a structure formed in an opening having a substantially vertical sidewall defined by a non - metallic material and having a substantially horizontal bottom defined by a conductive pad , the structure including a diffusion barrier covering the sidewall and a fill composed of conductive material . the structure including a first intermetallic compound separating the diffusion barrier from the conductive material , the first intermetallic compound comprises an alloying material and the conductive material , and is mechanically bound to the conductive material , the alloying material is at least one of the materials selected from the group of chromium , tin , nickel , magnesium , cobalt , aluminum , manganese , titanium , zirconium , indium , palladium , and silver ; and a first high friction interface located between the diffusion barrier and the first intermetallic compound and parallel to the sidewall of the opening , wherein the first high friction interface results in a mechanical bond between the diffusion barrier and the first intermetallic compound .