a solder joint comprising a solder capture pad on a substrate having a circuit ; and a lead containing or a lead free solder selected from the group comprising sn — ag — cu solder , sn — cu solder and sn — ag solder adhered to the solder capture pad ; the solder selected from the group comprising between 0 . 1 and 6 . 0 per cent by weight zn . a solder joint , comprising a solder capture pad on a substrate having a circuit ; and a sn — cu lead free solder adhered to the solder capture pad , the solder comprising between 0 . 1 and 6 . 0 % by weight zn . formation of voids at an interface between the solder and the solder capture pad is suppressed . a method for forming solder joints using the solders .