an apparatus and method used to selectively etch materials from the edge and bevel areas of a silicon wafer are provided . in one configuration , a bevel etch spin chuck , for use in a device for removing unwanted material from an edge and bevel area of a wafer , includes a fluid channel , a separation barrier , and a gas channel that are substantially circular and concentric . a fluid , such as an etching solution , is provided to the fluid channel and contacts one or more areas at the edge and bevel area of the wafer . a stream of continuously flowing gas , such as nitrogen , is provided to the gas channel and purges an active side of the wafer .