Cyber physical system (CPS) for contactless IC testing
In this paper, we study the testing flow in fabrication process of stacked-die products. We discuss the difficulties of traditional testing mechanism. To improve production yield, a contactless testing with cyber physical system (CPS) for pre-bond interposers is proposed in this paper. We propose a testing framework comprising a heating laser and an infrared-radiation camera. In addition, we also build a completely correct model of a functional interposer. By our proposed Classification Algorithm and BDA classifier, functional and defective interposers can be differentiated. Our experimental results show that the proposed framework provides an over 97% accuracy to identify functional interposers from a whole batch of untested products.