LIGHT EMITTING MODULE, FABRICATION METHOD THEREFOR, AND LAMP UNIT
In a light emitting module board, an electrode receiving the supply of current for light emission is provided in the light emitting surface of a semiconductor light emitting device. A light wavelength conversion member is a plate-like member mounted on the light emitting surface, and emits light after converting the wavelength of the light emitted by the semiconductor light emitting device. A relay electrode is provided in the surface of the light wavelength conversion member. The relay electrode extends from a position in contact with the electrode to an exposed position in the external space in a state where the light wavelength conversion member is mounted on the light emitting surface. The relay electrode is provided so that the upper part of the relay electrode, which is the exposed position, extends to a position located opposite to the lower part of the relay electrode which is the contacted position.