methods for sealing a porous dielectric are presented including : receiving a substrate , the substrate including the porous dielectric ; exposing the substrate to an organosilane , where the organosilane includes a hydrolysable group for facilitating attachment with the porous dielectric , and where the organosilane does not include an alkyl group ; and forming a layer as a result of the exposing to seal the porous dielectric . in some embodiments , methods are presented where the organosilane includes : alkynyl groups , aryl groups , flouroalkyl groups , heteroarlyl groups , alcohol groups , thiol groups , amine groups , thiocarbamate groups , ester groups , ether groups , sulfide groups , and nitrile groups . in some embodiments , method further include : removing contamination from the porous dielectric and a conductive region of the substrate prior to the exposing ; and removing contamination from the conductive region after the forming .