a method for fabricating a solder pad structure . a circuit board having thereon at least one copper pad is provided . a solder resist is formed on the circuit board and covers the copper pad . a solder resist opening , which exposes a portion of the copper pad , is formed in the solder resist by laser . the laser also creates a laser activated layer on sidewalls of the solder resist opening . a chemical copper layer is then grown from the exposed copper pad and concurrently from the laser activated layer .