delamination in the conventional chip - type electronic part may create voids thereinside , allowing an internal electrode therein to vibrate in presence of external impacts or large electromagnetic forces caused by a high frequency current flowing inside the electrode , in such a way that fatigue may accumulate in the internal electrode , which eventually will results in the internal electrode being electrically disconnected . to solve this problem , a chip - type electronic part of the present invention includes synthetic resins impregnated into the voids to secure the internal electrode , wherein external electrodes of the chip - type electronic part are made of a conductive synthetic resin or a porous conductive material formed by sintering a conductive paste . the former is achieved by impregnating the synthetic resins before the formation of the external electrodes and the later , by extending the pores from surfaces of the external electrodes to surfaces of a main body and then by impregnating the synthetic resins thereinto .