an apparatus for a single chip package using land grid array coupling is provided . the apparatus includes a multi - layer substrate , at least one integrated circuit chip , and a printed circuit board . the a multi - layer substrate has at least one substrate layer , has at least one first chip region and at least one second chip region in a lowermost substrate layer , configures a transmission line transition of a vertical structure for transmitting a signal from at least one integrated circuit chip coupled in the first chip region in a coaxial shape or in a form of a co - planar waveguide guide , and has an lgp coupling pad for connecting with a printed circuit board in the lowermost layer . the at least one integrated circuit chip is coupled in the first chip region and the second chip region . the pcb is connected with the multi - layer substrate using the lga coupling via the lga coupling pad .