a bonding pad arrangement for an integrated circuit includes a bonding pad fabricated on a bonding area to enable bonding . a first esd resistor is fabricated adjacent the bonding area , and at least a second esd resistor is fabricated adjacent the first esd resistor and the bonding area . the bonding pad extends beyond the bonding area to connect to the first esd resistor and to the at least second esd resistor , thereby providing at least two input esd circuits for at least one current consuming electronic circuit from the single bonding pad .