an electrical interconnect including a first circuitry layer with a first surface and a second surface . at least a first dielectric layer is printed on the first surface of the first circuitry layer to include a plurality of first recesses . a conductive material is deposited in a plurality of the first recesses to form a plurality of first conductive pillars electrically coupled to , and extending generally perpendicular to , the first circuitry layer . at least a second dielectric layer is printed on the first dielectric layer to include a plurality of second recesses generally aligned with a plurality of the first conductive pillars . a conductive material is deposited in a plurality of the second recesses to form a plurality of second conductive pillars electrically coupled to , and extending parallel the first conductive pillars .