a printed wiring board comprising a main printed wiring board provided with a first wiring pattern , and an auxiliary flexible printed wiring board , provided with a second wiring pattern for modifying the first wiring pattern and bonded to the main printed wiring board so as to electrically connect the second wiring pattern to a desired part of the first wiring pattern . the auxiliary board may be affixed to the main board with a pressure - sensitive adhesive or thermosetting adhesive . the auxiliary board may be provided with marks for facilitating alignment , holes to provide access to the main board , a dummy pattern for preventing tears of the flexible auxiliary board , and a second dummy pattern to prevent warping from uneven stresses applied to the flexible auxiliary board by differences in thermal expansion of the auxiliary board and the pattern printed thereon . a method of making the board is also disclosed and claimed .