped . operating heat from a plurality of heat - generating computer components , representatively circuit board - mounted processor chips , is efficiently transferred to the heat sink system by heat pipe modules associated with the heat - generating components . each module includes an evaporator plate held in thermal contact with its associated component , a condenser plate removably plugged into one of the sockets and in a heat transfer relationship therewith , and a plurality of thermosyphoning type heat pipes interconnected between the evaporator and condenser plates . the use of the heat pipe modules permits rapid and easy pull - away electrical and cooling system disconnection for each processor board as well as providing for effective cooling of the processors without the necessity of forcing a flow of air across them .