an apparatus is provided . an integrated circuit or ic is secured to a package housing . the ic has an ic substrate and an epitaxial layer formed over the substrate and having an active region and an upper surface . the upper surface is substantially exposed , and bond pads are formed over the epitaxial layer . bond fixtures are each secured to and in electrical contact with at least one of the bond pads and with the package housing . a fill formed over at least a portion of the epitaxial layer so as to substantially encapsulate the active region , where the fill has a dielectric constant that is substantially equivalent to the dielectric constant of air . additionally , the fill has a thickness , where the thickness is sufficiently large enough to confine parasitics of the active region at the upper surface of the epitaxial layer .