An electrical filter includes a dielectric substrate with inner and outer coils about a first region and inner and outer coils about a second region, a portion of cladding removed from wires that form the coils and coupled to electrically conductive traces on the dielectric substrate via a solder joint in a switching region. An apparatus to thermally couple a superconductive device to a metal carrier with a through-hole includes a first clamp and a vacuum pump. A composite magnetic shield for use at superconductive temperatures includes an inner layer with magnetic permeability of at least 50,000; and an outer layer with magnetic saturation field greater than 1.2 T, separated from the inner layer by an intermediate layer of dielectric. An apparatus to dissipate heat from a superconducting processor includes a metal carrier with a recess, a post that extends upwards from a base of the recess and a layer of adhesive on top of the post. Various cryogenic refrigeration systems are described.
Please help me write a proper abstract based on the patent claims. CLAIM: 1. A method of fabricating an electrical filter for use with differential signals, the method comprising: winding a first length of wire about a first region of a dielectric substrate, to form a first inner coil of wire, wherein the first length of wire comprises a first wire core and a first resistive cladding; winding the first length of wire about a second region of the dielectric substrate, to form a second inner coil of wire, wherein the first and the second regions of the dielectric substrate are separated by a switching region of the dielectric substrate; winding a second length of wire around the first inner coil of wire, to form a first outer coil of wire, wherein the second length of wire comprises a second wire core and a second resistive cladding; winding the second length of wire around the second inner coil of wire, to form a second outer coil of wire; exposing a portion of the first and the second wire core in the switching region by removing a first portion of the first and the second resistive cladding, respectively, and tapering a second portion of the first and the second resistive cladding on each side of the first portion of the first and the second wire cladding, respectively; soldering the first and the second lengths of wire to each of a first and a second conductive trace in the switching region to form a solder joint, wherein the solder joint overlies the exposed portion of the first and the second wire core, and overlies the tapered portion of the first and the second cladding, and wherein the solder joint electrically couples the first and the second wire cores to the first and the second conductive traces, and mechanically couples the first and the second lengths of wire to the switching region; and cutting each of the first and the second lengths of wire between the first and the second conductive trace, to form a first conductive signal path comprising the first inner coil of wire and the second outer coil of wire, and a second conductive signal path comprising the first outer coil of wire and the second inner coil of wire. 2. The method of claim 1 wherein winding a first length of wire about a first region of a dielectric substrate includes winding a first length of continuous superconductive wire about a first region of a dielectric substrate, the first length of continuous superconductive wire comprising a core material that is superconducting below a first critical temperature, and wherein winding a second length of wire about a first region of the dielectric substrate includes winding a second length of continuous superconductive wire about a first region of the dielectric substrate, the second length of continuous superconductive wire comprising a core material that is superconducting below a second critical temperature. 3. The method of claim 1 wherein exposing a portion of the first and the second wire core in the switching region by removing a first portion of the first and the second resistive cladding, respectively, and tapering a second portion of the first and the second resistive cladding on each side of the first portion of the first and the second wire resistive cladding, respectively, includes applying an etchant to a portion of the first and the second lengths of wire. 4. The method of claim 3, further comprising: heating the switching region to cause the etchant to corrode the first and the second resistive claddings. 5. The method of claim 3, further comprising: applying a protective mask to the first and the second conductive traces to protect the first and the second conductive traces from the etchant, wherein soldering the first and the second lengths of wire to each of a first and a second conductive trace in the switching region to form a solder joint includes removing the protective mask from the first and the second conductive traces. 6. The method of claim 3 wherein applying an etchant to a portion of the first and the second lengths of wire includes applying ferric chloride to a portion of the first and the second lengths of wire. 7. The method of claim 1 wherein winding a first length of wire about a first or a second region of a dielectric substrate, to form a first or a second inner coil of wire, respectively, includes winding a first number of turns in the first length of wire, and winding a second length of continuous wire about a first or a second region of a dielectric substrate, to form a first or a second outer coil of wire, respectively, includes winding a second number of turns in the second length of wire, wherein the second number of turns is less than or equal to the first number of turns. 