the present invention relates generally to a new method of repairing electrical lines , and more particularly to repairing electrical lines having an opening at the module level with devices in place . various methods and processes are used to repair this open or defective portion in an electrical conductor line . it could be repaired by securing a jumper wire or nugget across the open or the repair could be made by a deposition process , which includes but is not limited to filling the opening with a solder type material or inserting a solder coated electrical wire and heating the solder and allowing the solder to melt and repair the open . one of the attributes of this invention is the ability to repair on a substrate or module on which active components such as chips , and passive components such as pins , capacitors , etc . have been attached . the invention also allows repair of fine line patterns which are normally not repairable by conventional techniques .