a device and method to control the heating of an ic chip in a wafer form for measuring various parameters associated therewith are provided . embodiments include a device having a silicon layer with an upper surface , and on a plastic carrier ; a plurality of devices in the silicon layer and electrically coupled through the upper surface to a test control system ; a through silicon via extending into the silicon layer ; and a parallel heating structure adjacent to the plurality of devices electrically coupled to the test control system .