8. The method of claim 1 wherein winding a first length of wire about a first region of a dielectric substrate, to form a first inner coil of wire includes winding a first length of wire in a first direction about the dielectric substrate, and winding a second length of wire about a first region of a dielectric substrate, to form a first outer coil of wire includes winding a second length of wire in a second direction about the dielectric substrate, wherein the first direction is the same as the second direction. 9. The method of claim 1 wherein winding a first and a second length of wire includes winding a first and a second length of wire each with respective niobium-titanium wire cores, and copper-nickel claddings. 10.-71. (canceled) 72. An apparatus, comprising: a first tubular shield comprised of a first plurality of distinct U-shaped pieces of a nanocrystalline material that form a perimeter wall which forms a first cavity, the first cavity having at least a respective lateral dimension, the first tubular shield having a first end and a second end, the second end opposed to the first end along a length of the first tubular shield, the second end closed; and a first end cap comprised of a second plurality of distinct U-shaped pieces of a nanocrystalline material, the first end cap sized and dimensioned to be removably secured to the first tubular shield proximate the first end of the first tubular shield. 73. The apparatus of claim 72 wherein the first plurality of distinct U-shaped pieces of a nanocrystalline material are each comprised of a plurality of layers of a nanocrystalline amorphous iron-based material. 74. The apparatus of claim 72 wherein the first plurality of distinct U-shaped pieces of a nanocrystalline material are each comprised of a laminate of a plurality of layers of a nanocrystalline amorphous iron-based material in a polyethylene terephthalate (PET). 75. The apparatus of claim 72 wherein the first plurality of distinct U-shaped pieces of a nanocrystalline material are each comprised of a laminate of a plurality of layers of a nanocrystalline amorphous iron-based material in a polyethylene terephthalate (PET) loaded with a copper powder. 76. The apparatus of claim 72 wherein the first plurality of distinct U-shaped pieces of a nanocrystalline material are each comprised of a laminate of a plurality of layers of a tape comprised of a nanocrystalline amorphous Iron-based material in a polyethylene terephthalate (PET). 77. The apparatus of claim 72 wherein the U-shaped pieces are each from a single strip or a single piece of a laminate strip, with a first bend and a second bend each of which extend laterally across a longitudinal axis of the strip. 78. The apparatus of claim 72, further comprising: a copper base, about which the first plurality of distinct U-shaped pieces of a nanocrystalline material are arranged to form the first tubular shield. 79. The apparatus of claim 72 wherein the second plurality of distinct U-shaped pieces of a nanocrystalline material are each comprised of a laminate of a plurality of layers of a tape comprised of a nanocrystalline amorphous Iron-based material in a polyethylene terephthalate (PET). 80. The apparatus of claim 72, further comprising: a second tubular shield comprised of a third plurality of distinct U-shaped pieces of a nanocrystalline material that form a perimeter wall which forms a second cavity, the second cavity having at least a respective lateral dimension, the second tubular shield having a first end and a second end, the second end opposed to the first end along a length of the second tubular shield, the second end closed, the second tubular shield positioned in the first cavity of the first tubular shield. 81. The apparatus of claim 80, further comprising: a copper base, about which the first plurality of distinct U-shaped pieces of a nanocrystalline material are arranged to form the first tubular shield. 82. The apparatus of claim 81, further comprising: a processor received within the second cavity of the second tubular shield. 83. The apparatus of claim 82, further comprising: at least one degaussing wire wrapped about a portion of the first tubular shield, the degaussing wire electrically coupled to receive a periodic waveform of gradually decreasing amplitude to reduce a residual magnetism in the first tubular shield. 84. A method of forming an apparatus, comprising: arranging a first plurality of distinct U-shaped pieces of a nanocrystalline material to form at least a perimeter wall of a first tubular shield having a first cavity, the first cavity having at least a respective lateral dimension, the first tubular shield having a first end and a second end, the second end opposed to the first end along a length of the first tubular shield, the second end closed; and arranging a second plurality of distinct U-shaped pieces of a nanocrystalline material to form at least a perimeter wall of a first end cap, the first end cap sized and dimensioned to be removably secured to the first tubular shield proximate the first end of the first tubular shield. 85. The method of claim 84, further comprising: arranging a third plurality of distinct U-shaped pieces of a nanocrystalline material to form at least a perimeter wall of a second tubular shield having a second cavity, the second cavity having at least a respective lateral dimension, the second tubular shield having a first end and a second end, the second end opposed to the first end along a length of the second tubular shield, the second end closed, the second tubular shield sized and dimensioned to be removably received in the first cavity of the first tubular shield. 86. The method of claim 85, further comprising: inserting a processor in the second cavity of the second tubular shield; inserting the second tubular shield in the first cavity of the first tubular shield; and securing the first end cap to the first end of the first tubular shield. 87.-214. (canceled)