mechanisms for interconnecting and distributing signals and power between pcbs are provided . a first pcb having land grid arrays and a first wiring layer designed for interconnect components on the first pcb , and a second wiring layer for connecting the components to a second pcb , are provided . the second pcb has opposed parallel first and second surfaces , the first surface having a lga . a wiring layer designed to interconnect components on the second pcb , and a layer for interconnecting the components on the second pcb with the components on the first pcb , are provided . a first interposer couples to a lga of a first surface of the first pcb and connects a component to the first pcb . a second interposer is sandwiched between and couples to a lga of a second surface of the first pcb and to the lga of the first surface of the second pcb .