a hybrid semiconductor package is formed from a die having two opposed elongate die edges with conductive bond pads arranged transversely relative to the rows of outer leads . a first portion of inner leads is off - die wire bonded to some of the bond pads , and a second portion of inner leads is insulatively attached as loc leads between the bond pads along the opposed die edges . the hybrid package results in shorter inner leads of increased pitch enabling improved line yield at wire bond and encapsulation , as well as improved electrical performance , particularly for packages with very small dice .