electrical components having generally parallel leads extending in one direction from one side of their bodies , respectively , are successively transferred to a conveyor means movable through sequential processing stations to prepare the leads for circuit board connection or sequencing preparatory to such connection . spaced lead grippers on the conveyor means control lead portions adjacent to the bodies of the components . the stations sucessively act to determine the standoff length of the leads from the bodies of the components , reform remaining portions of the leads in coaxial relation while maintaining the standoff length , check for omission of a reformed component from proper position in the series and , upon release from the grippers , tape the coaxial portions of the leads of adjacent components in parallel , side - by - side relation . preferably , the means for checking reformed component presence also controls turning of a reel for storing the repackaged components .