the present invention discloses a method of forming fine conductive lines , patterns , and connectors , and is particularly useful in the formation of electronic devices . the method comprises a series of steps in which : a polymeric material is applied to a substrate ; the polymeric material is patterned to form openings through , spaces within , or combinations thereof in the polymeric material ; subsequently , conductive material is applied to the patterned polymeric material , so that it at least fills the openings and spaces existing in the polymeric material ; and excess conductive material is removed from the exterior major surface of the polymeric material using chemical - mechanical polishing , to expose at least the exterior major surface of the polymeric material . the structure remaining has a planar exterior surface , wherein the conductive material filling the openings and spaces in the patterned polymeric material becomes features such as fine lines , patterns , and connectors which are surrounded by the polymeric material . the polymeric material may be left in place as an insulator or removed , leaving the conductive features on the substrate .