a first resin encapsulated body and a second resin encapsulated body are stacked to form a resin - encapsulated semiconductor device . the first resin encapsulated body includes : a first semiconductor element ; an external terminal ; inner wiring ; and a first resin for covering those components , at least a rear surface of the external terminal , a rear surface of the semiconductor element , and a surface of the inner wiring are exposed from the first resin . the second resin encapsulated body includes : a second semiconductor element having an electrode pad formed on a surface thereof ; a second resin for covering the second semiconductor element ; and a metal body connected to the electrode pad , and is partly exposed from the second resin . the inner wiring and the metal body are electrically connected to each other .