an integrated device includes a redundant bond pad for accessing internal circuitry in the event that the main bond pad for that circuitry is difficult to access with testing equipment . signals from the redundant bond pad are biased to ground during normal operations of the integrated device . in order to test the relevant internal circuitry , a voltage is applied to a test mode enable bond pad , overcoming the bias that grounds the redundant bond pad . in addition , the signal from the test mode enable bon pad serves to ground any transmission from the main bond pad . as a result , the bond pad may be used to test the relevant internal circuitry given its accessible location in relation to the testing equipment .