a method of fabricating a passivation layer and a passivation layer for an electronic device . the passivation layer includes at least one passivation film layer and at least one nanoparticle layer . a first film layer is formed of an insulating matrix , such as aluminum oxide and a first layer of a noble metal nanoparticle layer , such as a platinum nanoparticle layer , is deposited on the first film layer . additional layers are formed of alternating film layers and nanoparticle layers . the resulting passivation layer provides a thin and robust passivation layer of high film quality to protect electronic devices , components , and systems from the disruptive environmental conditions .