INTEGRATED CIRCUIT
A photonic integrated semiconductor device and method of providing a photonic integrated semiconductor device. The device comprises: a temperature-sensitive semiconductor component and a micro-thermoelectric module. The micro-thermoelectric module is formed adjacent the temperature-sensitive component and is configured to adjust the temperature of the temperature-sensitive component. The first aspect recognises that locating and forming a thermoelectric module adjacent a temperature-sensitive component can be advantageous in dealing with heat generated on an integrated circuit. Furthermore, arranging the thermoelectric module to adjust the temperature of the temperature-sensitive component may negate the need to provide both a thermoelectric module to cool a temperature-sensitive device and a local electric heater adjacent a device. That is to say, the two components may be replaced with a single integrated component in accordance with the first aspect.