a multiple integrated circuit intra - package configuration having a centrally mounted integrated circuit die and an additional circuit device mounted in the package periphery . the additional circuit device may provide multiple functions , for example , to protect and enhance the performance of the integrated circuit die . examples of such functions are electrostatic discharge protection circuits and temperature sensing . the intra - package circuit device avoids problems such as simple and complex process compatibility and additional space requirements of utilizing components external to the package . the multiple circuit intra - package configuration utilizes the small space available in the vicinity of lead posts in integrated circuit packages such as soic and tssop configurations to mount circuit devices . in one embodiment , a circuit device , for example , a diode , is mounted on a lead post and connected as desired using any of a variety of connectability alternatives such as wire bonding . in another embodiment , the integrated circuit die is attached conventionally to a die pad having a die pad extension disposed between lead posts . a circuit device is mounted on the die pad extension and connected as desired . additionally , within the same package multiple circuit devices may be present and a large number of interconnectability options and versatile configurations are available .