semiconductor packages are provided to prevent a chip , such as a central processing unit chip , from being degraded due to hot spot heat generated during the operation of the chip and absorbs thermomechanical stresses in interfaces between the chip , a thermal interface material and a lid . the chip is electrically connected , e . g ., flip - chip bonded , to a package substrate . the lid is thermally connected to and disposed over a back surface of the chip with the tim interposed therebetween . a heat dissipation means adjacent the tim is also located between the lid and the chip to prevent the hot spot effect .