a process and apparatus for locally removing any material , such as a refractory metal , in particular tungsten , from any desired area of a wafer , such as an alignment mark area of a silicon wafer in process during the formation of integrated circuits thereon . the process comprising the steps of aligning said area of said wafer , such as an alignment mark on the wafer , to an etchant dispensing apparatus , placing the surface of the wafer adjacent at least a portion of an annular portion of the etchant dispensing apparatus , dispensing at least one etchant onto said area of said wafer , such as an alignment mark , and removing the at least one etching from the wafer . the apparatus for the cleaning of an area of a semiconductor wafer using a material comprising a tube having a bore therethrough and exterior wall , the tube supplying material to said area of the wafer and an annular member having an interior wall surrounding the tube , the annular member having a thin edge thereon for positioning adjacent a portion of the area of the wafer during the cleaning thereof , the annular member forming an annular space between the exterior wall of the tube and the interior wall of the annular member .