apparatus for handling delicate workpieces such as semiconductor substrates which have the configuration of small plates . the workpieces are preliminarily situated at predetermined locations in a positioning plane . then , without changing their positions relative to each other , the workpieces are all simultaneously transferred away from the positioning plane while being maintained during transfer in a common plane which moves with the workpieces . during their transfer the workpieces are held by suction in this common plane by way of suitable suction nozzles which have at least at their ends which engage the workpieces a soft elastic material . this common plane in which the workpieces are situated during their transfer is brought into coincidence with a predetermined working plane at which the workpieces are deposited upon termination of the suction at the nozzles and application of a pressure greater than atmospheric pressure at the nozzles , and in the working plane the workpieces are situated at locations which have with respect to each other the same relationship as the locations of the workpieces at the positioning plane . all of the above planes are preferably horizontal and of course parallel to each other at all times .