an electrical connecting device and related method of testing a semiconductor device which provides for testing of a semiconductor device under excellent and stable current transfer characteristics . moreover , the electrical connecting device is easily produced under mass production conditions and can be made with a structure for testing of a semiconductor device where there are many pins arranged in a fine pitch on the semiconductor device . the electrical connector device includes a contactor which has a coil - shaped spring and a transformable conductive member extending in the compressing direction of the coil - shaped spring . when one end of the conductive member is in contact with a first electrode and the other end of the conductive members in contact with the second electrode , the contactor electrically connects between the first electrode and the second electrode via the conductive member and generates contact pressure against the electrodes when the coil - shaped spring is pressed . a guide plate is provided in the electrical connector device having a through hole for inserting and positioning the contactor therein . in a preferred embodiment , the semiconductor device to be tested has the first electrode for contact against one end of the conductive member of the contactor . the second electrode is a land pattern in a substrate of the electrical connecting device contacting the other end of the transformable conductive member , with the land pattern in turn being connected to testing equipment for testing of the semiconductor device .