section_path: History of development/Metal-oxide semiconductor
section_name: Metal-oxide semiconductor
paragraph_text: Metal-oxide semiconductor
  
  In the 1950s, Mohamed Atalla investigated the surface properties of silicon semiconductors at Bell Labs, where he proposed a new method of semiconductor device fabrication, coating a silicon wafer with an insulating layer of silicon oxide so that electricity could reliably penetrate to the conducting silicon below, overcoming the surface states that prevented electricity from reaching the semiconducting layer. This is known as surface passivation, a method that became critical to the semiconductor industry as it made possible the mass production of silicon integrated circuits (ICs). Building on his surface passivation method, he developed the metal oxide semiconductor (MOS) process, which he proposed could be used to build the first working silicon field-effect transistor (FET). The led to the invention of the MOSFET (MOS field-effect transistor) by Mohamed Atalla and Dawon Kahng in 1959. With its scalability, and much lower power consumption and higher density than bipolar junction transistors, the MOSFET became the most common type of transistor in computers, electronics, and communications technology such as smartphones. The US Patent and Trademark Office calls the MOSFET a "groundbreaking invention that transformed life and culture around the world".
  
  CMOS (complementary MOS) was invented by Chih-Tang Sah and Frank Wanlass at Fairchild Semiconductor in 1963. The first report of a floating-gate MOSFET was made by Dawon Kahng and Simon Sze in 1967. FinFET (fin field-effect transistor), a type of 3D multi-gate MOSFET, was developed by Digh Hisamoto and his team of researchers at Hitachi Central Research Laboratory in 1989.