a semiconductor device package which can be readily mounted on a printed circuit board without requiring soldering or intermediate connectors . a supporting substrate has a unique lead frame configuration thereon in which the leads extend around side portions of the substrate and form integral spring contacts projecting from the lower surface of the substrate . the package preferably includes a metallic stud having a head portion mounted in the substrate for receiving a semiconductor device and a rod portion extending from the lower surface of the substrate . the rod portion of the stud can be removably secured in an aperture in a printed circuit board to engage the spring contacts with corresponding conductors on the circuit board .