a method for manufacturing a fluid ejection device , comprising the steps of : providing a first semiconductor body having a membrane layer and a piezoelectric actuator which extends over the membrane layer ; forming a cavity underneath the membrane layer to form a suspended membrane ; providing a second semiconductor body ; making , in the second semiconductor body , an inlet through hole configured to form a supply channel of the fluid ejection device ; providing a third semiconductor body ; forming a recess in the third semiconductor body ; forming an outlet channel through the third semiconductor body to form an ejection nozzle of the fluid ejection device ; coupling the first semiconductor body with the third semiconductor body and the first semiconductor body with the second semiconductor body in such a way that the piezoelectric actuator is completely housed in the first recess , and the second recess forms an internal chamber of the fluid ejection device .