a method for manufacturing semiconductor chips from a semiconductor wafer , including the steps of : fastening , on a first support frame , a second support frame having outer dimensions smaller than the outer dimensions of the first frame and greater than the inner dimensions of the first frame ; arranging the wafer on a surface of a film stretched on the second frame ; carrying out wafer processing operations by using equipment capable of receiving the first frame ; separating the second frame from the first frame and removing the first frame ; and carrying out wafer processing operations by using equipment capable of receiving the second frame .