disclosed is a system for handling large area , in - process , circuit panel layers . the circuit panel layers are thin and flimsy , and require rigid support for certain processing steps . the system includes a peripheral frame fixture for surrounding and supporting the in process circuit panel layer , and a a loading chuck for mounting the in - process circuit panel layer in the peripheral frame fixture . the peripheral frame fixture includes a bottom plate having a central opening to expose the circuit panel layer , a top frame having a corresponding central opening to expose the opposite surface of the circuit panel layer , and a compressive apparatus , as screws , bolts , or the like , for applying a z axis compressive force to the bottom plate , the top frame , and a panel layer therebetween . optionally , the fixture may include alignment pins or fiducials for aligning the bottom plate , a panel layer , and the top frame , and a robotic interface for a robotic arm to grasp and transfer the peripheral frame fixture . the system also includes a loading chuck for mounting the in - process circuit panel layer in the peripheral frame fixture . the loading chuck includes a peripheral edge for receiving the bottom plate of the peripheral frame fixture . this provides co - planarity of the in - process circuit panel layer , the bottom plate of the peripheral frame fixture , and the vacuum table . the vacuum table is within the area bounded by the peripheral edge of the loading chuck and the peripheral frame of the peripheral frame fixture , and is coplanar with them . the vacuum table includes slidable bearing surfaces , with vacuum apertures for drawing a vacuum to hold the panel in place , and slide actuators for moving the slidable bearing surfaces to apply x - y axis tension to a panel on the bearing surfaces .