A touchless microcomponent gripper for precision handling and microassembly
Touchless Automation is a contactless solution to handle microcomponents of any shape & material. 
It addresses the acute problem of microcomponents frequently getting damaged, contaminated, and as a result, discarded during the precision assembly processes. Our novel microgripper combines ultrasound & vacuum to make the microcomponents levitate underneath it at the distance of <50 µm. It is the smallest solution of this kind on the market.
We are targeting semiconductor manufacturing equipment & watchmaking industries for commercialization of Touchless Automation (with total addressable markets of €91.8m+ & €33.6m+ respectively). In 2017 we have generated strong market interest from other markets as well—pharmaceuticals, optoelectronics, metrology & others. 
In semiconductor equipment manufacturers & watchmakers, we have already defined technological feasibility studies with our prospects (Rolex, Ciposa, Comadur) to validate characteristics of the microgripper. In the implemented studies we have seen a 18-24% reduction in microparts damage & contamination. Finally, our partner Sabato Microtec—one of the leading global high-precision micromechanics manufacturers—will back us up with expertise, a wide network of contacts & equipment to develop & scale.
In Oct 2017 we have received a PCT report that confirmed innovation over prior art, which removed the final obstacle (from a competitive patent) and gave us freedom to operate and to commercialize Touchless Automation.
With Touchless Automation we are conservatively estimating €15m+ revenues by 2021 & €26m+ by 2023. In this Phase 1 project we will produce detailed market analysis for key & adjacent market segments, validate price ranges, determine sources of additional revenue streams & define a strong IP protection strategy.