the invention is a method for detecting float or peel of semiconductor chips arranged in x and y axes directions diced and bonded to a dicing tape on a stage . the method includes detecting float or peel of the semiconductor chips in a respective horizontal or longitudinal row arranged in the x or y axis direction ; moving the stage in the x axis direction , the y axis direction , a z axis direction , and a rotational direction around the z axis for aligning the stage with a position detection unit for detecting positions of the semiconductor chips in the x axis direction and the y axis direction ; detecting the positions of abnormal semiconductor chips in the respective horizontal or longitudinal row that includes said abnormal semiconductor chips ; and specifying the positions of said abnormal semiconductor chips on the x - y axes .