Multilayered ceramic circuit board.
@ A multilayered ceramic circuit board in which conductive material 4 and ceramic material 5 are alternatingly laminated, and wiring between the conductive layers 4 is connected by conductive material 3 in through holes in the ceramic layers. So that the circuit board is less sensitive to cracks due to thermal stress, the conductive material has a coefficient of thermal expansion which is greater than the coefficient of thermal expansion of said ceramic material, the respective materials are selected so that the difference between the coefficients of thermal expansion of the conductive material and the ceramic material is less than 100 x 10 <sup>7</sup>/°C.In particular, the conductive material comprises a metal and a glass composition which contains a SiO<sub>2</sub>- containing filler. The glass composition contains Si02 in an amount of 5 to 90% by weight, B<sub>2</sub>O<sub>3</sub> in an amount of 10 to 70% by weight and a refractory additive in an amount of 1 to 55% by weight.