the computer having a module board with semiconductor elements mounted on both sides thereof , a motherboard on which a plurality of units of the module board are mounted , and a rack cabinet on which a plurality of units of the motherboard are mounted includes a thermo - siphon that is thermally connected to the semiconductor elements mounted on one side of the module board , a metal plate that is thermally connected to the semiconductor elements mounted on one side of the module board , a thermally - conductive member that transfers the heat of the metal plate to the thermo - siphon in a situation where the heat of the semiconductor elements mounted on one side of the module board is transferred to the metal plate , and a pressing member that presses the thermo - siphon and the metal plate against the semiconductor elements mounted on the module board .