in some embodiments , an interconnectable circuit board may include one or more of the following features : a first electrically conductive pad located on a top of the circuit board , a plated through hole on the conductive pad which passes through the circuit board , a second electrically conductive pad coupled to the plated through hole ; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board , cut marks indicating safe locations for separating the circuit board , and a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board .