methods of fabricating leadless packages are described that provide good solder joint reliability . in most respects , the packages are fabricated in a manner similar to current lead frame based leadless packaging techniques . however , at some point in the process , the contacts are provided with undercut regions that are left exposed during solder plating so that the solder plating also covers the exposed side and undercut segments of the contacts . when the resultant devices are soldered to an appropriate substrate , each resulting solder joint includes a fillet that adheres very well to the undercut portion of contact . this provides a high quality solder joint that can be visually inspected from the side of the package .