Optical semiconductor encapsulating material
An optical semiconductor encapsulating material comprising (A) at least one (meth)acrylic compound selected from among a (meth)acrylate modified silicone oil, a long-chain alkyl (meth)acrylate and a polyalkylene glycol (meth)acrylate of 400 or greater number average molecular weight, (B) (meth)acrylate compound having an alicyclic hydrocarbon group with 6 or more carbon atoms ester bonded thereto and (C) radical polymerization initiator; and a photoelectric transducer and photoelectric converter apparatus utilizing the same. This optical semiconductor encapsulating material provides a hardening product that excels in transparency, being stable in ultraviolet rays and heat and suppressing yellowing and also exhibits excellent performance in adherence, and is suitable for use in the encapsulating material for light emitting element, photo acceptance element, etc. of optical semiconductor device (semiconductor light emitting device), especially the transparent encapsulating material for optical semiconductor, such as LED.