disclosed is an optical modulator module including an optical modulator configured to have a signal electrode and a ground electrode ; a conductive package configured to accommodate the optical modulator and have electrical continuity with the ground electrode of the optical modulator ; a substrate configured to have a ground electrode on a first surface thereof electrically connected to the package by solder or a conductive adhesive and have a signal electrode on another surface thereof ; and a lead pin configured to electrically connect the signal electrode of the optical modulator to the signal electrode of the substrate .