the invention relates to a method for a coupling device for connecting an electrical / electronic component , in particular a sensor , having a substrate , in particular a circuit board , wherein the coupling device comprises at least one electrical connection for electrical contacting and at least one damper element for movement uncoupling , wherein the electrical connection is formed by a lead frame and the lead frame is overmolded in regions by a damping mass as a damper element . the invention furthermore relates to an assembly having a coupling device and a method for producing said type of assembly .