a light - emitting diode is provided . an led die includes a first semiconductor layer , a light - emitting layer , a second semiconductor layer , a first electrode and a second electrode . at least a part of the first semiconductor is exposed from the light emitting layer and the second semiconductor layer . the first electrode and the second electrode is disposed on top of the exposed first semiconductor layer and the second semiconductor layer respectively . at least two metal pads are disposed on top of the first electrode and the second electrode of the led die respectively . each of the metal pads has a side surface . a fluorescent layer is disposed on a surface of the led die . the fluorescent layer directly contacts with the side surfaces of the metal pads and fills a gap between the metal pads .