Context: Electrochemical migration (ECM) is the growth of conductive metal filaments on or in a printed circuit board (PCB) under the influence of a DC voltage bias. Silver, zinc, and aluminum are known to grow whiskers under the influence of an electric field. Silver also grows conducting surface paths in the presence of halide and other ions, making it a poor choice for electronics use. Tin will grow "whiskers" due to tension in the plated surface. Tin-Lead or solder plating also grows whiskers, only reduced by the percentage Tin replaced. Reflow to melt solder or tin plate to relieve surface stress lowers whisker incidence. Another coating issue is tin pest, the transformation of tin to a powdery allotrope at low temperature.

Question: What's the process whereby metal filaments are grown on or in a PCB via DC voltage?
Answer: Electrochemical migration

Question: Along with silver and aluminum, what metal grows metal filaments when exposed to an electric field?
Answer: zinc

Question: In addition to "whiskers," what does silver sprout around ions like halide?
Answer: conducting surface paths

Question: What do scientist call the function whereby tin changes when it's very cold?
Answer: tin pest

Question: What's present in plated surfaces that causes tin to grow metal filaments?
Answer: tension

Question: What material is a good choice for electronics use?
Answer: Unanswerable

Question: Tin plast is what type of issue?
Answer: Unanswerable

Question: The transformation of silver to a powdery allotrope at low temperature is know as what?
Answer: Unanswerable

Question: AC voltage bias helps promote the growth of what?
Answer: Unanswerable