the present invention relates to a method for reducing tin whisker formation in tin deposits by plating on an underlying metal tin deposits which are predominantly in a predetermined crystal orientation that essentially matches that of the underlying metal in order to inhibit tin whisker growth . the most preferred crystal orientation is one that is the same as that of the underlying metal . the deposit preferably contains at least 95 % tin and optionally at least one alloying element of silver , bismuth , copper or zinc in an amount of 5 % or less . advantageously , the tin deposits are provided during electroplating from a specially formulated plating solution .