a method for predicting a source of semiconductor part deviation is disclosed . the method includes the steps of selecting at least one chart including part parameters and associating with each of the part parameters at least one fabrication process , which are stored in recipes , scanning the selected charts for deviations in the part parameters , wherein the deviations are determined by monitoring a trend of recent values of the part parameters , indicating the charts containing the part parameters wherein the part parameter values are determined as being outside of at least one trend tolerance value associated with the parameter , identifying , in each of the indicated charts at least one process associated with each of the part parameter deviations outside the at least one tread tolerance value , and determining a source of the parameter deviation by correlating each of the identified at least one processes . in one aspect of the invention , the selected chart includes the relationship between part parameters and processes .