an electrical check executed on wafer tests for the correct positioning or alignment of the probes of a probe card on the pads or bumps of the electronic devices integrated on the wafer . a signal is applied to cause a current to circulate in at least part of a seal ring of at least one of the electronic devices . in a case where the current flows between and through multiple electronic devices , the seal rings of those electronic devices are suitably interconnected to each other by electronic structures that extend through the scribe line between electronic devices .