a method of making a semiconductor packaged device comprises mounting onto a lead frame a bottom of a molded semiconductor chip having a first plastic package body covering a top face of a semiconductor chip , encapsulating the lead frame and the semiconductor chip with a second plastic package body with top surfaces of conductive contact bodies electrically connected to electrodes on the top surface of the semiconductor chip exposed and plating conductive pads on a top surface of the assembly structure to provide external electrical connections to the electrodes through the conductive contact bodies .