user20786: I was reading the MPU6050 datasheet to understand all the type of errors that affect the accelerometer, after finding information on the Reflow Profile i look up on wikipedia the Reflow Soldering Definition
As a noob i can't understand the importance, initially i though it was correlated with the temperature effect on the accelerometer bias, but i was wrong. 
Why is important?
How do you read this values?(or when you use this data)



user23093: Reflow soldering is an assembly process for printed circuit boards (PCBs) in which surface-mount parts are placed on a PCB prepared with solder paste.  The solder is melted by heating in a temperature-controlled oven, which then electrically connects component leads to pads on the PCB.  ICs can be damaged by high temperatures/rapid changes in temperatures, so the thermal profile defines the acceptable limits on the temperature of the reflow to avoid damaging the component.

20786: <p>I was reading the MPU6050 datasheet to understand all the type of errors that affect the accelerometer, after finding information on the Reflow Profile i look up on wikipedia the <a href="https://en.wikipedia.org/wiki/Reflow_soldering" rel="nofollow noreferrer">Reflow Soldering Definition</a></p>

<p>As a noob i can't understand the importance, initially i though it was correlated with the temperature effect on the accelerometer bias, but i was wrong. </p>

<p><strong>Why is important?</strong></p>

<p><strong>How do you read this values?(or when you use this data)</strong>
<a href="https://i.stack.imgur.com/A1aQS.png" rel="nofollow noreferrer"><img src="https://i.stack.imgur.com/A1aQS.png" alt="enter image description here"></a>
<a href="https://i.stack.imgur.com/aIW8D.png" rel="nofollow noreferrer"><img src="https://i.stack.imgur.com/aIW8D.png" alt="enter image description here"></a></p>
 23093: <p><a href="https://en.wikipedia.org/wiki/Reflow_soldering" rel="nofollow noreferrer">Reflow soldering</a> is an assembly process for printed circuit boards (PCBs) in which surface-mount parts are placed on a PCB prepared with solder paste.  The solder is melted by heating in a temperature-controlled oven, which then electrically connects component leads to pads on the PCB.  ICs can be damaged by high temperatures/rapid changes in temperatures, so the thermal profile defines the acceptable limits on the temperature of the reflow to avoid damaging the component.</p>
