an led package module according to an aspect of the invention may include : a substrate having predetermined electrodes thereon ; a plurality of led chips mounted onto the substrate , separated from each other at predetermined intervals , and electrically connected to the electrodes ; a first color resin portion molded around at least one of the plurality of led chips ; a second color resin portion molded around all of the led chips except for the led chip around which the first color resin portion is molded , and having a different color from the first color resin portion ; and a third color resin portion encompassing both the first color resin portion and the second color resin portion and having a different color from the first color resin portion and the second color resin portion . accordingly , a reduction in luminous efficiency of an led caused by yellowing is prevented to thereby increase luminous efficiency and achieve a reduction in size .