Context: Subtractive methods remove copper from an entirely copper-coated board to leave only the desired copper pattern. In additive methods the pattern is electroplated onto a bare substrate using a complex process. The advantage of the additive method is that less material is needed and less waste is produced. In the full additive process the bare laminate is covered with a photosensitive film which is imaged (exposed to light through a mask and then developed which removes the unexposed film). The exposed areas are sensitized in a chemical bath, usually containing palladium and similar to that used for through hole plating which makes the exposed area capable of bonding metal ions. The laminate is then plated with copper in the sensitized areas. When the mask is stripped, the PCB is finished.

Question: Do additive or subtractive methods use less raw materials?
Answer: additive

Question: What chemical element is often present in the bath used to sensitive exposed film after it's been imaged?
Answer: palladium

Question: What object is used to expose selected parts of the photosensitive film to light?
Answer: mask

Question: In subtractive methods, what metal covers the board and is then partially removed?
Answer: copper

Question: In the additive method, which parts of the laminate are plated with copper?
Answer: sensitized areas

Question: The advantage of the subtractive method is that less what?
Answer: Unanswerable

Question: Bare laminate is placed on top of photosensitive film in what process?
Answer: Unanswerable

Question: The exposed areas are sensitized using plutonium in what process?
Answer: Unanswerable

Question: The laminate is plated with silver during what process?
Answer: Unanswerable

Question: When the PCB is stripped, what is finished?
Answer: Unanswerable