in one embodiment , a mating circuit assembly is coupled and decoupled to a system by 1 ) mechanically and electrically coupling at least a first interposer , mounted on at least one of first and second substrates , to the mating circuit assembly . the mechanical and electrical coupling is accomplished using at least first and second spring mechanisms , with the first and second spring mechanisms being mounted between the connector housing and respective ones of the first and second substrates . at least one of the first and second substrates transmits signals between the first interposer and the system . the first interposer is electrically and mechanically decoupled from the mating circuit assembly by creating a vacuum between the connector housing and at least one of the first and second substrates . other embodiments are also disclosed .