this invention provide an adhesive tape and a liquid adhesive for electronic parts having sufficient thermal resistance and reliability . the adhesive tape comprises an adhesive layer composed of at least a polyimide comprising the repeating units represented by the formulas and , provided on surface of a heat resistance film or a release film : ## str1 ## wherein x is -- so 2 -- and / or -- c -- och 2 ch 2 o -- c --, ar is a divalent group containing aromatic rings , and r is an alkylene group having 1 to 10 carbon atoms or -- ch 2 oc 6 h 4 --, and n means an integer of 1 to 20 .