this disclosure relates to an object transport apparatus particularly useful for the high speed handling of semiconductor chips . transport is achieved by driving a vacuum pickup , through a rotational motion toward an object resting at a first reference location while simultaneously driving a cam , restraining a spring loaded cam follower , so that the vacuum pickup is positioned proximal to the first reference position . vacuum is applied to secure the object to the pickup . the cam and shaft are then simultaneously driven in the opposite direction to clear the other objects and obstruction by swinging the object through an arcuate motion while simultaneously elevating the object . as the pickup and object continue through the arcuate motion , the cam motion is reversed to position the object proximal to a deposition surface located at a second reference position . the cam is then further driven to contact the object with the deposition surface , the vacuum is released and the object is released . the cam is then driven down to allow the pickup to avoid interference with the released object or other obstructions and both the cam drive and shaft drive return the pickup to an index position , readying the apparatus for another cycle . all motions and operations are controlled by a controller .