a compact resistive thermal sensor is provided for an integrated circuit , wherein different sensor components are placed on different layers of the ic . this allows the lateral area needed for the sensor resistance wire on any particular ic layer to be selectively reduced . in a useful embodiment , a conductive element extending between first and second layers for connecting said first and second conductive paths into a single continuous conductive path having a resistance that varies with temperature . the sensor is responsive to electric current sent through said continuous path for determining temperature proximate to said continuous path from said path resistance .