solder balls are offset in the horizontal direction from fixing portions while their positional accuracy is ensured , and signal paths are shortened in a ball grid array ic socket . contacts fixed to contact hosing apertures of a housing include base portions , contact arms , and terminal portions that extend from the lower ends of the base portions toward a circuit board . the contact arms protrude so as to extend upward and then are bent unidirectionally . the terminal portions are constituted by transition portions that link solder ball pads to the base portions , while offsetting the solder ball pads in the same direction as the contact arms . the transition portions include vertical portions which are substantially perpendicular to the solder ball pads or inclined portions angled upwardly from the solder ball pads . the vertical or inclined portions prevent movement of the solder balls , thereby preventing positional misalignment and deformation thereof .