method of producing a bonded wire connection between an electronic component or a subassembly and a carrier by introducing energy from an ultrasound transducer into a wire that is to be bonded . according to this method , during the introduction of energy the impedance of the ultrasound transducer is measured as a function of time . the shape of the curve representing this time dependence is evaluated on the basis of a pre - specified comparison criteria , and the power input to the ultrasound transducer and / or a bond weight exerted on the wire is / are controlled in dependence on the result of this evaluation . a device usable for carrying out this method is also described .