an alignment method and apparatus is disclosed wherein , in one exposure process , alignment of a semiconductor substrate may be performed and , while moving the semiconductor substrate in a step - and - repeat manner in relation to shot positions on the semiconductor substrate , a pattern of an original may be printed on the semiconductor substrate at the respective shot position , wherein the one exposure process may be performed while using a plurality of placement data each specifying positions with respect to which the semiconductor substrate is to be positioned during the step - and - repeat motion .