the semiconductor portion of a circuit includes a plurality of flip chip devices which are arranged in a planar fashion in a common housing . the plurality of flip chip devices are connected to each other without wire bonding . the common housing includes a packaging structure , the packaging structure including a connective portion and at least one web portion , which aids in the thermal management of the heat emitted by the plurality of flip chip devices and which connects the flip chip devices to each other . passive devices in the circuit may also be arranged in a planar fashion in the common housing .