a bond pad structure and method of forming the bond pad structure which provides for reliable interconnections between the bond pad structure and the next level of circuit integration . the bond pad structure uses three metal pads separated by layers of dielectric . via plugs are formed between the first and second metal pads and between the second and third metal pads . the via plugs are formed in a diamond shape with respect to the metal pads . the metal pads are squares with the same orientation . the periphery of the via plugs forms a square rotated 45 ° with respect to the square metal pads .