a light emitting diode package is disclosed which has an integral reflector for improving performance . the package includes a substrate for supporting the led . a frame is formed on the top surface of the substrate surrounding the led . during fabrication , a liquid compound is dispensed into the frame in a manner to surround the led without covering the active area of the led . the liquid compound includes particles for scattering light . the top surface of the liquid compound is curved due to surface tension . the curvature remains after the compound is cured . in a preferred embodiment , an encapsulating material is used to cover the led and the compound . the reflector functions to increase the light output from the led package .