Improved pressboard and process for its preparation.
High temperature resistant pressboard comprised of 20-95% by weight aromatic polyamide fibrids and 80-5% by weight high temperature resistant floc, having a desirable combination of compression set values and oil absorption is prepared by a process whereby a low density pressboard is first prepared by forming a wet lap of multiple layers of a waterleaf containing 50-95% by weight water and pressing the wet lap at 100-200 DEG C under a pressure of 10-60 kg/cm<2>, drying, ultimately at 270-320 DEG C until substantially no further moisture is evolved and finally pressing at 270-320 DEG C under a pressure of 8-350 kg/cm<2> and optionally cooling under restraint.