Bumping process for light emitting diode
A bumping process for a light emitting diode (LED) is provided. At first, a LED chip with a plurality of electrodes is provided, then a moldboard having a plurality of through holes is disposed on the LED chip, and these electrodes are correspondingly exposed in these through holes, by the way of printing, a plurality of solders can be formed over these exposed electrodes. Finally, the process of lifting off the moldboard and reflowing the solder is provided. The way of printing solder is fast and the cost is lowered, and the composition and thickness of solder is under controlled to promote the reliability of follow-up LED chip package.