disclosed are methods for manufacturing electromagnetic interference shields for use in nonconductive housings of electronic equipment . in one embodiment , the shield may include an electrically nonconductive substrate , such as a thermoformable film , coated with an electrically conductive element , such as an extensible ink or a combination of conductive fibers with an extensible film . in one embodiment , a compressible conductive perimeter gap gasket may be formed by using a form in place process .