a method for fabricating a chip surface base includes preparing a first substrate , preparing a plurality of vias in the first substrate , depositing metal fillings into the plurality of vias , preparing a second substrate , bonding the first and second substrates and exposing the metal fillings . a method for fabricating a chip surface base includes preparing a first and second substrate , depositing a metal on at least one of the first and second substrates , bonding the first and second substrates , preparing a plurality of vias in the first substrate , depositing metal fillings into the plurality of vias and exposing the metal fillings . a chip surface base device includes a first substrate , a second substrate , a metal layer disposed between the first and second substrates and a plurality vias disposed on the first substrate .