Thermal energy regulating device
The present invention relates to a thermal energy adjusting device, which includes a heat-conducting substrate and a plurality of cooling chips. The heat-conducting substrate has a loading surface. Each cooling chip has a first surface and a second surface, and the second surfaces of those cooling chips are fixed on the loading surface of the heat-conducting substrate. Those cooling chips are electrically connected for supplying power thereto such that a temperature variation generated on the second surfaces of those cooling chips is conducted to the substrate. After the temperature variation derived from those cooling chips is conducted to the heat-conducting substrate with the thermal energy adjusting device, the heat-conducting substrate can result in a corresponding temperature change to enlarge a temperature-varying area, thereby uniformly distributing temperature over the heat-conducting substrate. The thermal energy adjusting device of the present invention can be disposed in clothes to generate a change of temperature rise on the second surface of the cooling chip and to conduct thermal energy to the heat-conducting substrate, so as to generate heat to keep warm for the clothing.