an apparatus for decoupling one contact of an integrated circuit device from a primary power source provided by a tester . the apparatus includes a rack mount applied over each of two pluralities of probe fingers which , together with other structure , provide electronic communication between the contacts of the device being tested and the primary power soruce . each of the mounts has a plurality of recesses formed therein for receipt of various chip capacitors and shorting elements . the recesses pass fully through their respective rack mounts , and a contact strip is positioned in an overlying relationship to a corresponding rack mount to secure the chip capacitors and shorting elements , selectively inserted into the various recesses , in operative electronic engagement with probe fingers corresponding to the recesses in which the various capacitors and shorting elements are received . projections extending from the contract strips are provided for this purpose . electronic communication between the various pins is completed by providing a decoupling strap bridging a gap between opposite , facing contact strips .