an embedded mim capacitor in a logic circuit and method for forming the same are disclosed . the device includes a substrate , a bottom electrode , a dielectric film , and a top electrode . the substrate comprises an insulator region . the bottom electrode comprises a first conductor and overlies the insulator region . the dielectric film overlies the bottom electrode , remaining parts of the bottom plate exposed . the top electrode comprises a second conductor and overlies the dielectric film . the dielectric film lines sidewalls and bottom of the top electrode .