a novel and improved device for interconnecting an integrated circuit package to a circuit board is presented . in accordance with the present invention an integrated circuit package having an central area devoid of surface contacts is positioned over a resilient or compressible connector system . the compressible connector includes an opening about its center which corresponds to the central area on the integrated circuit package . a component is mounted onto the circuit board within the opening of the compressible connector between the integrated circuit package and the circuit board .