a semiconductor component includes a semiconductor element that has a plurality of signals , a wiring board that is disposed below the semiconductor element and that draws the plurality of signals of the semiconductor element , a heat conduction member that dissipates heat generated by the semiconductor element , a joining member that is disposed between the semiconductor element and the heat conduction member and that joins the heat conduction member to the semiconductor element , a support member formed with an opening so as to surround the semiconductor element that supports the heat conduction member , a first adhesive member that is disposed between the support member and the wiring board to bond the support member with the wiring board and a second adhesive member that is disposed between the support member and the heat conduction member to bond the support member with the heat conduction member .