an electronic package that includes a composite material base . in one embodiment the electronic package is an expanded wafer - level package . the composite material base is composed of woven strands and polymer material . in one embodiment the composite material base is composed of woven fiberglass strands and an epoxy material . in various embodiments the package includes an electronic circuitry layer on one or another face of the composite material base . in other embodiments conductive vias connect the circuitry layers , including a redistribution layer . in yet another embodiment an electronic package is mounted on the composite material base and electrically couples to the circuit of the expanded wafer - level package . the package having the composite material base is mechanically stronger and can be made thinner than a package that relies on an encapsulant material for structure , and resists cracking .