an electronic device includes an electronic component and a heat dissipating casing configured to dissipate heat from the electronic component . the casing includes top and bottom sides of the heat dissipating casing forming a sealed chamber , and a pore structure formed within the sealed chamber . the sealed chamber is configured to receive a working medium and the pore structure is configured to absorb at least a portion of the working medium , whereby the heat generated from the electronic component is dissipated by a phase change of the working medium .