1 . micromechanical enclosure 2 . 1 . previous micromechanical enclosures that are made of two bonded wafers usually have , in the contact area , a glass frit bond which , on account of its large size , compensates for the unevennesses between the two joined wafers . 2 . 2 . in order to obtain a micromechanical enclosure with the smallest dimensions , a level compensation layer is arranged next to the conductor track layer beneath the contact area during the manufacture of the wafer . if a planarizing layer , which forms a level surface , is applied above this , then a level area is created which can easily be joined to another by means of a wafer bond . 2 . 3 . such enclosures are suitable for micromechanical sensors , particularly acceleration sensors in the field of automotive vehicles .