A multi-layer package structure for an acoustic microsensor
A multi-layer package structure for an acoustic microsensor, the package structure mainly utilizes a stack of multiple substrates for covering and protecting circuit elements such that integrated circuit element and acoustic microsensor arranged in recessions of a substrate with recessions can reduce volume of the package structure. By adding various sound hole designs, the problem of larger package volume can be effectively solved and sensing frequency of the acoustic microsensor can be increased simultaneously.