Hybrid wafer for multi-layer integration mems devices
It reports on the exploratory experiment of a hybrid wafer with two or more die wired for each other in this thesis. The cavity is formed to the wafer, and individual die is arranged there (die is MEMS device and LSIs, etc.). The surface of the wafer and the surface of the dies are made smooth with the resin, and flat wiring is done to the electrode pads of individual die by the photolithography technology. The accumulating mounting to which other wafers are sticked together in using the flip-chip technology and the TSV technology on the wafer can be done. As a result, it becomes possible to raise the package density from a past wafer-level packaging technology further.