a method of manufacturing a plurality of microelectronic packages including electrically and / or thermally conductive elements . the method includes providing a support structure having a plurality of protrusions and depressions extending outwardly from the support . a conductive element is then mated to the support structure in a male - to - female relationship . the depressions formed in the support structure and conductive element are used to house a microelectronic element such as a semiconductor chip . a substrate is provided so as to cover substantially each depression located in the conductive element . leads interconnect contacts to the chip to terminals on the substrate . a curable encapsulant material may be deposited into the depression so as to protect and support the leads and the microelectronic element . additionally , the curable encapsulant material forms part of the exterior of a single resulting chip package once the assembly is diced and cut into individual packages .