a chip package for semiconductor chips is provided by the method of forming a chip package includes the steps of forming a printed circuit board with a window therethrough ; forming semiconductor chip connections of one or more primary chips which overlie the window to the printed circuit board by solder connections , locating a suspended semiconductor chip within the window , and connecting the suspended semiconductor chip to one or more primary chips overlying the window in a chip - on - chip connection . a bypass capacitor is formed on the printed circuit board .