a semiconductor module comprises , an ic chip including an electric circuit and an electrically conductive terminal surface area connected electrically to the electric circuit , an electrically conductive member fixed onto the terminal surface area with an electrical conductivity between the electrically conductive member and the terminal surface area , and a resin adhering to a part of the electrically conductive member and to a part of the ic chip , or an alternative ic chip including an electric circuit and an antenna coil connected electrically to each other , and a resin adhering to at least a part of the alternative ic chip , wherein the alternative ic chip includes first and second surfaces opposite to each other in a thickness direction of the alternative ic chip , the antenna coil is juxtaposed with the electric circuit in the thickness direction and extends substantially along an imaginary plane parallel to the first and second surfaces , a distance between the antenna coil and the first surface is smaller than a distance between the antenna coil and the second surface in the thickness direction .