the present invention relates to a method and apparatus that prevents / minimizes cracking in the ceramic body of processors . the ability to prevent / minimize cracking can ensure successful operation and substantially increase processor lifetime . the present invention discloses a device for maintaining a microprocessor in a desired relationship with a printed wiring board while limiting the transmission of shock and vibrational motion to and from the processor includes a printed wiring board , a processor , and a dynamic isolating mount compressed between the printed wiring board and the processor , wherein the processor maintains the dynamic isolating mount in a compressed state such that the dynamic isolating mount bears on the printed wiring board .