the invention discloses a method by which a fluid heat reactive resin system is formulated below the melting point of the resin . this permits the application of coatings and the formation of shapes and powders from the fluid heat reactive system . liquefied gases are used to solvate resins so that curing agents , hardeners , pigments and flow control agents , and especially curing agents which are too reactive to be mixed with the resins above the melting point of the resins may be dispersed in the resins . after dispersion , the fluid heat reactive resin system remains in a deformable state under ambient conditions for a transient processing time . the transient processing time is established and maintained by the inclusion of plasticizers and high boiling solvents in the heat reactive resin system .