disclosed is a heat sink clip assembly comprising a frame and a clip for securing and aligning a heat sink with an electronic device package . the frame includes a cavity for receiving the electronic device package with the leads thereof exposed for mounting on a printed circuit board or the like . a resilient heat sink clip is removably engaged with a pair of latching members on the perimeter of the frame . the clip includes means for releasably gripping the heat sink . the heat sink is urged by the heat sink clip into intimate thermal contact with the electronic device package for dissipation of heat therefrom .