I want to know the answer to the following question:
How did Microsoft modify the architecture of the 360 to reduce failure rates?
All the background I'm provided with is that "Modifications include a reduction in the number, size, and placement of components, the addition of dabs of epoxy on the corners and edges of the CPU and GPU as glue to prevent movement relative to the board during heat expansion, and a second GPU heatsink to dissipate more heat.". Is that enough to answer the question?