a method of removing a coated film from an edge surface of a substrate comprising the steps of forming an insulating film for protecting a circuit pattern of a substrate by pouring an insulating resin solution on a circuit - pattern formation surface of the substrate , rotating the substrate having the insulating film coated thereon , removing the insulating film by pouring a solvent on the edge surface of the substrate , while the substrate is being rotated , and accelerating dehydration of the insulating film by taking at least one action of spraying a gas to the edge surface of the substrate and performing a local evacuation of a region in the proximity of the edge surface of the substrate while the substrate is being rotated .