a method of flip - chip mounting can reliably and stably mount a semiconductor chip to a mounting substrate while avoiding problems such as damage to the semiconductor chip due to a difference in thermal expansion coefficients between the semiconductor chip and the mounting substrate . the method of flip - chip mounting a semiconductor chip supports a mounting substrate on a stage in a state where a resin material has been supplied onto a chip mounting surface of the mounting substrate and presses the semiconductor chip toward the mounting substrate using a pressure / heat applying head to bond the semiconductor chip to the mounting substrate and thermally harden the resin material . a concave part is provided in a support surface of the stage that supports the semiconductor chip , and the semiconductor chip is bonded to the mounting substrate by pressing the semiconductor chip toward the mounting substrate using the pressure / heat applying head in a state where the mounting substrate is bent toward the concave part .