the disclosure generally relates to method and apparatus for predicting the steady state temperature of solid state devices , preferably under transient conditions . an apparatus according to one embodiment of the disclosure includes a thermocouple for detecting temperature of the solid state system ; a processor in communication with the thermocouple and programmed with instructions to : construct an initial curve for the solid state system , the initial curve having a shape ; obtain a plurality of theoretical temperature curves for the solid state system ; select one of the plurality of theoretical temperature curves having a shape closest to the shape of the initial curve ; and superimposing the selected theoretical temperature curve on the initial curve to predict the steady state temperature .