a device for producing a hermetically sealed chip carrier is taught . briefly stated , a sealing or perimeter ring is formed on a substrate with an appropriate lead pattern and ic chip contained within this ring . vias or ducts are disposed in the substrate with metal lead pedestals contained therein which provide electrical connection through the substrate and therefore between the lead pattern contained inside the sealing ring and the lead patterns on the outside of the sealing ring . this therefore allows for a continuous sealing ring such that a cap may be placed on top of the sealing ring and bonded by methods such as welding so as to form a hermetically sealed enclosure .