a capacitance coupled , transmission line - fed , radio frequency mems switch and its fabrication process using photoresist and other low temperature processing steps are described . the achieved switch is disposed in a low cost dielectric housing free of undesired electrical effects on the switch and on the transmission line coupling the switch to an electrical circuit . the dielectric housing is provided with an array of sealable apertures useful for wet , but hydrofluoric acid - free , removal of switch fabrication employed materials and also useful during processing for controlling the operating atmosphere surrounding the switch — e . g . at a pressure above the high vacuum level for enhanced switch damping during operation . alternative arrangements for sealing an array of dielectric housing apertures are included . processing details including plan and profile drawing views , specific equipment and materials identifications , temperatures and times are also disclosed .