a method of protecting a bond layer in a substrate support adapted for use in a plasma processing system . the method includes the steps of attaching an upper member of a substrate support to a lower member of a substrate support with a bonding material . an adhesive is applied to an outer periphery of the upper member and to an upper periphery of the lower member , and a protective ring is positioned around the outer periphery of the upper member and the upper periphery of the lower member . the protective ring is originally fabricated with dimensions the provide mechanical stability and workability . the protective ring is then machined to an exact set of final dimensions consistent with the design of the substrate support application .