disclosed are epoxy resin compositions which include an alkali metal containing cure accelerator . the alkali metal containing cure accelerators are preferably alkali metal hydroxides , alkoxides , carboxylates , or alkali metal salts . articles prepared from the resin compositions of the invention exhibit enhanced thermal properties , and similar non - thermal properties , when compared to articles prepared from compositions including other accelerators such as imidazoles . the resin compositions of the invention may be used for any purpose , but are particularly suited to be utilized in the manufacture of laminates for printed circuit boards and non - electrical structural applications .