a method is provided for forming at least one raised metallic contact on an electrical circuit . generally , this method includes the following steps : providing a composite base substrate which is defined by at least a first conductive layer , a dielectric material and a second conductive layer ; removing a portion of the first conductive layer to expose the dielectric material ; removing the exposed portion of the dielectric material to the second conductive layer , thereby forming a depression ; depositing at least one layer of conductive material on at least side wall portions of the depression ; removing the second conductive layer ; and completely removing the dielectric material to said first conductive layer thereby forming a raised metallic contact which extends perpendicularly away from the first conductive layer .