a circuit pattern forming method that can reduce a possibility of undesired short - circuits being produced in the circuit by satellites formed when fabricating a conductive pattern . thereby , a highly reliable printed circuit board can be formed . a conductive pattern and an insulating pattern of a predetermined thickness are overlappingly drawn by scanning a liquid ejection head and a substrate relative to each other a plurality of times , while ejecting droplets of a conductive pattern forming solution and an insulating pattern forming solution . when forming the conductive pattern and the insulating pattern that adjoin each other on the substrate , the step of forming the insulating pattern of at least one scan is executed between the conductive pattern forming steps that are executed the plurality of times , until the conductive pattern has a predetermined thickness .