a mosfet die and a schottky diode die are mounted on a common lead frame pad and their drain and cathode , respectively , are connected together at the pad . the pad has a plurality of pins extending from one side thereof . the lead frame has insulated pins on its opposite side which are connected to the fet source , the fet gate and the schottky diode anode respectively by wire bonds . the lead frame and die are molded in an insulated housing and the lead frame pins are bent downwardly to define a surface - mount package .