provided herein is a solder for sintered metal parts which is composed of fe and / or cr 5 ˜ 40 %, si and / or b 1 ˜ 5 %, cu 20 ˜ 65 %, mn 5 ˜ 30 %, and ni 20 % and up , and optional flux 1 ˜ 6 % . the solder may lack either or both of cu and mn . provided also herein is a process for soldering sintered metal parts with the solder . the solder joins parts very well with a minimum of infiltration into and corrosion to the sintered metal parts .