according to an aspect of the present invention , there is provided a semiconductor device manufacturing method , including : preparing a support plate having a mounting portion on which a mounting terminal is mountable ; preparing a circuit board having a mounting surface on which a semiconductor chip is mounted and a connection pad is formed ; bringing the support plate to face the mounting surface of the circuit board , and connecting the support plate to the connection pad through the mounting terminal ; forming a resin layer between the support plate and the mounting surface of the circuit board to cover the mounting terminal ; and removing the support plate , thereby faulting a via in the resin layer along a shape of the mounting portion so as to expose the mounting terminal therethrough .