an improved cooling system provides cooling away from the surface of electrical and electronic components with very low parasitic power consumption and very high heat transfer rates . the component to be cooled is in thermal contact with a cold plate evaporator device . refrigerant is circulated by a liquid refrigerant pump to the cold plate evaporator device , and the liquid refrigerant is at least partially evaporated by the heat generated by the component . the vapor is condensed by a conventional condenser coil and the condensed liquid along with any unevaporated liquid is returned to the pump . the system operates nearly isothermally in both evaporation and condensation .