an inventive brush and scrubbing device is provided for simultaneously scrubbing both planar and profiled surfaces of a thin disk such as a semiconductor wafer . the inventive brush has a contact surface having two portions , a planar portion for contacting a planar surface of a wafer , and a profiled portion for contacting an edge surface of a wafer . the profile of the profiled portion preferably follows the edge profile of a wafer to be cleaned by the brush . the profiled portion may have a higher modulus of elasticity than does the planar portion . preferably the brushes are roller type pva brushes having a plurality of nodules formed thereon .