disclosed are a fabrication process and a device of a multi - chip package having spliced substrates , characterized in utilizing an incomplete substrate and a substrate block with different dimensions to combine as a spliced complete substrate during the fabrication process . two kinds of chips with different functions , including memory and controller , are disposed on the incomplete substrate and the substrate block , respectively . then , the incomplete substrate and the substrate block are then spliced together by joining their spliced portions formed on their substrate sidewalls . finally , an encapsulant is formed on the incomplete substrate and further formed on the substrate block . accordingly , it is possible to integrate different functional chips into a single multi - chip package by optimizing packaging processing parameters with optimized materials .