a sputtering device includes a vacuum chamber , a target disposed in the vacuum chamber , a protection plate formed to surround the target with a space therebetween , and having an opening formed in front of the target , a substrate holder for holding a semiconductor wafer substrate and substantially closing the opening in front of the target in cooperation with the semiconductor wafer substrate , and an a . c . power source for striking the target with charged particles to emit target material when the semiconductor wafer substrate is set in front of the target , whereby depositing target material thereon as a sputtered film . the sputtering device further includes a temperature sensor , a heater unit and heater controller to heat at least the protection plate to a specified temperature and to maintain the specified temperature after sputtering is complete .