Context: Development of the methods used in modern printed circuit boards started early in the 20th century. In 1903, a German inventor, Albert Hanson, described flat foil conductors laminated to an insulating board, in multiple layers. Thomas Edison experimented with chemical methods of plating conductors onto linen paper in 1904. Arthur Berry in 1913 patented a print-and-etch method in Britain, and in the United States Max Schoop obtained a patent to flame-spray metal onto a board through a patterned mask. Charles Ducas in 1927 patented a method of electroplating circuit patterns.

Question: Who was the German inventor who wrote in 1903 about conductors being laminated in layers to a board?
Answer: Albert Hanson

Question: What material did Thomas Edison experiment with by trying to chemically attach conductors to it?
Answer: linen paper

Question: What year did Arthur Berry patent his print-and-etch method?
Answer: 1913

Question: In Max Schoop's method, what was used to create the flame-sprayed pattern on the board?
Answer: a patterned mask

Question: Who obtained a patent in 1927 for his method of electroplating circuit patterns?
Answer: Charles Ducas

Question: development of the methods used in ancient printed circuit boards started when?
Answer: Unanswerable

Question: Albert Hanson described what in 1913?
Answer: Unanswerable

Question: Arthur Berry patented what in 1923?
Answer: Unanswerable

Question: Thomas Edison patented a print-and-etch method in what year?
Answer: Unanswerable

Question: In Germany Max Schoop obtained a patent to do what?
Answer: Unanswerable