a method of encapsulating materials to protect circuit components from the stress of thermal cycling includes applying a first substance to cover wire bonds on a first layer , applying a second substance to wire bonds on a second layer , and curing the first and second substances by application of heat or radiation to bond the first and second substances together . it is emphasized that this abstract is provided to comply with the rules requiring an abstract which will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure . it is submitted with the understanding that it will not be used to interpret or limit the scope or the meaning of the claims .