a laminated chip includes : a first chip ; a first wiring layer formed on the first chip ; a second chip ; a second wiring layer formed on the second chip ; and a layer disposed between the first wiring layer and the second wiring layer , the layer includes an adhesive agent configured to bond the first wiring layer and the second wiring layer ; a plurality of first bumps connected to the first wiring layer ; a plurality of second bumps connected to the second wiring layer ; and solder connected to the plurality of first bumps and the plurality of second bumps .