inductors and methods for integrated circuits that result in inductors of a size compatible with integrated circuits , allowing the fabrication of inductors , with or without additional circuitry on a first wafer and the bonding of that wafer to a second wafer without wasting of wafer area . the inductors in the first wafer are comprised of coils formed by conductors at each surface of the first wafer coupled to conductors in holes passing through the first wafer . various embodiments are disclosed .