disclosed embodiments relate to a semiconductor device . a semiconductor device is fabricated by attachment of a first chip to a first surface of a pad of a leadframe . each of one or more terminals of the first chip is connected to a respective lead of the leadframe . the first chip and the first surface of the pad are then encapsulated in a packaging material , while leaving an opposite second surface of the pad exposed . a second chip is attached to a recessed portion of the second surface of the pad so that at least one terminal of the second chip is substantially coplanar with an un - recessed portion of the second surface . in one embodiment , a third chip is also attached to the recessed portion of the second surface so that at least one terminal of the third chip is substantially coplanar with the un - recessed portion of the second surface .