provided is a semiconductor assembly , comprising a circuit board including a conductor circuit , the conductor circuit including connecting pads , a semiconductor chip provided with connecting terminals provided on a first surface thereof , and mounted on the circuit board , a casing covering the circuit board , wherein the connecting pads of the conductor circuit and the connecting terminals of the semiconductor chip are disposed in mutually opposing relationship , and are connected with each other by an electroconductive bonding agent , a neutral plane of the semiconductor chip substantially coinciding with an overall neutral plane of the semiconductor assembly .