Epoxy resin (EP), as a kind of dielectric polymer, exhibits the advantages of low-curing shrinkage, high-insulating properties, and good thermal/chemical stability, which is widely used in electronic and electrical industry. However, the complicated preparation process of EP has limited their practical applications for energy storage. In this manuscript, bisphenol F epoxy resin (EPF) was successfully fabricated into polymer films with a thickness of 10~15 μm by a facile hot−pressing method. It was found that the curing degree of EPF was significantly affected by changing the ratio of EP monomer/curing agent, which led to the improvement in breakdown strength and energy storage performance. In particular, a high discharged energy density (Ud) of 6.5 J·cm−3and efficiency (η) of 86% under an electric field of 600 MV·m−1were obtained for the EPF film with an EP monomer/curing agent ratio of 1:1.5 by hot pressing at 130 °C, which indicates that the hot−pressing method could be facilely employed to produce high−quality EP films with excellent energy storage performance for pulse power capacitors.