the invention provides a wafer level chip size packaging target and a method for forming it . a wlcsp target is formed by recombining single chips , wafer parts each including two or more chips or half finished packaging targets which have been subjected to at least one previous step of packaging onto a first substrate , or bonding a wafer part which is formed by dicing a whole wafer and includes at least two chips to a second substrate for bonding . thus , a wafer with a larger size can be packaged through the wlcsp on a wlcsp apparatus with a smaller size while benefiting from the advantages of the wlcsp , the wlcsp apparatus remains applicable within a longer period of time , the cost is lowered , and enterprises may keep up with the development of the market and the increase of the wafer size without having to update the wlcsp apparatus substantially .