a second semiconductor chip and a junction member are mounted on a first semiconductor chip formed with a plurality of first pads on a surface thereof . a resin encapsulating body is provided which seals the first semiconductor chip , the second semiconductor chip and the junction member . the second semiconductor chip includes a plurality of second pads arranged in a central part thereof . the junction member includes first junction pads , second junction pads and connecting portions which connect the first junction pads and the second junction pads respectively . electrical connections of the second semiconductor chip from the second pads include connections to connecting terminals and connections to the connecting terminals or the first semiconductor chip from the second junction pads via the first junction pads .