a resin composition , including a polyimide resin ; a pre - polymerised maleimide resin ; a thermosetting resin ; and a flame retardant . the reactants for use in synthesizing the polyimide resin include an acid anhydride and a diamine , with the diamine including 4 , 4 ′- diaminodiphenylmethane and its analogous compounds and polyetherdiamines . the resin composition has the following advantages , a resin film or a prepreg is manufactured from the resin composition comprises a polyimide resin synthesized from a diamine of a specific structure and a pre - polymerised maleimide resin , so as to achieve satisfactory characteristics of circuit laminates , such as a low dielectric constant , a low dissipation factor , high heat resistance , and high adhesiveness , so as to be for use in the manufacturing of metal clad laminates and printed circuit boards .