the present invention is a method and apparatus for a very low profile ball grid array package . a substrate is provided with an aperture . a thin sheet material is secured to the substrate , covering the aperture , so as to form a cavity . a semiconductor die is mounted in the formed cavity on the thin sheet material . the semiconductor die is encapsulated with the thin sheet material supporting it during encapsulation . the use of the thin sheet material to form the cavity is a cost effective way to construct a ball grid array package having a very low profile .