to prevent increase in stress on a soldered join between a terminal pin and a circuit board in the event of thermal expansion , a support with a larger diameter and a recess with a smaller diameter are formed on a terminal pin . an alignment plate is arranged to be movable with respect to a connector housing between a support position in which the support member is a close fit in a position fixing hole , and a release position in which the recess is a loose fit . this eliminates the increase in stress on the soldered portion due to differing rates of thermal expansion and contraction of the circuit board and alignment plate .