an electrical circuit is formed by forming and patterning a conductive layer on a substrate , forming and patterning a conductive layer on another substrate , depositing a dielectric layer on at least a portion of one of conductive layers , mounting an integrated circuit between the substrates , coupling the ic to the conductive layers , and affixing the substrates together with the conductive layers between the substrates . these are either separate substrates or a unitary substrate . the ic is mounted either to a substrate , a conductive layer , or a dielectric layer . the ic is coupled to the conductive layers either directly or through openings formed in the dielectric layer . an interior conductive layer may be used to couple the ic to the conductive layers .