Heat sink
A heat sink 1 for use with a central processor unit or microprocessor 10 is disclosed. The heat sink 1 comprises a body 2 having an outer surface facing to the exterior and a plurality of internal passages 5 and voids 8 and 9 defined therein, forming an internal surface. The body 2 has a first plurality of passages 5 extending in a first direction and a second plurality of passages 5 extending in a second direction substantially perpendicular to the first direction. The passages 5 intersect with each other and open out into each other and also open out on to the outer surface of the body. The body has two voids 8 and 9 that extend from the front or leading face 11 of the outer surface in one of the first and second directions inwardly into the body 2. Typically the voids 8 and 9 are arranged such that they are substantially perpendicular to each other to form a cross when the front or leading face 11 of the outer surface is viewed end on. The heat sink 1 also includes a fan 3 for drawing air through the passages 5 and the voids 8 and 9 in the body 2. Typically, the fan 3 is a low velocity fan having a speed of 2,000 to 5,000 rpm so as to reduce noise generated by the fan. The heat sink 1 is mounted on top of the microprocessor 10 where it assists in drawing excess heat away from the microprocessor 10. Typically this is required when a process called overclocking is engaged in by a computer enthusiast.