a die - attach method and assembly using film and epoxy bonds speeds manufacturing for large die assemblies while providing improved bond characteristics . an adhesive film defining an epoxy flow mask is attached to the die or substrate , epoxy is dispensed within the epoxy flow mask area and the die is then bonded to the substrate . the film controls the flow of the epoxy , preventing spillover . additionally , the epoxy area can be made small with respect to the die size , reducing the time required to dispense the epoxy and reducing the amount of epoxy material required .