a metal sealed organic light emitting diode device comprising a lid , containing a recessed portion to accommodate large quantity of getter / dessicant , a band of metal stack at the perimeter over which is laid a band of low temperature melting solder alloy , pre - tinned subsequently , and a substrate . the substrate containing organic light emitting diode at the central area with a band of metal stack at the perimeter . the lid and the substrate are placed together in substantial alignment such that the pre - tinned low melting solder band of the lid contacts the metal stack of the substrate and thermally sealed in a controlled atmosphere . multiples of substrates are sealed with a single lid containing multiplicity of recessed portions with multi - segmented metal stack and pre - tinned solder band to derive a large area device .