the invention relates to a cooling structure of an electronic equipment needing forced - air - cooling by fans and so force and has an object to enhance a cooling capacity and enhance a mounting efficiency of the substrate units . the cooling structure of an electronic equipment needing forced - air - cooling comprises , to achieve the above object , substrate housing parts , an upstream side duct , a downstream side duct , exhaust means and air adjusting means . the substrate housing parts detachably house therein one or plurality of substrate units , and the downstream side duct allows the air for cooling which passed from the upstream side duct through the substrate housing part to flow . the exhaust means is provided at the exhaust part to forcibly discharge air to the outside air , thereby allowing the air for cooling to flow to the substrate housing parts , and the air adjusting means adjusts the air for cooling which flows to the downstream side duct .