the present invention relates to a positive photosensitive resin composition and a method for forming patterns by using the same . the positive photosensitive resin composition includes a novolac resin , an ortho - naphthoquinone diazide sulfonic acid ester , a dye and a solvent . the novolac resin further includes hydroxy - type novolac resin , which is synthesized by condensing hydroxylbenzaldehyde compound with aromatic hydroxyl compound . the dye includes at least one selected from the group consisting of diazo dye , anthraquinone dye and chromium azo dye , as well as triarylmethane dye . since the positive photosensitive resin composition can form colorfully fine patterns on metal circuits , and such patterns are not decolored after being etched , thereby beneficially blocking the reflected light of the metal circuits .