there is disclosed apparatus for socketing and testing integrated circuits , particularly rf and high - frequency integrated circuits in high density and fine pitch packages , and methods of operating the same . an exemplary apparatus includes an air machine and a housing . the housing includes a universal printed circuit board that is operable to receive a device under test , a controller that is operable to control testing of the received device under test , and a power supply . the housing and the air machine are associable to form an at least substantially air - tight chamber ensconcing the received device under test .