System for providing an open-cavity low profile encapsulated semiconductor package
System for providing an open-cavity semiconductor package and method for wire bonding a finger sensor die (300) to an external circuit. The finger sensor die includes a sensor array (316) having one or more die contacts (302) that are wire bonded to one or more external contacts of the external circuit so that a usable portion of the sensor array is maximized. The method comprises steps of forming a ball at a first end of a bonding wire (314), forming an electrically conductive connection between the ball and a selected external contact of the external circuit, extending the bonding wire to a selected die contact so as to form a wire loop having a low loop height (310), and forming an electrically conductive stitch connection between a second end of the bonding wire and the selected die contact. <IMAGE>