the invention is methods and compositions for removing bonding agents from the hard surfaces of machinery and , in its most preferred mode packaging equipment . the release composition comprises lecithin and a hydrophobic carrier . the method comprises the steps of applying a release composition to the surfaces of the packaging equipment . the packaging equipment is then used . any bonding agent deposited on the treated areas of the packaging equipment may then be removed . the invention is applicable to any number of package and container manufacture environments including package assembly , package sealing , product sealing , and labeling .