the present disclosure relates generally to encapsulant materials , a method of making thereof and the use thereof for maintaining the electrical and mechanical integrity of solder connections between electronic devices and substrates . more specifically , the present disclosure relates to reflow encapsulant materials with fluxing properties and a method of making thereof . the present disclosure further relates to a method of manufacturing flip - chip assemblies using the reflow encapsulant materials of the present disclosure wherein only one heating cycle is utilized .