chip - type electronic elements are applied in line on the surface of a carrier tape before they are supplied to an automatic electronic - element supply apparatus so as to be automatically mounted on a printed circuit board . side plates are disposed at an end portion of the body frame of the automatic electronic element supply apparatus for a chip - type electronic element mounting apparatus in such a manner that a plurality of carrier tape reels can be fastened to the side plates and the carrier tapes are discharged from the tape reels in a ratchet manner while moving adjacently in parallel to one another through another end portion of the body frame . thus , a multiplicity of different kinds of electronic elements can be supplied from one supply apparatus .