for use in microelectronics applications , an improvement to an epoxy resin composition to reduce bleeding of the composition when it is applied to a silicon or metal substrate consists in the addition to the composition of a polyhydroxyl compound having two or three hydroxyl groups , or of a monohydroxyl compound that also contains one or more phenyl groups . the hydroxyl compound is present in the composition in a ratio by weight to the flexibilizing compound of from 1 : 3 to 1 : 10 .