optical switch packaging techniques and optical switch components are described . in one aspect , an optical switch component that includes a die mounted on an interposer is described . the die has an exposed array of mirrors that can be used as part of an optical switch . typically , the interposer will also have a fiber array mount arranged to receive a fiber bundle and to position the fiber bundle appropriately over the array of mirrors . in some embodiments , an optical switch can be formed by putting together two mirror image interposer based optical switch components . when placing two interposer based optical switch components together , an alignment frame may be positioned between the interposers to help maintain a desired spacing between the respective arrays of mirrors . in some such embodiments , an inner housing is provided that encloses the dice , the fiber array mounts the alignment frame and portions of the interposers , but leaves connectors mounted on the interposers exposed . an outer housing may optionally be provided to encase the optical switch components and the inner housing . a resilient filler material may also be provided between the inner and outer housings to provide additional protection to the optical switch .