an inexpensive surface acoustic wave apparatus uses a flip chip bonding technique and is capable of reducing an ohmic loss by reducing an electrode electrical resistance and also operates at a high - frequency range . a surface acoustic wave apparatus has a surface acoustic wave element bonded to a package by using a bonding flip chip technique . in the surface acoustic wave element , on a piezoelectric substrate , an idt electrode , bus bar electrodes , reflector electrodes , relay electrodes , and electrode pads are disposed . conductive films are disposed on the electrode pads and define a first metallic film , and the conductive films are also disposed on at least any of the bus bar electrodes and the relay electrodes to define a second metallic film .