Microwave Journal
SiP Trends

The 5G revolution is pushing innovations for RF front-end SiP

Consolidated from Yole Développement and System Plus Consulting

March 26, 2019

Yole Développement (Yole) has just released a report showing an industry shift in packaging technology as 5G is implemented. They state that 5G will totally redefine how the RF front-end interacts in-between the network and the modem. The new RF bands for sub 6 GHz pose big challenges for the industry. Yole Développement (Yole) and System Plus Consulting have investigated this trend toward advanced packaging and have highlighted the ones focused on RF applications for cellphones. As the 5G revolution begins, the leading packaging companies are strongly investing in new technologies: “From a technology viewpoint, base stations to smartphones, protocols to hardware, semiconductor devices and packaging, 5G requires disruptive innovations and not incremental ones as it was mostly the case in the past,” explains Santosh Kumar from Yole. 

This month, both partners release three dedicated reports dedicated to the RF SiP technologies. With both reports, Yole and System Plus Consulting give a broad understanding of the industry evolution, the innovative technologies and the strategy of each players. The “Advanced RF System-in-Package for Cellphones” is a comprehensive review of the SiP market for various RF front-end modules in the mobile business. In addition, System Plus Consulting proposes two case studies to point out the technology choices made by the leading players and the benefits of each of them, with: “Broadcom AFEM-8092 System-in-Package in the Apple iPhone Xs/Xr Series” and “The Advanced packaging technology in the Apple Watch Series 4's System-in-Package”.


The RF SiP packaging market can be divided into two segments:


RFFE Markets

SiP Trends

SiP Examples
