COMPOSITE ELECTRICAL CONTACT STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
An improved wear resistant bump contact (Fig. 1, item 16) is produced by the inclusion of small particles (18) of hard materials in the conductive material of the contact bump, preferably by co-deposition at the time of electroplating of the bump bulk material. Desirable attributes of the small particles of hard material include small particle size, hardness greater than the hardness of the bulk material of the contact bump, compatibility with the plating conditions, and electrical conductivity. In one variation, the bump of metal-particle co-deposited material is coated by a thin cap layer (19) of noble, non oxidizing metal to prevent electrical erosion by arcing as contact is made and broken from the pad.