a method of producing a temperature sensing device is provided . the method includes forming at least one silicon layer and at least one electrode or contact to define a thermistor structure . at least the silicon layer is formed by printing , and at least one of the silicon layer and the electrode or contact is supported by a substrate during printing thereof . preferably , the electrodes or contacts are formed by printing , using an ink comprising silicon particles having a size in the range 10 nanometers to 100 micrometers , and a liquid vehicle composed of a binder and a suitable solvent . in some embodiments the substrate is an object the temperature of which is to be measured . instead , the substrate may be a template , may be sacrificial , or may be a flexible or rigid material . various device geometries are disclosed .