a solid state imaging device for a wafer - level pinhole camera module is provided by using a mask transfer technique to form , with a high degree of precision , pinhole openings in a light - shielding material formed upon cover glass covering the surfaces of imaging elements for wafer - level camera modules , and then dicing . also provided is a manufacturing method therefor . further provided is a compound - eye camera system in which a plurality of pinhole openings are formed . it is also possible to impart an apodization effect by changing the cross - sectional shape of the opening in the light - shielding material to a tapered shape to thereby change the transmission characteristics thereof .