a semiconductor device having a light transparent window includes : a wall produced at an outer contour of a light receiving section on the surface of a semiconductor chip , the molding resin which is produced after a process of inserting the chip in a metal mold . the wall and the metal mold adhere with each other for producing a space between the chip and the metal mold so that a light transparent window is produced at a light introduction section in a separate position from the wall above the chip .