NON-AQUEQUS SOLDER FLUX COMPOSITION
Non-aqueous solder flux compositions are disclosed. In some aspects, the compositions comprise: (a) an alkylbenzene sulfonic acid or an acidic phosphate ester; and (b) an alkanolamide, an ethoxylated alkanolamide, an alkanolamine, or an ethoxylated amine. Methods of making solder flux compositions and methods of using the compositions as components of tacky solder fluxes are described. The solder flux compositions have excellent wettability, oxide removal capability, and rheological characteristics for high-speed, pick-and-place manufacturing processes and can be made from a simple combination of two components, thereby avoiding the need for solvents, polymeric thickeners, and other components of traditional tacky solder fluxes.