PROCESS FOR JOINING MATERIALS USING A METALLIC HEAT SOURCE WITHIN A CONTROLLED ATMOSPHERE
This invention is directed to a process for joining materials (20,40) comprising providing an assembly comprising at least one material layer; at least one metal heat source (30); and at least one solder layer (25 or 35), each solder layer disposed between each metallic heat source and each material layer; placing the assembly in a controlled atmosphere (50); and initiating a chemical reaction in the metal heat source so as to enable the solder to join the material layer.