a semiconductor device includes a first conductive member , a second conductive member , a semiconductor chip , which is located between the conductive members , a bonding member , which is located between the first conductive member and the semiconductor chip , another bonding member , which is located between the second conductive member and the semiconductor chip , a molding resin , which is located between the first and second conductive members to seal the semiconductor chip , and a bonding member anti - sticking means , which is located between the molding resin and a surface of one member selected from the group consisting of the semiconductor chip and the conductive members . the bonding member anti - sticking means prevents the bonding members from sticking to the surface in the manufacturing process . as a result , the otherwise insufficient connection due to the sticking between the molding resin and the surface is improved , and the semiconductor device becomes durable in electric performance .