the present invention relates to the formation of a ball grid array testing receiver that is scalable for design consideration of miniaturization . a dielectric layer is formed upon a substrate that is substantially conformal to the upper surface of the substrate . a patterned masking layer is formed upon the dielectric layer and a subsequent etch forms a depression within the substrate and forms a ledge on the surface of the substrate that is adjacent to the depression . after formation of the ledge , a metal layer is formed continuously on the ledge and within the depression . following the formation of the metal layer , a masking layer is formed upon the metal layer . the masking layer is patterned so as to form a desired arrangement of metal lines by etching the underlying metal layer . the formation of the ledge enables the masking layer to resist formation of a breach between the surface of the substrate and the depression . as such , metal lines are formed so as to extend into the depression without a breach that would otherwise leave an open circuit during attempted use .