a bonding clip is provided in combination with a fluid conduit coupling that interconnects fluid conveying members . the bonding clip conducts electrical charge across the coupling to prevent buildup of electrostatic charges in the coupling . in one aspect of the invention , it may be considered a bonding clip . in another aspect , it may be considered the combination including the bonding clip and coupler . the invention also includes a method for dissipating electrostatic charge across a coupling used to interconnect fluid conveying members . in a preferred embodiment of the bonding clip , it includes a continuous flexible wire element mounted exteriorly of the coupling . the bonding clip is formed in a shape to connect the facing flanges of adjacent fluid conveying lines connected by the coupler , and to pass over the coupler with a defined gap separating a bridge portion of the clip from exterior surfaces of the coupler .