REFLOW SOLDER FURNACE AND METHOD FOR REFLOW SOLDERING
A reflow soldering furnace and a method for reflow soldering of components (3) disposed on a circuit board (1) in a reflow soldering furnace is described, in which the temperature of the solder points (5) of the individual components (3) distributed over the circuit board (1) follows as precise a target temperature as possible during soldering operations in the soldering chamber (13), said target temperature being prescribed by a predefined solder-specific temperature cycle, wherein a heating device (17) is provided in the soldering chamber (13), said heating device heating the soldering chamber (13) to a predefined base temperature based on the predefined solder-specific temperature cycle prescribed for the soldering process during soldering operations, wherein an arrangement (19) of infrared heating elements (21) that are controllable independently of one another is disposed above the circuit board (1) in the soldering chamber (13) and covering the base surface of the soldering chamber (13), said arrangement being brought in by the circuit board (1) during soldering operations, and wherein a control system (27) is provided that operates the infrared heating elements (21) during soldering operation, said elements together with the heating device (17) effecting as homogeneous a heating of the solder points (5) distributed over the circuit board (1) as possible, said heating being to a target temperature predefined by the solder-specific temperature cycle, said target temperature being above the base temperature.