METHOD FOR COATING AN OPTOELECTRONIC CHIP-ON-BOARD MODULE AND OPTOELECTRONIC CHIP-ON-BOARD-MODULE
The invention relates to a method for coating an optoelectronic chip-on-board module (21) that comprises a flat support (2, 2') fitted with one or several optoelectronic components (4) and has a transparent, UV- and temperature-resistant coating (24) consisting of one or more silicones, to a corresponding optoelectronic chip-on-board module (21) and to a system comprising several optoelectronic chip-on-board modules (21). The method according to the invention comprises the following method steps: a) preheating the support to be coated (2, 2') to a first temperature, b) applying a dam, (22) which encloses a surface or partial surface to be coated of the support (2, 2') and is made of a first thermally curable, highly reactive silicone that cures at the first temperature, onto the preheated support (2, 2'), c) filling the surface or partial surface of the support (2, 2'), which is enclosed by the dam (22), with a liquid second silicone (23), and d) curing the second silicone (23).