in one aspect , a repair method for repairing components comprising a base material with a directed microstructure is provided . the repair is performed in such a way that the repaired location correspondingly has a directed microstructure like the surrounding base material . a solder is applied in the region of a location to be repaired and is soldered to the component via heat exposure , a temperature gradient , i . e ., for instance a temperature variation from a higher temperature to a lower temperature , is thereby produced in the region of the location to be repaired .