This study revolves around the issues raised by the current semiconductor device metal casings (mainly composed of aluminum and its alloys), such as resource and energy consumption, complexity of the production process, and environmental pollution. To address these issues, researchers have proposed an eco-friendly and high-performance alternative material—Al2O3particle-filled nylon composite functional material. This research conducted detailed characterization and analysis of the composite material through scanning electron microscopy (SEM) and differential scanning calorimetry (DSC). The results show that the Al2O3particle-filled nylon composite material has a significantly superior thermal conductivity, about twice as high as that of pure nylon material. Meanwhile, the composite material has good thermal stability, maintaining its performance in high-temperature environments above 240 °C. This performance is attributed to the tight bonding interface between the Al2O3particles and the nylon matrix, which not only improves the heat transfer efficiency but also significantly enhances the material’s mechanical properties, with a strength of up to 53 MPa. This study is of great significance, aiming to provide a high-performance composite material that can alleviate resource consumption and environmental pollution issues, with excellent polishability, thermal conductivity, and moldability, which is expected to play a positive role in reducing resource consumption and environmental pollution problems. In terms of potential applications, Al2O3/PA6 composite material can be widely used in heat dissipation components for LED semiconductor lighting and other high-temperature heat dissipation components, thereby improving product performance and service life, reducing energy consumption and environmental burden, and laying a solid foundation for the development and application of future high-performance eco-friendly materials.