an integrated circuit die has a plurality of i / o cells disposed about its periphery , each i / o cell having an i / o bonding pad . a first group of i / o cells is disposed at the periphery of the die at locations away from corners of the die , each of the first group of i / o cells having an i / o pad disposed thereon and spaced at a first distance from the periphery of the die . a second group of i / o cells is disposed at the periphery of the die at locations away from corners of the die , each of the second group of i / o cells having an i / o pad disposed thereon and spaced at a distance from the periphery of the die more than the first distance , the distance increasing as a function of the proximity of each i / o cell to a corner of the die .