a method of manufacturing a light emitting device . the method includes : mounting a light emitting chip on a substrate ; forming a transparent resin portion and a phosphor layer by using a liquid droplet discharging apparatus , the transparent resin portion being formed in a shape of a dome and covering the light emitting chip to fill an exterior thereof on the substrate , a phosphor layer containing phosphor and being formed on an exterior of the transparent resin portion close to at least a top side thereof ; and forming a reflecting layer at a position exterior of the transparent resin portion and the phosphor layer close to the substrate .