a dual flat non - leaded semiconductor package is disclosed . a method of making a dual flat non - leaded semiconductor package includes forming a leadframe having a die bonding area with an integral drain lead , a gate lead bonding area and a source lead bonding area , the gate lead bonding area and a source lead bonding area being of increased area ; bonding a die to the die bonding area ; coupling a die source bonding area to the source lead bonding area ; coupling a die gate bonding area to the gate lead bonding area ; and partially encapsulating the die , the drain lead , the gate lead and the source lead to form the dual flat non - leaded semiconductor package .