an apparatus including a contact point formed on a device layer of a circuit substrate or an interconnect layer on the substrate ; a first dielectric material ; and a different second polymerizable dielectric material on the substrate and separated from the device layer or the interconnect layer by the first dielectric material following polymerization , the second dielectric material comprising a glass transition temperature of at least 250 ° c . and a thermal decomposition temperature of at least 400 ° c . a method including depositing a dielectric material and thermally treating the dielectric material at a temperature greater than the thermal decomposition temperature .