a semiconductor assembly includes a semiconductor die comprising lower and upper electrical contacts . a lead frame having a lower die pad is electrically and mechanically connected to the lower electrical contact of the die . an upper conductive member has a first portion electrically and mechanically connected to the upper electrical contact of the die . a lead terminal has a surface portion electrically and mechanically connected to a second portion of the conductive member . the surface portion of the lead terminal and / or the second portion of the conductive member has a series of grooves disposed therein . packaging material encapsulates the semiconductor die , at least a portion of the lead frame , at least a portion of the upper conducive member and at least a portion of the lead terminal .