a method of manufacturing a thin film electronic device comprises applying a first plastic coating directly to a rigid carrier substrate and forming thin film electronic elements over the first plastic coating . a second plastic coating is applied over the thin film electronic elements with electrodes on top , with a portion lying directly over the associated electronic element , spaced by the second plastic coating . the rigid carrier substrate is released from the first plastic coating , by a laser release process . this method enables traditional materials to be used as the base for the electronic element manufacture , for example thin film transistors . the second plastic coating can form part of the known field shielded pixel technology .