an apparatus and corresponding method for heating a wafer during processing . the apparatus includes a process chamber enclosing a processing tube defining a processing area . the processing tube includes a first wall and a second wall which define a hollow cavity or passageway therebetween . the second wall includes a plurality of holes or outlets formed thereon which allow environmental communication between the hollow cavity and the processing area . the apparatus also includes a plurality of resistive heating elements positioned adjacent to the processing tube . a thermal energy output from the resistive heating elements is configured to heat a gas flowing through the hollow cavity . the gas flowing through the hollow cavity exits the hollow cavity through the plurality of holes and convectively change the temperature of the wafer disposed in the processing tube .