an apparatus , method , and system , the apparatus and system including a flexible microsystems enabled microelectronic device package including a microelectronic device positioned on a substrate ; an encapsulation layer encapsulating the microelectronic device and the substrate ; a protective layer positioned around the encapsulating layer ; and a reinforcing layer coupled to the protective layer , wherein the substrate , encapsulation layer , protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device . the method including encapsulating a microelectronic device positioned on a substrate within an encapsulation layer ; sealing the encapsulated microelectronic device within a protective layer ; and coupling the protective layer to a reinforcing layer , wherein the substrate , encapsulation layer , protective layer and reinforcing layer form a flexible and optically transparent package around the microelectronic device .