METHOD FOR INSERTING A WIRE INTO A GROOVE OF A SEMICONDUCTOR CHIP, AND PIECE OF EQUIPMENT FOR IMPLEMENTING SUCH A METHOD
The invention relates to a method for inserting a wire (7a, 7b) into a longitudinal groove of a semiconductor chip (1) for the assembly thereof, the groove containing a pad (6a, 6b) made of a bonding material having a set melting point, the method comprising: in a positioning step, placing a longitudinal section of the wire (7a, 7b) along the groove, in forced abutment against the pad (6a, 6b); and, in an insertion step, exposing a zone containing at least one portion of the pad (6a, 6b) to a processing temperature higher than the melting point of the bonding material and for a sufficient time to make the pad (6a, 6b) at least partially melt, and causing the wire (7a, 7b) to be inserted into the groove. The invention also relates to a piece of equipment allowing the insertion method to be implemented.