the present invention comprises a radiation immobilizable epoxy formulation which displays improved initial and thermal cycle strengths when bonding different materials such as terephthalate polyesters and aluminum . the composition comprises : a compound or mixture of compounds having a plurality of epoxy groups per molecule ; a polyoxyalkylene amine curative for the epoxy ; an imide compound selected from those having the formulas ; and ## str1 ## a photocurable ethylenically unsaturated compound and photoinitiator , said ethylenically unsaturated compound and photoinitiator present in amounts which together are effective to cause the composition to become immobilized when irradiated with actinic radiation .