an integrated heat sink module includes a sinuously channeled base and a bonded top surface electrode that is dielectrically isolated from the base . the top surface electrode acts as a common modular electrode capable of conducting heat to an ultimate cooling medium with no intervening thermal barrier . constrained copper technology is employed to ensure that the relatively low effective temperature coefficient of expansion of the channel base is acquired by the channel cover , which is the dielectrically insulated top surface , and that the common electrode is integrated with , by forming a part of , the fluid channel in the base . the heat sink weight is reduced significantly by the channeling , while use of the cct technology ensures high reliability and integrity of the module .