a substrate treating apparatus includes a spin chuck for supporting a substrate to be rotatable in a plane including a principal surface of the substrate , a motor for rotating the spin chuck , a circulating pump for circulating a removal liquid and transmitting the removal liquid to a first nozzle , and a heater for heating the removal liquid in circulation . when removing a reaction product , the spin chuck is rotated at a rotational frequency of at least 100 rpm and not exceeding 3 , 000 rpm , and the first nozzle supplies the removal liquid at a rate of at least 50 ml per minute to the surface of the substrate supported and rotated by the spin chuck .