the invention relates to the manufacturing of a multilayer structure and especially it relates to the manufacturing of a three - dimensional structure and its use as an electronics assembly substrate and as a winding for transformers and inductors . when a multilayer structure is manufactured by folding a conductor - insulator - conductor laminate , where the conductor layers to be separated from each other follow each other on opposite sides of the conductor - insulator - conductor laminate in the sections following each other and where the insulator has been removed from the places where the conductor layers are to be connected together after folding , it is possible to manufacture a wide range of three - dimensional multilayer structures where the volume occupied by the windings over the total volume can be maximized . alternatively , by using the method it is also possible to manufacture a multilayer structure where components have been buried inside . the method makes it also possible to make connections between layers in a flexible manner . among other issues , the method can be easily automated for mass - production .