A technique relates to an assembly for a quantum computing device. A quantum bus plane includes a first set of recesses. A readout plane includes a second set of recesses. A block is positioned to hold the readout plane opposite the quantum bus plane, such that the first set of recesses opposes the second set of recesses. A plurality of qubit chips are included where each has a first end positioned in the first set of recesses and has a second end positioned in the second set of recesses.
Please help me write a proper abstract based on the patent claims. CLAIM: 1. A quantum device, comprising: a first structure including a first set of couplings; a second structure including a second set of couplings; and at least one qubit chip coupled to the first set of couplings and the second set of couplings. 2. The quantum device of claim 1, wherein the first structure comprises a circuit. 3. The quantum device of claim 2, wherein the circuit is configured to couple at least two qubit chips. 4. The quantum device of claim 2, wherein the circuit comprises at least one coupling resonator. 5. The quantum device of claim 1, wherein the second structure comprises a circuit. 6. The quantum device of claim 5, wherein the circuit comprises transmission lines configured to couple to qubit chips. 7. The quantum device of claim 6, wherein the transmission lines are configured to couple the qubits chips to connectors. 8. The quantum device of claim 1, wherein the at least one qubit chip is positioned to the first and second structures for communication. 9. The quantum device of claim 1, wherein the at least one qubit chip comprises a superconducting qubit. 10. The quantum device of claim 1, wherein the at least one qubit chip comprises a readout resonator. 11. A quantum device, comprising: a quantum bus plane including a first set of couplings; a readout plane including a second set of couplings; and qubit chips positioned to the first set of couplings and positioned to the second set of couplings. 12. The quantum device of claim 11, wherein the qubit chips extend to the quantum bus plane and the readout plane. 13. The quantum device of claim 11, wherein the first set of couplings is configured to receive the qubit chips in the readout plane; and wherein the second set of couplings is configured to receive the qubit chips in the quantum bus plane. 14. The quantum device of claim 11, wherein the quantum bus plane comprises a substrate with interconnect wiring, the interconnect wiring connecting the qubit chips via coupling bus resonators. 15. The quantum device of claim 11, wherein the readout plane comprises a substrate with fan-out wiring, the fan-out wiring individually connecting each of the qubit chips to a circuit board. 16. The quantum device of claim 15, wherein the circuit board individually connects each of the qubit chips to connectors in a one-to-one relationship. 17. A quantum device comprising: a first coupling; a second coupling; and a qubit chip coupled to the first coupling and the second coupling, the qubit chip comprising a superconducting qubit and a readout resonator. 18. The quantum device of claim 17, wherein the first coupling is formed on a first structure comprising a first circuit. 19. The quantum device of claim 18, wherein the second coupling is formed on a second structure comprising a second circuit. 20. The quantum device of claim 19, wherein the first structure opposes the second structure so as to position the qubit chip.