a method and apparatus for preventing board warpage during the application and curing or drying of liquid epoxies , or the like , on printed circuit boards using a clamping fixture assembly , which includes at least one clamping fixture support and at least one clamping fixture overlay . if desired , a plurality of printed circuit boards may be processed using an appropriate clamping fixture assembly . furthermore , the clamping fixture may be constructed so a slight bow or curvature thereof can counter either a convex or concave bow or curvature of the printed circuit board . in the method , at least one printed circuit board is mounted to a clamping fixture support whereby a clamping fixture overlay is placed on top of the first printed circuit board .