a cooling supply package for an electronic component has a supply port communicating with a plurality of outer supply channels , and a return port communicating with a plurality of outer return channels . the outer supply channels and outer return channels communicate with distinct ones of openings in a slot layer and into return and supply slots , respectively . an orifice layer supplies fluid to an electronic component from supply slots and receives return fluid into the return slots after having cooled the electronic component . a cooling supply and electronic combination is also disclosed .