LPKF is making new believers in its laser-based circuit-manufacturing equipment, recently announcing an order of more than $8.75 million for laser systems for manufacturing three-dimensional (3D) embedded cellular telephone antennas from a major international electronics group. LPKF Chief Executive Officer (CEO) Dr. Ingo Bretthauer, notes that the order underlines the growing acceptance of Molded Interconnect Devices (MIDs) for mass-production applications using LPKF's laser direct structuring (LDS) technology: "This order, the biggest in our company history, marks the final breakthrough into mass production of our MID technology." The MIDs are 3D circuit carriers made of plastic resin and structured and activated using a laser beam.