one or more electronic components can be mounted on the back side of a semiconductor die . the components can be passive components , active components , or combinations thereof . the components can be soldered to signal routes on the back side of the die , the signal routes being attached to the die using a metallization layer or using one or more dielectric layer sections . placing components on the back side of the die can allow for incorporation of the components without necessarily increasing the form factor of the die &# 39 ; s package .