a blade - like connecting needle for measuring a semiconductor wafer has an increased capability for measuring a small current and also has stable characteristics . the blade - like connecting needle 1 includes a blade signal 10 line for transmitting signal from the semiconductor wafer , a support insulator 8 covering at least a portion of the blade signal line 10 , a plurality of blade guard patterns 12 a , 12 b , 12 c , 12 d disposed in or on the support insulator 8 for electromagnetically shielding the blade signal line 10 , and a probe 2 supported on the support insulator 8 and connected to the blade signal line 10 . there are also disclosed processes of producing the blade - like connecting needle 1 . a method for manufacturing a coaxial or hollow blade - like connecting needle is also provided .