Analysis of LED wire bonding process using arbitrary Lagrangian-Eulerian and equilibrium mesh smoothing algorithm
In light emitting diode (LED) packaging, wire bonding is used to connect the power of chip. The contact force during thermosonic bonding process might be able to make the failures, such as pad peeling, cracking, and delamination. This study presents an effective simulation technology with bonding wire geometry validation for the LED wire bonding process. An axisymmetric finite element (FE) model using explicit method with a second level accuracy arbitrary Lagrangian-Eulerian (ALE) algorithm is constructed in this research. In addition, ALE using the equilibrium smoothing algorithm can make the contact behavior and geometric shape of bonding wire be the same as experimental results, and element distortion would be reduced.