a method and apparatus is disclosed for soldering leadless semiconductor modules having contact pads on the bottom thereof to and desoldering them from leaded terminal pads on a printed wiring board . the device includes a housing having a bore in which is slidably mounted a suction head . the suction head is used to raise and lower the module relative to the leaded terminals . the suction head has a passageway connected to a source of vacuum for both holding the module relative to the head as well as exhausting heated air from a source which is directed against the leaded terminals to melt same .