a telephone line attenuator pad comprises a printed circuit board one portion of which mounts a plurality of resistances each connected in series with a pair of electrical printed circuit conductors . the resistances and mounting portion of the board are potted within a hollow case and the remaining portion of the board , including portions of the printed circuit conductors , projects from the case for removable mounting , in either of two opposing orientations , in an electrical connector to which are connected a plurality of permanent , fixed resistors included in the attenuator network to which telephone line circuitry is connected .