a semiconductor device according to an embodiment includes a semiconductor chip , a cap disposed to face the semiconductor chip , and having a through - hole electrode arranged in a through hole , and a bump electrode provided between the semiconductor chip and the cap , wherein the bump electrode is in a protruding shape connecting the semiconductor chip and the through - hole electrode , and wherein at least a portion of the bump electrode is included in the through - hole electrode , and electrically connected thereto , so that the adhesive performance between the cap and the bump electrode can be increased .