a process for forming printed circuit boards having integral inductor cores . according to the invention , a thin nickel layer is formed on a copper foil . the copper foil structure is then laminated to a substrate such that the nickel layer is in contact with the substrate . the copper foil is removed , leaving the nickel layer on the substrate . using photomechanical imaging and etching techniques known in the art , nife is plated and patterned directly on the nickel layer , thereby forming integral inductor cores of the substrate . this process of the present invention allows for the elimination of several steps used in known processes , while also reducing etch time and minimizing waste of nife .