THERMALLY CONDUCTIVE THERMOPLASTICS FOR DIE-LEVEL PACKAGING OF MICROELECTRONICS
A composition and method for die-level packaging of microelectronics is disclosed. The composition includes about 20% to about 80% of a thermoplastic base matrix; about 20% to about 70% of a non-metallic, thermally conductive material such that the composition has a coefficient of thermal expansion of less than 20 ppm/C and a thermal conductivity of greater than 1.0 W/mK. Using injection molding techniques, the composition can be molten and then injected into a die containing the microelectronics to encapsulate the microelectronics therein.