a capacitor is disposed within a semiconductor device assembly atop a plastic layer pad , beneath which passes a pair of leads connected to a semiconductor device . the capacitor is connected to the pair of leads , such as by soldering , spot welding or conductive epoxy through cutouts in the pad . in one embodiment , the cutouts extend into the pad from inner and outer edges thereof . in another embodiment , the cutouts are holes through the pad . a plurality , such as four , capacitors are conveniently disposed atop a corresponding plurality of pads , and are connected to a corresponding plurality of pairs of leads within the semiconductor device assembly . by positioning the capacitor as closely to the semiconductor device as possible , the efficacy of the capacitor is maximized . method and apparatus are disclosed .