WALL COOLING DEVICE
The invention relates to a device for cooling a wall (10) having a first surface exposed to a heating source, and a second surface along which flows an external fluid at a temperature lower than T in order to maintain said wall at a temperature substantially equal to the temperature T. The device comprises at least one cooling part (12) including an attachment portion (14) and a cooling portion (16), said part being made of a thermally-conductive shape-memory alloy having a transition temperature T. The attachment portion is rigidly attached to the second surface (10b) of said wall. The cooling portion is shaped so as to assume by itself a first position substantially parallel to said wall when the temperature of the wall is lower than T, and to assume by itself a second position in which the average plane of said second portion defines, together with the plane tangent to said wall, a dihedral of between 45 and 90 degrees.