a method is provided for preparing the surface of a cyanate ester resin composite for metal plating . more particularly , a layer consisting essentially of cyanate ester resin is applied to the surface of the composite . thereafter , the surface of the resin layer is etched , preferably by treatment with an etching solution containing either a quaternary ammonium hydroxide or a primary amine . upon completion of the etching process , the cyanate ester resin layer may be successfully plated with metal . the method of the invention operates to improve adhesion between the cyanate ester resin composite and a subsequently - plated metal by providing the composite with a homogenous distribution of mechanical anchoring sites for a subsequently - plated metal , such that uniformity of adhesion is achieved . a cyanate ester resin composite prepared for plating in accordance with the invention may , upon plating , replace certain metallic components in such applications as aircraft , spacecraft , and automobiles given its highly conductive metallic coating .