POLYAMIDEIMIDESILOXANE HOT MELT ADHESIVE
A solution of a hot melt adhesive which comprises an organic solvent and a fully imidized polyamideimidesiloxane is disclosed wherein 0.5 to 30 mole% of the dianhydride or diamine monomers are siloxane containing monomers. Up to 50 mole% of the diamine monomer is aliphatic diamine that contains neither siloxane groups nor amide linkages and 40 to 99 mole% is aromatic diamine that does not contain siloxane groups. The aromatic diamine is (1) 20 to 100 mole% unsymmetrical aromatic diamine having at least two aromatic rings, two amine groups on different aromatic rings, and contains an amide linkage in the chain and (2) up to 50 mole% of aromatic diamine that contains neither siloxane groups nor amide linkages. A tape can be made from the solutions and an article can be attached to a substrate by applying the tape to the substrate or the article.