Electret condenser microphone
An object of the present invention is to provide a digital-output electret condenser microphone capable of being soldered on a wiring substrate of an apparatus by using a reflow furnace. An electret condenser microphone according to the present invention has an electret polymer film and a spacer that are formed of a heat-resistant material. Sound apertures are provided in a front panel of the electrically conductive capsule and/or the wiring substrate. Provided on the surface exposed in the open end of the electrically conductive capsule are multiple terminals, including at least a power supply terminal, a digital signal output terminal, and a clock input terminal. The terminals are protruded outward beyond a caulked part at the open end of the electrically conductive capsule.
