Heterogeneous integration: Optical receivers
Datacenters are demanding dramatic increases in the volume and density of optical interconnections, requiring multiple high performance lasers, modulators, and photodiodes in a single module to meet growing bandwidth needs along with dramatically lower power and cost. The heterogeneous integration of InP material into a silicon photonics wafer flow enables high performance integrated circuits to be fabricated using established silicon foundry infrastructure. Aurrion has established a library of photonic circuit elements which can be combined to form the single chip solutions for products like 100Gb/s transceivers needed for current and next generation datacenter applications. Here we will focus on the receiver portion of an integrated transceiver.