as an outside box mark for automatic overlay measurement formed on a semiconductor substrate , a # shape is formed by laying two vertical lines formed by word lines over two parallel lines formed of bit lines . thereby , a misalignment value in the word line direction and a misalignment value in the bit line direction are measured simultaneously by using one box mark . when forming capacity contacts between wiring lines of a #- shaped structure formed of word lines and bit lines , it is conducted by using a box mark for automatic overlay measurement . as a result , it becomes possible to shorten the time required for measuring the misalignment values in the x direction and y direction and analyzing the measurement result .