Indium Corporation’s Tim Jensen, Product Manager for Engineered Solder Materials, will host a one-hour Thermal Live™ webinar at 10 a.m. EST on Oct. 23 regarding Innovation Metal Thermal Interface Materials to Maximize Heat Dissipation.

Jensen will discuss how metal-based thermal interface materials (TIMs) are proving to be an attractive option in electronics assembly because of their high z-direction thermal conductivity. Many recent innovations have led to great strides in improving interfacial resistance, heat dissipation, and longer life during power cycling. Jensen will review these innovations and examine why they make metal TIMs the most attractive option for high-reliability applications, such as TIM 1, TIM 2, IGBT, LED, and other applications.

Jensen is an SMTA-certified process engineer. He has more than 20 years of experience working with customers troubleshooting and optimizing SMT process lines and solving defects, such as head-in-pillow, graping, and QFN voiding. Jensen has worked directly on hundreds of surface mount lines and developed a number of different products. Using that direct knowledge and expertise, he works closely with Indium Corporation’s technical service, sales, and research and development teams to develop cutting-edge products that address the unique challenges faced by the electronics assembly industry. As senior product manager, Jensen is responsible for Indium Corporation’s most diverse product group, which includes solder preforms, wire, ribbon and foil, as well as thermal interface materials. He earned his bachelor’s degree in chemical engineering from Clarkson University and his master’s in business administration from Syracuse University.

