an apparatus and a process for the manufacture of a solder - bump adhered wafer substrate for use in the semiconductor industry , comprising one or more of the following steps including : arranging a first compressive member and a second compressive member in an opposed , compressibly displaceable , spaced - apart relationship , with a pattern plate disposed therebetween with the pattern plate having a plurality of aligned through - holes arranged thereon ; filling the through - holes with a molten solder ; compressing the solder and the pattern plate between the first and second opposed compressive members to compact the solder therein and cleans the pattern plate of excess solder ; chilling the pattern plate to solidify the molten solder in the through - holes ; and removing the pattern plate from the spaced - apart compressive members to produce a wafer with solder bumps thereon .