disclosed herein is a semiconductor light emitting device module comprising : a substrate ; at least one support disposed on a surface of the substrate ; a heat transfer member disposed on the substrate and the support , the heating transfer member having a cavity formed in at least a portion of the heat transfer member ; first conductive layer and second conductive layer contacting the heat transfer member via an insulating layer , the first conductive layer and the second conductive layer being electrically isolated from each other in accordance with exposure of the insulating layer or exposure of the heat transfer member ; and at least one semiconductor light emitting device electrically connected to the first conductive layer and the second conductive layer , the at least one semiconductor light emitting device is thermally contacted an exposed portion of the heat transfer member .