a flexible integrated circuit package for mounting on a substrate is disclosed . the package consists of a tape film having layers of dielectric and conductive material , a semiconductor die and an array of conductive leads . a molded body covers the die , and absorbs the majority of the pressure applied when compressing the package between a heatsink and a printed circuit board . rigid removable support material surrounds the molded body to keep the package flat while it is being mounted to the pcb . the support material is removed after soldering of the package to the pcb . the invention permits the package to be tightly compressed between a heatsink and a substrate without causing degradation of the conductive connections . reliability of the connections is further increased since the tape film is flexible enough to accommodate bending of the substrate to which the package is connected .