a method for mechanically supporting a integrated circuit package having a column grid array interconnection with a printed circuit board is provided by inserting a supporting device between the ic package and the pcb after the ic package is solder attached to the pcb . the supporting device is removably and mechanically fastened to the pcb and is designed in such a shape so that the supporting device cannot come into contact with the solder columns of the cga to cause damage or shorting . this invention eliminates the maximum retention load constraint of the ic package and enables a wide variety of thermal solution implementations without comprising reliability .