a base having a plurality of pins extending upwardly therefrom is provided . a support is provided over the base . the support has an upper surface and a plurality of holes extending therethrough . the pins extend through the holes and upwardly beyond the upper surface of the support . an actuator is provided beneath the support . a board having a plurality of integrated circuits bonded thereto is provided . the integrated circuits form a repeating pattern of integrated circuit packages across the board , and the board has a plurality of holes extending through it . the board is placed over the support upper surface with the pins extending into the holes in the board . while the board is over the support upper surface , it is cut to separate the integrated circuit packages from one another .