a cleaning wafer or substrate for use in cleaning , or in combination with , components of , for example , integrated chip manufacturing apparatus . the cleaning substrate can include a substrate having varying predetermined surface features , such as one or more predetermined adhesive , non - tacky , electrostatic , projection , depression , or other physical sections . the predetermined features can provide for more effective cleaning of the components with which they are used , such as an integrated chip manufacturing apparatus in the place of the integrated chip wafer . the cleaning substrate can be urged into cleaning or other position by vacuum , mechanical , electrostatic , or other forces . the cleaning substrate can adapted to accomplish a variety of functions , including abrading or polishing . the cleaning substrate may be made by a novel method of making , and it may then be used in a novel method of use i combination with chip manufacturing apparatus .