the present invention provides a heat sink structure , which includes : a housing located on a material with low thermal conductivity ; and a heat conductor placed inside the housing . at least one air gap is formed between the heat conductor and the housing to reduce the conductivity from the heat conductor to the housing , and thus increasing the thermal resistance between the heat conductor and the housing . the surface temperature of the bottom of the housing thus could be reduced and averaged , so as to effectively improve the lifespan , the safety and reliability of a device with the heat sink structure .